We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 574 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. 共栄電資 Tokyo//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
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Substrate Product ranking

Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.

  1. Busbar for Data Centers - High Current Board 共栄電資
  2. FPC for the space industry 太洋テクノレックス 本社　和歌山
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 Printed circuit board 北一電気
  5. 5 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.

Substrate Product List

451～480 item / All 1940 items

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Current vector control and three-phase PWM motor control board

Current vector control and three-phase PWM motor control board

The current vector control program (d-q coordinate transformation) was implemented with three-phase PWM.

Digital Servo Control Technology and Program Current Vector Control Program (d-q Coordinate Transformation) realized with 3-phase PWM Compatible with ARM-based CPUs from various manufacturers: Cortex-M3 series, STMicroelectronics, Freescale, Toshiba, Fujitsu, Texas Instruments, etc. Renesas SH series.

  • Servo
  • Substrate

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Dimatix Inkjet Head SG/PQ/QS/QE Board

Dimatix Inkjet Head SG/PQ/QS/QE Board

Fujifilm Dimatix inkjet head drive controller board SG/PQ/QS/QE control.

This is a Fujifilm Dimatix inkjet head drive controller board. It can control SG/PQ/QS/QE. The pulse width is variable, and there is an optional head drive waveform generation software. The maximum ejection cycle is 20kHz and it can be synchronized with a transport system encoder. It can be connected to a printing PC via a dedicated PCIe board, supporting up to 10 heads. Bitmap data can be used for printing, and there is also printing control software available. Ink circulation pumps are available for separate purchase. Dimatix SG/PQ/QS head development kit ⇒ Total price: ¥4,900,000 1 head control AMP board: ¥3,500,000 * USB interface / encoder synchronization * Please order in lots of 4: ¥1,400,000 (4 boards for 4 heads) Computer printing control software, CMYK compatible (our specifications, controls 8 heads) * License-free for the first time: ¥3,500,000 * Dimatix head supply is also possible. * Please consult us about RIP software, PDF data, 6 colors/8 colors, etc. * Ink circulation module for SG: ¥600,000

  • Other process controls
  • Other semiconductor manufacturing equipment
  • Substrate

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PCIe board for high-speed inkjet printing and multi-head control.

PCIe board for high-speed inkjet printing and multi-head control.

High-speed label printer that changes the design with each print, one-pass super wide color printer (up to 40 heads), high-speed large 3D printer.

High-speed label printer that changes designs with each print. The GEN5 can change and print designs of 100mm in length at a rate of 12 types per second, with a printing speed of 72m/min. Compatible with various heads: Kyocera, Dimatix, Konica Minolta, and others. Single-pass ultra-wide color printer (up to 40 heads). For high-speed, large 3D printers.

  • Other FA equipment
  • Substrate

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Konica Minolta KM1024i/1800i shared control board

Konica Minolta KM1024i/1800i shared control board

Konica Minolta KM1024i/KM1800i head control board - Head waveform generation software - Extension cable available between control board and head.

Konica Minolta KM1024i/KM1800i Head Control Board - Head drive waveform generation software; extension cable available between control board and head - Head connection cable can be extended (up to about 5m) - Can be synchronized with the transport system encoder (using PCIe board) - Full specification control of KM1024i/KM1800i possible - Maximum discharge cycle of 30 kHz - Head temperature control (heating) possible - Printing PC and printing control board connected and data transferred via high-speed PCIe board * PCIe has a maximum data transfer speed of 350 MB/s * Head control board receives at 20 MB/s from PCIe board * Industry's fastest - PCIe board can control up to 10 head control boards per PCIe board - Up to 4 PCIe boards can be inserted into a standard PC * For label printing, PCIe board can be used to change printing data for each print (up to about 3 times/second) - Multiple units can be used (up to 40 heads) to create a printing machine with 10 heads per CMYK color - Bitmap data is used for printing * Available for user printing machines via DLL

  • Other FA equipment
  • Substrate

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Substrate "Flexible Printed Circuit (FPC)" / NOK

Substrate "Flexible Printed Circuit (FPC)" / NOK

Replacement from the harness is also possible! An extremely thin and flexible circuit board that can be bent freely.

