We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 575 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. 共栄電資 Tokyo//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
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Substrate Product ranking

Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.

  1. Busbar for Data Centers - High Current Board 共栄電資
  2. FPC for the space industry 太洋テクノレックス 本社　和歌山
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 Printed circuit board 北一電気
  5. 5 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.

Substrate Product List

1051～1080 item / All 1946 items

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Verification of 0603/0402 capacitor mounting on lead-free leveler substrate.

Verification of 0603/0402 capacitor mounting on lead-free leveler substrate.

By setting the appropriate pad dimensions, it is possible to support small-sized chip mounting!

Multilayer ceramic capacitors (MLCCs) are facing a challenging situation in procurement due to increased demand from smartphones and a rapid rise in automotive demand. In this tight supply-demand environment, MLCC manufacturers are promoting a shift from larger sizes (1608 and above) to smaller sizes (0603 and 0402) to increase supply capacity. This document introduces the "Verification of 0603/0402 Capacitor Mounting on Lead-Free Leveler Boards." We encourage you to read it! *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate

"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate

Corresponding to the 'density' of components! High-frequency build-up substrate.

What supports KyoDen's narrow adjacent mounting technology is not just the mounting technology itself. It is unique to KyoDen that we can also offer solutions from substrate manufacturing technology, design, and analysis.

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  • Printed Circuit Board
  • Substrate

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We undertake everything from printed circuit board production and prototyping to mass production!

We undertake everything from printed circuit board production and prototyping to mass production!

Quality is our top priority!

Before the factory shipment of printed circuit boards, we conduct pre-shipment inspections of all printed circuit boards at Core System Co. to ensure high and stable quality of the products delivered to customers.

  • Contract manufacturing
  • Substrate

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Electroless copper plating equipment for semiconductor and printed circuit board horizontal manufacturing.

Electroless copper plating equipment for semiconductor and printed circuit board horizontal manufacturing.

Supports everything from single-sided substrates to flexible substrates using Roll to Roll!

This is a machine for electroless copper plating for substrate manufacturing. With optimal spray configuration, uniform plating can be achieved even inside blind vias and high aspect ratio through holes. Since it operates with horizontal transport, automation is possible from input to output. 【Features】 ◆ Plating is possible without the need for electrical conductivity, even on non-conductive materials. ◆ When combined with our various products, circuit widths can be minimized to 25μm. = For more details, please contact us =

  • Other surface treatment equipment
  • Other machine tools
  • Substrate

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Mounting Machine "RX-8" (SMT Surface Mount Machine)

Mounting Machine "RX-8" (SMT Surface Mount Machine)

A high-speed modular mounter that achieves a throughput of 100,000 CPH! It offers top-class area productivity with a dual-head mounter!

The SMT (Surface Mount Technology) high-speed compact modular mounter 'RX-8' boasts a maximum throughput of 100,000 CPH and features a compact design of 998mm. Equipped with a high-precision planet head, it is perfect for the production of ultra-small chip components and small ICs, as well as products that require high-density mounting and precision, such as LED edge lights. 【Features】 - The 998mm compact design achieves high-efficiency production with class-leading area efficiency. - Compatible with 0201 chips and flexible substrates. - Capable of detecting front-and-back inversion, chip standing inspection, and component presence detection. - Automatic suction position correction function automatically adjusts and corrects the suction position of components. *For more details, please refer to the PDF document or feel free to contact us.

  • Mounter
  • Substrate

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High-frequency substrate "Caflon"

High-frequency substrate "Caflon"

A super low loss of 0.00045 can be achieved at 18GHz.

Polifron Corporation has developed high-frequency substrates that utilize the properties of PTFE through its unique technology. This high electrical characteristic cannot be achieved with other substrates. By using high-purity PTFE with a dielectric constant of "2.1" as the dielectric material, an ultra-low loss of 0.00045 at 18GHz can be realized. 【Features】 ○ Ultra Low Loss ○ Very Low Dk ○ Isotropic Properties For more details, please contact us or download the catalog. *This catalog is in English.

  • Printed Circuit Board
  • Substrate

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Control board Input/Output Universal IHP/04011ASS

Control board Input/Output Universal IHP/04011ASS

A universal card is provided so that you can freely create circuits and conduct experiments.

