We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 575 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:May 13, 2026~Jun 09, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:May 13, 2026~Jun 09, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. 共栄電資 Tokyo//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 沖電気工業 産業営業本部 産業営業統括室 Tokyo//Information and Communications

Substrate Product ranking

Last Updated: Aggregation Period:May 13, 2026~Jun 09, 2026
This ranking is based on the number of page views on our site.

  1. Busbar for Data Centers - High Current Board 共栄電資
  2. FPC for the space industry 太洋テクノレックス 本社 和歌山
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 Printed circuit board 北一電気
  5. 5 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.

Substrate Product List

661~690 item / All 1945 items

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Compact X-ray reel counter

Chip counter sale price 4.5 million yen (excluding tax) - It's compact, so it doesn't take up much space!

Easy Counter offers an unprecedented affordable price. Its compact size makes it a great option for those who have struggled with finding a place to put it. 99% accuracy and a counting time of 14 seconds. The operation is simple, significantly reducing the costs associated with part counting. 【Features】 ■ Measurement time: Approximately 10 seconds per reel ■ Capable of counting various parts (cut parts, bagged parts, etc.) ■ Easy to operate, with training completed in just 10 minutes *For more details, please refer to the PDF document or feel free to contact us.

  • Company:KnK
  • Price:1 million yen-5 million yen
  • Other electronic measuring instruments
  • X-ray inspection equipment
  • Defect Inspection Equipment
  • Substrate

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[Voices from Development Manufacturers] Well Research Co., Ltd.

We are satisfied with the speed and high technical capability of the design, manufacturing, and component procurement of the circuit boards used in space.

Kai Electronics Co., Ltd. has been involved in the design and manufacturing of printed circuit boards, as well as the overall development of electronic devices, and has worked with many development manufacturers in design and production. Within the company, there are three engineers specializing in system design, enclosure design, and printed circuit board design. We can pursue designs that take into account requirements from other processes and seek optimal solutions from multiple perspectives. This time, we would like to introduce feedback from a development representative at Well Research Co., Ltd. They have requested the design of circuit boards for use in space and have expressed satisfaction with the appropriate size design and the delivery schedule from parts procurement to manufacturing. [Customer Feedback] - We have requested the artwork design, manufacturing, and parts procurement for the circuit boards. - They responded quickly despite a tight delivery schedule. - The size requirements for the space industry are strict, but they provide optimal solutions. For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Bilbari CoinMech Interface 'BVCM-MIF-02'

Easy operation of vending machine bill validator data and coin mechanism from PC or microcontroller!

When trying to build a vending machine system, cash acceptance devices such as bill validators (note recognition machines) and coin mechanisms are always necessary. Our 'BVCM-MIF-02' has been developed to allow easy operation of these cash acceptance devices from a PC. The firmware handles the timing-critical aspects automatically, enabling users to easily operate the bill validator and coin mechanism. 【Features】 ■ Usable regardless of the OS through serial connection or USB connection (recognized as a virtual COM port) ■ The firmware automatically processes the timing-critical aspects of communication with the bill validator and coin mechanism ■ When using Windows OS, it can be utilized more easily by using a dedicated DLL *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Printed circuit board

Leave it to us for metal substrates, through-hole substrates, and contact substrates.

The Electronics Division of NBC Corporation is involved in the design, manufacturing, and sales of printed circuit boards, contributing to the field of car electronics, with a motto of "creating reliable products." Recently, we have also started manufacturing metal substrates aimed at improving reliability against heat, which has received positive feedback from our customers. Please feel free to contact us if you have any requests. 【Production Volume】 ■ Single-sided boards: 11,000 m²/month ■ Double-sided multilayer boards: 22,000 m²/month ■ Metal substrates: 1,000 m²/month *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Ultra-small, high-precision flexible substrate

Custom-made high-definition and ultra-high-definition substrates with narrow pitch! Leave it to us for flexible substrates (high-definition FPC)!

Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We cater to customer needs with features such as staggered layout narrow pitch, single-sided narrow pitch BGA, and sensor coils with both sides pitch, as well as single-sided, double-sided, and multilayer options. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Single-sided 20μ pitch ■ Subtractive method ■ Staggered layout narrow pitch ■ Semi-additive method *For more details, please download the PDF or contact us.

  • Board to FPC connector
  • Substrate

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Printed circuit board

We provide printed circuit boards used in various fields.

Daimuta Electronics Co., Ltd. handles single-sided printed circuit boards, double-sided through-hole boards, multilayer printed circuit boards, and assembled products. We have established a consistent production line from materials to shipment, enabling us to respond to any requests with short lead times, from prototyping to mass production. Additionally, we assist in the miniaturization and high performance of electronic devices through the introduction of advanced manufacturing equipment and state-of-the-art inspection equipment and quality control. 【Products】 ■ Printed Circuit Boards - Single-sided printed circuit boards - Double-sided through-hole boards - Multilayer printed circuit boards - Assembled products *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Introduction to the Printed Circuit Board Manufacturing Business

We manufacture composite substrates and high-frequency printed circuit boards tailored to customer users.

The manufacturing base of Kyoei Denshi has established the latest production lines, is engaged in the development of new technologies, and is capable of producing printed circuit boards from prototypes to mass production across a wide range of fields. 【Features】Our unique manufacturing technology allows us to provide circuit boards that cannot be made elsewhere. ■ By utilizing technology to bond aluminum and substrates, we have significantly improved the design flexibility of aluminum-based substrates and enabled aluminum grounding. ■ By laminating honeycomb materials, we achieve both warpage prevention and lightweight, low dielectric properties for the circuit boards. ■ By converting busbars and coils into circuit boards, we realize insulation and miniaturization. *For more details, please contact us or download the PDF for more information.

  • Printed Circuit Board
  • Substrate

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Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm]

By substrate-izing busbars and coils used for high current applications, high insulation properties and a reduction in labor hours are achieved!

We have substrate-mounted busbars and coils used for high current applications in the heavy electrical and automotive industries. By substrate mounting, the following effects can be expected: - Substrate mounting of power devices such as IGBTs and SiCs - Installation on equipment after substrate mounting → Reduction of assembly work and prevention of miswiring - Space-saving due to substrate mounting and simplification of wiring → Miniaturization of the entire device - Generally, a thick copper substrate refers to a substrate with a copper foil thickness of 200μ (0.2mm) or more, but we have also achieved substrate mounting with 3000μ (3mm) copper plates. - The greatest advantage of substrate mounting is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, so there is no concern about variation in thickness like with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Polyester hybrid laminated board [Compatible with products over 1m!]

It is possible to manufacture items exceeding 1 meter! Mainly used as insulation boards for railways and power plants.

We would like to introduce the "Polyester Hybrid Laminated Board" handled by Kyoei Electric Co., Ltd. The polyester resin can be colored with pigments such as white and N7 gray. The laminate thickness ranges from T1 to T40, and the substrate consists of alternating layers of glass cloth and glass mat. Our company can manufacture products exceeding 1 meter, so please feel free to contact us when needed. 【Features】 ■ Polyester resin, vinyl ester resin ■ Substrate: alternating layers of glass cloth and glass mat ■ Laminate thickness: approximately T1 to T40 ■ Maximum dimensions: approximately 1000*2300 ■ Can be colored with pigments in polyester resin (white, N7 gray, etc.) *For more details, please refer to the PDF document or feel free to contact us.

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  • Other polymer materials
  • Substrate

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Printed circuit board

We respond to a variety of products, small lots, and short delivery times with cutting-edge equipment and our unique production management system.

