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Substrate Product List and Ranking from 574 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. 共栄電資 Tokyo//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
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Substrate Product ranking

Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.

  1. Busbar for Data Centers - High Current Board 共栄電資
  2. FPC for the space industry 太洋テクノレックス 本社　和歌山
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 Printed circuit board 北一電気
  5. 5 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.

Substrate Product List

481～510 item / All 1940 items

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Alumina ceramic substrate for chip resistors

Alumina ceramic substrate for chip resistors

High-reliability substrates born from a unique production system.

This is an alumina ceramic substrate made using high-purity alumina raw materials that excel in electrical and thermal properties, and is produced through advanced processing technology to achieve excellent dimensional accuracy and divisibility. We use high-purity alumina raw materials tailored to specific applications, maintaining stable quality and outstanding characteristics while adhering to a strict quality control system during production. 【Features】 ■ Manufacturing with high precision in thickness and dimensions is possible ■ High-precision through-hole forming and divided groove forming are achievable ■ Can be produced at a relatively low cost compared to other ceramic materials ■ Proposal of "high-reflective ceramics" considering cost-effectiveness ■ Suitable for porous applications with a high porosity rate *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Start of sample provision for high-purity alumina substrates (99.6%).

Start of sample provision for high-purity alumina substrates (99.6%).

We have added "high-purity alumina (99.6%) substrates" to our lineup and prepared standard samples (100x100x0.2).

■Alumina Ceramic Substrates Born from Our Unique Production System■ In recent years, the electronics industry, which is accelerating the pace of evolution, has developed tiny chip components that can now fit on the tip of a finger, advancing the information society. Among these, chip resistors are essential basic electronic components for constructing electronic circuits. Our alumina ceramics use high-purity alumina raw materials that excel in electrical and thermal properties, achieving excellent dimensional accuracy and divisibility through advanced processing technology. For other alumina ceramic products as well, we use high-purity alumina raw materials tailored to their applications, maintaining stable quality and excellent characteristics while producing under a strict quality control system.

  • Fine Ceramics
  • Substrate

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Zirconia ceramic substrate

Zirconia ceramic substrate

A specialized manufacturer of high-performance ceramic substrates produces thin zirconia ceramic substrates with toughness and ionic conductivity.

Flexible Ceramic Substrates Utilizing Toughness" Flexible Zirconia Ultra-thin Zirconia Ceramic Substrates Zirconia possesses strong toughness. By combining this with our thin ceramic substrate manufacturing technology, we have realized "flexible ceramic substrates." The ultra-thin ceramic substrate (thickness: 50μm) is also transparent and has the potential to achieve substrate thinning, positioning it as a "next-generation ceramic substrate.

  • Fine Ceramics
  • Substrate

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Fine printed circuit board

Fine printed circuit board

Printed circuit boards for small electronic devices: Fine circuit printing is a circuit printing technology primarily for ultra-small electronic components.

In recent years, as the miniaturization, lightweight design, and high performance of electronic devices have progressed, the demands for high implementation and high density in circuit board packages have been increasing year by year. To meet these demands, our company is leveraging its thick film printed circuit board (through-hole) technology to develop even more delicate pattern printing techniques.

  • Printed Circuit Board
  • Fine Ceramics
  • Substrate

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For high-performance ceramic substrates, please consult our specialized manufacturer.

For high-performance ceramic substrates, please consult our specialized manufacturer.

We offer ceramic substrates and printed circuit boards. Please also take advantage of our contract processing services utilizing our manufacturing technology (green sheet coating and firing).

Product Lineup ■ Ceramic Substrates - Alumina Ceramic Substrates - Zirconia Ceramic Substrates ■ Printed Circuit Ceramic Substrates - Thick Film Printed Circuit Ceramic Substrates - Fine Printed Circuit Ceramic Substrates ■ Ceramic Substrate Application Products - Ceramic Materials for LED Packages - Ceramic Materials for All-Solid-State Batteries - Ceramic Materials for Ceramic Tile Crafts ■ Functional Ceramic Materials - High Reflective Ceramic Materials - Porous Alumina Ceramic Substrates (Setters) - Powder Forming Ceramics

  • variety _substrates.jpg
  • Fine Ceramics
  • Printed Circuit Board
  • Substrate

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Kyoritsu Elex, a specialized manufacturer of high-performance ceramics.

Kyoritsu Elex, a specialized manufacturer of high-performance ceramics.

For high-performance ceramic substrates, please consult our specialized manufacturer.

