We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. 共栄電資 Tokyo//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 null/null
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Substrate Product ranking

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. Busbar for Data Centers - High Current Board 共栄電資
  2. FPC for the space industry 太洋テクノレックス 本社　和歌山
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  5. 5 CAN/CANFD communication is possible with the sequencer! CANNEX サンプロシステム

Substrate Product List

421～450 item / All 1948 items

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Special Printed Circuit Board Manufacturing Service for LED Lighting (Metal Base Board)

Special Printed Circuit Board Manufacturing Service for LED Lighting (Metal Base Board)

Ideal for LED lighting products with high temperatures. Significantly reduces lifespan deterioration due to reasons other than the LED chip.

We offer a variety of materials, including aluminum and copper, in different thicknesses, allowing for the production of metal base substrates with various specifications. LEDs are characterized by their energy efficiency, brightness, and long lifespan; however, one drawback is that their lifespan can decrease due to factors other than the heat generated by the LED chip, which can be problematic. Metal base substrates are designed to dissipate the heat generated by the LED during operation. By using materials such as aluminum or copper, which have good thermal conductivity, we can effectively dissipate the heat generated by the LED. For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Substrate

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Printed circuit board manufacturing - single-sided board

Printed circuit board manufacturing - single-sided board

Standard materials: Galapagos substrate, paper phenol, composite.

We use FR-4 (glass epoxy substrate), FR-1 (paper phenolic), and CEM-3 (composite) as standard materials. We offer a wide range of thicknesses from 0.5mm to 2.0mm to meet our customers' needs. *Other thicknesses can also be accommodated by using double-sided materials. We can ship within the shortest possible working days of 1 day. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board
  • Substrate

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Printed circuit board manufacturing double-sided flexible circuit board

Printed circuit board manufacturing double-sided flexible circuit board

The thinnest flexible substrate with a total thickness of 100μ is possible. Halogen-free options are also available.

Like one-sided flex, we have a variety of materials in stock. The thinnest option allows for a total thickness of 100μ for flex PCBs, and of course, we can also accommodate halogen-free requirements. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board
  • Substrate

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Printed circuit board manufacturing - build-up boards

Printed circuit board manufacturing - build-up boards

This is a method of forming a build-up layer on top of a core substrate.

The precision of printed circuit boards has advanced, leading to an increased demand for printed wiring boards using the build-up method. The build-up method is a construction technique that forms build-up layers on top of a core substrate. The connection between the core substrate and the build-up layers is made using laser vias. By using this method, it becomes possible to achieve higher density wiring. Currently, we can accommodate up to two-layer builds (two layers of build-up layers above and below). Additionally, we can also handle stack vias and filled vias. We have a track record of manufacturing rigid-flex boards and multilayer flex boards using the build-up method. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board
  • Substrate

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Special Printed Circuit Board Manufacturing - Impedance Control Board

Special Printed Circuit Board Manufacturing - Impedance Control Board

Control the pattern width and interlayer thickness to perform impedance control.

Based on our extensive past experience, we control the pattern width and layer thickness to perform impedance control. By using the Polar company's impedance simulation software 'Si8000', we can pre-calculate the impedance values of the completed circuit boards, enabling accurate impedance control. Additionally, we can simulate the layer configuration, line width, and spacing during the pattern design phase, allowing us to propose specifications that facilitate easier impedance control. For measuring the impedance of the completed circuit boards, we use the 'MZPC50' measuring instrument from Microcraft Co., Ltd., and we can provide measurement results (using the TDR method). For more details, please contact us or refer to our catalog.

  • Printed Circuit Board
  • Substrate

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Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

This is a circuit board with resin embedded in the through holes and pads placed on top.

This is a circuit board designed to secure the mounting space for components by embedding resin in through-holes and providing pads on top. With the trend towards narrower pitches for components such as BGA and CSP, the demand has increased. Resin and metal paste are embedded using vacuum printing. For more details, please contact us or refer to the catalog.

  • Printed Circuit Board
  • Substrate

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Benefits of K2: Reducing initial costs of flexible circuit boards.

Benefits of K2: Reducing initial costs of flexible circuit boards.

Mold cost 0 yen! Cut initial costs to manufacture flexible substrates cheaply and quickly!

