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Substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

  1. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. null/null
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

  1. Understand in 3 minutes! Solder Resist Formation Technology [Materials Provided] プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm] 共栄電資
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

Substrate Product List

631～660 item / All 1922 items

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Microcircuit "High-Density Substrate"

Microcircuit "High-Density Substrate"

Stable peel strength can be achieved regardless of the substrate type! The semi-additive method accommodates fine patterns.

Our "High-Density Substrate" utilizes a semi-additive process to accommodate fine patterns. We employ a 5μm copper foil known as UTC for primary copper, achieving stable peel strength regardless of substrate type, and preventing abnormal gold plating due to palladium residue. Additionally, by adopting via-fill plating for electro-copper plating, we minimize variations in plating thickness and accommodate filled vias. With an any-layer stack structure and multi-stage build-up wiring boards at its core, we respond to various substrate needs from double-sided boards to multilayer boards. 【Features】 ■ Peel strength of 10N/cm or more ■ Adoption of via-fill plating for electro-copper plating *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Ultra-thin substrate

Ultra-thin substrate

Introducing products suitable for those looking to produce a small quantity of ultra-thin rigid substrates!

We would like to introduce our "Ultra-thin Substrate" that we handle. Detailed designs tailored to customer requirements are possible through layer composition, copper foil thickness, and lamination methods. It has become an ultra-thin printed circuit board while maintaining the characteristics of rigid substrates. It can accommodate a wide range of methods, including build-up processes and through-hole technology, and unlike flexible substrates, it possesses both the electrical characteristics and strength of rigid substrates. 【Features】 ■ Innovative substrate materials and methods for 4-layer and 6-layer designs ■ Detailed designs tailored to customer requirements through layer composition, copper foil thickness, and lamination methods ■ Accommodates a wide range of methods, including build-up processes and through-hole technology ■ An ultra-thin printed circuit board that maintains the characteristics of rigid substrates ■ Unlike flexible substrates, it combines the electrical characteristics and strength of rigid substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Introduction to the SMT-A Line for M Size Line of Printed Circuit Board Surface Mounting

Introduction to the SMT-A Line for M Size Line of Printed Circuit Board Surface Mounting

The equipment specifications and facilities for the surface mount technology (SMT-A line) process of printed circuit boards have been updated.

We handle everything from prototype production to small-lot, multi-variety printed circuit board assembly and finished product packaging, and we have established a system that allows us to provide products consistently, primarily through production outsourcing. ◆ Line Name: Surface Mount: SMT-A Line ◆ Target PCB Dimensions: 50(W)×50(L) to 250-330mm ◆ Target Component Dimensions: 0402 to 120x90mm, minimum 0.3mm pitch ◆ Target Component Height: up to 30mm ◆ Target Component Variety: 280 types (equivalent to 8mm tape) 【Equipment】 Laser Marker: LMC-3000 (Juts) Printer: SGP2 (Panasonic) linked with SPI SPI: VP-9000M (CKD) with 3D inspection function Mounting Machine: VM101 (Panasonic) Mounting Machine: VM102 (Panasonic) Mounting Machine: VM101 (Panasonic) for irregular components, with tray changer N2-compatible Reflow Oven: TNV-M508CR (Tamura Manufacturing) *For details, please download and view the materials.

  • Contract manufacturing
  • Substrate

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Introduction to SMT-B Line for Surface Mount Printed Circuit Boards: Compatible with L Size

Introduction to SMT-B Line for Surface Mount Printed Circuit Boards: Compatible with L Size

Implementation of L-size substrates is possible!! Here is a list of equipment specifications and facilities for the surface mount technology (SMT-B line) process of printed circuit boards.

We handle everything from small lot multi-variety printed circuit board assembly for L-size substrates to the assembly and packaging of finished products, and we have established a system that allows us to provide products consistently, primarily through production outsourcing. ◆ Line Name: Surface Mount: SMT-B Line ◆ Target Substrate Dimensions: 50(W)×50(L) to 390–460mm ◆ Target Component Dimensions: 0402 to 120×90mm, minimum 0.4mm pitch ◆ Target Component Height: up to 28mm ◆ Target Component Variety: 280 varieties (equivalent to 8mm tape) 【Equipment】 Printer: SPG2 (Panasonic) with 2D solder inspection + coating function Mounting Machine: AM100 (Panasonic) Mounting Machine: AM100 (Panasonic) with tray changer N2 Compatible Reflow Oven: TNV-N568CR-P (Tamura Manufacturing) *For details, please download and view the materials.

