Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
661～690 item / All 1922 items
Just replace it with the standard product.
This is a TWELITE board compatible with TWELITE DIP from Monowireless. It has implemented convenient features for the FA environment. 【Features】 - Power enhancement circuit - RST protection circuit - Equipped with FRAM - I2C external pull-up - Input circuit external pull-up
Unique gap mechanism and high-speed image processing! Multi-layer exposure is possible with the auto-alignment system.
The "MA-1000 series" is a manual exposure device suitable for small-lot production of various types and for experiments and research. It can adopt soft contact exposure and proximity exposure. Additionally, we prepare optical systems that combine ultra-high-pressure mercury lamps, various mirrors, and special lenses appropriately according to the application and substrate size. 【Features】 ■ Capable of soft contact exposure and proximity exposure ■ In-plane uniform illumination using a unique mirror and lens optical system ■ Multi-layer exposure is possible *For more details, please refer to the related links or feel free to contact us.
Substrate materials that demonstrate excellent transmittance in the IR (infrared wavelength range) for semiconductor and electronic device manufacturing!
We manufacture and sell "germanium substrates." These substrate materials exhibit excellent transmittance in the infrared (IR) wavelength range. We offer N-type and P-type germanium substrates (flat polished wafers, diameters of 1, 2, or 3 inches / crystal orientations of 100, 110, or 111) that have been doped during crystal growth for semiconductor and electronic device manufacturing. Please feel free to contact us if you have any inquiries. 【Products Offered】 ■ N-type and P-type germanium substrates *For more details, please refer to the PDF document or feel free to contact us.
Turnkey connector implemented! A thin polymer resin film is used as insulation.
"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.
We provide total coordination from circuit board design to product completion!
Our company provides total coordination from CAD design of printed circuit boards to board manufacturing, assembly, sheet metal processing, resin processing, cable processing, and assembly inspection. Since there is a close connection between each process, we streamline manufacturing to reduce time and labor costs while providing high-quality products at lower costs. Please feel free to contact us if you have any requests. *For more details, please do not hesitate to inquire.
From the manufacturing of printed circuit boards to pattern design and component mounting.
Our company is a specialized manufacturer of printed circuit boards located in Kawaguchi City, Saitama Prefecture. We manufacture using small films, allowing for the production of prototypes and small lots with a variety of products. Additionally, we actively manufacture using films retrieved from defunct circuit board companies, which others tend to avoid. 【Our Features】 ■ Low initial costs ■ Partial modifications are possible ■ Production from other companies' films is also possible ■ We propose more cost-effective manufacturing methods ■ Management period for films and plates is a minimum of 5 years *Please feel free to contact us for more details.
Leave everything related to the design, manufacturing, assembly, and procurement of printed circuit boards to us!
Our company provides 24-hour support for the design, manufacturing, assembly, and procurement of printed circuit boards with ultra-short delivery times. We leverage our network across various industries both domestically and internationally to manage and procure semiconductors and electronic components in-house. Additionally, we offer flexible responses from small lot production to mass production and prototype assembly, enabling us to achieve short delivery times and high-quality production that is challenging for overseas manufacturing. 【Features】 ■ Same-day shipping for single-sided boards at the shortest level ■ Initial time reduction system ■ Capable of handling sizes from 0603 ■ Support for large boards (LL) ■ We can produce boards starting from just one piece *For more details, please download the PDF or feel free to contact us.
The functions of electronic devices are becoming increasingly complex, and their sizes are getting smaller. If you need multilayer substrates, please consult us here.
Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.
4-layer high-density wiring circuit board
Number of layers: Four layers Material: FR-4 Board thickness: 1.57 +/- 0.13 mm Surface treatment: Electroless gold plating Copper foil thickness: H/H~1/1 oz Remark: Impedance control 75 OHM Differential pair: 85/90/100 OHM
It is a composite board of rigid and flexible substrates. Most rigid substrates are multilayer boards.