Create and experiment with circuits freely! Universal prototype board equipped with a 3.3V power circuit. ■□■Features■□■ ■ The onboard 3.3V power supply allows you to immediately configure 3.3V circuits. ■ Compact card size (50mm x 30mm) *excluding connectors ■ General-purpose 2.54mm pitch 0.8mm through-holes (18 columns, 9 rows) ■ 5V input → equipped with a 3.3V power circuit ■ Adopts Mi II wiring system * A crimping punch is required for connections with this product. ■ For other functions and details, please download the catalog or contact us.

  • Printed Circuit Board
  • Substrate

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Printed circuit board

Printed circuit board

For high-frequency applications, from design to manufacturing and component assembly of printed circuit boards. High-speed FPGA boards ensure stable operation.

If you are experiencing issues such as instability caused by the printed circuit board, please feel free to consult us. So far, all designs from our company have been operating stably.

  • Circuit board design and manufacturing
  • Substrate

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Micro Module Technology Corporation - Business Overview

Micro Module Technology Corporation - Business Overview

One-stop support for miniaturization and modularization of circuit boards using bare chip mounting, from concept to mass production!

We specialize in micro-joining technologies centered on bare chip mounting and inter-board bonding, providing support services that enable miniaturization, thinning, and high-function modularization of circuit boards. We offer one-stop support from concept planning through design, prototyping, evaluation, analysis, and small-to-medium scale production. Utilizing our in-house cleanroom facilities (Class 100–1000), customers can proceed with confidence even without in-house expertise or equipment. 【Benefits of Bare Chip Mounting】 ■Added Value ・Miniaturization and thinning expand product applications and contribute to the creation of new markets. ・Integrating semiconductor back-end processes enhances manufacturing value. ■Improved Cost Competitiveness ・Miniaturization and shared design improve production efficiency and help reduce material costs. ・Compared with SoC-based approaches, development costs can be significantly reduced in some cases. 　Effects vary depending on development conditions and specifications. ■Performance Improvement ・Eliminating secondary wiring shortens interconnections and improves electrical performance. ・Reduced wiring loss contributes to higher-speed operation and improved high-frequency characteristics. ■Environmental Considerations ・Reducing the number of materials used helps decrease waste and environmental impact.

  • Circuit board design and manufacturing
  • Substrate

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PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit

PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit

A flexible fabric ribbon sensor incorporates "piezoelectric sensors" and "capacitive sensors." Dual sensing enhances detection accuracy and creates added value.

The "PICLIA Piezo Cable Sensor" and "Capacitive Sensor" are integrated into a single fabric-like ribbon. This flexible and soft ribbon sensor offers high durability and can perform dual sensing with two types of sensor outputs. It can be utilized in applications for monitoring and health monitoring in areas such as "wearable devices, medical and nursing care, automotive, toilets, railways and aircraft, cinemas and amusement facilities." 【Features】 ◆ Flexible and soft "fabric-like ribbon sensor" ⇒ Provides a comfortable touch even when directly contacted, while maintaining high durability in actual use. ◆ Built-in "piezoelectric sensor" and "capacitive sensor" ⇒ Enhanced detection accuracy through composite sensing and creation of added value. ◆ "Piezoelectric sensor"… detects biological information (heart rate, respiration, body movement), etc. ⇒ Vital sensing is possible even through clothing, with a differential response (responds only when "changes" occur). ◆ "Capacitive sensor"… detects the presence of objects through changes in capacitance. ⇒ Capable of distinguishing between people and objects. ◆ No power supply needed for the sensors, as they generate power through self-generation ⇒ low power consumption.

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  • Sensors
  • Piezoelectric Devices
  • Substrate

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Introduction from circuit and software design to board design and board manufacturing.

Introduction from circuit and software design to board design and board manufacturing.

We will respond with a consistent system from upstream circuits and software design to circuit board manufacturing!