  • Contract manufacturing
  • Substrate

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Sapphire product "Sapphire substrate (for semiconductors)"

Sapphire product "Sapphire substrate (for semiconductors)"

We can provide 6-inch substrates stably at high quality and low price.

We offer "sapphire substrates (for semiconductors)" made from sapphire, which has excellent electrical insulation properties. Additionally, we have started growing single-crystal sapphire in the Republic of Lithuania, a nation known for its diligent and outstanding technical skills among the Baltic States. We are also producing high-quality, low-cost 6-inch substrates with a thickness of 1mm (TTV≦5μm, BOW≦10μm, warpage≦15μm). Please feel free to consult us if you have any requests. 【Features of Sapphire】 ■ Excellent electrical insulation and very good thermal conductivity ■ Chemically and thermally stable, with hardness close to that of diamond *For more details, please feel free to contact us.

  • Other electronic parts
  • Ceramics
  • Substrate

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Fujigijutsu Co., Ltd. Business Introduction

Fujigijutsu Co., Ltd. Business Introduction

Leave the design and manufacturing of printed circuit boards to us.

Fujitech Co., Ltd. is engaged in the design of printed circuit board patterns and the sale of printed circuit boards. We have experienced first-class printed circuit board manufacturing design engineers on staff, capable of handling products in all fields, whether consumer goods or industrial products. Additionally, through partnerships with affiliated companies, we can manufacture circuit boards with extremely short lead times. Please feel free to contact us with your requests. 【Business Activities】 ■ Printed Circuit Board Design ■ Printed Circuit Board Manufacturing ■ Component Assembly *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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DBC substrate (Direct Bonded Copper)

DBC substrate (Direct Bonded Copper)

Ion migration risk is reduced! Insulation substrate for power modules.

The "DBC substrate (Direct Bonded Copper)" is an insulating substrate for power modules that can reduce the risk of ion migration. In the manufacturing of thick copper insulating substrates, conventional technology uses Ag bonding materials containing active metals such as titanium for the bonding of copper and ceramics. However, when high voltage is applied in a high humidity environment after pattern formation, the silver contained in the bonding material can grow in spots or protrusions between the electrodes, posing a risk of short-circuiting due to ion migration. Our DBC substrate reduces the risk of ion migration by bonding copper and ceramics without silver, significantly improving the reliability as an insulating substrate for power modules. 【Features】 ■ Excellent heat dissipation and heat resistance ■ Excellent electrical insulation ■ High strength ■ Low thermal expansion ■ Excellent wetting and solderability *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board
  • Substrate

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Printed circuit board "copper inlay board"

Printed circuit board "copper inlay board"

Achieves high heat dissipation! It can be relatively easily changed from the current substrate!

The "copper inlay substrate" is a printed circuit board that improves heat dissipation characteristics in specific areas by press-fitting copper pins directly beneath heat-generating components. By directly contacting heat-generating components with copper, which has high thermal conductivity, it achieves excellent heat dissipation and can be relatively easily modified from existing substrates. It enhances heat dissipation performance, which was insufficient with thermal vias that only have through holes. Additionally, it can suppress cost and weight increases associated with heat dissipation, and since it can directly apply the existing printed wiring board structure, it allows for relatively easy adaptation in printed circuit board design. 【Features】 ■ Partially improves heat dissipation characteristics ■ Relatively easy to modify from existing substrates ■ Enhances heat dissipation performance ■ Can suppress cost and weight increases related to heat dissipation ■ Can directly apply the existing printed wiring board structure, allowing for relatively easy adaptation in printed circuit board design *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board
  • Substrate

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Eco Assist Co., Ltd. Business Introduction

Eco Assist Co., Ltd. Business Introduction

Free collection of circuit boards, silicon, non-ferrous metals, and used computers in Imabari City, Ehime Prefecture is available at our company.

Eco Assist Co., Ltd. is promoting a recycling business for non-ferrous metals, precious metals, and rare metals. We can collect everything, including items that are no longer in use or have broken down. All collected products will be recycled and reused, so there will be no costs incurred for disposal. 【Business Activities】 ■ Purchasing and processing of OA equipment, purchasing and selling of non-ferrous metals ■ Purchasing and selling of plastics ■ Purchasing, processing, and selling of circuit boards ■ Purchasing and selling of metal silicon *For more details, please download the PDF or contact us.

