We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 562 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. Understand in 3 minutes! Solder Resist Formation Technology [Materials Provided] プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  2. Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm] 共栄電資
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社　和歌山
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室

Substrate Product List

421～450 item / All 1924 items

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COB for optical communication

COB for optical communication

We propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. 【Features】 ○ Excellent high-frequency characteristics Optimal material selection, layer composition, and L/S can be determined through simulation, allowing for high consistency in control. ○ High-precision contour processing High-precision CCD processing can be performed to match the position of the patterns. ○ Highly reliable surface treatment Reliable plating processes for electrolytic and electroless wire bonding with gold and Ni/Pd/Au are available. *Detailed information such as "specifications" is available in the catalog. *For more information, please contact us or download the catalog.

  • Printed Circuit Board
  • Substrate

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Ultra-thin multilayer printed circuit board

Ultra-thin multilayer printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-Sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. 【Features】 The thinnest 4-layer printed circuit board with a thickness of 0.15mm * For detailed information such as "specifications," please refer to the catalog. * For more information, please contact us or download the catalog.

  • Printed Circuit Board
  • Substrate

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Technical Introduction: "High-Frequency Technology"

Technical Introduction: "High-Frequency Technology"

Introducing high-frequency technology! We provide substrates that match the impedance of mounted components and the circuit board.

At Sato-Sen Co., Ltd., we can achieve the desired impedance matching and noise reduction through circuit design for high frequency, material selection, layer configuration, and impedance simulation based on patterns. Furthermore, we provide quality assurance with impedance measurement substrates. We also have design simulation capabilities for high frequency and a long history of mass production in the gigahertz range. 【Features】 - We offer substrates that match the impedance of mounted components and the board, which is required due to the increasing speed of transmission signals. - Using our in-house simulation software, we provide high-frequency printed circuit boards that meet your satisfaction through optimal material selection, layer configuration, and circuit design. → High-precision impedance control is possible due to our extensive database. - Impedance measurement can be conducted using our measurement equipment (TDR) with test coupons. → Compatible with Z0±7%, and prototypes can be made with ±5%. Please contact us for more details.

  • Printed Circuit Board
  • Substrate

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Single-sided flexible printed circuit board (single-sided FPC)

Single-sided flexible printed circuit board (single-sided FPC)

The most standard specifications at a low cost.

This is the most basic structure of an FPC with a conductor pattern formed only on one side.

  • Printed Circuit Board
  • Substrate

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Component Mounting Flexible Circuit Board (Component Mounting FPC)

Component Mounting Flexible Circuit Board (Component Mounting FPC)

Support for component mounting is also available.

This is an FPC with electronic components mounted.

  • Printed Circuit Board
  • Substrate

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[Processing Results] Large-scale LBO Single Crystal Substrate

[Processing Results] Large-scale LBO Single Crystal Substrate

The distortion of the wavefront achieved an excellent polishing precision of 0.26μm! We have successfully processed the polishing of LBO single crystal substrates.

This is an introduction to the polishing processing results of the "large LBO single crystal substrate" (100×100×1.5mm). The disturbance of the transmitted wavefront achieves an excellent polishing accuracy of 0.26μm. We have successfully polished the LBO single crystal substrate, which is used in the LFEX laser. 【Overview】 ■ Shape accuracy: PV0.26μm, Measurement device: Zygo Verifire ATZ ■ Surface roughness: Sa0.44nm, Measurement device: Zygo NewView 8300 ■ Substrate size: 100×100×1.5mm *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Substrate

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CAN/CANFD communication is possible with the sequencer! CANNEX

CAN/CANFD communication is possible with the sequencer! CANNEX

Leave CAN communication to us with the sequencer.

