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Substrate Product List and Ranking from 562 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. Understand in 3 minutes! Solder Resist Formation Technology [Materials Provided] プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  2. Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm] 共栄電資
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社　和歌山
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室

Substrate Product List

481～510 item / All 1924 items

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High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

Efficiently dissipate heat from the copper coin to the back side! It is possible to reduce the heat generation of the entire circuit board.

We would like to introduce our high thermal conductivity substrate, the "Copper Inlay Substrate [Copper Coin]." Among the diverse electronic components, there are some that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, we offer substrates embedded with copper coins. 【Features】 ■ Efficiently dissipates heat to the backside by incorporating copper coins ■ Reduces overall heat generation of the substrate *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High Thermal Conductivity Substrate "Thick Copper Substrate"

High Thermal Conductivity Substrate "Thick Copper Substrate"

Using thick copper foil of 105μm or more! We provide substrates that enhance large current and heat dissipation.

We would like to introduce our high thermal conductivity substrate, the "Thick Copper Substrate." By increasing the copper thickness, it becomes possible to carry more current and improve heat dissipation. We offer substrates that enhance high current and heat dissipation by using copper foil thicker than 105μm. 【Product Lineup】 ■ Double-sided Printed Circuit Boards - Copper foil thickness: 70, 105, 140, 175μm ■ Multilayer Printed Circuit Boards - Copper foil thickness (outer layer, inner layer): 70, 105μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High thermal conductivity substrate "Metal base substrate"

High thermal conductivity substrate "Metal base substrate"

Used in products that require high heat dissipation, such as power boards and LED boards!

The "metal base substrate" is a high thermal conductivity substrate made by laminating aluminum or copper. By using metals with high thermal conductivity, it is possible to efficiently dissipate heat from heat-generating components. Additionally, by changing the resist ink from a standard white to a white suitable for LEDs, a high reflectivity is achieved. This enables the production of high-brightness LED substrates. 【Lineup】 ■ Copper base substrate ■ Aluminum base substrate ■ Double-sided aluminum base *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High-speed signal and high-density substrate "Back Drill Substrate"

High-speed signal and high-density substrate "Back Drill Substrate"

Providing high-speed transmission boards with better characteristics! Applications include base stations, communication devices, and high-speed routers.

We would like to introduce our high-speed signal and high-density substrate, the "Back Drill Substrate." By removing unnecessary through-hole stubs through back drilling, we eliminate signal disturbances. Furthermore, it becomes possible to reduce attenuation, allowing us to provide high-speed transmission substrates with better characteristics. 【Features】 ■ Back drilling process ■ Capability to eliminate signal disturbances and reduce attenuation *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High-speed signal, high-density substrate "Build-up substrate"

High-speed signal, high-density substrate "Build-up substrate"

Build-up structure! Supports various interlayer connections with laser VIA, IVH, and through VIA.

We would like to introduce our high-speed signal and high-density substrate, the "Build-Up Substrate," which we handle. It supports build-up substrates from 4 layers to 16 layers, and thanks to its build-up structure, it accommodates various interlayer connections using laser vias, IVH, and through vias. It allows for the mounting of narrow-pitch components and high-density designs. Please feel free to consult us when you need assistance. 【Features】 ■ Supports build-up substrates from 4 layers to 16 layers ■ Allows for the mounting of narrow-pitch components and high-density designs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High-frequency hybrid substrate "Hybrid substrate"

High-frequency hybrid substrate "Hybrid substrate"

The intended use is for base stations and communication equipment! We offer circuit boards with excellent cost performance.

The "Hybrid Substrate" is a high-frequency hybrid substrate that enables the manufacturing of multilayer substrates combining a variety of materials. By using expensive materials with excellent high-frequency characteristics only in the necessary layers, we provide cost-effective substrates. We will propose combinations of materials (high-frequency materials and FR-4 materials) considering electrical characteristics, material reliability, and more. 【Features】 ■ Capable of manufacturing multilayer substrates combining a variety of materials ■ Expensive materials with excellent high-frequency characteristics are used only in the necessary layers ■ Combinations of materials are proposed considering electrical characteristics, material reliability, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High-frequency compatible substrate "Fluororesin substrate"

High-frequency compatible substrate "Fluororesin substrate"

Materials with excellent frequency characteristics! Capable of high-frequency performance tailored to specific applications.