"Flexible Printed Circuit (FPC)" is a circuit board with excellent bending durability, formed on a thin and sturdy film. It can replace harnesses (wires), and it is also capable of shielding processing, waterproofing, and component mounting. Leveraging its features of being "thin," "light," "flexible," and "high-density mounting," it is an indispensable product for miniaturization and weight reduction of portable electronic devices, as well as for space-saving and wiring simplification in various industrial equipment, devices, and automobiles. 【Features】 ■ Extremely thin and can be bent freely ■ Can replace harnesses (wires) ■ Much thinner and lighter compared to rigid boards and harnesses ■ Capable of shielding processing, waterproofing, and component mounting *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Face Corporation Company Profile

Face Corporation Company Profile

Comprehensive support from design and procurement to production. We strive to provide services that exceed expectations.

Face Corporation is a contract manufacturing company specializing in EMS (Electronic Manufacturing Services) for a wide variety of small quantities, as well as industrial electronic devices (circuit boards and unit assembly for control and power equipment). We are capable of handling everything from circuit design and board design to material procurement and various environmental surveys related to these processes. We strive to provide flexible services that exceed customer expectations, aiming to be a company that can be entrusted with peace of mind. 【Business Overview】 ■ EMS (Contract Manufacturing Service for Electronic Devices) *For more details, please refer to the PDF document or feel free to contact us.

  • EMS
  • Substrate

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Microwave Band Low Noise Amplifier "EV860"

Microwave Band Low Noise Amplifier "EV860"

It is a low-noise amplifier that can be used in the 7GHz band.

The microwave band low noise amplifier "EV860" is a low noise amplifier that can be used in the 7GHz band. It can be used in the front-end section of FPU devices, RF input sections of ROF devices, etc. 【Features】 ○ Low noise: NF = 1.5dB or less ○ Compatible with digital STL/TTL and C/D bands ○ Usable with a single power supply (DC +12V) For more details, please contact us or download the catalog.

  • Other electronic parts
  • Substrate

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AuSn solder

AuSn solder

By pre-applying AuSn solder to the circuit board, it becomes possible to directly mount chip components, thereby reducing assembly labor.

【Features】 ○ AuSn composition: Au:Sn=7:3 (standard) (other compositions are also available) ○ Standard film thickness (t): 3μm ○ Film thickness tolerance: ±20% ○ Pattern minimum dimension (D): 50μm ○ Pattern tolerance: ±10μm ● For other functions and details, please contact us.

  • Other electronic parts
  • Substrate

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Electronic Ceramics (Thin film integrated circuit components & Substrates)

Electronic Ceramics (Thin film integrated circuit components & Substrates)

A thin film integrated circuit pattern will be formed on a ceramic substrate.

By using alumina with a purity of 99.9%, we provide fine circuit patterns (line/space=30um/30um) that enable operation in the 30GHz band required for next-generation wireless communication systems. 【Thin Film Integrated Circuits】 We pattern integrated circuits on various ceramic substrates. ●Side patterns (over 0.3t), and AuSn solder patterns is possible. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors is possible. ● The combination of our unique 99.9% alumina substrate and fine patterns allows for the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● For substrate materials, we also accommodate aluminum nitride (ALN) substrates, quartz substrates, and more. 【High-Quality Alumina Substrates】 ● Dense ● The three-point bending strength is 660MPa, which is significantly higher than conventional products (about twice as much). ● Excellent electrical properties with low dielectric loss in high-frequency bands.