Hokuei Electric Co., Ltd. has been engaged in the assembly of printed circuit boards for automotive and office automation equipment. We respond to a variety of small lots and short delivery times, and we also quickly address new job requests. We take pride in our ability to meet customer demands, including quality, delivery, and cost, with unmatched capability. 【Main Products】 ■ Printed circuit boards for meters ■ Auto light sensors ■ Automotive lighting (for doors) *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Printed circuit board assembly

Leave your printed circuit boards and PCB assembly products to us.

We provide support from design to component mounting for printed circuit boards and board-mounted products. We can accommodate printed circuit boards from double-sided boards to high-layer-count boards and impedance boards. Please feel free to consult us for small quantities starting from one piece. 【Features】 ■ One-stop proposal for board design, mounting, and industrial electrical equipment *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Substrate

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Evaluation of the "56G-PAM4 Board" implementation completed.

We will support the upcoming high-speed communication standards with PAM4 signal communication boards!

To Matsudo Co., Ltd. and RITA Electronics, the main FPGA board for the '56G-PAM4 communication board' created during the technical study session aimed at solving customer challenges has been completed! After completing the basic checks, we will proceed with waveform verification using this board and continue to verify the operation in combination with the evaluation boards that will be successively completed thereafter. In an increasingly high-speed communication environment, we aim to accumulate high-speed technologies leading to PCIe Gen6.0, DDR, and 400G Ethernet, and provide solutions to our customers.

  • Communications
  • Circuit board design and manufacturing
  • Substrate

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Characteristics of Daishin Sangyo Co., Ltd.

Even one unit is fine! We can accommodate from small lots to mass production.

Daishin Sangyo Co., Ltd. thoroughly implements the "3S" that is trusted by our customers. (1) Speed (Prompt Response), (2) Service (Proposals/Information Provision), (3) Special (Advanced Technology Support) Our company welcomes requests from design to circuit board production, parts procurement, and rapid delivery of actual layers. We can accommodate from small lots to mass production. Please feel free to contact us. 【Features】 ■ Support for printed circuit boards, design, board production, parts procurement, assembly, and finished products ■ Capable of handling small lots to mass production ■ Able to provide ultra-short delivery times for printed circuit boards ■ Lead-free compliance * For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Other processing machines
  • Substrate

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[Data] BGA Mounting Board Data Specifications

Below t1.6! Here are examples of data specifications for BGA-mounted substrates.

This document presents examples of board data specifications for BGA mounted boards with a pitch of 1.6 mm or less. It introduces various specifications, starting with "4-pitch BGA mounted through resin-filled boards," "0.5-pitch BGA mounted through resin-filled boards," and the main specifications of build-up boards. We encourage you to read it. [Contents] ■ Through boards (Recommended design specifications for BGA section) ■ Build-up boards (Recommended design specifications for BGA section) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Other processing machines
  • Substrate

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Printed Circuit Board "6-Layer 2-2-2 Build-Up Board"

Introduction of a printed circuit board with a 0.3 pitch 144 pin BGA featuring via-on-via with copper plating!

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "6-layer 2-2-2 build-up substrate" is a printed circuit board equipped with a 0.3 pitch 144 pin BGA. It features via-on-via with via fill copper plating. The core part has 2 layers of through-hole (TH) with resin filling and cover plating, and the resist is exposed using laser via DI. 【Features】 ■ Via-on-via with via fill copper plating ■ Core part 2-layer TH with resin filling and cover plating ■ Core part 2-layer TH with φ0.2 drill / land diameter φ0.25 *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Circuit board design and manufacturing
  • Substrate

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Printed circuit board "8-layer 6-stage continuous IVH board"

Introduction of a printed circuit board with a hole wall pattern gap of 0.175 and a 0.4 pitch 196 pin BGA.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "8-layer 6-stage continuous IVH substrate" is a printed circuit board equipped with a 0.4 pitch 196 pin BGA. The gap between the hole wall patterns is 0.175. L1-2/L1-3/L1-4/L1-5/L1-6/L1-7 IVH passes through L1-8. 【Specifications】 ■ BGA pad/IVH land: φ0.3 ■ Hole wall gap: 0.175 ■ IVH drill diameter - L1-2/L1-3 = φ0.1 - L1-4 to L1-7 = φ0.15 *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Circuit board design and manufacturing
  • Substrate

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GNSS low noise amplifier

Introduction of case studies for equipment using high frequency.