"Fluororesin substrates" are printed circuit boards with low dielectric constant and low dielectric loss, exhibiting very good frequency characteristics. They can be tailored to high-frequency characteristics according to the application. Additionally, we can handle products from both domestic and overseas manufacturers. Please feel free to consult us when you need assistance. 【Material Types】 ■ General FR-4 material ■ PPE material ■ LCP material ■ Fluororesin material *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Side-coated substrate

Side-coated substrate

Coating on the substrate side! Prevents powder drop from the edge caused by rubbing against the guide rail.

We would like to introduce our "Side Coated Substrate." Powder shedding from the opened sides of laminated substrates can affect the assembly process and become a source of foreign matter within the mold. By coating the sides of the openings, we contribute to solving problems during assembly. By applying a coating to the sides of the substrate, we prevent powder shedding from the edges that occurs when the substrate rubs against guide rails during transport. [Applications] ■ Device substrates ■ Substrates requiring resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Tent Through Hole PCB

Tent Through Hole PCB

Prevent the flow of sealing resin and flux during component mounting!

The "Tent Through Hole Substrate" is a substrate that forms a tent membrane over the through-hole sections using a dry film type solder resist. It prevents the flow of sealing resin and other resins after component mounting, as well as the wicking of flux and solder during the mounting process. Please feel free to contact us when you need assistance. [Applications] ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Silicone embedded substrate

Silicone embedded substrate

By changing the height of the circuit, it is possible to form silicone ink on the circuit as well!

We would like to introduce our "Silicone Embedded Substrate." By filling the gaps between the circuits where LED elements are mounted with silicone ink that has high reflectivity and weather resistance, we can suppress the degradation of the resin substrate. Additionally, by combining this with a step process, it is possible to form silicone ink on the circuit by changing the height of the circuit. 【Applications】 ■ Substrate boards for chip LEDs, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Functional step substrate

Functional step substrate

Suitable for applications such as power supplies, inverters, and high-current circuit boards and device components!

We would like to introduce our "Function Step Board." Through our step circuit process, we can arrange high-current circuits using thick copper foil, such as 70μm, and fine wire control circuits using copper foil, such as 18μm, on the same substrate, enabling the provision of copper-thick hybrid circuit boards through continuous wiring. By forming unevenness through step formation in part of the circuit, we can provide height adjustment of mounted components and functions based on shape and structure in substrates used for device components. 【Specifications (Partial)】 ■ Base material copper foil thickness: 18μm, 35μm, 70μm, 105μm ■ Maximum step height - 18μm copper foil: 12μm - 35μm copper foil: 25μm - 70μm copper foil: 50μm - 105μm copper foil: 80μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Ultra-thin rigid substrate

Ultra-thin rigid substrate

It is possible to manufacture a double-sided board with a substrate thickness of 0.04t, while being a rigid substrate!

We would like to introduce our "Ultra-Thin Rigid Substrate." Thanks to our technology, we can manufacture double-sided substrates with a thickness of 0.04 mm, while still being rigid. This is ideal for applications such as circuit boards for ultra-thin high-density devices. Please feel free to contact us when you need assistance. 【Applications】 ■ Circuit boards for ultra-thin high-density devices, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Thin plate bending substrate

Thin plate bending substrate

Surface treatment includes heat-resistant preflux and electroplating/non-electrolytic gold plating! Compatible with routers.

The "Thin Plate Bending Substrate" is a substrate that serves as an alternative to flexible substrates, using thin glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, which are used for several bends or bending during assembly. Applications include LED lighting substrates used on curved surfaces, substrates that require component mounting and bending, and substrates for connections between boards, all suitable for several bends. Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Number of layers: Single-sided / Double-sided ■ Thickness: 0.06 to 0.1mm ■ Minimum bending radius: Can be bent up to 5 times at R1.5 ■ Outline processing: Router compatible *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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End face through-hole substrate. Our unique processing solves copper burrs and powder drop!

End face through-hole substrate. Our unique processing solves copper burrs and powder drop!

We will solve the implementation issues and challenges arising from the miniaturization of electronic components with our special structures such as edge-through-hole boards and laminated boards.

End face through holes are formed by cutting through holes created at the edges of the substrate using contour processing. Traditionally, copper burrs were generated during the cutting of through holes, but our company can provide end face through holes without burrs even with router processing thanks to our unique process. Additionally, this unique process allows for the partial etching of landless through holes and the copper plating of through holes. In printed circuit boards for electronic device applications such as compact modules, miniaturization and heat dissipation are required. Our company offers special structure printed circuit boards tailored to your needs, such as metal cavity structure boards and three-dimensional structure boards through lamination.