  • High frequency/microwave parts
  • Fine Ceramics
  • Circuit board design and manufacturing
  • Substrate

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Characteristics and Applications of Various Ceramic Substrates

Characteristics and Applications of Various Ceramic Substrates

Consistent production from manufacturing ceramics substrates with low dielectric loss in the microwave band, microwave dielectric substrates, to the formation of thin film patterns.

【High-Quality Alumina Substrate】 ○ Dense ○ The three-point bending strength is 660 MPa, which is significantly higher, about twice that of conventional products ○ Excellent electrical properties with low dielectric loss in the high-frequency range 【Zirconia Substrate】 ○ High strength and high toughness ○ Large elastic deformation capacity in bendable ceramics 【High Dielectric Substrate】 ○ Due to its high relative permittivity, it enables miniaturization of high-frequency circuits compared to alumina substrates ○ Low dielectric loss even in the high-frequency range 【Thin Film Integrated Circuit】 (Circuit formation on various ceramic substrates) ○ Formation of air bridges, side patterns (0.5t or more), and AuSn solder patterns is possible ○ Simultaneous mounting of conductors, thin-film resistors, and thin-film inductors is possible ○ By combining a unique 99.9% alumina substrate with fine patterns, it enables the formation of low-loss and low-noise circuits in the high-frequency range ○ Substrate materials also include high dielectric substrates, aluminum nitride substrates (AlN substrates), and quartz substrates.

  • High frequency/microwave parts
  • Fine Ceramics
  • Substrate

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Lighter than aluminum, with the rigidity of steel - the birth of Super Material SA001.

Lighter than aluminum, with the rigidity of steel - the birth of Super Material SA001.

The silicon/aluminum composite material SA001, created by our unique composite technology, is lighter than aluminum and has the Young's modulus of cast iron, while also accommodating hollow structures through bonding technology.

We have developed a composite material SA001 made of metallic silicon and aluminum. This super material is lighter than aluminum, has a higher Young's modulus than cast iron, and boasts a specific stiffness that is twice that of aluminum. Thanks to our joining technology, it can also accommodate hollow structures and built-in flow paths. ● Adoption achievements: Parts for high-precision 3D measuring machines, parts for semiconductor manufacturing equipment ● Application proposal: Temperature control plates for electrostatic chucks * By changing the material from aluminum to SA001, we can resolve the thermal expansion difference issue with alumina ESC.

  • Other metal materials
  • aluminum
  • Composite Materials
  • Substrate

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3D processing ceramic products

3D processing ceramic products

The use of ceramics has expanded due to high-precision processing of complex shapes and curved surfaces using 5-axis machining.

The introduction of a 5-axis machining machine, which adds the C-axis (table rotation) and A-axis (table tilt axis) to the X, Y, and Z axes, has made it possible to achieve high-precision machining of complex shapes and curved surfaces, thereby expanding the applications of ceramics. Cost reduction is also expected due to the reduction in setup time.

  • Fine Ceramics
  • Other molds
  • Other machine elements
  • Substrate

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Formation of thin-film integrated circuits on stepped ceramic substrates.

Formation of thin-film integrated circuits on stepped ceramic substrates.

We have made it possible to form thin-film integrated circuits on "stepped ceramic substrates," which eliminate the need for customer bonding processes and reduce thermal conduction loss.

This product was originally used by users who bonded two circuit boards together (after joining with solder, paste, and adhesive), and it was created with the concept of providing it as a "single integrated component." By making it a single component, (1) the user's effort and costs for joining are reduced, and (2) thermal conduction loss from joining materials has been eliminated. Furthermore, it has become possible to form thin-film integrated circuits on stepped ceramic substrates. [Application Example] The step difference between the upper and lower circuit boards is adjusted to match the thickness of the laser element, which is mounted on the lower board. This allows the top surface of the laser element and the upper circuit board to be at the same height, enabling wire bonding at the shortest distance.