At K2, we do not create molds or Thomson molds (Victoria molds) for small lot production of flexible printed circuits, which generally allows us to respond to the time-consuming flexible circuit manufacturing with short lead times. Since there are no costs for creating molds, we can significantly reduce the initial costs, making our prices attractive. Furthermore, this method allows for individual correction of each circuit board, providing the advantage of high quality. 【Features】 ■ Flexible circuit board mold cost: 0 yen ■ Short lead times ■ High quality *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Supporting all types of printed circuit board manufacturing! 'K2's Special Board Manufacturing'

Supporting all types of printed circuit board manufacturing! 'K2's Special Board Manufacturing'

We can manufacture special circuit boards that align with your design philosophy! We also accommodate high-difficulty designs and specifications.

Our company possesses a series of equipment necessary for substrate manufacturing, including plating process equipment and manufacturing lines for build-up substrates. We can consistently produce specialized substrates that require advanced processing technology and precision, and we can provide them in a short delivery time. Additionally, for inquiries regarding environmental surveys or after the substrate manufacturing, our specialized staff will be ready to respond thoroughly even after delivery. 【Features】 ■ Flexible response to detailed customer requests ■ Thorough data checks contribute to reducing delivery times and costs ■ Short delivery times possible through in-house integrated production and strict delivery management *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Printed Circuit Board
  • Substrate

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Have you ever been turned down for special substrate manufacturing?

Have you ever been turned down for special substrate manufacturing?

Accurate technical advice is possible! By introducing advanced equipment, we can accommodate a wide range of specialized substrates.

Our company is capable of handling a wide range of special substrates by creatively utilizing various equipment available in-house, starting with advanced DI (Direct Imaging) equipment. Additionally, since over 90% of our staff are full-time employees, we have accumulated extensive knowledge and know-how regarding substrates by inheriting past experiences, enabling us to provide accurate technical advice to our customers. Please feel free to consult us regarding any special substrates. 【Special substrates we can handle】 ■ Build-up substrates ■ Heat dissipation substrates ■ Impedance control substrates ■ Rigid-flex and multilayer flex substrates ■ Cavity substrates ■ Fine patterns *For more details, please refer to the PDF document or feel free to contact us.

  • Other services
  • Substrate

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Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

Same manufacturing line as trial production! A 100% equipment utilization rate enables short delivery times for medium lot production.

Our company is equipped with large-capacity facilities as a prototype manufacturer, allowing us to produce not only small lots but also medium-lot prototypes and medium-volume production with short lead times. Thanks to the 100% operating rate of our large-capacity equipment, we can handle urgent requests without any issues, even for large quantities. We have secured sufficient inventory even during periods when material procurement was difficult, ensuring there are no delays in delivery. 【Features】 - Capable of producing small lots as well as medium-lot prototypes and medium-volume production with short lead times - 100% equipment operating rate - Sufficient inventory secured, with no delivery delays - Initial costs do not become excessively high - Capable of handling special substrates such as flexible and rigid-flex boards *For more details, please refer to the PDF document or feel free to contact us.

  • Other services
  • Substrate

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Are you having trouble with substrate manufacturing and component mounting?

Are you having trouble with substrate manufacturing and component mounting?

We respond to various requests! We can handle everything from circuit board design to component assembly in one go.

We design conversations with our customers with care and create simple and easy-to-understand printed circuit boards. We have various experiences in board design, including power supply, analog, and high-frequency boards, and we respond to various requests for component mounting based on quantity and requirements. Since our assembly factories also have their areas of expertise, we partner with over 10 factories and coordinate according to the project needs. We can also accommodate requests for ultra-short delivery times along with board manufacturing. 【Board Design】 ■PADS ■Quadcept ■CR8000 ■CR5000 *For more details, please refer to the PDF document or feel free to contact us.

  • Other services
  • Substrate

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We won't lose! Leave it to us for quick turnaround on build-up substrates.

We won't lose! Leave it to us for quick turnaround on build-up substrates.

High quality and quick delivery are possible! If you have any concerns, please feel free to consult with us!