  • Used goods purchase
  • Other services
  • Substrate

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Manufacturing of Flexible Circuit Boards *Product Achievements Introduction

Manufacturing of Flexible Circuit Boards *Product Achievements Introduction

Are you facing any issues with flexible substrates? We have extensive experience in various fields, including medical devices and automotive control systems.

This is an introduction to our "Flexible Circuit Board Manufacturing." "Flexible Printed Circuit Boards" are used in applications such as communication devices and measurement instruments, and we handle various types including "Single-Sided FPC," "Double-Sided FPC," and "Rigid-Flex." Materials used include polyimide and polyester. For "Multilayer Flex" and "Rigid-Flex," we collaborate with partner companies for production. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi 【Product Achievements (Excerpt)】 ■ Flexible for ultrasound diagnostic probes ■ Flexible for motor field winding (for high electromagnetic field generation) ・Source: Gunma University ■ Flexible for superconducting devices operating at -269℃ (for superconducting circuit evaluation) ・Main Source: Yokohama National University *For more details, please refer to the PDF document or feel free to contact us.

  • Board to FPC connector
  • Substrate

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Business Introduction: "Design, Development, Manufacturing, and Sales of Flexible Printed Circuits (FPC)"

Business Introduction: "Design, Development, Manufacturing, and Sales of Flexible Printed Circuits (FPC)"

Rich experience in embedded products for medical and special environments. Widely adopted by universities and research institutions! Simple mock-up production available. *Case study materials are currently being distributed.

At Stay Electronics Co., Ltd., we are engaged in the design, development, manufacturing, and sales of flexible printed circuits (FPC). We are equipped with prototyping facilities such as UV-YAG laser systems and cutting plotters, as well as inspection equipment like image dimension measuring instruments, allowing us to provide consistent support from design to prototyping, manufacturing, and inspection. With extensive manufacturing experience in FPCs for medical devices, we maintain a wide range of materials in stock and can flexibly respond to and propose solutions for customer requests under special conditions. ★ We also respond to requests for mock-up production! Whether it's challenges that other companies couldn't solve, stalled projects, or if you have never used flexible circuits before and just want to grasp the concept, please feel free to contact us for inquiries and consultations. 【Examples of Flexible Circuit Board Development】 ◎ FPC for ultrasound diagnostic probes ◎ FPC for superconducting devices operating at -269°C ◎ FPC for motor field winding ◎ FPC for ATM security monitoring, among others *Some development examples can be viewed via "PDF Download." Please feel free to reach out for inquiries.

  • Printed Circuit Board
  • Substrate

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Express Manufacturing [Printed Circuit Board]

Express Manufacturing [Printed Circuit Board]

We will deliver the prototype and the first production lot as quickly as possible!

"Express Manufacturing" is the EX-SYSTEM that delivers from prototype to mass production in the shortest time possible. We can deliver only the circuit board in as little as 2 days, and with assembly in as little as 4 days. ★ In the assembly process, we operate fully on weekends, allowing for effective utilization. * The actual working schedule is based on our company calendar. * The surface treatment for standalone circuit boards is water-soluble pre-flux, and the schedule for gold plating and solder leveling will be discussed separately (generally an additional +1 day). * Data submission is accepted until 17:00. * For more details, please refer to the PDF document or feel free to contact us.

  • Visual Inspection Equipment
  • Printed Circuit Board
  • Substrate

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Super Express Manufacturing [Printed Circuit Board]

Super Express Manufacturing [Printed Circuit Board]

We will deliver the prototype and the first production lot as quickly as possible!

"Super Express Manufacturing" is the EX-SYSTEM that delivers from prototype to mass production of multi-layer boards (6 to 10 layers) in the shortest time possible. For 6-layer boards, delivery is possible in as little as 3 days. ★ Assembly support is also available. We operate fully on weekends, allowing for effective utilization. * The working schedule is based on our company calendar. * The surface treatment for standalone boards is water-soluble preflux, and schedules for gold plating, solder leveling, etc., will be discussed separately (generally an additional +1 day). * Submission of specifications must be done by 17:00 the day before (data submission is accepted until 15:00 the following day). * For more details, please refer to the PDF materials or feel free to contact us.