1. Molding Technology for Ultra-Thin Ceramic Sheets Our company employs a doctor blade method for the coating process of green sheets. We mix carefully selected ceramic raw materials and resin materials, and by molding sheets using the doctor blade method, we produce green sheets with stable thickness and strength. With high-precision gap management of the blade, we are able to achieve green sheets as thin as 20 micrometers. (We are also developing coating technology for layers as thin as 5 micrometers.)

  • Printed Circuit Board
  • Substrate

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Ceramic thin plate chip break (segmentation) chocolate break

Ceramic thin plate chip break (segmentation) chocolate break

For high-performance ceramic substrates, please consult our specialized manufacturer.

"Providing split slits for individualization through mold forming" "1. Removal of the frame part", "2. Barb break (strip shape)", "3. Chip break (individualization)" makes individualization easy.

  • LED-Pack_5050_V-cut_break_sheet.png
  • LED-Pack_5050_no_V-cut_break_sheet.png
  • Printed Circuit Board
  • Fine Ceramics
  • Substrate

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Ceramic substrate for firing setters (development product)

Ceramic substrate for firing setters (development product)

We assist in the firing of ferrite substrates and metal injection molding (MIM) products using optimized "ceramic substrates for setters" in the firing process.

Improving production efficiency in the "batch-type vacuum sintering furnace" used in the sintering process is a significant challenge. One proposal is to enhance production efficiency through "multi-layer stacking." By replacing the conventional ceramic support plate (7mm thick) with "our ceramic substrate for sintering setters (1mm thick)," it becomes possible to increase the number of shelf layers from 16 to 18, resulting in a 12% improvement in sintering loading efficiency. Additionally, it allows for "thicker workpieces" to be sintered with the same number of workpieces, enabling broader utilization of the sintering furnace. The second proposal is "micro-convex porous ceramic processing." Among the process conditions that affect sintering quality, "debinding performance and characteristics" are crucial, and various porous ceramic materials are being utilized creatively. In addition to these porous ceramic substrate technologies, using ceramic support plates for setters that have undergone "micro-convex porous ceramic processing" allows for space to be secured at the bottom of the sintering workpieces, thereby improving debinding efficiency and performance.

  • setter_debinding_less_adhesion.png
  • Ceramics
  • Substrate

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Improving thermal conductivity of alumina substrates with printed circuit technology [For mounting power devices!]

Improving thermal conductivity of alumina substrates with printed circuit technology [For mounting power devices!]

Leveraging the strengths of a "ceramics substrate specialized manufacturer," we have achieved "high thermal conductivity of alumina substrates" through via formation technology and printed circuit technology!

In the implementation of power devices, where applications are expanding in areas such as home appliances and EV vehicles, expectations for "thermal conductivity performance of the substrate" are rising significantly. Through the mass production achievements of our flagship high-power LED packages, we have developed technologies to improve heat dissipation performance associated with higher power output. In particular, we have received many inquiries regarding "improving thermal conductivity using general-purpose alumina ceramic substrates compared to aluminum nitride substrates, which excel in thermal conductivity" for ceramic circuit boards. We have achieved improvements in thermal conductivity by applying through-hole processing technology (via formation) and printed circuit technology, filling the via sections of alumina ceramic substrates with "metallic materials," while using general-purpose alumina ceramic substrates. For high-power LED package substrates, we have achieved a thermal conductivity of "369 W/mk" with alumina ceramic substrates. If you are facing challenges with "thermal measures" for ceramic substrate implementation of high-power power devices, please consult with us.

  • Fine Ceramics
  • Circuit board design and manufacturing
  • Other electronic parts
  • Substrate

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Notice of Participation in "Nepcon Japan"

Notice of Participation in "Nepcon Japan"

We plan to exhibit "high flame-retardant silicone resin sheets" and "thick film printed circuit ceramic substrates"!

Our company is a specialized manufacturer of high-performance ceramic substrates. We plan to exhibit at the "Semiconductor Forum (Joint Exhibition)" at "NEPCON Japan" held at Tokyo Big Sight. We will showcase products such as "Alumina and Zirconia (Ceramic Substrates)." We sincerely look forward to your visit. 【Exhibition Overview】 ■ Dates: January 21 (Wed) - January 23 (Fri), 2026 ■ Venue: Tokyo Big Sight ■ Booth Number: E23-42 (East Hall 6) ■ Nearest Stations: - Rinkai Line: Get off at "Kokusai Tenjijo" Station and walk about 7 minutes - Yurikamome: Get off at "Tokyo Big Sight" Station and walk about 3 minutes *For more details, please feel free to contact us.