K2 has all the necessary equipment for circuit board manufacturing in-house. Since we can complete all processes without relying on outsourcing, we are able to respond to short delivery times. Additionally, our factory operates on Saturdays, allowing us to count Saturdays as manufacturing days. "We can't accommodate ultra-short delivery times," "We were turned down for consultations on special circuit board manufacturing," "We have concerns about the quality of the circuit boards." We will solve these issues using K2's unique know-how. 【What K2 can do】 ◆ Number of Layers We have many manufacturing achievements from 1 to 4 layers. ◆ Capable of manufacturing with various materials and specifications We also handle complex specifications such as high-frequency build-up boards and build-up rigid-flex boards. *Depending on the specifications, we can manufacture in as little as one week. For more details, please download our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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COB for optical communication

COB for optical communication

We propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. 【Features】 ○ Excellent high-frequency characteristics Optimal material selection, layer composition, and L/S can be determined through simulation, allowing for high consistency in control. ○ High-precision contour processing High-precision CCD processing can be performed to match the position of the patterns. ○ Highly reliable surface treatment Reliable plating processes for electrolytic and electroless wire bonding with gold and Ni/Pd/Au are available. *Detailed information such as "specifications" is available in the catalog. *For more information, please contact us or download the catalog.

  • Printed Circuit Board
  • Substrate

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Ultra-thin multilayer printed circuit board

Ultra-thin multilayer printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-Sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. 【Features】 The thinnest 4-layer printed circuit board with a thickness of 0.15mm * For detailed information such as "specifications," please refer to the catalog. * For more information, please contact us or download the catalog.

  • Printed Circuit Board
  • Substrate

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Technical Introduction: "High-Frequency Technology"

Technical Introduction: "High-Frequency Technology"

Introducing high-frequency technology! We provide substrates that match the impedance of mounted components and the circuit board.

At Sato-Sen Co., Ltd., we can achieve the desired impedance matching and noise reduction through circuit design for high frequency, material selection, layer configuration, and impedance simulation based on patterns. Furthermore, we provide quality assurance with impedance measurement substrates. We also have design simulation capabilities for high frequency and a long history of mass production in the gigahertz range. 【Features】 - We offer substrates that match the impedance of mounted components and the board, which is required due to the increasing speed of transmission signals. - Using our in-house simulation software, we provide high-frequency printed circuit boards that meet your satisfaction through optimal material selection, layer configuration, and circuit design. → High-precision impedance control is possible due to our extensive database. - Impedance measurement can be conducted using our measurement equipment (TDR) with test coupons. → Compatible with Z0±7%, and prototypes can be made with ±5%. Please contact us for more details.

  • Printed Circuit Board
  • Substrate

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Single-sided flexible printed circuit board (single-sided FPC)

Single-sided flexible printed circuit board (single-sided FPC)

The most standard specifications at a low cost.

This is the most basic structure of an FPC with a conductor pattern formed only on one side.

  • Printed Circuit Board
  • Substrate

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Component Mounting Flexible Circuit Board (Component Mounting FPC)

Component Mounting Flexible Circuit Board (Component Mounting FPC)

Support for component mounting is also available.

This is an FPC with electronic components mounted.

  • Printed Circuit Board
  • Substrate

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[Processing Results] Large-scale LBO Single Crystal Substrate

[Processing Results] Large-scale LBO Single Crystal Substrate

The distortion of the wavefront achieved an excellent polishing precision of 0.26μm! We have successfully processed the polishing of LBO single crystal substrates.

This is an introduction to the polishing processing results of the "large LBO single crystal substrate" (100×100×1.5mm). The disturbance of the transmitted wavefront achieves an excellent polishing accuracy of 0.26μm. We have successfully polished the LBO single crystal substrate, which is used in the LFEX laser. 【Overview】 ■ Shape accuracy: PV0.26μm, Measurement device: Zygo Verifire ATZ ■ Surface roughness: Sa0.44nm, Measurement device: Zygo NewView 8300 ■ Substrate size: 100×100×1.5mm *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Substrate

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CAN/CANFD communication is possible with the sequencer! CANNEX

CAN/CANFD communication is possible with the sequencer! CANNEX

Leave CAN communication to us with the sequencer.

This is an interface board for performing CAN communication using the KEYENCE PLC Ethernet communication unit KV-XLE02. It can be used with Ethernet instead of USB, so a computer is not required during operation. It can be installed inside a control panel. We provide demo units, sample ladder programs, and free monitoring software for computers. The user manual can be found on our company website. https://sunprosys.co.jp/ftp/cannex/CANNEX.html Our company has extensive experience in the production of assembly and inspection equipment related to work requiring CAN/LIN communication. - Performing electrical inspections and visual inspections using image processing while moving the object via CAN communication - Controlling AMR's CAN communication with a sequencer - Automatically saving the CAN communication logs from the inspection equipment to an SD card mounted on the sequencer - Writing software to the microcontroller within the workpiece and performing assembly and electrical inspections semi-automatically.