  • Visual Inspection Equipment
  • Printed Circuit Board
  • Substrate

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One-Sided Super Express Manufacturing: Challenge to Japan's Fastest [Printed Circuit Board]

One-Sided Super Express Manufacturing: Challenge to Japan's Fastest [Printed Circuit Board]

Single-sided board (double-sided non-TH board) completed in as fast as 12 hours!

"One-Sided Super Express Manufacturing" is an EX-SYSTEM that can be completed in the fastest 12 hours and delivered in the shortest time. ★ Implementation support is also available. We operate fully on weekends, allowing for effective utilization. * This is based on our company's calendar of working days. * The surface treatment for standalone circuit boards is water-soluble preflux, and the schedule for gold plating and solder leveling will be discussed separately (generally an additional +1 day). * Submission of specifications must be done by 17:00 the day before (data submission is accepted until 8:00 the following day). * For more details, please refer to the PDF document or feel free to contact us.

  • Visual Inspection Equipment
  • Printed Circuit Board
  • Substrate

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Compact X-ray reel counter

Compact X-ray reel counter

Chip counter sale price 4.5 million yen (excluding tax) - It's compact, so it doesn't take up much space!

Easy Counter offers an unprecedented affordable price. Its compact size makes it a great option for those who have struggled with finding a place to put it. 99% accuracy and a counting time of 14 seconds. The operation is simple, significantly reducing the costs associated with part counting. 【Features】 ■ Measurement time: Approximately 10 seconds per reel ■ Capable of counting various parts (cut parts, bagged parts, etc.) ■ Easy to operate, with training completed in just 10 minutes *For more details, please refer to the PDF document or feel free to contact us.

  • Company：KnK
  • Price：1 million yen-5 million yen
  • Other electronic measuring instruments
  • X-ray inspection equipment
  • Defect Inspection Equipment
  • Substrate

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[Voices from Development Manufacturers] Well Research Co., Ltd.

[Voices from Development Manufacturers] Well Research Co., Ltd.

We are satisfied with the speed and high technical capability of the design, manufacturing, and component procurement of the circuit boards used in space.

Kai Electronics Co., Ltd. has been involved in the design and manufacturing of printed circuit boards, as well as the overall development of electronic devices, and has worked with many development manufacturers in design and production. Within the company, there are three engineers specializing in system design, enclosure design, and printed circuit board design. We can pursue designs that take into account requirements from other processes and seek optimal solutions from multiple perspectives. This time, we would like to introduce feedback from a development representative at Well Research Co., Ltd. They have requested the design of circuit boards for use in space and have expressed satisfaction with the appropriate size design and the delivery schedule from parts procurement to manufacturing. [Customer Feedback] - We have requested the artwork design, manufacturing, and parts procurement for the circuit boards. - They responded quickly despite a tight delivery schedule. - The size requirements for the space industry are strict, but they provide optimal solutions. For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Bilbari CoinMech Interface 'BVCM-MIF-02'

Bilbari CoinMech Interface 'BVCM-MIF-02'

Easy operation of vending machine bill validator data and coin mechanism from PC or microcontroller!

When trying to build a vending machine system, cash acceptance devices such as bill validators (note recognition machines) and coin mechanisms are always necessary. Our 'BVCM-MIF-02' has been developed to allow easy operation of these cash acceptance devices from a PC. The firmware handles the timing-critical aspects automatically, enabling users to easily operate the bill validator and coin mechanism. 【Features】 ■ Usable regardless of the OS through serial connection or USB connection (recognized as a virtual COM port) ■ The firmware automatically processes the timing-critical aspects of communication with the bill validator and coin mechanism ■ When using Windows OS, it can be utilized more easily by using a dedicated DLL *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Printed circuit board

Printed circuit board

Leave it to us for metal substrates, through-hole substrates, and contact substrates.

The Electronics Division of NBC Corporation is involved in the design, manufacturing, and sales of printed circuit boards, contributing to the field of car electronics, with a motto of "creating reliable products." Recently, we have also started manufacturing metal substrates aimed at improving reliability against heat, which has received positive feedback from our customers. Please feel free to contact us if you have any requests. 【Production Volume】 ■ Single-sided boards: 11,000 m²/month ■ Double-sided multilayer boards: 22,000 m²/month ■ Metal substrates: 1,000 m²/month *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Introduction to the Printed Circuit Board Manufacturing Business

Introduction to the Printed Circuit Board Manufacturing Business

We manufacture composite substrates and high-frequency printed circuit boards tailored to customer users.