  • Exhibition
  • Substrate

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High thermal conductivity substrate "Copper Inlay Substrate"

High thermal conductivity substrate "Copper Inlay Substrate"

We provide a substrate embedded with copper coins to efficiently dissipate heat.

Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper-inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Substrate

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Printed circuit board "Flexible substrate"

Printed circuit board "Flexible substrate"

Fine pattern formation and support for high-density wiring compatible with small-diameter vias are also possible!

"Flexible printed circuit boards" are printed wiring boards formed on a flexible insulating film that can be significantly deformed, such as by bending. They excel in flexibility and bending characteristics, allowing for wiring in movable parts and three-dimensional wiring. Our company offers products that meet various needs, including single-sided FPC, double-sided FPC, and others. 【Features】 ■ Excellent bending and flexural properties ■ Ability to bend freely ■ Capable of wiring in movable parts and three-dimensional wiring ■ Supports high-density wiring compatible with fine pattern formation and small-diameter vias *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Printed Circuit Board "Fluororesin Substrate"

Printed Circuit Board "Fluororesin Substrate"

High-density wiring compatible with thin plates, fine pattern formation, and small-diameter vias is also possible!

"Fluororesin substrate" is a printed circuit board made from materials such as fluororesin-impregnated glass cloth. It has a very low dielectric constant and dielectric loss tangent, providing excellent high-frequency characteristics, making it suitable for high-frequency equipment applications. We offer products tailored to needs such as thin plates and small sizes. 【Features】 ■ Excellent high-frequency characteristics (relative permittivity and dielectric loss tangent) ■ Capable of high-density wiring that supports thin plates, fine pattern formation, and small-diameter vias ■ Products tailored to your needs *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

Efficiently dissipate heat from the copper coin to the back side! It is possible to reduce the heat generation of the entire circuit board.

We would like to introduce our high thermal conductivity substrate, the "Copper Inlay Substrate [Copper Coin]." Among the diverse electronic components, there are some that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, we offer substrates embedded with copper coins. 【Features】 ■ Efficiently dissipates heat to the backside by incorporating copper coins ■ Reduces overall heat generation of the substrate *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High Thermal Conductivity Substrate "Thick Copper Substrate"

High Thermal Conductivity Substrate "Thick Copper Substrate"

Using thick copper foil of 105μm or more! We provide substrates that enhance large current and heat dissipation.

We would like to introduce our high thermal conductivity substrate, the "Thick Copper Substrate." By increasing the copper thickness, it becomes possible to carry more current and improve heat dissipation. We offer substrates that enhance high current and heat dissipation by using copper foil thicker than 105μm. 【Product Lineup】 ■ Double-sided Printed Circuit Boards - Copper foil thickness: 70, 105, 140, 175μm ■ Multilayer Printed Circuit Boards - Copper foil thickness (outer layer, inner layer): 70, 105μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High thermal conductivity substrate "Metal base substrate"

High thermal conductivity substrate "Metal base substrate"

Used in products that require high heat dissipation, such as power boards and LED boards!

The "metal base substrate" is a high thermal conductivity substrate made by laminating aluminum or copper. By using metals with high thermal conductivity, it is possible to efficiently dissipate heat from heat-generating components. Additionally, by changing the resist ink from a standard white to a white suitable for LEDs, a high reflectivity is achieved. This enables the production of high-brightness LED substrates. 【Lineup】 ■ Copper base substrate ■ Aluminum base substrate ■ Double-sided aluminum base *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High-speed signal and high-density substrate "Back Drill Substrate"

High-speed signal and high-density substrate "Back Drill Substrate"

Providing high-speed transmission boards with better characteristics! Applications include base stations, communication devices, and high-speed routers.

We would like to introduce our high-speed signal and high-density substrate, the "Back Drill Substrate." By removing unnecessary through-hole stubs through back drilling, we eliminate signal disturbances. Furthermore, it becomes possible to reduce attenuation, allowing us to provide high-speed transmission substrates with better characteristics. 【Features】 ■ Back drilling process ■ Capability to eliminate signal disturbances and reduce attenuation *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High-speed signal, high-density substrate "Build-up substrate"

High-speed signal, high-density substrate "Build-up substrate"

Build-up structure! Supports various interlayer connections with laser VIA, IVH, and through VIA.