Nihon Circuit Co., Ltd. will assist you from the development of prototype products to mass production design and manufacturing. Depending on your requirements, we can develop system design, circuit design, PCB design, PCB manufacturing, mechanical, structural, and enclosure design and manufacturing, embedded software and applications, FPGA programming, as well as evaluation and inspection all in-house. Additionally, even in the absence of specifications, we can consider product specifications based on images (such as block diagrams or sketches). 【Features】 ■ Capable of mixed design of digital and analog circuits ■ A consistent system that covers everything from upstream circuit and software design to PCB manufacturing ■ Experience in designing high-frequency (tens of GHz) PCBs ■ Able to accommodate various PCB specifications and production quantities from a single prototype design and manufacturing to mass production design and manufacturing ■ We can also handle partial requests such as development (HW, SW), PCB design, and manufacturing only *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Substrate

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Taclum Plus board for MMIC implementation

Taclum Plus board for MMIC implementation

Laser processing capability, loss improvement through wire length reduction, and heat dissipation improvement by direct mounting of copper plates.

Taclum PLUS, provided by Taconic (USA), is a PTFE substrate for MMIC implementation.

  • Other semiconductors
  • Substrate

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Flexible printed circuit board

Flexible printed circuit board

Flexible printed circuit board

Flexible printed circuit boards (FPC) using liquid crystal polymer (LCP) as an insulating material. Excellent high-frequency characteristics and dimensional stability, achieving precise characteristic impedance matching in FPC. ● Achieving Gbps-level high-speed transmission By adopting LCP as the insulating substrate, it offers a flat low dielectric constant, low dielectric loss tangent, and low moisture absorption across a wide frequency range, resulting in low transmission loss and high dimensional stability. Achieving Gbps-level high-speed transmission. ● Achieving low EMI Low EMI is realized through precise characteristic impedance matching enabled by fine pattern formation technology and high dimensional stability. ● Adoption of the "Bump Build-Up Method" By using conductive bumps as interlayer connection materials in the "Bump Build-Up Method," drilling and plating processes are unnecessary, achieving cost reduction and precise characteristic impedance matching. ● Use of halogen-free materials Adoption of halogen-free materials with consideration for environmental conservation. ● Expansion into various applications Excellent flexibility allows for secondary processing such as bending and electronic component mounting. Proven performance as high-speed differential transmission standard cables such as LVDS, HDMI, and PCI Express.

  • Printed Circuit Board
  • Substrate

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Semiconductor substrate and its manufacturing method, as well as a vapor phase growth apparatus used for it.

Semiconductor substrate and its manufacturing method, as well as a vapor phase growth apparatus used for it.

Warping caused by differences in physical constants is canceled out between both surfaces! It is possible to manufacture semiconductor substrates with minimal warping!

The issue of warping in GaN substrates leads to high costs due to low yield, as well as low crystal quality and small areas of low quality, which in turn becomes the biggest factor hindering the widespread adoption of GaN substrates. The present invention aims to produce semiconductor substrates with minimal warping using a vapor phase growth method. By alternately growing semiconductor crystals on both sides of the base substrate using the vapor phase growth method, the warping caused by differences in physical constants such as the thermal expansion coefficients of the base substrate and the semiconductor is canceled out between the two sides, making it possible to manufacture semiconductor substrates with minimal warping. 【Key Solutions】 - Manufacturing semiconductor substrates by growing semiconductor crystals on the base substrate using the vapor phase growth method. - A process in which raw gas is brought into contact with one principal surface of the base substrate to grow semiconductor crystals on the base substrate. - Another process in which raw gas is brought into contact with the other principal surface of the base substrate to grow semiconductor crystals on the base substrate. - Alternating between the first process and the other process. *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductors
  • Substrate

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Sagami P.C.I. Co., Ltd. manufactured printed circuit board.

Sagami P.C.I. Co., Ltd. manufactured printed circuit board.

High quality, short delivery time, low cost

Specialized in hole drilling with drills, contour processing with routers, and fine hole processing with lasers.

  • Processing Contract
  • Substrate

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[LED] Lens Diffusion Plate: Manufacturing Method of LSD and Types of Substrates

[LED] Lens Diffusion Plate: Manufacturing Method of LSD and Types of Substrates

Lens diffusion plates can be manufactured using various methods! Introducing a variety of manufacturing techniques!

Lens diffusion plates can be manufactured using various methods, but the most common method is the "roll-to-roll" process. This method offers many advantages such as uniform film thickness, high-precision transfer, and high-speed processing, making it stable and cost-effective. We introduce various manufacturing methods, starting with the "roll-to-roll" process. Please take a moment to read through it. [Contents] ■ Lens diffusion plates: Manufacturing methods and types of substrates for LSD *For more details, please refer to the PDF document or feel free to contact us.