The manufacturing base of Kyoei Denshi has established the latest production lines, is engaged in the development of new technologies, and is capable of producing printed circuit boards from prototypes to mass production across a wide range of fields. 【Features】Our unique manufacturing technology allows us to provide circuit boards that cannot be made elsewhere. ■ By utilizing technology to bond aluminum and substrates, we have significantly improved the design flexibility of aluminum-based substrates and enabled aluminum grounding. ■ By laminating honeycomb materials, we achieve both warpage prevention and lightweight, low dielectric properties for the circuit boards. ■ By converting busbars and coils into circuit boards, we realize insulation and miniaturization. *For more details, please contact us or download the PDF for more information.

  • Printed Circuit Board
  • Substrate

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Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm]

Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm]

By substrate-izing busbars and coils used for high current applications, high insulation properties and a reduction in labor hours are achieved!

We have substrate-mounted busbars and coils used for high current applications in the heavy electrical and automotive industries. By substrate mounting, the following effects can be expected: - Substrate mounting of power devices such as IGBTs and SiCs - Installation on equipment after substrate mounting → Reduction of assembly work and prevention of miswiring - Space-saving due to substrate mounting and simplification of wiring → Miniaturization of the entire device - Generally, a thick copper substrate refers to a substrate with a copper foil thickness of 200μ (0.2mm) or more, but we have also achieved substrate mounting with 3000μ (3mm) copper plates. - The greatest advantage of substrate mounting is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, so there is no concern about variation in thickness like with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Polyester hybrid laminated board [Compatible with products over 1m!]

Polyester hybrid laminated board [Compatible with products over 1m!]

It is possible to manufacture items exceeding 1 meter! Mainly used as insulation boards for railways and power plants.

We would like to introduce the "Polyester Hybrid Laminated Board" handled by Kyoei Electric Co., Ltd. The polyester resin can be colored with pigments such as white and N7 gray. The laminate thickness ranges from T1 to T40, and the substrate consists of alternating layers of glass cloth and glass mat. Our company can manufacture products exceeding 1 meter, so please feel free to contact us when needed. 【Features】 ■ Polyester resin, vinyl ester resin ■ Substrate: alternating layers of glass cloth and glass mat ■ Laminate thickness: approximately T1 to T40 ■ Maximum dimensions: approximately 1000*2300 ■ Can be colored with pigments in polyester resin (white, N7 gray, etc.) *For more details, please refer to the PDF document or feel free to contact us.

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  • Other polymer materials
  • Substrate

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Printed circuit board

Printed circuit board

We respond to a variety of products, small lots, and short delivery times with cutting-edge equipment and our unique production management system.

Hokuei Electric Co., Ltd. has been engaged in the assembly of printed circuit boards for automotive and office automation equipment. We respond to a variety of small lots and short delivery times, and we also quickly address new job requests. We take pride in our ability to meet customer demands, including quality, delivery, and cost, with unmatched capability. 【Main Products】 ■ Printed circuit boards for meters ■ Auto light sensors ■ Automotive lighting (for doors) *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Printed circuit board assembly

Printed circuit board assembly

Leave your printed circuit boards and PCB assembly products to us.

We provide support from design to component mounting for printed circuit boards and board-mounted products. We can accommodate printed circuit boards from double-sided boards to high-layer-count boards and impedance boards. Please feel free to consult us for small quantities starting from one piece. 【Features】 ■ One-stop proposal for board design, mounting, and industrial electrical equipment *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Substrate

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Evaluation of the "56G-PAM4 Board" implementation completed.

Evaluation of the "56G-PAM4 Board" implementation completed.

We will support the upcoming high-speed communication standards with PAM4 signal communication boards!

To Matsudo Co., Ltd. and RITA Electronics, the main FPGA board for the '56G-PAM4 communication board' created during the technical study session aimed at solving customer challenges has been completed! After completing the basic checks, we will proceed with waveform verification using this board and continue to verify the operation in combination with the evaluation boards that will be successively completed thereafter. In an increasingly high-speed communication environment, we aim to accumulate high-speed technologies leading to PCIe Gen6.0, DDR, and 400G Ethernet, and provide solutions to our customers.

  • Communications
  • Circuit board design and manufacturing
  • Substrate

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Characteristics of Daishin Sangyo Co., Ltd.

Characteristics of Daishin Sangyo Co., Ltd.

Even one unit is fine! We can accommodate from small lots to mass production.