Number of Layers: Eight Layers Material: FR-4/Polyimide Board Thickness: FR4: 1.0 +/- 10% PI: 0.05mm Surface Treatment: Electroless Gold Plating 2µ" (min), Ni 100µ" (min) Copper Foil Thickness: 1/H~H/1 oz Remark: Camera Lens
It is a commonly used circuit board.
It is a two-layer FR-4 substrate.
Generally, high multi-layer lamination technology is adopted in manufacturing.
Number of layers: 4 layers Material: FR4 Board thickness: 2.28 +/- 0.23 mm Surface treatment: Electroless gold plating Copper foil thickness: 1/3/0.85 OZ
Visualizing temperature and humidity within the factory to address static electricity! Capable of small-lot production with diverse manufacturing equipment.
TokuNaga Manufacturing Co., Ltd. is a company that assembles printed circuit boards for electronic devices and various electrical components, as well as assembling molded products and metal parts. Within the factory, temperature and humidity are visualized, and at the headquarters, measures are taken to improve low humidity environments using a dry fog humidifier, as well as wearing conductive work clothing, conductive shoes, and grounding bands to address static electricity issues. Additionally, certified personnel are engaged in in-process inspections and soldering work, and to aim for higher skills, education and qualification acquisition are promoted. 【Business Activities】 ■ Printed circuit boards for oil heating devices, power supply equipment, control devices, etc. ■ Assembly of operation panels, power boxes, etc. *For more details, please refer to the PDF materials or feel free to contact us.
We also have detailed materials explaining mold (potting) and coating that can implement measures for waterproofing, humidity resistance, and earthquake resistance of the implementation substrate.
If the printed circuit board is used as is, it often leads to malfunctioning of the board, damage to components or the board itself, and a reduction in the lifespan of the board. Therefore, for printed circuit boards in harsh environments, measures such as waterproofing, moisture-proofing, vibration-proofing, dust-proofing, and explosion-proofing become necessary. As a countermeasure, resin molding (resin potting) can be used to inject urethane resin into cases, which can shut out dust, dirt, water, and vibrations. Additionally, since the board is fixed in place, it can be protected from vibrations. *Consideration for implementation is possible even without a case. Furthermore, by coating the surface of the board, it is possible to protect the board from dust, dirt, and moisture. *For more details, please refer to the PDF document or feel free to contact us.
By injecting urethane resin into cases, dust, dirt, and water are shut out! This processing technology contributes to the waterproofing, dustproofing, and seismic resistance of printed circuit boards.
Resin potting is a processing technology that allows for the injection of urethane resin into cases, effectively shutting out dust, dirt, and water. Since the circuit board is fixed in place, it can be protected from vibrations. This contributes to the waterproofing, long life, and earthquake resistance of the mounted circuit board. 【Advantages of Resin Potting】 - No worries about dust or dirt adhering to the circuit board - Excellent waterproofing and moisture resistance - Strong against vibrations and impacts as the case can be filled and fixed with resin - Can extend the component replacement cycle, proving effective for products aimed at overseas markets - Prototyping is possible We will carry out work according to your requirements, so please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.
We specialize in the manufacturing of "single-sided printed circuit boards" and "double-sided printed circuit boards"!
Our company specializes in the manufacturing of printed circuit boards up to "30mm round or 30mm square" and "50mm round or 50mm square" among wiring boards. We are also skilled in small lot production, working with copper-clad laminates ranging from 1 to about 30 sheets as the work size, cutting materials into panels (boards) sized from 255mm square to 340mm square, with our preferred lot size being the production of 10 to 300 panels (boards) per lot. Additionally, we focus on the rare production of "paper phenolic resin boards" in Japan, achieving stable supply. 【Our Features】 ■ Preferred board sizes are small items (compact and small sizes) ■ Preferred lot sizes are small quantities ■ Resist using thermosetting inks and UV-cured inks ■ Basic production involves "repeat production" with press processing ■ Specializing in rigid boards with "single-sided and double-sided" options *Please feel free to contact us for more details.
