We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 408 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Feb 11, 2026~Mar 10, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Feb 11, 2026~Mar 10, 2026
This ranking is based on the number of page views on our site.

  1. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. null/null
  4. 4 共栄電資 Tokyo//Electronic Components and Semiconductors
  5. 5 スクリーンプロセス Kanagawa//others

Substrate Product ranking

Last Updated: Aggregation Period:Feb 11, 2026~Mar 10, 2026
This ranking is based on the number of page views on our site.

  1. Understand in 3 minutes! Solder Resist Formation Technology [Materials Provided] プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm] 共栄電資
  4. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  5. 5 CAN/CANFD communication is possible with the sequencer! CANNEX サンプロシステム

Substrate Product List

1051~1080 item / All 1489 items

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Support for high current, high voltage, and high heat dissipation specifications.

Multi-layer structure with conductor thickness of up to 500μm! We propose an optimal heat dissipation structure.

Our company solves issues related to high current, high voltage, and heat dissipation through a special structure. We are capable of conducting high current (up to 400A) tests and manufacturing metal (with AL2.5mm) products. Additionally, we propose multi-layer structures with conductor thicknesses of up to 500μm and suitable heat dissipation designs. We address concerns such as the labor-intensive assembly of busbars and issues caused by warping of printed circuit boards due to heat. [For such concerns] ■ I want to carry high current ■ The assembly of busbars is labor-intensive ■ Issues caused by warping of printed circuit boards due to heat ■ High heat density, making heat dissipation difficult *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Support for high-density build-up structures

High-density wiring is now possible, enhancing design flexibility! Compatible with various specifications.

We would like to introduce our support for high-density build-up structures. High-density wiring has become possible, enhancing design flexibility. With LVH connections, high-speed wiring without via stubs is achievable. We support specifications such as narrow pitch compatibility and high-frequency compatibility (application of low dielectric materials, application of VLP copper foil, characteristic impedance matching, and improved characteristics for high-frequency applications). 【Supported Specifications】 ■ Narrow pitch compatibility ■ High-frequency compatibility (application of low dielectric materials, application of VLP copper foil, characteristic impedance matching & improved characteristics) ■ Thick copper foil specifications ■ Mixed IVH & LVH *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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[In Development] BLE Authentication System "T-ioT"

We are developing a circuit board that can support various solutions using smartphones as authentication devices!

This is a system that can support multiple solutions on the same substrate, allowing for unlocking and sharing of operation permissions or usage restrictions via an app by touching the smartphone equipped with NFC to authenticate Bluetooth to the main unit. It is being developed as a security enhancement for locker locks, focusing on the concept of "unlocking with a smartphone." However, we also aim to provide only the substrate, envisioning solutions such as the following: - Adding a function to unlock via an app by connecting "T-ioT" to existing electric lock systems like keypad or card readers. We are working towards enabling temporary key sharing as "one-time unlock" or "time-limited unlock." - A solution that activates authentication at the next point by authenticating the smartphone in a predetermined order. We believe this will be effective for patrol duties, roll calls, and confirming presence. *Please note that since this is a product under development, specifications may change. If you have any requests or interest, please feel free to contact us.*

  • locker
  • Substrate

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Utilization of fluororesin as a next-generation communication infrastructure.

I will also explain the contributions and challenges related to 5G and 6G, as well as the challenges in the use of fluororesins!

Communication devices include various items such as smartphones, tablets, and computers. One of the components that operates inside all these devices is the circuit board, which is an essential and important part for the functioning of all components. Moreover, with the advent of 5G and the move towards post-5G, communication is becoming more advanced, and just like various components, circuit boards are also required to evolve. One material that is expected to contribute to the performance improvement of communication circuit boards is "fluororesin." Here, we will briefly introduce why fluororesin is considered necessary as a next-generation communication circuit board, along with its reasons and technical challenges. *For detailed content of the article, please refer to the PDF. For more information, feel free to contact us.*

  • Other electronic parts
  • Substrate

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Introduction to the production flow for manufacturing various types of circuit boards in a short delivery time.

By coordinating the substrate manufacturing and assembly processes, we have achieved faster delivery!