  • High frequency/microwave parts
  • Fine Ceramics
  • Substrate

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Contracting business for electronic components

Contracting business for electronic components

Short delivery times and small lot electronic circuit board manufacturing! We can accommodate a wide range of needs from design to shipping at any stage.

At Tosa Electronics Co., Ltd., we engage in the "contract business for electronic components," providing support for a series of operations from design, assembly, processing, adjustment, inspection, to shipping. As the assembly and related operations of electronic components shift from Japan to overseas, we support a series of operations from processing to shipping of electronic circuit boards in small lots and short delivery times, based on the manufacturing know-how we have cultivated over more than 20 years since our founding. 【Features】 ■ Wide-ranging support from any stage, including design, inspection, and shipping ■ Capable of manufacturing electronic circuit boards with short delivery times, small lots, and a variety of types *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Substrate

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[Specification] H8 Control Board

[Specification] H8 Control Board

Introduction of the specification document that includes explanations of each section, development preparations, and sample programs!

This document is the specification sheet for the "H8 control board" handled by Tosa Electronics, which engages in the processing, assembly, and inspection of electronic components and electronic circuit boards. It includes descriptions of various parts such as sensor input terminals, as well as development preparations and sample programs. [Contents] ■ Description of each part ■ Development preparations ■ Sample programs *For more details, please refer to the PDF document or feel free to contact us.

  • Converters and Transducers
  • Substrate

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[Specification] Motor Shield Board (with Bluetooth)

[Specification] Motor Shield Board (with Bluetooth)

Introducing the specification document that includes connection diagrams and the development environment for Arduino programs!

This document is the specification sheet for the "Motor Shield Board (with Bluetooth)" handled by Tosa Electronics, which engages in the processing, assembly, and inspection of electronic components and electronic circuit boards. It includes descriptions of various parts such as motor control terminals, connection configuration diagrams, and the Arduino programming development environment. 【Contents】 ■ Description of each part ■ Connection configuration diagram ■ Arduino programming development environment ■ Bluetooth communication specification *For more details, please refer to the PDF document or feel free to contact us.

  • Converters and Transducers
  • Substrate

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Specification Document: Mighty Shield Circuit Board

Specification Document: Mighty Shield Circuit Board

Introducing the specification document that includes descriptions of each part of the product and the development environment for Arduino programs!

This document is the specification sheet for the "Mighty Shield Board" handled by Tosa Electronics, which engages in the processing, assembly, and inspection of electronic components and electronic circuit boards. It includes descriptions of various parts such as the stepping motor control terminals, connection configuration diagrams, and the Arduino programming development environment. [Contents] - Descriptions of various parts - Connection configuration diagrams - Arduino programming development environment - Bluetooth communication specification *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Substrate

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[Specification] Arduino_DAC_SHIELD Board

[Specification] Arduino_DAC_SHIELD Board

Introducing the specifications of a shield board that performs 8-channel DAC output controlled by SPI for Arduino Uno!

This document is the specification sheet for the "Arduino_DAC_SHIELD board" handled by Tosa Electronics, which engages in the processing, assembly, and inspection of electronic components and electronic circuit boards. It includes product descriptions, usage instructions, and sample programs. The "Arduino_DAC_SHIELD board" is a shield board for Arduino Uno that provides 8-channel DAC output controlled via SPI. [Contents] ■ Product Description ■ Usage Instructions ■ Sample Programs ■ Circuit Diagram *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Substrate

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Board "RasPi_HAT (Raspberry Pi HAT)"

Board "RasPi_HAT (Raspberry Pi HAT)"

You can freely solder and use the free through holes! Introducing the expansion HAT board.