This is an interface board for performing CAN communication using the KEYENCE PLC Ethernet communication unit KV-XLE02. It can be used with Ethernet instead of USB, so a computer is not required during operation. It can be installed inside a control panel. We provide demo units, sample ladder programs, and free monitoring software for computers. The user manual can be found on our company website. https://sunprosys.co.jp/ftp/cannex/CANNEX.html Our company has extensive experience in the production of assembly and inspection equipment related to work requiring CAN/LIN communication. - Performing electrical inspections and visual inspections using image processing while moving the object via CAN communication - Controlling AMR's CAN communication with a sequencer - Automatically saving the CAN communication logs from the inspection equipment to an SD card mounted on the sequencer - Writing software to the microcontroller within the workpiece and performing assembly and electrical inspections semi-automatically.

  • PLC
  • Substrate

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Print Circuit Board Repair Pen SKETT-PEN (Assistance Paint Pen)

Print Circuit Board Repair Pen SKETT-PEN (Assistance Paint Pen)

The substrate correction becomes quick, easy, and clean.

The "SKETT-PEN" is a pen designed to fix defects in the resist layer of printed circuit boards. It is a portable type that is easy to carry, allowing for immediate work anywhere, and prevents defective products from flowing into subsequent processes. It contributes to cost reduction by minimizing waste due to correction errors. The pen tip is available in two sizes, thick and thin, and can be replaced. The ink can be diluted to the customer's desired color. *However, there are some inks that cannot be used. Based on our usage experience, we recommend UV curing types. 【Features】 ○ Easy to carry, can be used in any work location, and prevents defective products from flowing into subsequent processes ○ Reduces variation in correction finish and waste due to correction errors ○ Shaking the pen stirs the ink inside, allowing for uniform application at any time ○ Two types of pen tips (thick and thin) are selectable and replaceable ○ Using a thin pen tip allows for the correction of fine defects that were previously difficult to address For more details, please download the catalog or contact us.

  • Printed Circuit Board
  • Substrate

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Simple wrist-type frequency correction vibration acceleration effective value measuring instrument 'TVHP-001'

Simple wrist-type frequency correction vibration acceleration effective value measuring instrument 'TVHP-001'

Instantly measure work vibrations with a simple switch operation! This is a measuring device for vibration tool management personnel.

The 『TVHP-001』 is a simple handheld vibration acceleration effective value measuring device that can measure various vibrating tools with frequency correction. With easy switch operation, it instantly measures work vibrations. There are no complicated operating procedures, making it easy to introduce. It features a built-in lithium-ion battery that can be used for long periods when fully charged. It is available at an affordable low price. 【Features】 ■ Instantly measures work vibrations with simple switch operation ■ Easy to introduce due to the absence of complicated operating procedures ■ Built-in lithium-ion battery that can be used for long periods when fully charged ■ Capable of measuring various vibrating tools ■ Achieved at an affordable low price *For more details, please refer to the PDF document or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Substrate

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Production equipment and tools: tabletop small liquid sprayer

Production equipment and tools: tabletop small liquid sprayer

Inline process for liquid spraying! Reduction of environmental impact and reduction of solvent usage.

Maruhi Co., Ltd. is engaged in everything from the design and development of production equipment and tools to parts processing and assembly. We possess processing equipment such as NC lathes, machining centers, wire cutting, inner diameter grinding, and outer diameter grinding, and we respond to customer requests from prototype to mass production. The tabletop small liquid sprayer is an ideal product for inline liquid spraying processes. It is a low-cost solution that reduces environmental impact and solvent usage. It is easy to clean and simple to change setups. For more details, please contact us or refer to our catalog.

  • Painting Machine
  • Substrate

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Dynamic Map "Millimeter Wave Wiring Circuit Board"

Dynamic Map "Millimeter Wave Wiring Circuit Board"

Patent research materials related to millimeter-wave wiring circuit boards.

We offer a dynamic map titled "Millimeter Wave Wiring Circuit Board," which focuses on wiring board technology that supports millimeter wave and terahertz wave transmission, as well as related materials and electronic component technologies. This dynamic map utilizes recent domestic public patent information, where technical experts conduct patent research and classification to track the activities of companies and research institutions working on 6G. It visualizes the movements of technology based on patent information, providing an overview of the advanced patent environment. [Related Materials] ■ Dynamic Map "Post 5G - 6G Low Dielectric and Low Loss Materials" ■ Dynamic Map "6G and Transmission Lines" ■ Dynamic Map "Metamaterial Application Development" ■ Patent Guidebook "Information and Communication Series" ■ Invention Derivation Guidebook "Information and Communication Series" *For more details, please download the PDF or feel free to contact us.