  • Circuit board design and manufacturing
  • Substrate

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MI-PCB Technology

MI-PCB Technology

High heat dissipation and noise issue resolution with GND reinforcement MI-PCB technology!

"MI-PCB Technology" is a new concept PCB technology that aims to efficiently solve problems by inserting thick metals with excellent thermal conductivity at appropriate positions within the PCB layers. It possesses Thick Metal Etching & Patterning Technology. It can be used in automotive products, electric vehicles, smartphones, and more. 【Features】 ■ High Thermal Performance ■ Reduces the thickness of electronic product sets ■ No need for heatsinks ■ Eliminates processes related to heatsink attachment, improving productivity (No need for thermal grease application and eliminates the heatsink attachment process) *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Substrate

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Heat-dissipating substrate "DPGA"

Heat-dissipating substrate "DPGA"

This is a substrate with unique high heat dissipation properties developed by Daiwa Kogyo Co., Ltd.

"DPGA" stands for "Daiwa Process Global Advance," which is a process developed independently by Daiwa Industrial that uses metal Cu bumps for interlayer wiring connections. A substrate with high heat dissipation characteristics enables high brightness and long lifespan of LEDs, as well as miniaturization of heat sinks. 【Features】 ○ Interlayer connection using metal pillars (copper bumps) → Achieves low resistance, high connection reliability, and high thermal conductivity ○ Copper bumps can be of any shape and size → For cylindrical shapes, diameters can range from 0.3 to 4.00 mm ○ Mixing of copper bumps of different sizes is possible ○ Improved thinness, lightness, and rigidity → Minimum board thickness: 0.3 mm, using prepreg for the insulation layer ○ Maximizes the functionality of LEDs → Ideal for LED substrates (liquid crystal panels, lighting) and automotive substrates For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Substrate

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Cost reduction: High heat dissipation, high current circuit board

Cost reduction: High heat dissipation, high current circuit board

Achieving unit cost reduction, unit size reduction, and extended lifespan. Ideal for LED substrates and automotive substrates!

We would like to introduce Daiwa Kogyo Co., Ltd.'s "High Heat Dissipation and High Current Circuit Boards." Our "High Heat Dissipation Circuit Board" replaces ceramic substrates, achieving cost reduction in substrate expenses. Additionally, by switching from water cooling to air cooling, we achieve cost reduction in unit expenses. We also manufacture products such as "Copper Pin Embedded Circuit Boards," which reduce thermal damage to components, as well as "Aluminum Base/Copper Base Circuit Boards" that can handle thermal conductivity up to 10W, and "Thick Copper Circuit Boards" suitable for high current. If you are having trouble with circuit boards, please feel free to consult with us. 【Features】 ■ High Heat Dissipation Circuit Board - Achieves cost reduction in substrate expenses by replacing ceramic substrates - Achieves cost reduction in unit expenses by switching from water cooling to air cooling - Realizes reduction in unit size and component costs through miniaturization of heat sinks/fans ■ Copper Pin Embedded Circuit Board - Provides pinpoint heat dissipation from high-heat components - Reduces thermal damage to components *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Daiwa Industrial Co., Ltd. Company Profile

Daiwa Industrial Co., Ltd. Company Profile

Addressing environmental issues! We provide customers with excitement and satisfaction through manufacturing and technology development.

Our company was founded in 1967, starting as a metal pressing processing business, and applied that technology to the contour processing of printed circuit boards. We began manufacturing printed circuit boards in 1982 and have continued to this day. We have also succeeded in developing technology that enables general printed circuit boards to have heat dissipation properties equivalent to or exceeding those of ceramics. Focusing on "manufacturing and technology development" that leads the world without being swayed by environmental changes, we provide our customers with excitement and satisfaction. 【Business Activities】 ■ Manufacturing, development, and sales of printed wiring boards *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Contract manufacturing
  • Circuit board design and manufacturing
  • Substrate

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High Heat Dissipation Substrate 'DPGA-M'

High Heat Dissipation Substrate 'DPGA-M'

DPGA is made double-sided and supports back-side wiring! Equal-length wiring is possible even when parallel circuits are present.