  • PLC
  • Substrate

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Print Circuit Board Repair Pen SKETT-PEN (Assistance Paint Pen)

Print Circuit Board Repair Pen SKETT-PEN (Assistance Paint Pen)

The substrate correction becomes quick, easy, and clean.

The "SKETT-PEN" is a pen designed to fix defects in the resist layer of printed circuit boards. It is a portable type that is easy to carry, allowing for immediate work anywhere, and prevents defective products from flowing into subsequent processes. It contributes to cost reduction by minimizing waste due to correction errors. The pen tip is available in two sizes, thick and thin, and can be replaced. The ink can be diluted to the customer's desired color. *However, there are some inks that cannot be used. Based on our usage experience, we recommend UV curing types. 【Features】 ○ Easy to carry, can be used in any work location, and prevents defective products from flowing into subsequent processes ○ Reduces variation in correction finish and waste due to correction errors ○ Shaking the pen stirs the ink inside, allowing for uniform application at any time ○ Two types of pen tips (thick and thin) are selectable and replaceable ○ Using a thin pen tip allows for the correction of fine defects that were previously difficult to address For more details, please download the catalog or contact us.

  • Printed Circuit Board
  • Substrate

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Simple wrist-type frequency correction vibration acceleration effective value measuring instrument 'TVHP-001'

Simple wrist-type frequency correction vibration acceleration effective value measuring instrument 'TVHP-001'

Instantly measure work vibrations with a simple switch operation! This is a measuring device for vibration tool management personnel.

The 『TVHP-001』 is a simple handheld vibration acceleration effective value measuring device that can measure various vibrating tools with frequency correction. With easy switch operation, it instantly measures work vibrations. There are no complicated operating procedures, making it easy to introduce. It features a built-in lithium-ion battery that can be used for long periods when fully charged. It is available at an affordable low price. 【Features】 ■ Instantly measures work vibrations with simple switch operation ■ Easy to introduce due to the absence of complicated operating procedures ■ Built-in lithium-ion battery that can be used for long periods when fully charged ■ Capable of measuring various vibrating tools ■ Achieved at an affordable low price *For more details, please refer to the PDF document or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Substrate

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Production equipment and tools: tabletop small liquid sprayer

Production equipment and tools: tabletop small liquid sprayer

Inline process for liquid spraying! Reduction of environmental impact and reduction of solvent usage.

Maruhi Co., Ltd. is engaged in everything from the design and development of production equipment and tools to parts processing and assembly. We possess processing equipment such as NC lathes, machining centers, wire cutting, inner diameter grinding, and outer diameter grinding, and we respond to customer requests from prototype to mass production. The tabletop small liquid sprayer is an ideal product for inline liquid spraying processes. It is a low-cost solution that reduces environmental impact and solvent usage. It is easy to clean and simple to change setups. For more details, please contact us or refer to our catalog.

  • Painting Machine
  • Substrate

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Dynamic Map "Millimeter Wave Wiring Circuit Board"

Dynamic Map "Millimeter Wave Wiring Circuit Board"

Patent research materials related to millimeter-wave wiring circuit boards.

We offer a dynamic map titled "Millimeter Wave Wiring Circuit Board," which focuses on wiring board technology that supports millimeter wave and terahertz wave transmission, as well as related materials and electronic component technologies. This dynamic map utilizes recent domestic public patent information, where technical experts conduct patent research and classification to track the activities of companies and research institutions working on 6G. It visualizes the movements of technology based on patent information, providing an overview of the advanced patent environment. [Related Materials] ■ Dynamic Map "Post 5G - 6G Low Dielectric and Low Loss Materials" ■ Dynamic Map "6G and Transmission Lines" ■ Dynamic Map "Metamaterial Application Development" ■ Patent Guidebook "Information and Communication Series" ■ Invention Derivation Guidebook "Information and Communication Series" *For more details, please download the PDF or feel free to contact us.

