Support for high current, high voltage, and high heat dissipation specifications.
Multi-layer structure with conductor thickness of up to 500μm! We propose an optimal heat dissipation structure.
Our company solves issues related to high current, high voltage, and heat dissipation through a special structure. We are capable of conducting high current (up to 400A) tests and manufacturing metal (with AL2.5mm) products. Additionally, we propose multi-layer structures with conductor thicknesses of up to 500μm and suitable heat dissipation designs. We address concerns such as the labor-intensive assembly of busbars and issues caused by warping of printed circuit boards due to heat. [For such concerns] ■ I want to carry high current ■ The assembly of busbars is labor-intensive ■ Issues caused by warping of printed circuit boards due to heat ■ High heat density, making heat dissipation difficult *For more details, please refer to the PDF document or feel free to contact us.
- Company:OKIサーキットテクノロジー
- Price:Other