We have achieved the lowest prices in the web circuit board manufacturing industry with our express response circuit board production!
We have achieved the lowest prices in the industry for web-based circuit board manufacturing with ultra-fast response times! Our fixed-price circuit board manufacturing plan is a first in the industry! Regardless of the board size, the manufacturing cost for a 2-layer board is a fixed ¥90,000! *Please note that there are limitations on the sizes that can be manufactured. If you are struggling with delivery times, please make use of our services!
No initial fees! We can manufacture circuit boards at one of the lowest prices in the country!
We have achieved some of the lowest prices in the domestic web circuit board manufacturing industry! Regarding quality, we conduct two checks at our certified circuit board manufacturing factory and during the acceptance of the boards at our company, so there are no issues! Price examples: Board size: 90mm x 75mm, Layers: 2 Surface treatment: Flux, Thickness: 1.6 Resist: Double-sided green, Resist: Double-sided white Quantity: 5 pieces Price: ¥18,299 Board size: 120mm x 60mm, Layers: 4 Surface treatment: Flux, Thickness: 1.6 Resist: Double-sided green, Resist: Double-sided white Price: ¥32,538 Please feel free to request a quote, even if just to try it out!
Handheld cable checker compatible with various wire harnesses.
The "Cable Check Box" is a portable, handy cable checker that is easy to carry. It performs continuity tests on wire harnesses using a rotary switch for selection and lamp indicators. Additionally, it can accommodate various wire harnesses through a relay harness. 【Features】 ■ Compatible with various wire harnesses ■ Testing can be performed while the harness is connected ■ Excellent portability and convenience for carrying ■ Pin number specification with a rotary switch (simple type: TYPE A) ■ Testing is done simply by pressing the test button (standard type: TYPE B) *For more details, please refer to the PDF document or feel free to contact us.
We will guide you through the roles, performance, and features of each process and equipment, as well as a tour of the printed circuit board manufacturing factory!
We are offering a "WEB Factory Tour Proposal." In the initial company introduction, we will provide an overview of our company, its features, and usability. During the subsequent factory tour, we will explain the roles, performance, and features of each process and equipment (with documentation), and conduct a live video tour of the printed circuit board manufacturing factory, followed by a Q&A session. 【Schedule Image (Tentative)】 ■ Date: **Month** **Day**, 2022 13:30 - 15:00 ■ Location: WEB ■ Company Introduction: 13:30 - 13:50 ■ Factory Tour: 13:50 - 14:50 (Guided by documentation and live video) ■ Q&A Session: 14:50 - 15:00 *For more details, please feel free to contact us.
Of course, short delivery times in manufacturing quickly resolve evaluation-related issues.
Priken takes pride in being among the top class for short manufacturing lead times, but we are fully committed to resolving our customers' issues as quickly as possible. We propose "jigs" that reduce the effort required for prototype evaluation and consider schedules to meet desired delivery dates, achieving short lead times. We aim for not only manufacturing speed but also proposals for efficient development without waste. 【Features】 ■ Proposing evaluation jigs to shorten work lead times ■ Reducing effort and shortening lead times by simplifying request materials ■ Proposing short lead times while considering the client's methods *For more details, please download the PDF or feel free to contact us.
It is possible to carry out the production of the substrate from the layout with an appropriate cost, considering the yield assumptions!
At our company, we operate a simulation tool called "Estimate-kun," which is specialized in circuit board manufacturing, to propose various structures of circuit boards based on our extensive prototyping experience. By providing us with the basic specifications, we can suggest circuit boards that can be manufactured more quickly and at an optimal cost. Additionally, we will propose points for relaxing design rules based on the balance of risk, process steps, and cost. 【Features】 ■ Extract necessary materials and process conditions for various structures of circuit boards ■ Achieve matching with various specifications ■ Produce circuit boards at suitable costs *For more details, please download the PDF or feel free to contact us.