"DPGA-M" is a high thermal conductivity substrate that features a single-sided multilayer design and supports backside wiring. By adopting a single-sided multilayer structure, it significantly enhances design flexibility, allowing for backside wiring. Although it has multiple layers stacked on one side, it is possible to penetrate copper bumps. This enables direct connection of high thermal conductivity components to the copper base and heat sink. 【Features】 ■ Single-sided multilayer structure ■ Enables backside wiring ■ Allows for equal-length wiring even in the presence of parallel circuits ■ Significantly increases design flexibility ■ Enables direct connection of high thermal conductivity components to the copper base and heat sink *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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High Heat Dissipation Substrate 'DPGA-S'

High Heat Dissipation Substrate 'DPGA-S'

Separating the copper base on the back and ensuring insulation! Maintaining the strength of the substrate even after separating the copper base.

The "DPGA-S" is a high thermal conductivity substrate that separates the copper base on the back side and is designed for insulation. Thanks to the high thermal conductivity provided by the through-type copper bumps, it is possible to make the insulation layer up to 0.3mm thick. This allows for maintaining the strength of the substrate even after separating the copper base. Additionally, by separating the layers, it is also possible to mount electrodes on the copper base side. 【Features】 ■ High thermal conductivity due to through-type copper bumps ■ Insulation layer can be made up to 0.3mm thick ■ Allows for mounting electrodes on the copper base side by separating the layers ■ The back side can also be utilized for electrical connections *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Copper Pin Embedded Substrate "DPGA-EF"

Copper Pin Embedded Substrate "DPGA-EF"

Embed copper pins directly under the heating components! This can reduce the cost difference based on the number of copper pins.

"DPGA-EF" is a type of substrate that embeds copper pins only in the necessary areas. It can be produced at a lower cost compared to copper bases with bumps. The copper pins are inserted into the holes of the rigid substrate and fixed with resin. Unlike press-fitting, there is no risk of cracks or other issues. Additionally, the copper pins are embedded all at once. Unlike the press-fitting method, the cost difference based on the number of copper pins can be minimized. 【Features】 ■ Both sides of components can be mounted ■ Heat-generating components can be cooled precisely ■ There are no concerns about cracks or chemical residue, as it differs from the copper pin press-fitting method ■ It can be produced at a lower cost compared to copper bases with bumps ■ Unlike the press-fitting method, the cost difference based on the number of copper pins can be minimized *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Copper base / aluminum base substrate

Copper base / aluminum base substrate

The thermal conductivity can support up to 10W! Introducing a single-sided, one-layer metal substrate using a high thermal conductivity insulation layer.

We would like to introduce our "Copper Base/Aluminum Base Substrates." The "Copper Base" is a plain substrate without copper bumps. It features a high thermal conductivity copper material with a 4-10W insulation layer and copper foil laminated together, suitable for high heat dissipation of LEDs. The "Aluminum Base Substrate" is compatible with aluminum substrate materials from various manufacturers. You can choose suitable materials from a wide lineup based on thickness, thermal conductivity, and more. 【Features】 <Copper Base> - No copper bumps - High thermal conductivity copper material with a 4-10W insulation layer and copper foil laminated - Suitable for high heat dissipation of LEDs <Aluminum Base Substrate> - Compatible with aluminum substrate materials from various manufacturers - A wide selection of suitable materials available *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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High current compatible thick copper substrate

High current compatible thick copper substrate

We introduce a thick copper substrate that incorporates a 400μ copper plate bonded to the core material, accommodating multilayer configurations.

The "High Current Compatible Thick Copper Substrate" is a substrate that consists of a core material bonded with a copper plate as the outer layer. The thickness of the outer layer copper can be up to 400μ. It is designed to accommodate high current applications. Additionally, it can also support multilayer boards where copper plates are bonded to the inner layers, with only the outer layer being thick copper. Thick copper can be used for both outer layer circuits and inner layer circuits. 【Features】 ■ A 4-layer board combining 35μ inner layer with 300μ outer layer ■ Compatible with the step of thick copper through silk printing with inkjet *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Analog and Digital Circuit Design & Software Production

Analog and Digital Circuit Design & Software Production

We have 40 years of experience in analog and digital circuit design and software development, and we are also engaged in new technology development.

We are developing and supplying CPU boards for industrial use using the RX family. This family achieves high computational performance and excellent low power consumption, making it suitable for applications ranging from small-scale to large-scale. We develop products that meet customer needs, from circuit design to prototype mass production, using this CPU.

  • Instrumentation and Control Systems
  • Control Panel
  • Substrate

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Maruwa Manufacturing Co., Ltd. Business Introduction

Maruwa Manufacturing Co., Ltd. Business Introduction

Specialized manufacturer of flexible printed circuit boards (FPC)!