  • Patent/Copyright related services
  • Substrate

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Ricoh GEN5 Inkjet Head Controller Drive Board

Ricoh GEN5 Inkjet Head Controller Drive Board

Controller drive board for GEN5 (Ricoh wide format head) and CMYK color printing control software. A starter kit is also available.

Controller drive board for GEN5 (Ricoh wide format head) and CMYK color printing control software. A starter kit is also available. Ricoh GEN5 Head Development Kit 　　⇒ Total amount: ¥5,300,000 (includes 2 heads and control board) 　　GEN5 dual-head control AMP board: ¥4,500,000 　　* USB interface / encoder synchronization 　　* Please order in lots of 4: ¥1,800,000 (4 pieces, 8 heads possible) 　　PC printing control software, CMYK compatible (our specifications, 8 head control) 　　* First time only, license-free: ¥3,500,000 　　* RIP software, PDF data, 6 colors / 8 colors, etc. are also available for consultation. 1. The head control unit and drive AMP for GEN5 are integrated into a single board. 　　* Power will not be unintentionally cut off. 　　* Head temperature and board temperature can be measured. 2. Maximum ejection cycle of 30 kHz. Can be synchronized with the transport system encoder. 3. Multi-drop compatible. Head temperature control is possible. 4. The interface with the printing PC uses USB (maximum 12 Mbps). 5. Multiple units can be used to configure a CMYK color printer. 6. There is software for generating head drive waveforms.

  • Other process controls
  • Substrate

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Kyocera KJ4A/B Inkjet Head Drive Board

Kyocera KJ4A/B Inkjet Head Drive Board

This is a drive board for the Kyocera inkjet head KJ4A/B.

This is a drive board for the Kyocera Inkjet Head KJ4A/B. Kyocera KJ4A/B Head Development Kit 　　⇒ Total amount: ¥4,940,000 　　1 Head Control Board　　　　@ ¥180,000 　　　　　・Optional head extension board/cable available. 　　　　　　　　　　　　　　　　　　@ ¥15,000 　　※ USB interface/encoder synchronization ※ High-speed PCIe (dedicated) interface/encoder synchronization 　　　　　・Transfer speed: maximum 20MB/second 　　　　　・Can print different printing data 3 times/second 　　　　　・One PCIe board can control 8 head control boards 　　　　　・Optional price: @ ¥850,000 per board 　　※ Please order in lots of 8 boards: ¥1,440,000 (8 boards for 8 heads) 　　Computer printing control software compatible with CMYK Paint Shop 　　　(Our specifications, controls 4 to 8 heads,) 　　※ First time only, license-free: ¥3,500,000

  • Other electronic parts
  • Substrate

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Konica Minolta Inkjet Head Circuit Board KM256LNB-DPN

Konica Minolta Inkjet Head Circuit Board KM256LNB-DPN

Konica Minolta Inkjet Head Controller KM256LNB-DPN DPN control head drive board.

1. Konica Minolta inkjet head controller. KM256LNB-DPN DPN control head drive board. 2. It can be used with a maximum of 10 to 40 boards. 3. There is a PCIe board for high-speed data driving from a computer. 4. It can be synchronized with an encoder of 0.1 micrometers. Konica Minolta KM1024i head development kit ⇒ Total amount: ¥4,900,000 1 head control AMP board @ ¥350,000 * USB interface / encoder synchronization * Please order in lots of 4 boards: ¥1,400,000 (4 boards for 4 heads possible) Computer printing control software, compatible with CMYK Paint Shop (Our specifications, control of 4 to 8 heads, capable of gradation printing) * First time only, license-free: ¥3,500,000 * KM1024i head supply is also possible. Please consult with us. * Please consult regarding RIP software, PDF data, 6 colors/8 colors, etc.

