List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
181～225 item / All 5250 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
A method to triple production capacity without expanding the clean room!
- Bonding Equipment
A systematic explanation of the manufacturing process of semiconductor ICs, from the front-end and back-end processes to assembly, including the roles and necessity of the materials used in each stage...
- Other semiconductors
- Other semiconductor manufacturing equipment
- Technical Seminar
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film formation method. A compact thin-film experimental device that can accommodat...
- Sputtering Equipment
VOXIA compact X-ray CT imaging device
Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.
Are you having trouble with the delivery time for cast prototypes? "Casting prototype service!" for cast iron, aluminum castings, and stainless steel castings (lost wax casting)!
- Other semiconductor manufacturing equipment
Easier wedge bonding of copper wire using heating technology.
- Bonding Equipment
Easily connect copper wire chips with innovative laser heating.
- Bonding Equipment
The optimal bonding solution for the aerospace field, which requires high reliability.
- Bonding Equipment
High-precision bonding solutions that meet miniaturization needs.
- Bonding Equipment
Providing the optimal bond for high-brightness LED manufacturing.
- Bonding Equipment
Providing optimal and high-quality bonds that correspond to high currents.
- Bonding Equipment
Achieving high-quality bonds optimized for automotive powertrains.
- Bonding Equipment
Reliable bonding solutions that support the robustness of industrial robots.
- Bonding Equipment
Bonding solutions that contribute to improving productivity and reducing costs in home appliance manufacturing.
- Bonding Equipment
Providing optimal and high-quality bonding that supports multi-pin configurations.
- Bonding Equipment
Providing the ideal bond for manufacturing high-sensitivity sensors.
- Bonding Equipment
Providing bonds that contribute to improving durability in the renewable energy sector.
- Bonding Equipment
Providing optimal and high-quality bonds that support high-speed transmission.
- Bonding Equipment
Providing optimal adhesive for large-capacity bonding for EV batteries.
- Bonding Equipment
Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.
- Bonding Equipment
![Soft Etching Device [nanoETCH]](https://image.mono.ipros.com/public/product/image/e80/2000071234/IPROS34856758710167043703.jpeg?w=280&h=280){kind=small}
<30W Low power - Etching control precision 10mW Achieving damage-free and delicate etching processing.
- Etching Equipment
VOXIA compact X-ray CT imaging device
Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.
For correcting and fixing the warping of films, wafers, and thin plates. Choose from 3 methods × 60 standard types.
- Other semiconductor manufacturing equipment
- Visual Inspection Equipment
- Other machine elements
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Annealing furnace
VOXIA compact X-ray CT imaging device
Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.
It is a high-performance vacuum deposition source that can be used as a high-temperature heating cell for vacuum applications, with an organic deposition source up to 800°C and a metal deposition sour...
- Evaporation Equipment
- Heating device
- Electric furnace
◉Mini-BENCH-prism Semi-Automatic Ultra-High Temperature Experimental Furnace Max 2000℃
◉ Maximum operating temperature Max 2000℃ ◉ PLC semi-automatic control A higher model of the tabletop Mini-BENCH with semi-automatic control Automatically controls each process of "vacuum/purge cycle," "gas replacement," and "venting" Maximum operating temperature 2000℃ Semi-automatic control ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace ◉ Effective heating range (crucible dimensions) - Planar heater heating range: Φ2 inch to Φ6 inch - Cylindrical heater heating range: Φ30 to Φ80 x Depth Max 100(H) mm ◉ Up to 3 MFC systems for automatic flow control (or manual adjustment) ◉ APC automatic pressure control ◉ Ensures safety during operation Monitors abnormal cooling water, chamber temperature, and overpressure. Made of SUS, the robust water-cooled chamber can be safely used even during continuous operation at maximum temperature. ◉ Compact and space-saving Width 603 x Depth 603 x Height 1,160 mm (*Installed inside rotary pump housing) Various sample heating experiments, such as ultra-high temperature heating of small samples and new material research and development, can be easily performed with simple operations. The main unit is compact yet can be used for research and development in various fields.
Wide range of support from surface-treated steel plates to heavy processing! Combinations of polishing brushes, polishing wheels, vertical brushes, and wire brushes are available for selection.
- Wafer processing/polishing equipment
- Other abrasives
- Other surface treatment equipment
Resist coater for cover glass integrated touch panel (OGS)
- Resist Device
A 3D spray coater that can be applied to any 3D shape. It reads the substrate shape with a laser scanner and automatically generates the application path.
- Coater
High-precision spray coater designed for developers for process development of various nano materials such as touch panels and fuel cells!
- Coater
An electrical characteristic testing system that maximizes the performance of power devices for EV control.
- Tester
- Semiconductor inspection/test equipment
- Testing Equipment and Devices
SPEA DOT800T Electrical Characteristic Testing System for Power Devices
- Tester
- Semiconductor inspection/test equipment
- Testing Equipment and Devices
We will solve the shortage of outsourcing partners for precision processing due to capacity overload at existing factories, such as in semiconductors and precision components.
- Etching Equipment
We aim to support our customers in mastering all aspects of their maintenance strategy!
- Tester
We will maintain the assets on the vehicle and along the tracks in good repair condition!
- Tester
This is the latest version of the tester that has been introduced around the world for many years!
- Tester
A cost-effective device with powerful capabilities in a compact size!
- Tester
Component-level diagnostics and high-performance functional testing in a single system!
- Tester
This is a product for simplified testing of circuit card assemblies!
- Tester
It is a product suitable for both old-style replacements and new test stations!
- Tester
This is a product for detecting and identifying faults in circuit cards that is expandable and affordably priced!
- Tester
It completely detects, isolates, and repairs wiring faults even in extremely harsh environments!
- Tester
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
- Sputtering Equipment
- Evaporation Equipment
VOXIA compact X-ray CT imaging device
Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.
Low-cost minimum necessary configuration (manual control) applicable as tubular furnace, diffusion furnace, and thermal CVD.
- Oxidation/Diffusion Device
◉Mini-BENCH-prism Semi-Automatic Ultra-High Temperature Experimental Furnace Max 2000℃
◉ Maximum operating temperature Max 2000℃ ◉ PLC semi-automatic control A higher model of the tabletop Mini-BENCH with semi-automatic control Automatically controls each process of "vacuum/purge cycle," "gas replacement," and "venting" Maximum operating temperature 2000℃ Semi-automatic control ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace ◉ Effective heating range (crucible dimensions) - Planar heater heating range: Φ2 inch to Φ6 inch - Cylindrical heater heating range: Φ30 to Φ80 x Depth Max 100(H) mm ◉ Up to 3 MFC systems for automatic flow control (or manual adjustment) ◉ APC automatic pressure control ◉ Ensures safety during operation Monitors abnormal cooling water, chamber temperature, and overpressure. Made of SUS, the robust water-cooled chamber can be safely used even during continuous operation at maximum temperature. ◉ Compact and space-saving Width 603 x Depth 603 x Height 1,160 mm (*Installed inside rotary pump housing) Various sample heating experiments, such as ultra-high temperature heating of small samples and new material research and development, can be easily performed with simple operations. The main unit is compact yet can be used for research and development in various fields.