ジャパンクリエイト List of Products and Services

The SD-8004 model is a spin spray development system for 4" to 8" wafers. It performs developing, rinsing, water washing, and spin drying through automatic and manual operation. Condition settings are done via a touch panel on the operation panel. Each processing mode is displayed on the touch panel during the respective mode. For more details, please contact us or refer to the catalog.

• Coater
• Other semiconductor manufacturing equipment

This machine is a spin-type spray developing device that performs developing, rinsing, washing, and drying through automatic and manual operation. It can process several workpieces at once. For more details, please contact us or refer to the catalog.

• Other semiconductor manufacturing equipment

The JASC-150 model is a fully automatic spinner with a developer solution temperature accuracy of ±1°C. It accommodates φ4", φ5", and φ6" through fixture exchange. By adopting high-precision robots, it has achieved high throughput. For more details, please contact us or refer to the catalog.

• Coater
• Other semiconductor manufacturing equipment

Japan Create Co., Ltd.'s spinner is a product developed with a focus on performance and price among many spinners. It is a manual spinner intended for use in laboratories, schools, and other experimental settings. It can be applied mainly for resist coating of silicon wafers (gallium arsenide, glass, ceramics), as well as in developing devices, etching devices, stripping devices, and spin-drying devices. For more details, please contact us or refer to the catalog.

• Coater
• Other semiconductor manufacturing equipment

This machine automatically transports masks stored in the loader, passing through each processing tank and storing them in the unloader. It supports various options such as batch type and scrub washing. Please contact us for more details.

• Other semiconductor manufacturing equipment

The cleaning machines for wafers and mask glasses are equipped with brush cleaning and fine jet cleaning. For more details, please contact us.

• Other semiconductor manufacturing equipment

This machine is a resist stripping device. The robot automatically transports the cassette set in the loader, goes through each processing stage, dries it with hot air blow/spin dryer, and discharges it to the unloader. For more details, please contact us.

• Other semiconductor manufacturing equipment

The cleanliness of the quartz tubes used in the manufacturing process of wafers greatly affects the quality of the products. Therefore, the cleaning of quartz tubes used in the diffusion process, CVD process, and annealing process is an important point. Japan Create Co., Ltd. provides quartz tube cleaning equipment that meets customer needs based on many years of experience and achievements. There are two types of systems: horizontal and vertical, and we can accommodate the shape of the quartz tubes, so please consult with us. For more details, please contact us.

• Other semiconductor manufacturing equipment

The SFH type is a tabletop spin dryer. It is a tabletop spin dryer that specifically accommodates substrates of 150mm square or smaller in a cassette, allowing for manual vertical loading of either 2 or 4 cassettes for spin drying. It features a built-in HEPA or ULPA filter in the lid, which improves the cleanliness of the chamber by introducing clean air. For more details, please contact us.

• Other semiconductor manufacturing equipment

The SF series is widely used for compact tabletop drying of small quantities of silicon or compound semiconductor wafers. The operation is extremely simple: after placing the wafers on the rotating platform, just lower the top cover and press the start button to perform a safe spin-dry finish. For more details, please contact us.

• Other semiconductor manufacturing equipment

The SPD type simultaneously dries 2 or 4 carriers, equipped with a clean filter at the top, ensuring that clean air continuously flows through the main body, maintaining cleanliness within the chamber. By changing the cradle, it can dry wafers ranging from 4 to 12 inches. For more details, please contact us.

• Other semiconductor manufacturing equipment

The SRD type is a drying device of the single carrier (25 sheets or 13 sheets) processing type that achieves high quality in addition to the excellent drying performance and operability of conventional models. By incorporating ULPA or HEPA filters into the lid and introducing clean air, it dramatically improves the cleanliness within the chamber. By changing the cradle, it can dry 2 to 3 types of wafers. For more details, please contact us.

• Other semiconductor manufacturing equipment

This machine is a device for drying glass substrates, ceramic substrates, film substrates, and other materials. The items to be dried are placed in a dedicated cassette, which is then set into the rotor of the spin dryer using a cassette frame. The chamber creates a negative pressure through rotation, and clean air that passes through the HEPA filter integrated into the lid enhances the cleanliness within the chamber, allowing for high-quality spin drying. For more details, please contact us.