  • lens
  • Substrate

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The importance of thermal management through substrate patterning.

The importance of thermal management through substrate patterning.

Introducing an experimental verification on "how much difference substrate patterning makes in thermally demanding circuits!"

An important factor in machine design, circuit design, and substrate design is "controlling heat." The heat dissipation path, from the perspective of thermal resistance, is significantly large, as heat conducted from components to the substrate wiring is transmitted into the air. With the recent trend of high-density integration of components and miniaturization of devices, the importance of measures through substrate patterning has been increasing. Here, we will introduce specific thermal countermeasures based on verification experiments regarding "how much difference substrate patterning can make in thermally demanding circuits." *For detailed content of the article, please refer to the related links. For more information, feel free to contact us.*

  • Circuit board design and manufacturing
  • Substrate

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High-frequency substrate

High-frequency substrate

Many production achievements and a rich lineup! We also accommodate small quantities and short delivery times.

"High-frequency substrates" are one of the areas in which our company excels, and we have a wealth of production experience. We offer a wide range of low dielectric constant and low loss materials that are essential for substrates transmitting GHz band and Gbps high-speed signals. We can accommodate small production quantities and respond with short lead times, so please feel free to consult with us. 【Materials we handle (example)】 ■R-5775 (MEGTRON6) ■CCL-HL950SK TypeSK ■MCL-LX-67Y ■NPC-F220 ■CGP-500 ■CS-3376B *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Example: Artwork for high-voltage circuit board + circuit board manufacturing

Example: Artwork for high-voltage circuit board + circuit board manufacturing

A case where we made proposals primarily to satisfy functionality, performance, and safety!

We would like to introduce a case where we conducted the artwork and manufacturing of a high-voltage circuit board. We received an inquiry from a customer developing a high-voltage circuit board for the first time, and we proposed the circuit board design values primarily from our side. In this case, there were no clearly defined standards to comply with, so we made proposals to satisfy functionality, performance, and safety, and after adjustments with the customer, we finalized the specifications. 【Outline Specifications】 ■ Output: Maximum AC/DC 5kV ■ Insulation Design: Between other blocks = AC2kV Between Low Voltage block and High Voltage block = AC4kV (to the extent possible) *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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[Artwork Design/Circuit Board Design Work] Motor Driver, Sensing Circuit Board

[Artwork Design/Circuit Board Design Work] Motor Driver, Sensing Circuit Board

Supports IMX series CMOS image sensor evaluation IF boards and QSFP 40Gbps optical transceiver modules!

Our company has a track record in artwork design and PCB design work for robot motor drivers and sensing boards. We can accommodate requests such as transitioning from an old PCB (QFP) to a new PCB (BGA) while keeping the number of layers and dimensions the same as the current design, and we can also handle the implementation of paired chips and the mounting of optical lenses within budget. Please feel free to contact us when you need our services. 【Overview of Achievements in Robot Motor Drivers and Sensing Boards】 ■ Gate driver chip compatible with 3-phase brushless motors ■ High-voltage MOSFET driving at 48V, with current sensing and overcurrent monitoring using a 16-bit ADC ■ PWM frequency of 100 kHz, with a measured driving current of 2A ■ Microcontroller, serial bus, GPIO, level shifter ■ Designed to be more compact than previous PCBs, with heat dissipation measures and improved stability of the serial bus operation *For more details, please download the PDF or feel free to contact us.

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  • Circuit board design and manufacturing
  • Substrate

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Build-up substrate

Build-up substrate

Fine pitch, fine pattern, slim type! Dramatically improved wiring flexibility.

We handle suitable "build-up substrates" for interposers. The minimum line and space are L/S = 20/20μm. It supports LVH diameter/land diameter = 60/90μm with an LVH pitch of 150μm. Using a core of 25μm and prepreg of 20μm allows for thin board construction. 【Application Areas】 ■ Wireless modules ■ Interposers ■ Smartphones ■ Tablet devices ■ Digital cameras ■ Communication base stations *For more details, please download the PDF or feel free to contact us.

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  • Circuit board design and manufacturing
  • Substrate

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Rigid-flexible substrate

Rigid-flexible substrate

A "trump card" for miniaturization and low profile! Applicable to digital cameras, robots, and more.