We will do our utmost to support our customers' smooth development!
We handle "electrical characteristic measurement substrates" used in the development processes of chip components and connectors, as well as in shipping inspections. We provide comprehensive proposals for precise impedance management, design rules considering product reliability, structures suitable for measurement methods, and surface treatments, delivering high-precision and durable substrates. 【Features】 ■ Impedance control: ±10% / coupon management, ±3% / selection ■ Proposals for design rules, structures, and surface treatments tailored to measurement applications ■ One-stop solution: from evaluation board creation to metal masks and assembly *For more details, please download the PDF or feel free to contact us.
![Understand in 3 minutes! Substrate for electrical characteristic measurement [Materials Available]](https://image.mono.ipros.com/public/product/image/b64/2001482622/IPROS5831598321479633871.jpg?w=280&h=280)
We are currently providing materials that introduce special requirements when using measurement substrates!
We are pleased to present materials introducing our "Measurement Substrates for Electrical Characteristics." This document summarizes the error factors in impedance management, the differences between models and actual products in "Aligning Impedance," and includes information on "Differences Between Measurement Substrates and General Substrates." The content is designed to be easily referenced during your consideration of implementation. Please feel free to download and read it. 【Contents Included】 ■ Aligning Impedance ■ Differences Between Measurement Substrates and General Substrates ■ Compatibility with Measurement Methods *For more details, please download the PDF or feel free to contact us.
![Understand in 3 minutes! Solder Resist Formation Technology [Materials Provided]](https://image.mono.ipros.com/public/product/image/372/2001482628/IPROS9616608863840498519.jpg?w=280&h=280)
We are currently providing materials that include specifications such as terminal size, clearance, and solder mask thickness!
We are pleased to present materials introducing our "Solder Resist Formation Technology." This document includes specifications such as terminal size, clearance, solder mask thickness, and surface treatment, along with images. Please make use of it when selecting products. [Featured Products] ■ SMD (Solder Mask Define) ■ NSMD (Non-Solder Mask Define) *For more details, please download the PDF or feel free to contact us.
KIBAN is a manufacturer that has shaped images with high flexibility. Solving development challenges, the "Master of Assurance" creates value beyond "safety."
【Features of Puriken】 ■ Product lineup: Supports various specifications from single-sided to high multilayer, through-hole, IVH, and build-up ■ Full support system: Full support from circuit board design to manufacturing and component mounting (coordinating optimal lead times) ■ Process tracking: Real-time tracking of circuit board manufacturing process progress (providing a convenient system to understand process progress) ■ Educational support: WEB factory tours via LIVE video (showing all equipment in the circuit board manufacturing process), also accommodating on-site seminars ◇ Examples of actual products Product applications: Power supply, measurement, motors, video, communication, audio, sensors, and others High-speed signal and high-frequency circuits: 4K and 8K video equipment, medical cameras, wireless devices, various antennas High current and high voltage: UPS uninterruptible power supplies, battery packs, various in-vehicle ECUs, lighting equipment < Circuit Board Design > Supported CAD / In-house owned: CR-5000BD, CR-8000DF Design specifications: Digital, analog, mixed digital-analog, high-speed transmission, high current, high voltage, etc. < Circuit Board Manufacturing > Number of layers: Single-sided to 24 layers, fixture boards Specifications: Through-hole, pad-on-via, IVH, build-up, etc. * Many other product examples available! For more details, please download the materials or contact us.
Please let us assist you with support for each process, from deadline management and specification adjustments to full process support.