Daishin Sangyo Co., Ltd. thoroughly implements the "3S" that is trusted by our customers. (1) Speed (Prompt Response), (2) Service (Proposals/Information Provision), (3) Special (Advanced Technology Support) Our company welcomes requests from design to circuit board production, parts procurement, and rapid delivery of actual layers. We can accommodate from small lots to mass production. Please feel free to contact us. 【Features】 ■ Support for printed circuit boards, design, board production, parts procurement, assembly, and finished products ■ Capable of handling small lots to mass production ■ Able to provide ultra-short delivery times for printed circuit boards ■ Lead-free compliance * For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Other processing machines
  • Substrate

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[Data] BGA Mounting Board Data Specifications

[Data] BGA Mounting Board Data Specifications

Below t1.6! Here are examples of data specifications for BGA-mounted substrates.

This document presents examples of board data specifications for BGA mounted boards with a pitch of 1.6 mm or less. It introduces various specifications, starting with "4-pitch BGA mounted through resin-filled boards," "0.5-pitch BGA mounted through resin-filled boards," and the main specifications of build-up boards. We encourage you to read it. [Contents] ■ Through boards (Recommended design specifications for BGA section) ■ Build-up boards (Recommended design specifications for BGA section) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Other processing machines
  • Substrate

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Printed Circuit Board "6-Layer 2-2-2 Build-Up Board"

Printed Circuit Board "6-Layer 2-2-2 Build-Up Board"

Introduction of a printed circuit board with a 0.3 pitch 144 pin BGA featuring via-on-via with copper plating!

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "6-layer 2-2-2 build-up substrate" is a printed circuit board equipped with a 0.3 pitch 144 pin BGA. It features via-on-via with via fill copper plating. The core part has 2 layers of through-hole (TH) with resin filling and cover plating, and the resist is exposed using laser via DI. 【Features】 ■ Via-on-via with via fill copper plating ■ Core part 2-layer TH with resin filling and cover plating ■ Core part 2-layer TH with φ0.2 drill / land diameter φ0.25 *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Circuit board design and manufacturing
  • Substrate

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Printed circuit board "8-layer 6-stage continuous IVH board"

Printed circuit board "8-layer 6-stage continuous IVH board"

Introduction of a printed circuit board with a hole wall pattern gap of 0.175 and a 0.4 pitch 196 pin BGA.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "8-layer 6-stage continuous IVH substrate" is a printed circuit board equipped with a 0.4 pitch 196 pin BGA. The gap between the hole wall patterns is 0.175. L1-2/L1-3/L1-4/L1-5/L1-6/L1-7 IVH passes through L1-8. 【Specifications】 ■ BGA pad/IVH land: φ0.3 ■ Hole wall gap: 0.175 ■ IVH drill diameter - L1-2/L1-3 = φ0.1 - L1-4 to L1-7 = φ0.15 *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Circuit board design and manufacturing
  • Substrate

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GNSS low noise amplifier

GNSS low noise amplifier

Introduction of case studies for equipment using high frequency.

**Features** This is a low-noise amplifier for GNSS (Global Navigation Satellite System). By combining two types of SAW filters, a relative attenuation of over 30dB (compared to 1495.9–1510.9MHz and 1555MHz) is achieved for the L1 (1575.42MHz) and L2 bands (1227.06MHz). It supports various positioning systems, including GPS and the Quasi-Zenith Satellite System (QZSS), and can amplify signals with low noise. Additionally, the power supply is superimposed on the coaxial cable to simplify wiring. *For more details, please download the PDF or feel free to contact us.*

  • High frequency/microwave parts
  • Substrate

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Leave it to us for soldering and electronic mechanical parts processing! Catalog available.

Leave it to us for soldering and electronic mechanical parts processing! Catalog available.

For lead-free soldering compliant with RoHS regulations, including flow soldering and reflow soldering, as well as assembly of electronic machinery, [catalog available].

We have 30 years of experience in designing various types of printed circuit boards, from single-sided boards to multilayer boards, including analog and digital circuits. We handle a wide range of precision equipment and industrial machinery, and we look forward to your inquiries, including those from the automotive industry, medical industry, office automation equipment, and amusement sectors. 【Supported Boards】 ◆ Rigid boards and component mounting ◆ Flexible boards and component mounting ◆ Single-sided and double-sided ◆ Multilayer boards *For more details, please download our catalog or feel free to contact us.

  • Reflow Equipment
  • Other mounting machines
  • Substrate

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