The "RasPi_HAT" is an expansion HAT board that can connect three HAT boards to a Raspberry Pi. You can mount a Raspberry Pi 3 or Raspberry Pi ZERO (WH) on the lower left part of the board, and attach other HAT boards elsewhere. There are free through-holes on the lower right part of the board, allowing you to solder as you wish, similar to a universal board. 【Features】 ■ All GPIO pins are connected to the array ■ Pins for UART and I2C are provided for external connections (JST EH connector) ■ Power can be supplied to the Raspberry Pi mounted on the lower left via USB, from a DC jack on the board, or from the EH connector *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Substrate

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BMSspot

BMSspot

Lithium-ion battery management system board

We will utilize BMSspot to develop various energy solutions with abundant experience and high technology.

  • Integrated operation management
  • Substrate

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Yuki Corporation - Equipment Development Achievements

Yuki Corporation - Equipment Development Achievements

We will conduct development in various technical fields, including digital, analog, high frequency, and industrial applications.

Yuki Corporation aims to be a "circuit board company that understands electronics" by adding the support of products as electronic equipment engineers to its main business of circuit board design and manufacturing. Additionally, with the establishment of the Equipment Development Department, we have created a system where all steps from planning and development of electronic devices to product inspection and shipping can be conducted in-house at Yuki. In our fruit (industrial product) sorting and management system, we determine grades (size, color, presence of defects) through image processing of fruits (such as pears, persimmons, watermelons, peaches, chestnuts, plums, apples, etc.) and have built a comprehensive system that covers sorting, invoice issuance, and shipping management. Our hydroponic plant LED lights can create an optimal light environment for plant growth by controlling the ratio of red, blue, and green (the three primary colors of light) using a computer. 【Features】 - Development is possible across various technical fields - Staff in the Equipment Development Department have extensive experience and achievements in product development - Support for products as electronic equipment engineers - All steps from planning and development of electronic devices to product inspection and shipping can be conducted in-house at Yuki Corporation - Development of small items such as switching power supplies, standalone FPGA designs, and software-only products is also possible For more details, please contact us or download the catalog.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • LED lighting
  • Substrate

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Printed circuit board - 4-layer board

Printed circuit board - 4-layer board

The shortest 24 hours! A four-layer board that leads your business to success.

Yuki Corporation responds to customer requests with the technical expertise cultivated over many years. To achieve goals such as stable quality, improved operational rates, and avoiding duplication of capital investment, experts from printed circuit board manufacturers and partial processing manufacturers have joined forces to establish a printed circuit board manufacturing company with an in-house integrated production system. We are committed to "manufacturing" and have built a production line that meets customer demands for small quantities, diverse varieties, and short delivery times. Furthermore, we will continue our unwavering efforts to deliver "valuable products," "services," and "peace of mind" as a company based on high quality and excellent technology. **Features** - Consistent support from design to printed circuit board manufacturing to component mounting. - Partial processing of surface treatment is also handled in-house. → Metal masks, various metal etching, electroplating, electroless gold, etc. - Ultra-short delivery times. Medium-volume products can also be delivered quickly. - Actively responding to high-layer, high-density, and high-difficulty products. → High-layer boards up to 20 layers, high-density boards with 5 pins between. - Actively working on environmental measures such as halogen-free materials and lead-free options. For more details, please contact us or download the catalog.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Yuki Corporation Business Introduction

Yuki Corporation Business Introduction

We support everything related to substrate manufacturing. We can handle the entire process or just a single step.

In the printed circuit board business of Yuki Corporation, we respond to ultra-short delivery times. In the electronics business, we also engage in software development and electronic device development. We handle everything from prototypes to mass production. We can provide a consistent response from printed circuit board design to board manufacturing to component assembly. We support metal masks, various metal etching, electroplating, electroless gold, and thick gold bonding, among others. "More than one" is our company policy. We actively respond to high-layer, high-density, and high-difficulty products (high-layer up to 20 layers, high-density up to 5 pins between vias). We are also actively working on environmental measures such as halogen-free materials and lead-free RoHS compliance. 【Business Content】 ○ Development, manufacturing, and sales of printed circuit boards and electronic devices For more details, please contact us or download the catalog.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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World's thinnest 0.6mm supercapacitor "G/H Series"

World's thinnest 0.6mm supercapacitor "G/H Series"

Achieves ultra-thin, flat, compact design with low ESR (Equivalent Series Resistance).