We would like to introduce our high-speed signal and high-density substrate, the "Build-Up Substrate," which we handle. It supports build-up substrates from 4 layers to 16 layers, and thanks to its build-up structure, it accommodates various interlayer connections using laser vias, IVH, and through vias. It allows for the mounting of narrow-pitch components and high-density designs. Please feel free to consult us when you need assistance. 【Features】 ■ Supports build-up substrates from 4 layers to 16 layers ■ Allows for the mounting of narrow-pitch components and high-density designs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High-frequency hybrid substrate "Hybrid substrate"

High-frequency hybrid substrate "Hybrid substrate"

The intended use is for base stations and communication equipment! We offer circuit boards with excellent cost performance.

The "Hybrid Substrate" is a high-frequency hybrid substrate that enables the manufacturing of multilayer substrates combining a variety of materials. By using expensive materials with excellent high-frequency characteristics only in the necessary layers, we provide cost-effective substrates. We will propose combinations of materials (high-frequency materials and FR-4 materials) considering electrical characteristics, material reliability, and more. 【Features】 ■ Capable of manufacturing multilayer substrates combining a variety of materials ■ Expensive materials with excellent high-frequency characteristics are used only in the necessary layers ■ Combinations of materials are proposed considering electrical characteristics, material reliability, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High-frequency compatible substrate "Fluororesin substrate"

High-frequency compatible substrate "Fluororesin substrate"

Materials with excellent frequency characteristics! Capable of high-frequency performance tailored to specific applications.

"Fluororesin substrates" are printed circuit boards with low dielectric constant and low dielectric loss, exhibiting very good frequency characteristics. They can be tailored to high-frequency characteristics according to the application. Additionally, we can handle products from both domestic and overseas manufacturers. Please feel free to consult us when you need assistance. 【Material Types】 ■ General FR-4 material ■ PPE material ■ LCP material ■ Fluororesin material *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Side-coated substrate

Side-coated substrate

Coating on the substrate side! Prevents powder drop from the edge caused by rubbing against the guide rail.

We would like to introduce our "Side Coated Substrate." Powder shedding from the opened sides of laminated substrates can affect the assembly process and become a source of foreign matter within the mold. By coating the sides of the openings, we contribute to solving problems during assembly. By applying a coating to the sides of the substrate, we prevent powder shedding from the edges that occurs when the substrate rubs against guide rails during transport. [Applications] ■ Device substrates ■ Substrates requiring resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Tent Through Hole PCB

Tent Through Hole PCB

Prevent the flow of sealing resin and flux during component mounting!

The "Tent Through Hole Substrate" is a substrate that forms a tent membrane over the through-hole sections using a dry film type solder resist. It prevents the flow of sealing resin and other resins after component mounting, as well as the wicking of flux and solder during the mounting process. Please feel free to contact us when you need assistance. [Applications] ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Silicone embedded substrate

Silicone embedded substrate

By changing the height of the circuit, it is possible to form silicone ink on the circuit as well!

We would like to introduce our "Silicone Embedded Substrate." By filling the gaps between the circuits where LED elements are mounted with silicone ink that has high reflectivity and weather resistance, we can suppress the degradation of the resin substrate. Additionally, by combining this with a step process, it is possible to form silicone ink on the circuit by changing the height of the circuit. 【Applications】 ■ Substrate boards for chip LEDs, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Functional step substrate

Functional step substrate

Suitable for applications such as power supplies, inverters, and high-current circuit boards and device components!

We would like to introduce our "Function Step Board." Through our step circuit process, we can arrange high-current circuits using thick copper foil, such as 70μm, and fine wire control circuits using copper foil, such as 18μm, on the same substrate, enabling the provision of copper-thick hybrid circuit boards through continuous wiring. By forming unevenness through step formation in part of the circuit, we can provide height adjustment of mounted components and functions based on shape and structure in substrates used for device components. 【Specifications (Partial)】 ■ Base material copper foil thickness: 18μm, 35μm, 70μm, 105μm ■ Maximum step height - 18μm copper foil: 12μm - 35μm copper foil: 25μm - 70μm copper foil: 50μm - 105μm copper foil: 80μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Ultra-thin rigid substrate

Ultra-thin rigid substrate

It is possible to manufacture a double-sided board with a substrate thickness of 0.04t, while being a rigid substrate!

We would like to introduce our "Ultra-Thin Rigid Substrate." Thanks to our technology, we can manufacture double-sided substrates with a thickness of 0.04 mm, while still being rigid. This is ideal for applications such as circuit boards for ultra-thin high-density devices. Please feel free to contact us when you need assistance. 【Applications】 ■ Circuit boards for ultra-thin high-density devices, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Thin plate bending substrate

Thin plate bending substrate

Surface treatment includes heat-resistant preflux and electroplating/non-electrolytic gold plating! Compatible with routers.