• Other semiconductor manufacturing equipment

~Overview~ - By incorporating an ULPA or HEPA filter into the lid, the cleanliness within the chamber is significantly improved by introducing clean air. - The replacement of the cradle allows for the drying of 4 to 8-inch wafers. For 12-inch wafers, it accommodates up to 2 carriers. - In the event of abnormal vibrations, it automatically stops.

• Other clean room equipment and facilities
• Other semiconductor manufacturing equipment

SRC-15001 is a sheet-type spray cleaning device. Place the item to be cleaned on the sample table, and by turning ON the start switch, the sample table begins to rotate while the nozzle arm swings the radius of the cleaning item, spraying high-pressure pure water from a two-fluid nozzle. Next, finishing cleaning is performed using megasonic waves, followed by spin drying. For more details, please contact us or refer to the catalog.

• Coater
• Other semiconductor manufacturing equipment

Japan Create Co., Ltd. is a manufacturer primarily dealing with semiconductor manufacturing equipment, as well as other equipment such as LCD manufacturing devices. Since all products are manufactured in-house, we can offer them at low prices. The "Automatic Wafer Cleaning System" consists of a sheet-type automatic cleaning device, with wafer transport configured using a 3-axis multi-joint clean robot and a uniaxial robot for front and rear transport. 【Features】 - Suitable for wafers from 2 inches to 18 inches and 300mm square substrates - Uses a multi-joint robot from the loader - Automatically processes through each stage to the unloader cassette - Also available in a type that can use FOUP in addition to cassettes For more details, please contact us or download the catalog.

• Other semiconductor manufacturing equipment

The "Automatic Wafer Resist Coating Device" is a sheet-type automatic resist coating device. The resist coating uses a high-performance pump according to viscosity, enabling high-precision application. Additionally, it can be used for applying adhesives and protective films, among other applications. The wafer transport is facilitated by a 3-axis multi-joint clean robot installed at the center of the device, with loaders and unloaders available in FOUP or cassette types. 【Features】 - Suitable for wafers from 2 inches to 18 inches and 300mm square substrates - Uses a multi-joint robot from the loader - Automatically processes through each stage to the unloader cassette For more details, please contact us or download the catalog.

• Resist Device

The "Automatic Resist Coating and Developing System" is a sheet-type automatic resist coating and developing device. It is equipped with a resist coating chamber and a developing chamber. The resist coating uses a high-performance pump according to viscosity, allowing for high-precision coating. Additionally, the developing solution is constantly maintained at a constant temperature through an electronic cooler and circulated, enabling high-precision developing processing. The transportation of wafers is handled by a 3-axis multi-joint clean robot installed at the center of the device, which is also equipped with a loader and unloader. 【Features】 - Suitable for wafers from 2 inches to 18 inches and 300mm square substrates - Uses a multi-joint robot from the loader - Automatically processes through each stage to the unloader cassette For more details, please contact us or download the catalog.

• Resist Device

The "Automatic Substrate Development Device" is a sheet-type automatic development device for substrates. The developer solution is maintained at a constant temperature by an electronic cooler and is sprayed onto the wafer for high-precision development processing. Additionally, the development method can be selected between spray type and paddle type. Substrate transport is facilitated by a 3-axis multi-joint clean robot installed at the center of the device, with loaders and unloaders available in FOUP or cassette types. 【Features】 ○ Suitable for wafers from 2 inches to 18 inches and 300mm square substrates ○ Uses a multi-joint robot from the loader ○ Automatically processes through each step to the unloader cassette For more details, please contact us or download the catalog.

• Other semiconductor manufacturing equipment

Japan Create Co., Ltd. is a manufacturer primarily dealing with semiconductor manufacturing equipment, as well as other equipment such as LCD manufacturing devices. Since all products are manufactured in-house, we can offer them at a low cost. The "Automatic Wafer Cleaning Device" is a single-wafer automatic etching device. The wafer transport is equipped with a 3-axis multi-joint clean robot located at the center of the device, and the loader and unloader can be either FOUP or cassette type. 【Features】 - Suitable for wafers from 2 inches to 18 inches and 300mm square substrates - Uses a multi-joint robot from the loader - Automatically processes through each stage to the unloader cassette For more details, please contact us or download the catalog.