We would like to introduce our "Rigid Flexible Circuit Boards." Traditionally, connections were made using B to B connectors, but with the rigid-flex design, both the area and height have been reduced to less than half. These can be applied in fields such as automotive, tablet devices, smartphones, and medical equipment. 【Board Specifications】 ■ 8-layer through-hole board (Rigid Flexible Circuit Board) ■ Board thickness t = 0.7mm ■ Flexible part thickness t = 0.28mm ■ Minimum L/S: 0.1/0.1mm ■ Minimum Via: hole diameter 0.25mm ■ Land diameter surface layer 0.45mm, inner layer 0.5mm *For more details, please download the PDF or feel free to contact us.

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  • Circuit board design and manufacturing
  • Substrate

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Transparent flexible substrate

Transparent flexible substrate

Ideal for wearable devices! Applicable to medical and smartphones, etc.

We provide transparent FPC with excellent transparency in a short delivery time. We can use low-cost PET material "Polyethylene Terephthalate," and we also adopt PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting. Additionally, we support the transparency of the resist. 【Features】 ■ Achieving short delivery times from order to delivery, possible only with our company ■ Use of low-cost PET material "Polyethylene Terephthalate" ■ Adoption of PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting ■ Support for the transparency of the resist *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Handbook for Circuit Board Noise Countermeasures

Handbook for Circuit Board Noise Countermeasures

We support product development without setbacks by implementing noise countermeasures from the early design stage.

This document is a "PCB Noise Mitigation Handbook" for circuit designers, FPGA developers, and electronic device developers. It introduces the importance of GND, voltage drop, and the significance of "power/GND reinforcement" in relation to DC analysis and load variations. Additionally, it includes information on "impedance disturbances and countermeasures," such as the disruption of impedance and its solutions. [Contents] ■ Crosstalk suppression and isolation ■ Power/GND reinforcement ■ Impedance matching and equal-length wiring *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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What exactly is substrate-less?

What exactly is substrate-less?

Solving the heat dissipation problem of LEDs! New technology achieves board-less design.

"Board-less" refers to a technology that overturns the conventional concept of heat dissipation by enabling three-dimensional mounting without the use of printed circuit boards, thanks to MARBS (three-dimensional wiring technology), which ideally transfers heat to heat sinks. "MARBS" is a next-generation printed circuit board wiring technology that combines two technologies: "nano-level bonding technology" and "three-dimensional wiring technology." This technology allows for a high level of heat dissipation that was previously impossible with conventional boards, enabling flexible LED light distribution design and the direct formation of wiring patterns on curved metal substrates. 【Differences between MARBS and conventional boards】 - Enables a high level of heat dissipation that was previously impossible - Allows for flexible LED light distribution design - Enables direct formation of wiring patterns on curved metal substrates - Solves LED heat dissipation issues *For more details, please refer to the related link page or feel free to contact us.

  • Circuit board processing machine
  • Other processing machines
  • Wiring materials
  • Substrate

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Flat Grinding System Continuous Mirror Polishing Machine

Flat Grinding System Continuous Mirror Polishing Machine

We will propose a polishing machine tailored to your needs!

This is an announcement from Nappu Industrial Co., Ltd. regarding the flat grinding system continuous mirror polishing machine.

  • Repair Agent
  • Substrate

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"Alumina thick film circuit board" with excellent heat dissipation and heat resistance properties.

"Alumina thick film circuit board" with excellent heat dissipation and heat resistance properties.

Building a consistent high-quality line! Introducing electronic material substrates with high reliability!

The "Alumina Thick Film Circuit Board" is an electronic material substrate with high reliability, where electrode materials and resistive materials are baked onto an alumina substrate that excels in heat dissipation and heat resistance. It is suitable for applications such as automotive electronic components, communication industrial equipment, power supplies, and safety devices. Our company, in collaboration with our affiliated company "Ina Ceramic Co., Ltd.," produces and sinters alumina substrates, establishing a consistent high-quality line from circuit printing, firing, resistance value adjustment, component mounting, molding, to electrical testing. 【Features】 ■ Electrode materials and resistive materials are baked onto an alumina substrate with excellent heat dissipation and heat resistance ■ High reliability ■ A consistent high-quality line is established from circuit printing to electrical testing *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Substrate

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