Our company supports product development from the design of printed circuit boards to prototype implementation. We perform high-efficiency pattern design that reflects the high technical skills and know-how accumulated as a printed circuit board assembly manufacturer, producing various types of boards, from single-sided boards to multilayer and high-density boards, in a short delivery time. By coordinating the board manufacturing and assembly processes, we achieve faster delivery. We can flexibly respond to requests from any stage of the process. 【Production Flow】 ■ Specification Meeting ■ Pattern Design ■ Board Manufacturing ■ Component Procurement ■ Metal Mask Production ■ Board Assembly ■ Inspection ■ Delivery *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other electronic parts
  • Substrate

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Mold base

The fixed mold and movable mold are all finished with PL surface grinding!

The "Mold Base" from JAPAN MOLD TRADE Co., Ltd. is a base with all fixed and movable molds finished with PL surface grinding. 【Features】 ■ Processed according to your specifications for items such as ejector plates, die blocks, and supports ■ All components except bolts, movable inserts, fixed inserts, and cores are processed ■ All parts are delivered in an assembled state *For more details, please download the PDF or feel free to contact us.

  • Other molds
  • Circuit board processing machine
  • Substrate

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Introduction to Asia Electronics Co., Ltd. "Total Support for Product Development and Manufacturing"

Comprehensive support from design, manufacturing, inspection to shipping! We respond to user needs with advanced technology.

At Asia Electronics Co., Ltd., we provide total support for product development and manufacturing. Based on your inquiries, we offer proposals and provide consistent support from design, manufacturing, inspection, to shipping, aiming to improve product quality and achieve short delivery times. Additionally, we excel in high-density circuit board development, BGA, CSP rework, reballing, press-fit, and small-lot production of various types and assemblies. We invite you to try our reliable technology. [Development (Excerpt)] ■Hardware ■Software ■Mechanical Development ■Design of single-sided and multilayer boards *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Other contract services
  • Other electronic parts
  • Substrate

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Introduction to Takeda Manufacturing Co., Ltd.

We will manufacture tools in a short delivery time to match the testers you have!

Takeda Manufacturing Co., Ltd. is engaged in the development, manufacturing, and sales of boards for LSI testers and various electronic devices. We have a wealth of experience in cable harnesses, checkers, machined products, resin products, sheet metal products (including painting), and other electronic device prototypes. We strive to create safe tools that can be used for a long time, taking the operating environment into full consideration, so please feel free to contact us with your requests. 【Industry】 ■ Development, manufacturing, and sales of boards for LSI testers and various electronic devices. *For more details, please download the PDF or contact us.

  • Evaluation Board
  • Circuit board design and manufacturing
  • Substrate

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Business Introduction: PB (Private Brand)

We complete the process until product completion in-house! We bring our customers' desired images and ideas to life.

Excel Corporation offers products designed and manufactured in-house. Our job is to realize the images and ideas desired by our customers. We conduct simulations of product images to ensure they align with current trends and bring them closer to completion. As a "monozukuri" (manufacturing) company, we leverage our years of know-how in design, manufacturing, and quality to propose completed products. 【Features】 ■ Product installation plans ■ Electrical and optical design ■ Enclosure and structural design ■ Illuminance simulation ■ Product specifications *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Processing Contract
  • Substrate

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Used circuit board for hole-opening machine LANISA board

【Production Stopped Recycled Products】 ■If you are having trouble with the circuit board of the hole punch machine being out of production, please contact us.

【Production Halted Recycled Products】 ■If you are having trouble with the circuit board of the hole punch machine being out of production, please contact us. ■If necessary, we can also carry out replacement work.

  • Printed Circuit Board
  • Substrate

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Used PCNT4 board for hole-opening machine

[Production Halted Recycled Products] ■If you are having trouble due to the production halt of the circuit board for the hole punch machine, please contact us.

【Production Halted Recycled Products】 ■ Please contact us if you are having trouble with the circuit board of the hole punch machine being out of production. ■ If necessary, we can also carry out replacement work.

  • Printed Circuit Board
  • Substrate

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"Contract hardware development" is our specialty in circuit design using FPGA!

Through thorough discussions with our clients, we will carry out design and manufacturing that meets your requests and ensures your satisfaction. Of course, our aftercare is also comprehensive!