• Etching Equipment

The "RCA Wafer Cleaning System" is an automatic cleaning device primarily based on RCA cleaning, widely adopted as a highly reliable cleaning method. It features a "3-axis multi-joint clean robot" for wafer transport and a "FOUP" used in the loader and unloader, achieving cleaning in a non-particle environment. 【Features】 ■ Quick response from quotes to customization ■ Support for not only our own equipment but also for other manufacturers' equipment ■ Detailed response to sudden specification changes *For more details, please download the catalog or contact us.

• Other semiconductor manufacturing equipment

The "RCA Wafer Cleaning System" is an automatic cleaning device primarily based on the RCA cleaning method, widely adopted as a highly reliable cleaning method. With a "3-axis multi-joint clean robot" for wafer transport and "FOUP" used for loaders and unloaders, it achieves cleaning in a non-particle environment. 【Features】 ■ Quick response from estimates to customization ■ Support for our own equipment as well as other manufacturers' equipment ■ Detailed response to sudden specification changes *For more details, please download the catalog or contact us. 【Exhibition Information】 SEMICON Japan Location: Tokyo Big Sight Period: December 13-15, 2017 Booth Number: 3509, East Hall

• Other semiconductor manufacturing equipment

We are currently distributing a comprehensive catalog of our "sheet-type wafer processing equipment," which automatically processes wafers from 2 inches to 18 inches and 300mm substrates from the loader to the unloader cassette using a multi-joint robot through various stages, free of charge! We are also accepting inquiries for demonstrations at any time, so please feel free to contact us! *For more details, please download the catalog or contact us.

• Wafer processing/polishing equipment

The "tabletop spin coater" is a device that generates a coating film by rapidly rotating a smooth substrate, utilizing centrifugal force. It is mainly used in semiconductor manufacturing processes. The coating sizes available range from MAX φ150 to MAX φ450 (tabletop / inner cup method). Additionally, we are always accepting requests for demo machine rentals and thickness measurement tests at our company. If you are interested, please feel free to contact us. *For more details, please download the catalog or contact us.

• Coater
• Other semiconductor manufacturing equipment

The "MH-100" is a compact, space-saving tabletop diamond wire saw for laboratory use. It features an easy-to-handle single wire type, making it ideal for research and development applications. Additionally, we offer the multi-wire saw "MH1000," which utilizes precision machining technology to cut materials thinly and with high accuracy. It employs a total of five axes of AC servo motors: two axes for wire drive, two axes for traverse, and one axis for vertical movement of the workpiece, making it a specialized small machine capable of cutting various materials, including quartz and ceramics. 【Features (MH-100)】 ■ Compact and space-saving for laboratory use ■ Easy-to-handle single wire type ■ Ideal for research and development applications *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• others

- Pricing suitable for research prototypes - Automatic cutting on an XY table using a high-precision 5-phase microstepping motor with a closed-loop system. The X-axis is equipped with a rotation mechanism. - Cutting under constant stress Automatic cutting under constant stress is possible by detecting wire deflection with a high-precision position sensor and controlling the movement speed through feedback to the stepping motor. - Simple design with easy operation via a touch panel.

• Other processing machines

This device is designed to cut materials thinly and with high precision by utilizing precision machining technology. It uses a total of 5-axis AC servo motors, including wire-driven 2 axes, traverse 2 axes, and workpiece vertical 1 axis, and is a compact dedicated machine capable of cutting various materials such as quartz and ceramics.

• Other semiconductor manufacturing equipment
• Other processing machines

The "CO2 Spray Cleaning Device" allows for CO2 cleaning in a low dew point environment for cleaning in a vacuum environment. It uses our proprietary nozzle, the CO2 Rubber Jet Nozzle. The speed and density of solid CO2 particles can be varied, enabling us to propose optimal cleaning conditions. It can be used for particle removal on micro lenses, removal of sputter residues, and improvement of wettability. 【Features】 ■ Our proprietary nozzle: CO2 Rubber Jet Nozzle ■ Cleaning in a vacuum environment ■ Damage-free dry cleaning is possible ■ Maximum substrate size is φ12 inches ■ Handheld spray unit available for sale *For more details, please refer to the PDF document or feel free to contact us.

• Other cleaning machines