**Features** This is a low-noise amplifier for GNSS (Global Navigation Satellite System). By combining two types of SAW filters, a relative attenuation of over 30dB (compared to 1495.9–1510.9MHz and 1555MHz) is achieved for the L1 (1575.42MHz) and L2 bands (1227.06MHz). It supports various positioning systems, including GPS and the Quasi-Zenith Satellite System (QZSS), and can amplify signals with low noise. Additionally, the power supply is superimposed on the coaxial cable to simplify wiring. *For more details, please download the PDF or feel free to contact us.*

  • High frequency/microwave parts
  • Substrate

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Leave it to us for soldering and electronic mechanical parts processing! Catalog available.

For lead-free soldering compliant with RoHS regulations, including flow soldering and reflow soldering, as well as assembly of electronic machinery, [catalog available].

We have 30 years of experience in designing various types of printed circuit boards, from single-sided boards to multilayer boards, including analog and digital circuits. We handle a wide range of precision equipment and industrial machinery, and we look forward to your inquiries, including those from the automotive industry, medical industry, office automation equipment, and amusement sectors. 【Supported Boards】 ◆ Rigid boards and component mounting ◆ Flexible boards and component mounting ◆ Single-sided and double-sided ◆ Multilayer boards *For more details, please download our catalog or feel free to contact us.

  • Reflow Equipment
  • Other mounting machines
  • Substrate

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FA Environment Compatible TWELITE DIP Board

Just replace it with the standard product.

This is a TWELITE board compatible with TWELITE DIP from Monowireless. It has implemented convenient features for the FA environment. 【Features】 - Power enhancement circuit - RST protection circuit - Equipped with FRAM - I2C external pull-up - Input circuit external pull-up

  • Other electronic parts
  • Embedded Board Computers
  • Development support tools (ICE, emulators, debuggers, etc.)
  • Substrate

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Manual Exposure Device for Experimental and Research Equipment 'MA-1000 Series'

Unique gap mechanism and high-speed image processing! Multi-layer exposure is possible with the auto-alignment system.

The "MA-1000 series" is a manual exposure device suitable for small-lot production of various types and for experiments and research. It can adopt soft contact exposure and proximity exposure. Additionally, we prepare optical systems that combine ultra-high-pressure mercury lamps, various mirrors, and special lenses appropriately according to the application and substrate size. 【Features】 ■ Capable of soft contact exposure and proximity exposure ■ In-plane uniform illumination using a unique mirror and lens optical system ■ Multi-layer exposure is possible *For more details, please refer to the related links or feel free to contact us.

  • Other processing machines
  • Substrate

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Germanium substrate

Substrate materials that demonstrate excellent transmittance in the IR (infrared wavelength range) for semiconductor and electronic device manufacturing!

We manufacture and sell "germanium substrates." These substrate materials exhibit excellent transmittance in the infrared (IR) wavelength range. We offer N-type and P-type germanium substrates (flat polished wafers, diameters of 1, 2, or 3 inches / crystal orientations of 100, 110, or 111) that have been doped during crystal growth for semiconductor and electronic device manufacturing. Please feel free to contact us if you have any inquiries. 【Products Offered】 ■ N-type and P-type germanium substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • Substrate

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Flexible circuit board / Rigid-flexible circuit board

Turnkey connector implemented! A thin polymer resin film is used as insulation.

"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.

  • Board to Board Connectors
  • Printed Circuit Board
  • Substrate

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Printed circuit board

We provide total coordination from circuit board design to product completion!