We mainly handle circuit board design and manufacturing, logic circuit design, and mechanical design and manufacturing. 【Development Examples】 - P-THIN-GEM A neutron detector capable of measuring two-dimensional images of materials using neutrons and TOF (Time-Of-Flight) information. - 8ch-5Gsps-Digitizer Writes analog signals to analog memory at speeds of up to 5Gsps. - BRoaD III A module that facilitates the verification of signal logic, input switching, and comparison of outputs from multiple logic circuits. - ADC-SiTCP An ADC board capable of digitizing 16-channel balanced analog inputs at 40Msps. - Acrylic chamber for moisture supply A discharge experiment case for Kinki University. An acrylic case that allows observation of discharges while supplying moisture. ★ We specialize in circuit design using FPGA (VeriLog) and the development of devices incorporating hardware TCP. *For more details, please feel free to contact us.

  • Other electronic measuring instruments
  • Substrate

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LED signal light circuit board unit 'MR1105-80AR' 110φ red

Wide-angle ultra-high brightness signal light board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit, 'MR1105-80AR', which we handle. This is a best-selling product that has been a specialty of our company for over 10 years. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Supply voltage: AC100V, also available in DC24V specification ■ Dimensions: 135mm square ■ Inner diameter: 110φ ■ Number of LEDs: 80 ■ Emission color: Red *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights
  • Substrate

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LED signal light circuit board unit 'MR2505-160AY' 250φ yellow

Wide-angle ultra-high brightness signal light board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit, 'MR2505-160AY'. This is a best-selling product from our company, which specializes in LED signal light circuit board units and has been in the market for over 10 years. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Supply Voltage: AC100V ■ Dimensions: 280mm square ■ Inner Diameter: 250φ ■ Number of LEDs: 160 ■ Emission Color: Yellow *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights
  • Substrate

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APN Corporation "Company Profile"

One-stop support for your requests - We respond to all inquiries related to printed circuit boards.

Our company is capable of handling all processes related to circuit design, PCB design, manufacturing, assembly, and more, allowing us to provide one-stop solutions for any requests from our customers. 【Business Features】 ■ Specializing in miniaturization of printed circuit boards ■ Flexible response to analog, digital, and mixed-signal circuits ■ Quick turnaround with agile service ■ Extensive experience across a wide range of fields ■ Thorough quality control *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Simple Signal Generation Board 'CV200'

It comes with editing software that supports pattern creation and timing adjustments.

This product is a simplified signal generation board with a V-by-One(R) HS 32lane interface that supports ultra-high resolution 8K4K/60Hz. Pattern creation and timing settings can be freely adjusted according to the testing environment implemented by the customer. It also supports 4K2K/120Hz modules. 【Standard Specifications】 ■ Powered by a single DC12V supply ■ Data rewriting is performed via USB connection from a PC ■ Supports external control using a PC ■ Optional Remote Box available to extend switch operation *For more details, please download the PDF (English version) or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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eDP Simple Signal Generation Board 'iM1427'

It is suitable for high-resolution, high-speed transmission modules.

The "iM1427" is a simplified signal generation board with eDP (embedded Display Port/5.4G) interface, compatible with modules for Ultra books and Tablets, and includes pattern editing software for eDP output. This board has two DisplayPort outputs, allowing for simultaneous lighting of two panels, thereby expanding the range of inspection and evaluation methods. 【Features】 ■ Includes software for editing lighting patterns and timing ■ Allows pattern creation and timing settings to match the testing environment conducted by the customer *For more details, please download the PDF (English version) or feel free to contact us.

  • Signal Generator
  • Printed Circuit Board
  • Substrate

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Small module circuit board 'KEIm-25'

System on Module equipped with Intel(R) MAX(R) 10 FPGA

This product is a compact System on Module equipped with an Intel® MAX® 10 FPGA and a Nios® processor along with peripheral interfaces. It is a small type measuring 30×40mm and can be embedded with a single connector. It has a wide operating temperature range, making it suitable for harsh operating environments such as industrial equipment. Please feel free to contact us if you have any inquiries. 【Features】 ■ Compact and lightweight ■ Eliminates concerns about discontinuation ■ Usable from prototyping to mass production ■ Customizable ■ Uses 10M25 *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Board to Board Connectors
  • Substrate

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Adoption of IPC-A-610 "Acceptability of Electronic Assemblies"! Product Development Case Study

We will introduce examples of developed motor control boards, control units, and solar cell control circuit boards.