  • Other electronic parts
  • Substrate

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Inkjet DPN head control device with 1% accuracy support

Inkjet DPN head control device with 1% accuracy support

Achieved 1% precision head control through inkjet DPN discharge control.

This is a control board for two types of DPN heads compatible with Konica Minolta models KM256LNB-DPN and KM128SNG-MB. It supports diagonal head arrangement, allows high-speed ejection at 50 kHz, and can simultaneously use a maximum of 10 to 40 heads.

  • Other semiconductor manufacturing equipment
  • Other process controls
  • Other semiconductors
  • Substrate

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Current vector control and three-phase PWM motor control board

Current vector control and three-phase PWM motor control board

The current vector control program (d-q coordinate transformation) was implemented with three-phase PWM.

Digital Servo Control Technology and Program Current Vector Control Program (d-q Coordinate Transformation) realized with 3-phase PWM Compatible with ARM-based CPUs from various manufacturers: Cortex-M3 series, STMicroelectronics, Freescale, Toshiba, Fujitsu, Texas Instruments, etc. Renesas SH series.

  • Servo
  • Substrate

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Dimatix Inkjet Head SG/PQ/QS/QE Board

Dimatix Inkjet Head SG/PQ/QS/QE Board

Fujifilm Dimatix inkjet head drive controller board SG/PQ/QS/QE control.

This is a Fujifilm Dimatix inkjet head drive controller board. It can control SG/PQ/QS/QE. The pulse width is variable, and there is an optional head drive waveform generation software. The maximum ejection cycle is 20kHz and it can be synchronized with a transport system encoder. It can be connected to a printing PC via a dedicated PCIe board, supporting up to 10 heads. Bitmap data can be used for printing, and there is also printing control software available. Ink circulation pumps are available for separate purchase. Dimatix SG/PQ/QS head development kit ⇒ Total price: ¥4,900,000 1 head control AMP board: ¥3,500,000 * USB interface / encoder synchronization * Please order in lots of 4: ¥1,400,000 (4 boards for 4 heads) Computer printing control software, CMYK compatible (our specifications, controls 8 heads) * License-free for the first time: ¥3,500,000 * Dimatix head supply is also possible. * Please consult us about RIP software, PDF data, 6 colors/8 colors, etc. * Ink circulation module for SG: ¥600,000

  • Other process controls
  • Other semiconductor manufacturing equipment
  • Substrate

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PCIe board for high-speed inkjet printing and multi-head control.

PCIe board for high-speed inkjet printing and multi-head control.

High-speed label printer that changes the design with each print, one-pass super wide color printer (up to 40 heads), high-speed large 3D printer.

High-speed label printer that changes designs with each print. The GEN5 can change and print designs of 100mm in length at a rate of 12 types per second, with a printing speed of 72m/min. Compatible with various heads: Kyocera, Dimatix, Konica Minolta, and others. Single-pass ultra-wide color printer (up to 40 heads). For high-speed, large 3D printers.

  • Other FA equipment
  • Substrate

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Konica Minolta KM1024i/1800i shared control board

Konica Minolta KM1024i/1800i shared control board

Konica Minolta KM1024i/KM1800i head control board - Head waveform generation software - Extension cable available between control board and head.

Konica Minolta KM1024i/KM1800i Head Control Board - Head drive waveform generation software; extension cable available between control board and head - Head connection cable can be extended (up to about 5m) - Can be synchronized with the transport system encoder (using PCIe board) - Full specification control of KM1024i/KM1800i possible - Maximum discharge cycle of 30 kHz - Head temperature control (heating) possible - Printing PC and printing control board connected and data transferred via high-speed PCIe board * PCIe has a maximum data transfer speed of 350 MB/s * Head control board receives at 20 MB/s from PCIe board * Industry's fastest - PCIe board can control up to 10 head control boards per PCIe board - Up to 4 PCIe boards can be inserted into a standard PC * For label printing, PCIe board can be used to change printing data for each print (up to about 3 times/second) - Multiple units can be used (up to 40 heads) to create a printing machine with 10 heads per CMYK color - Bitmap data is used for printing * Available for user printing machines via DLL

  • Other FA equipment
  • Substrate

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Substrate "Flexible Printed Circuit (FPC)" / NOK

Substrate "Flexible Printed Circuit (FPC)" / NOK

Replacement from the harness is also possible! An extremely thin and flexible circuit board that can be bent freely.