Our company provides total coordination from CAD design of printed circuit boards to board manufacturing, assembly, sheet metal processing, resin processing, cable processing, and assembly inspection. Since there is a close connection between each process, we streamline manufacturing to reduce time and labor costs while providing high-quality products at lower costs. Please feel free to contact us if you have any requests. *For more details, please do not hesitate to inquire.

  • Contract manufacturing
  • Circuit board design and manufacturing
  • Substrate

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Processing of support substrates for semiconductor wafers

Even with a 10mm corner, it is possible depending on the processing method! During prototype development, we can process from just one piece.

At Musashino Fine Glass, we accept processing of support substrates for semiconductor wafers. We offer substrates made of borosilicate glass, non-acrylic glass, and quartz glass. Rectangular substrates can be processed up to a maximum size of 370×470mm, and circular substrates up to a maximum diameter of φ300mm, with processing methods available for sizes as small as 10mm square. During the prototype development phase, we can process from just one piece, so please feel free to consult with us when needed. 【Processing Overview】 ■ Processing Substrates: Borosilicate glass, non-acrylic glass, quartz glass ■ Processing Sizes: Maximum rectangular size 370×470mm, maximum circular size φ300mm (minimum size available upon consultation) ■ Thickness Accuracy: TTV≦1μm is possible ■ Processing Quantity: Processing from one piece during prototype development, mass production is also possible *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Circuit board design and manufacturing
  • Other semiconductors
  • Substrate

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Printed circuit board

From the manufacturing of printed circuit boards to pattern design and component mounting.

Our company is a specialized manufacturer of printed circuit boards located in Kawaguchi City, Saitama Prefecture. We manufacture using small films, allowing for the production of prototypes and small lots with a variety of products. Additionally, we actively manufacture using films retrieved from defunct circuit board companies, which others tend to avoid. 【Our Features】 ■ Low initial costs ■ Partial modifications are possible ■ Production from other companies' films is also possible ■ We propose more cost-effective manufacturing methods ■ Management period for films and plates is a minimum of 5 years *Please feel free to contact us for more details.

  • Printed Circuit Board
  • Substrate

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Printed circuit board

Leave everything related to the design, manufacturing, assembly, and procurement of printed circuit boards to us!

Our company provides 24-hour support for the design, manufacturing, assembly, and procurement of printed circuit boards with ultra-short delivery times. We leverage our network across various industries both domestically and internationally to manage and procure semiconductors and electronic components in-house. Additionally, we offer flexible responses from small lot production to mass production and prototype assembly, enabling us to achieve short delivery times and high-quality production that is challenging for overseas manufacturing. 【Features】 ■ Same-day shipping for single-sided boards at the shortest level ■ Initial time reduction system ■ Capable of handling sizes from 0603 ■ Support for large boards (LL) ■ We can produce boards starting from just one piece *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Contract manufacturing
  • Substrate

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Multilayer substrate

The functions of electronic devices are becoming increasingly complex, and their sizes are getting smaller. If you need multilayer substrates, please consult us here.

Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.

  • Processing Contract
  • Circuit board design and manufacturing
  • Substrate

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4-layer high-density wiring circuit board

4-layer high-density wiring circuit board

Number of layers: Four layers Material: FR-4 Board thickness: 1.57 +/- 0.13 mm Surface treatment: Electroless gold plating Copper foil thickness: H/H~1/1 oz Remark: Impedance control 75 OHM Differential pair: 85/90/100 OHM

  • Circuit board design and manufacturing
  • Substrate

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8-layer rigid-flexible printed circuit board

It is a composite board of rigid and flexible substrates. Most rigid substrates are multilayer boards.

Number of Layers: Eight Layers Material: FR-4/Polyimide Board Thickness: FR4: 1.0 +/- 10% PI: 0.05mm Surface Treatment: Electroless Gold Plating 2µ" (min), Ni 100µ" (min) Copper Foil Thickness: 1/H~H/1 oz Remark: Camera Lens

  • Circuit board design and manufacturing
  • Substrate

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