List of Semiconductor Manufacturing Equipment products

For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.

• Work gloves

We provide design and manufacturing services for automatic assembly machines and labor-saving machinery in various fields, including automotive parts, electronic components, semiconductors, and constr...

• Assembly robot
• Semiconductor inspection/test equipment
• Automatic sorting machine

A mask shop that provides high-quality class photomasks "quickly," "cheaply," and "easily."

• Photomask

Most of the work is done in-house through trial and error! We handle all processes including design, manufacturing, machining, welding, electrolysis, and cleaning internally.

• Wafer processing/polishing equipment
• Processing Contract

Multiple specialized electro-polishing factories established! Responding to diverse needs along with various cleaning equipment and clean facilities.

• Wafer processing/polishing equipment
• Processing Contract

Ultra-fine hole machining technology

• Other semiconductor manufacturing equipment

From the pursuit of steel materials, we measure with high-precision inspection equipment such as temperature control of heat treatment furnaces, hardness tests, microstructure inspections, and dimensi...

• Other inspection equipment and devices
• Semiconductor inspection/test equipment

Ideal for small-lot and multi-variety production of small precision parts! It is possible to use grinding stones with a diameter of 3mm or less.

• Wafer processing/polishing equipment

Maintain a comfortable working environment with dust collection! No consumables needed for rust prevention of compounds in wet processes.

• Wafer processing/polishing equipment

Achieve significant efficiency improvements! Introducing a high-performance, lightweight, easy-to-use, and long-lasting centrifugal barrel polishing machine.

• Wafer processing/polishing equipment
• Other abrasives
• Other processing machines

Select the appropriate grinding method according to the production volume! Easily achieve VA/VE for parts.

• Wafer processing/polishing equipment
• Grinding Machine
• Other contract services

As the production quantity increases, it becomes possible to reduce the total cost.

• Wafer processing/polishing equipment
• Grinding Machine
• Other contract services

Mirror surface cutting processing Display sign Mirror surface

• Other semiconductor manufacturing equipment

We have reduced the need for Kaeri processing in paper handling.

• Wafer processing/polishing equipment
• Grinding Machine
• Other contract services

Introducing a case where a company was looking for one that could ensure precision through grinding processing, as the required precision could not be achieved with press processing alone!

• Wafer processing/polishing equipment
• Processing Contract

Introduction to the case study of Konishi Manufacturing, which utilizes its top-notch grinding and polishing equipment in Japan to provide integrated solutions for flat cutting, cylindrical grinding, ...

• Wafer processing/polishing equipment
• Processing Contract

Introduction of Konishi Manufacturing's case, which utilizes its top-notch equipment for grinding and polishing processes in Japan, providing comprehensive support for flat cutting, cylindrical grindi...

• Wafer processing/polishing equipment
• Processing Contract

High precision and mass production are achievable with grinding processing utilizing bearing machining technology!

• Wafer processing/polishing equipment
• Grinding Machine
• Other contract services

Ideal for collecting fallen or adhered foreign objects.

• Tester
• Glassware and containers
• Analytical Equipment and Devices

Ideal for cutting and marking.

• Tester
• Microscope
• Analytical Equipment and Devices

We provide reliable support from the sale of internal and external mold materials to processing.

• Wafer processing/polishing equipment
• Processing Contract

Development, manufacturing, and consulting of ultra-high-speed electron beam drawing technology and its elemental technologies! Contributing to society through precision processing technology.

• Electron beam lithography equipment
• Other electronic parts
• Contract manufacturing

We can equip it with the measuring and inspection devices you desire.

• Other semiconductor manufacturing equipment

Supports operation linked with external devices! Inspections are conducted according to the specified conditions.

• Tester

Added outer diameter grinding processing! Contributed to total cost reduction.

• Wafer processing/polishing equipment
• Grinding Machine
• Other contract services

From procurement of pressing, forging, and cutting processing to consistent support for polishing and grinding processing!

• Wafer processing/polishing equipment
• Grinding Machine
• Other contract services

Cost reduction of over 40%! Cost reduction proposal service utilizing processing equipment.

• Wafer processing/polishing equipment
• Grinding Machine
• Other contract services

Embellished printing that resonates with customers' five senses the appeal of real products and services. Digital spot UV varnishing.

• Coater
• Other processing machines

Osaka Cutting Mass Production Lathe Processing and Machining Processing [Leave cost reduction to Filir Co., Ltd.]

• CVD Equipment
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

A technique born from the application of precision photography and photo corrosion methods! An ideal processing method for ultra-small, ultra-thin, and complex-shaped products.

• Processing Contract
• Etching Equipment

Aluminum precision parts for semiconductor manufacturing equipment. [Leave cost reduction to Philir Co., Ltd.]

• Semiconductor inspection/test equipment
• Ion implantation equipment
• CMP Equipment

Aluminum precision parts, lathe processing, machining processing [Leave cost reduction to Filir Co., Ltd.]