Maruwa Manufacturing Co., Ltd. is a company primarily engaged in the manufacturing and sales of flexible printed circuit boards (FPC). Our products are used in various applications such as space and aerospace equipment, as well as medical devices. To meet diverse needs, we possess advanced technologies for high-density FPC formation and thin FPC formation, and with our extensive experience and production techniques, we provide timely FPC solutions that satisfy our customers. For any inquiries regarding flexible printed circuit boards (FPC), please feel free to consult with us. [Business Activities] ■ Manufacturing and sales of flexible printed circuit boards (FPC) *For more details, please refer to our catalog or feel free to contact us.

  • Other electronic components and modules
  • Other Machine Parts
  • Substrate

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FPC "Single-sided FPC"

FPC "Single-sided FPC"

Ideal for flexible bending and effective use of embedded space!

"Single-sided FPC" is a printed circuit board that has a conductor pattern on only one side. Due to its thinness, it allows for flexible bending and effective use of assembly space, and we also offer fine-pitch specifications in addition to standard specifications. This product is mainly used in backlights and motors. 【Features】 ■ Conductor pattern on one side only ■ Allows for flexible bending and effective use of assembly space *For more details, please refer to the catalog or feel free to contact us.

  • Electronic Components
  • Other Machine Parts
  • Substrate

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Japan Universe Co., Ltd. (Printed Circuit Board Division) Company Profile

Japan Universe Co., Ltd. (Printed Circuit Board Division) Company Profile

We provide comprehensive technology related to electronic devices from specification creation to development, design, manufacturing, and evaluation.

At Nippon Universe Co., Ltd. - Printed Circuit Board Division, we utilize the technology we have cultivated over 48 years to respond to printed circuit board design, manufacturing, and assembly with small quantities and short lead times. We are enhancing our simulation technology to aim for higher quality designs. In wiring design, we can significantly shorten design lead times through a simultaneous parallel design system. We support the establishment of ultra-short lead time lines that operate on weekends and holidays, as well as provide assistance from numerous satellite design offices across the country. We also handle the preparation of documentation related to circuit boards and have extensive experience in high-speed signal design (LVDS2, DDR2, DDR3). Regarding manufacturing (outsourcing), we can accommodate short lead times for single-sided boards to 36-layer high multilayer boards, as well as various types of board manufacturing (high multilayer boards, flex, ceramic boards, BGA). We select the optimal factory based on customer requirements (high difficulty, budget, lead time). For component assembly (outsourcing), we can achieve high-quality assembly with the latest equipment (maintaining a defect rate of 0.003 or lower). We respond to short lead times through manual assembly and mounting machines. For more details, please contact us or download our catalog.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Business Information: Japan Universe Co., Ltd.

Business Information: Japan Universe Co., Ltd.

We provide comprehensive technology related to electronic devices from specification creation to development, design, manufacturing, and evaluation.

Japan Universe Co., Ltd. provides comprehensive technology related to electronic devices, from specification creation to development, design, manufacturing, and evaluation. We have established an environment that allows for integrated production of everything, enabling high quality along with small lot sizes, a variety of products, and short delivery times. Please feel free to consult with us first. 【Business Content】 ■ Design, manufacturing (outsourcing), assembly (outsourcing), and sales of printed circuit boards ■ Dispatch services *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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GaN substrate (square)

GaN substrate (square)

Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor.

Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor. Due to its higher breakdown voltage, faster switching speed, higher thermal conductivity, and lower on-resistance, GaN-based power devices are significantly superior to silicon-based devices.

  • Other metal materials
  • Substrate

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Ideal for surface mount heater applications without adhesive! 'SUS/Polyimide substrate'

Ideal for surface mount heater applications without adhesive! 'SUS/Polyimide substrate'

"5% weight reduction temperature is 534℃!" This is a stainless steel/polyimide substrate suitable for high-temperature planar heating heater applications, without the use of adhesives.

Kawamura Industries provides stainless steel/polyimide materials by leveraging the know-how of polyimide coating technology developed over many years on stainless steel foil. **Features of Kawamura Industries' "SUS/Polyimide Material"** - Excellent heat resistance due to being adhesive-free → 5% weight loss temperature (534°C) - High adhesion strength achieved through unique polyimide technology → Stainless steel/polyimide adhesion strength (2.4 kN/m) - Wide range of thickness options → Stainless steel thickness (15, 18, 20, 30, 50 μm) → Polyimide thickness (selectable between 5-25 μm) *For examples of properties, please refer to the PDF document or feel free to contact us.*

  • Composite Materials
  • stainless
  • Other polymer materials
  • Substrate

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