  • Patent/Copyright related services
  • Substrate

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Ricoh GEN5 Inkjet Head Controller Drive Board

Ricoh GEN5 Inkjet Head Controller Drive Board

Controller drive board for GEN5 (Ricoh wide format head) and CMYK color printing control software. A starter kit is also available.

Controller drive board for GEN5 (Ricoh wide format head) and CMYK color printing control software. A starter kit is also available. Ricoh GEN5 Head Development Kit 　　⇒ Total amount: ¥5,300,000 (includes 2 heads and control board) 　　GEN5 dual-head control AMP board: ¥4,500,000 　　* USB interface / encoder synchronization 　　* Please order in lots of 4: ¥1,800,000 (4 pieces, 8 heads possible) 　　PC printing control software, CMYK compatible (our specifications, 8 head control) 　　* First time only, license-free: ¥3,500,000 　　* RIP software, PDF data, 6 colors / 8 colors, etc. are also available for consultation. 1. The head control unit and drive AMP for GEN5 are integrated into a single board. 　　* Power will not be unintentionally cut off. 　　* Head temperature and board temperature can be measured. 2. Maximum ejection cycle of 30 kHz. Can be synchronized with the transport system encoder. 3. Multi-drop compatible. Head temperature control is possible. 4. The interface with the printing PC uses USB (maximum 12 Mbps). 5. Multiple units can be used to configure a CMYK color printer. 6. There is software for generating head drive waveforms.

  • Other process controls
  • Substrate

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Kyocera KJ4A/B Inkjet Head Drive Board

Kyocera KJ4A/B Inkjet Head Drive Board

This is a drive board for the Kyocera inkjet head KJ4A/B.

This is a drive board for the Kyocera Inkjet Head KJ4A/B. Kyocera KJ4A/B Head Development Kit 　　⇒ Total amount: ¥4,940,000 　　1 Head Control Board　　　　@ ¥180,000 　　　　　・Optional head extension board/cable available. 　　　　　　　　　　　　　　　　　　@ ¥15,000 　　※ USB interface/encoder synchronization ※ High-speed PCIe (dedicated) interface/encoder synchronization 　　　　　・Transfer speed: maximum 20MB/second 　　　　　・Can print different printing data 3 times/second 　　　　　・One PCIe board can control 8 head control boards 　　　　　・Optional price: @ ¥850,000 per board 　　※ Please order in lots of 8 boards: ¥1,440,000 (8 boards for 8 heads) 　　Computer printing control software compatible with CMYK Paint Shop 　　　(Our specifications, controls 4 to 8 heads,) 　　※ First time only, license-free: ¥3,500,000

  • Other electronic parts
  • Substrate

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Konica Minolta Inkjet Head Circuit Board KM256LNB-DPN

Konica Minolta Inkjet Head Circuit Board KM256LNB-DPN

Konica Minolta Inkjet Head Controller KM256LNB-DPN DPN control head drive board.

1. Konica Minolta inkjet head controller. KM256LNB-DPN DPN control head drive board. 2. It can be used with a maximum of 10 to 40 boards. 3. There is a PCIe board for high-speed data driving from a computer. 4. It can be synchronized with an encoder of 0.1 micrometers. Konica Minolta KM1024i head development kit ⇒ Total amount: ¥4,900,000 1 head control AMP board @ ¥350,000 * USB interface / encoder synchronization * Please order in lots of 4 boards: ¥1,400,000 (4 boards for 4 heads possible) Computer printing control software, compatible with CMYK Paint Shop (Our specifications, control of 4 to 8 heads, capable of gradation printing) * First time only, license-free: ¥3,500,000 * KM1024i head supply is also possible. Please consult with us. * Please consult regarding RIP software, PDF data, 6 colors/8 colors, etc.

  • Other electronic parts
  • Substrate

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Inkjet DPN head control device with 1% accuracy support

Inkjet DPN head control device with 1% accuracy support

Achieved 1% precision head control through inkjet DPN discharge control.

This is a control board for two types of DPN heads compatible with Konica Minolta models KM256LNB-DPN and KM128SNG-MB. It supports diagonal head arrangement, allows high-speed ejection at 50 kHz, and can simultaneously use a maximum of 10 to 40 heads.

  • Other semiconductor manufacturing equipment
  • Other process controls
  • Other semiconductors
  • Substrate

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