"Flexible Printed Circuit (FPC)" is a circuit board with excellent bending durability, formed on a thin and sturdy film. It can replace harnesses (wires), and it is also capable of shielding processing, waterproofing, and component mounting. Leveraging its features of being "thin," "light," "flexible," and "high-density mounting," it is an indispensable product for miniaturization and weight reduction of portable electronic devices, as well as for space-saving and wiring simplification in various industrial equipment, devices, and automobiles. 【Features】 ■ Extremely thin and can be bent freely ■ Can replace harnesses (wires) ■ Much thinner and lighter compared to rigid boards and harnesses ■ Capable of shielding processing, waterproofing, and component mounting *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Face Corporation Company Profile

Face Corporation Company Profile

Comprehensive support from design and procurement to production. We strive to provide services that exceed expectations.

Face Corporation is a contract manufacturing company specializing in EMS (Electronic Manufacturing Services) for a wide variety of small quantities, as well as industrial electronic devices (circuit boards and unit assembly for control and power equipment). We are capable of handling everything from circuit design and board design to material procurement and various environmental surveys related to these processes. We strive to provide flexible services that exceed customer expectations, aiming to be a company that can be entrusted with peace of mind. 【Business Overview】 ■ EMS (Contract Manufacturing Service for Electronic Devices) *For more details, please refer to the PDF document or feel free to contact us.

  • EMS
  • Substrate

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Microwave Band Low Noise Amplifier "EV860"

Microwave Band Low Noise Amplifier "EV860"

It is a low-noise amplifier that can be used in the 7GHz band.

The microwave band low noise amplifier "EV860" is a low noise amplifier that can be used in the 7GHz band. It can be used in the front-end section of FPU devices, RF input sections of ROF devices, etc. 【Features】 ○ Low noise: NF = 1.5dB or less ○ Compatible with digital STL/TTL and C/D bands ○ Usable with a single power supply (DC +12V) For more details, please contact us or download the catalog.

  • Other electronic parts
  • Substrate

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AuSn solder

AuSn solder

By pre-applying AuSn solder to the circuit board, it becomes possible to directly mount chip components, thereby reducing assembly labor.

【Features】 ○ AuSn composition: Au:Sn=7:3 (standard) (other compositions are also available) ○ Standard film thickness (t): 3μm ○ Film thickness tolerance: ±20% ○ Pattern minimum dimension (D): 50μm ○ Pattern tolerance: ±10μm ● For other functions and details, please contact us.

  • Other electronic parts
  • Substrate

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Electronic Ceramics (Thin film integrated circuit components & Substrates)

Electronic Ceramics (Thin film integrated circuit components & Substrates)

A thin film integrated circuit pattern will be formed on a ceramic substrate.

By using alumina with a purity of 99.9%, we provide fine circuit patterns (line/space=30um/30um) that enable operation in the 30GHz band required for next-generation wireless communication systems. 【Thin Film Integrated Circuits】 We pattern integrated circuits on various ceramic substrates. ●Side patterns (over 0.3t), and AuSn solder patterns is possible. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors is possible. ● The combination of our unique 99.9% alumina substrate and fine patterns allows for the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● For substrate materials, we also accommodate aluminum nitride (ALN) substrates, quartz substrates, and more. 【High-Quality Alumina Substrates】 ● Dense ● The three-point bending strength is 660MPa, which is significantly higher than conventional products (about twice as much). ● Excellent electrical properties with low dielectric loss in high-frequency bands.