CAP-XX's electric double-layer capacitors (supercapacitors) are the world's thinnest at 0.6mm thick, compact yet high-capacity, and feature a high energy density, allowing for high output even under peak load due to their low ESR (equivalent series resistance). They are available in a wide range of options to suit various usage conditions and applications.

  • Capacitor
  • Substrate

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Single Crystal Substrate Crystals: A-Z

Single Crystal Substrate Crystals: A-Z

We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.

We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class company in the industry. You can purchase from as little as one piece. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.

  • Secondary Cells/Batteries
  • Other metal materials
  • Substrate

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Ceramic Substrate: A-Z

Ceramic Substrate: A-Z

We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.

We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class supplier in the industry. You can purchase as little as one item. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.

  • Secondary Cells/Batteries
  • Other metal materials
  • Substrate

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Screw press: Small powder molding machine for low load.

Screw press: Small powder molding machine for low load.

By simply turning the handle lightly, a load of up to 5,000N can be applied.

The screw press is a molding machine for low loads. With simple operation by just turning the handle, it can apply a load of up to 5,000N (500kgf). Being a screw-type press, it allows for easy "pressurization," "holding," and "depressurization." As a compact machine, it is ideal for molding within a glove box. Heater specifications can also be manufactured.

  • Powder Molding Machine
  • Substrate

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STH technology

STH technology

Implementation of components directly above the through hole and solder balls is possible! Achieving high density in the circuit board.

The "STH technology" is a technique that enables the mounting of components directly above the through-hole by filling the through-hole section. Since pads can be formed directly above the through-hole, it allows for chip component mounting, ball mounting, and wire bonding, making high-density mounting possible. Additionally, it excels in moisture resistance and chemical resistance compared to conventional S/R ink filling, thereby improving the reliability of the through-hole. 【Features】 ■ Enables component mounting directly above the through-hole ■ Allows for high-density mounting ■ Moisture resistance and chemical resistance ■ Improved reliability of the through-hole ■ Can form STH directly under the chip and be used as a thermal through-hole *For more details, please refer to the catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Build-up technique

Build-up technique

Complex structures can be realized by combining machining technology, STH technology, and others!

Our build-up substrates enable complex structures through a combination of proprietary technologies (such as milling technology and STH technology), meeting the demands for high density and high functionality. We have a proven track record of drilling holes using laser vias in various materials that possess characteristics such as high heat resistance, high Tg, and chemical resistance. Additionally, our unique vacuum hot press method ensures that there are no voids in the inner layers, allowing for highly reliable build-up substrates with excellent flatness and positional accuracy between inner layer patterns. 【Features】 ■ Capable of forming laser holes directly above through holes in combination with STH technology ■ Fill via method allows laser holes to be filled with Cu plating ■ Achieves even higher density *For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other electronic parts
  • Substrate

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Hirayama Fine Tech Co., Ltd. Business Introduction

Hirayama Fine Tech Co., Ltd. Business Introduction

We aim to create products that our customers can trust and feel secure about.

Heiyama Fine Tech Co., Ltd. was founded in 1910, initially engaged in industrial engraving, and has evolved into a manufacturer of printed circuit board design and production, supported by tradition and technical expertise. In 2008, we established a new factory in Uenohara City, Yamanashi Prefecture, and introduced state-of-the-art equipment. Additionally, we have implemented IT integration through electronic tags across all processes, utilizing this data not only for production management but also for quality improvement, and are committed to continuous enhancement. We always maintain a sense of gratitude, value "monozukuri" (craftsmanship) from the customer's perspective, and will continue to promote various technological innovations and value creation. 【Business Content】 ○ Design and manufacturing of printed circuit boards For more details, please contact us or download our catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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