【Features of Puriken】 ■ Product lineup: Supports various specifications from single-sided to high multilayer, through-hole, IVH, and build-up ■ Full support system: Comprehensive support from circuit board design to manufacturing and component assembly (coordinating optimal lead times) ■ Process tracking: Real-time tracking of circuit board manufacturing process progress (providing a convenient system to understand process progress) ■ Educational support: WEB factory tours via LIVE video (showing all circuit board manufacturing process equipment), also accommodating on-site seminars ◇ Examples of actual products Product applications: Power supply, measurement, motors, video, communication, audio, sensors, and others High-speed signal and high-frequency circuits: 4K/8K video equipment, medical cameras, wireless devices, various antennas High current and high voltage: UPS uninterruptible power supplies, battery packs, various in-vehicle ECUs, lighting equipment < Circuit Board Design > Supported CAD / In-house owned: CR-5000BD, CR-8000DF Design specifications: Digital, analog, mixed digital-analog, high-speed transmission, high current, high voltage, etc. < Circuit Board Manufacturing > Number of layers: Single-sided to 24 layers, fixture boards Specifications: Through-hole, pad-on-via, IVH, build-up, etc. * Many other product examples are available! For more details, please download the materials or contact us.
[Presentation Materials Available] A detailed document condensed with the latest technology and abundant achievements thoroughly explains the true value and effectiveness of Shinchoku-kun. Please experience the business transformation!
"Progress-kun" is a cloud-based system provided by Priken that enables visualization of the circuit board manufacturing process. Upon placing an order, an automatic confirmation email is sent to the representative, along with an ID, password, and access URL, allowing real-time tracking of the progress. The monthly order volume ranges from 1,500 to 2,000 items. The average time from order to delivery is 2 to 3 days. In the fastest cases, delivery can be completed on the same day the order is placed. This is made possible by a one-stop system that allows for consistent in-house production from design to manufacturing. Since all processes can be completed in-house, we can deliver products without any time lag. □ As a comprehensive contact point for PCB companies! Everything and anything! ■ Supports a variety of products ■ Delivery in as little as 1 day ■ Orders accepted from just one circuit board *For more details, please download the PDF or feel free to contact us.
Announcement of Webinar / September 9 (Tuesday) 11:00 AM - 12:00 PM 【A Rough Method for Estimating the Heat Dissipation Copper Foil Area of Printed Circuit Boards!!】
A Rough Method for Estimating the Heat Dissipation Copper Foil Area of Printed Circuit Boards!! In cases where there are components or circuit configurations that may generate heat, and new or unknown factors necessitate heat countermeasures, delays or failures in design responses can occur due to a lack of experience in thermal design or the absence of analysis tools. This can lead to problems in actual devices and delays in development schedules. To conduct thermal analysis, tools are typically required, but many do not have the necessary resources, and hiring specialized firms can often be costly. In this webinar, we will introduce heat countermeasure techniques that can be implemented even when there is no time or budget for simulations. ■ Recommended for: - Engineers dealing with components or circuits where heat generation is a concern, such as power circuits, motor control, and LED boards. - AW designers ■ Date: Tuesday, September 9, 2025, 11:00 AM - 12:00 PM ■ Format: Webinar (using Zoom) ■ Organized by: Ryosan Corporation ■ Co-organized by: Priken Corporation ■ Participation Fee: Free *For more details, please refer to the related link URL below or feel free to contact us.
It is possible to assist with processing management, time reduction, cost reduction, and yield improvement!
We would like to introduce our "Ultra-High Flatness Substrate." We have achieved high flatness even for small-diameter substrates of conventional semiconductor single crystal substrates. In standard processing, the limit for flatness (TTV) was ≦3um, but we have realized TTV ≦1um, and we can respond to even higher flatness requirements depending on specifications. The high flatness of the base substrate offers advantages in bonding substrates and photolithography, and it also contributes to the uniformity of various deposition films formed on the substrate, expanding its applications to devices that require precision in the future. Additionally, as a substrate manufacturer, we can adjust substrate thickness and achieve symmetry in edge shapes from the ingot stage, which can help reduce the cumbersome processing management, shorten time, cut costs, and improve yield for our customers. 【Effective Examples】 ■ We want to reduce the time and cost of thinning and flattening support substrates for bonding. ■ Improving yield in the outer peripheral area. *For more details, please refer to the related links or feel free to contact us.