  • High frequency/microwave parts
  • Fine Ceramics
  • Circuit board design and manufacturing
  • Substrate

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Characteristics and Applications of Various Ceramic Substrates

Characteristics and Applications of Various Ceramic Substrates

Consistent production from manufacturing ceramics substrates with low dielectric loss in the microwave band, microwave dielectric substrates, to the formation of thin film patterns.

【High-Quality Alumina Substrate】 ○ Dense ○ The three-point bending strength is 660 MPa, which is significantly higher, about twice that of conventional products ○ Excellent electrical properties with low dielectric loss in the high-frequency range 【Zirconia Substrate】 ○ High strength and high toughness ○ Large elastic deformation capacity in bendable ceramics 【High Dielectric Substrate】 ○ Due to its high relative permittivity, it enables miniaturization of high-frequency circuits compared to alumina substrates ○ Low dielectric loss even in the high-frequency range 【Thin Film Integrated Circuit】 (Circuit formation on various ceramic substrates) ○ Formation of air bridges, side patterns (0.5t or more), and AuSn solder patterns is possible ○ Simultaneous mounting of conductors, thin-film resistors, and thin-film inductors is possible ○ By combining a unique 99.9% alumina substrate with fine patterns, it enables the formation of low-loss and low-noise circuits in the high-frequency range ○ Substrate materials also include high dielectric substrates, aluminum nitride substrates (AlN substrates), and quartz substrates.

  • High frequency/microwave parts
  • Fine Ceramics
  • Substrate

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Lighter than aluminum, with the rigidity of steel - the birth of Super Material SA001.

Lighter than aluminum, with the rigidity of steel - the birth of Super Material SA001.

The silicon/aluminum composite material SA001, created by our unique composite technology, is lighter than aluminum and has the Young's modulus of cast iron, while also accommodating hollow structures through bonding technology.

We have developed a composite material SA001 made of metallic silicon and aluminum. This super material is lighter than aluminum, has a higher Young's modulus than cast iron, and boasts a specific stiffness that is twice that of aluminum. Thanks to our joining technology, it can also accommodate hollow structures and built-in flow paths. ● Adoption achievements: Parts for high-precision 3D measuring machines, parts for semiconductor manufacturing equipment ● Application proposal: Temperature control plates for electrostatic chucks * By changing the material from aluminum to SA001, we can resolve the thermal expansion difference issue with alumina ESC.

  • Other metal materials
  • aluminum
  • Composite Materials
  • Substrate

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3D processing ceramic products

3D processing ceramic products

The use of ceramics has expanded due to high-precision processing of complex shapes and curved surfaces using 5-axis machining.

The introduction of a 5-axis machining machine, which adds the C-axis (table rotation) and A-axis (table tilt axis) to the X, Y, and Z axes, has made it possible to achieve high-precision machining of complex shapes and curved surfaces, thereby expanding the applications of ceramics. Cost reduction is also expected due to the reduction in setup time.

  • Fine Ceramics
  • Other molds
  • Other machine elements
  • Substrate

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Formation of thin-film integrated circuits on stepped ceramic substrates.

Formation of thin-film integrated circuits on stepped ceramic substrates.

We have made it possible to form thin-film integrated circuits on "stepped ceramic substrates," which eliminate the need for customer bonding processes and reduce thermal conduction loss.

This product was originally used by users who bonded two circuit boards together (after joining with solder, paste, and adhesive), and it was created with the concept of providing it as a "single integrated component." By making it a single component, (1) the user's effort and costs for joining are reduced, and (2) thermal conduction loss from joining materials has been eliminated. Furthermore, it has become possible to form thin-film integrated circuits on stepped ceramic substrates. [Application Example] The step difference between the upper and lower circuit boards is adjusted to match the thickness of the laser element, which is mounted on the lower board. This allows the top surface of the laser element and the upper circuit board to be at the same height, enabling wire bonding at the shortest distance.

  • High frequency/microwave parts
  • Fine Ceramics
  • Substrate

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