• CVD Equipment
• Etching Equipment
• Semiconductor inspection/test equipment

Aluminum precision machining Osaka 【Leave cost reduction to Philir Co., Ltd.】

• CVD Equipment
• Etching Equipment
• Other semiconductor manufacturing equipment

Aluminum precision parts for semiconductor manufacturing equipment, Osaka. [Leave cost reduction to Philir Co., Ltd.]

• Sputtering Equipment
• Ion implantation equipment
• Evaporation Equipment

Five-axis machining for semiconductor manufacturing equipment parts [Leave cost reduction to Philir Co., Ltd.]

• CVD Equipment
• Semiconductor inspection/test equipment
• Etching Equipment

Semiconductor manufacturing equipment aluminum parts machining【Leave cost reduction to Philir Co., Ltd.】

• Etching Equipment
• Resist Device
• Oxidation/Diffusion Device

A solder paste printer that realizes a variety of printing forms made possible by the press-in method!

• Other mounting machines
• Other semiconductor manufacturing equipment
• Printing Machinery

Aluminum semiconductor device parts processing [Leave cost reduction to Philir Co., Ltd.]

• CVD Equipment
• Etching Equipment
• Other semiconductor manufacturing equipment

It is suitable for samples where you want to control the grinding amount with automatic grinding!

• Wafer processing/polishing equipment
• Other measurement, recording and measuring instruments

We protect the environment with dry cleaning plasma technology and significantly improve the productivity of semiconductor devices.

• Etching Equipment
• Ashing device
• Other semiconductor manufacturing equipment

Customize wafers according to your needs! We respond to your requests with a full lineup of sizes.

• Wafer processing/polishing equipment
• Wafer
• Processing Contract

Capable of handling various grinding tasks! It produces minimal dust dispersion and provides a quiet working environment.

• Wafer processing/polishing equipment

Suitable for a wide range of applications, including deburring and cleaning! Available in belt and wheel types.

• Wafer processing/polishing equipment

A wide variety of ceramic products used in wafer manufacturing processes and device manufacturing processes are featured!

• Ceramics
• Wafer processing/polishing equipment
• Other machine elements

The material width supports 35mm to 160mm for TAB/CSP/COF and 250mm to 300mm for FPC!

• others
• Resist Device

The transport speed is 1.5m/min, and it can accommodate material widths up to 350mm! The chemical temperature and pressure are controlled with high precision.

• Etching Equipment

The transport speed is 5.0 m/min, and it can accommodate material widths up to 310 mm! Etching the surface of metal foils (such as aluminum).

• Drying Equipment
• Other surface treatment equipment
• Etching Equipment

High-speed alignment with original power meters! Custom alignment devices tailored to customer requirements can be manufactured.

• Other semiconductor manufacturing equipment

It is possible to have a large effective pattern area, allowing for effective use of materials.

• Plating Equipment
• Etching Equipment
• Other semiconductor manufacturing equipment

Remove smearing after drilling holes such as blind vias and through holes with a laser drill!

• Etching Equipment
• drill
• Drying Equipment

Yashima's electron beam deposition equipment is all custom-ordered. It is efficient, highly expandable for the future, and simple. Therefore, the price is also reasonable.

• Evaporation Equipment

It is equipped with transfer functionality and thickness measurement functionality.

• Other semiconductor manufacturing equipment

Silicon block internal foreign matter inspection device

• Semiconductor inspection/test equipment
• Other measurement, recording and measuring instruments
• Analytical Equipment and Devices

Thin-film solar cell panel measurement device

• Semiconductor inspection/test equipment
• Other measurement, recording and measuring instruments
• Analytical Equipment and Devices

Crystal Defect Measurement Device (Light Scattering Tomography)

• Semiconductor inspection/test equipment
• Other electronic measuring instruments
• Analytical Equipment and Devices

Inline wafer measurement module

• Semiconductor inspection/test equipment
• Other electronic measuring instruments
• Analytical Equipment and Devices

Using the JPV method, non-contact measurement of junction leakage in PN junctions, evaluation of the depletion layer capacitance, and rapid measurement of the sheet resistance of PN junction samples!

• Other inspection equipment and devices
• Semiconductor inspection/test equipment

The world's only spectroscopic ellipsometer technology for measuring pore rate and pore distribution using an EP (optical porosimeter).

• Semiconductor inspection/test equipment
• Other measurement, recording and measuring instruments
• Analytical Equipment and Devices

The PN determination of silicon wafers/blocks can be performed instantly.

• Semiconductor inspection/test equipment
• Other electronic measuring instruments
• Analytical Equipment and Devices

Instantly measure the resistance of silicon ingots/blocks non-contact and non-destructively using eddy current technology.

• Semiconductor inspection/test equipment
• Other electronic measuring instruments
• Analytical Equipment and Devices

Mapping measurements using the u-PCD method are possible, and there are numerous achievements in the solar cell and semiconductor markets.

• Semiconductor inspection/test equipment
• Other measurement, recording and measuring instruments
• Analytical Equipment and Devices