The "Thin Plate Bending Substrate" is a substrate that serves as an alternative to flexible substrates, using thin glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, which are used for several bends or bending during assembly. Applications include LED lighting substrates used on curved surfaces, substrates that require component mounting and bending, and substrates for connections between boards, all suitable for several bends. Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Number of layers: Single-sided / Double-sided ■ Thickness: 0.06 to 0.1mm ■ Minimum bending radius: Can be bent up to 5 times at R1.5 ■ Outline processing: Router compatible *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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End face through-hole substrate. Our unique processing solves copper burrs and powder drop!

End face through-hole substrate. Our unique processing solves copper burrs and powder drop!

We will solve the implementation issues and challenges arising from the miniaturization of electronic components with our special structures such as edge-through-hole boards and laminated boards.

End face through holes are formed by cutting through holes created at the edges of the substrate using contour processing. Traditionally, copper burrs were generated during the cutting of through holes, but our company can provide end face through holes without burrs even with router processing thanks to our unique process. Additionally, this unique process allows for the partial etching of landless through holes and the copper plating of through holes. In printed circuit boards for electronic device applications such as compact modules, miniaturization and heat dissipation are required. Our company offers special structure printed circuit boards tailored to your needs, such as metal cavity structure boards and three-dimensional structure boards through lamination.

  • Circuit board design and manufacturing
  • Substrate

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MI-PCB Technology

MI-PCB Technology

High heat dissipation and noise issue resolution with GND reinforcement MI-PCB technology!

"MI-PCB Technology" is a new concept PCB technology that aims to efficiently solve problems by inserting thick metals with excellent thermal conductivity at appropriate positions within the PCB layers. It possesses Thick Metal Etching & Patterning Technology. It can be used in automotive products, electric vehicles, smartphones, and more. 【Features】 ■ High Thermal Performance ■ Reduces the thickness of electronic product sets ■ No need for heatsinks ■ Eliminates processes related to heatsink attachment, improving productivity (No need for thermal grease application and eliminates the heatsink attachment process) *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Substrate

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Heat-dissipating substrate "DPGA"

Heat-dissipating substrate "DPGA"

This is a substrate with unique high heat dissipation properties developed by Daiwa Kogyo Co., Ltd.

"DPGA" stands for "Daiwa Process Global Advance," which is a process developed independently by Daiwa Industrial that uses metal Cu bumps for interlayer wiring connections. A substrate with high heat dissipation characteristics enables high brightness and long lifespan of LEDs, as well as miniaturization of heat sinks. 【Features】 ○ Interlayer connection using metal pillars (copper bumps) → Achieves low resistance, high connection reliability, and high thermal conductivity ○ Copper bumps can be of any shape and size → For cylindrical shapes, diameters can range from 0.3 to 4.00 mm ○ Mixing of copper bumps of different sizes is possible ○ Improved thinness, lightness, and rigidity → Minimum board thickness: 0.3 mm, using prepreg for the insulation layer ○ Maximizes the functionality of LEDs → Ideal for LED substrates (liquid crystal panels, lighting) and automotive substrates For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Substrate

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Cost reduction: High heat dissipation, high current circuit board

Cost reduction: High heat dissipation, high current circuit board

Achieving unit cost reduction, unit size reduction, and extended lifespan. Ideal for LED substrates and automotive substrates!

We would like to introduce Daiwa Kogyo Co., Ltd.'s "High Heat Dissipation and High Current Circuit Boards." Our "High Heat Dissipation Circuit Board" replaces ceramic substrates, achieving cost reduction in substrate expenses. Additionally, by switching from water cooling to air cooling, we achieve cost reduction in unit expenses. We also manufacture products such as "Copper Pin Embedded Circuit Boards," which reduce thermal damage to components, as well as "Aluminum Base/Copper Base Circuit Boards" that can handle thermal conductivity up to 10W, and "Thick Copper Circuit Boards" suitable for high current. If you are having trouble with circuit boards, please feel free to consult with us. 【Features】 ■ High Heat Dissipation Circuit Board - Achieves cost reduction in substrate expenses by replacing ceramic substrates - Achieves cost reduction in unit expenses by switching from water cooling to air cooling - Realizes reduction in unit size and component costs through miniaturization of heat sinks/fans ■ Copper Pin Embedded Circuit Board - Provides pinpoint heat dissipation from high-heat components - Reduces thermal damage to components *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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