We would like to introduce various product development examples that we have conducted. We have developed products such as the "Motor Control Board for Commercial Vacuum Cleaners," the "Motor Control Board for Commercial Floor Cleaning Machines," and the "Automatic Door Control Unit Board." Additionally, we have examples of development such as the "Electric Control System with Built-in Angle Sensor," which adopts a bus slot type with excellent expandability for adding functions later, and the "Solar Cell Control Circuit Board," which can operate independently. 【Development Examples (Partial)】 ■ Motor Control Board for Commercial Vacuum Cleaners ■ Motor Control Board for Commercial Floor Cleaning Machines ■ Automatic Door Control Unit Board ■ Electric Control System with Built-in Angle Sensor ■ Solar Cell Control Circuit Board *For more details, please download the PDF or feel free to contact us.

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  • Contract manufacturing
  • Substrate

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"PCB Design and Manufacturing Services" Introducing special technologies for PCBs!

We support your company from creation to manufacturing! [Free materials available]

We would like to introduce our "Circuit Board Design and Manufacturing Services." Our circuit board design takes into account the assembly process and repairs. You can also trust us with high-frequency circuit board design. We primarily offer domestic manufactured circuit boards for prototypes and short lead times. We can accommodate urgent requests such as "I need a circuit board urgently." Additionally, we can handle both OUT-OUT and OUY-IN for overseas manufactured circuit boards. Please leave it to our experienced company. 【Features】 ■ Circuit Board Design - Design considering the assembly process and repairs - You can also trust us with high-frequency circuit board design ■ Circuit Board Manufacturing - Prototype samples / small quantity and variety / mass production boards / special boards *Available from just one piece - Domestic manufactured circuit boards: Focus on prototypes and short lead times, capable of handling high difficulty level boards - Overseas manufactured circuit boards: 6 years of experience with major automotive circuit boards *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Introduction to Chiyo Electronic Industry Co., Ltd. "Circuit Board Manufacturing"

We are working on establishing a manufacturing system that can meet our customers' needs!

Chiyo Electronic Industries Co., Ltd. has 7 SMT lines and produces high-quality circuit boards with short lead times that are difficult to achieve with overseas production. We accommodate both small-batch production of various types and mass production, switching between approximately 40 lots of different models per day. Additionally, by managing components with our unique barcode system, we ensure accurate inventory management and traceability. 【Manufactured Items】 ■ Circuit boards for currency processing machines ■ Circuit boards for analytical instruments ■ Circuit boards for car navigation systems ■ Circuit boards for plasma power supplies ■ Currency processing machine units ■ Analytical measurement instruments *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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System Core Co., Ltd. Business Introduction

We will assist you with the automation of equipment and the development of new products.

At System Core Co., Ltd., we develop devices that control objects using electronic circuit boards and computers equipped with microcontrollers (MCUs). In the design, development, and production of electronic circuit boards and embedded devices, we have developed numerous board devices such as logic circuit boards, motor and solenoid driver boards, and LED lighting boards. In embedded program (microcontroller) software development, we assist clients who specialize in board development or those who are lacking embedded programming staff, and we can also develop microcontroller software exclusively. 【Business Activities】 ■ Embedded hardware and software design, development, and production ■ Control equipment Windows software development ■ Electronic board development, design, and production ■ Various product shipping inspection devices ■ Other various software and hardware development and design *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • Other embedded systems (software and hardware)
  • Embedded system design service
  • Substrate

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Freesia Auto Research Co., Ltd. Business Introduction

We respond to all needs from the design, prototyping, manufacturing, to assembly of printed circuit boards.

Our company, as one of the leading circuit board manufacturers in Japan, provides comprehensive support from circuit board design to assembly. With the teamwork of planners and printed circuit board designers who have extensive experience, we design and manufacture printed circuit boards that are thoroughly focused on circuit performance. Leveraging the network of our various locations across Japan, we respond flexibly to meet our customers' needs. 【Business Activities】 ■ Circuit Board Design ■ Circuit Board Prototyping ■ Circuit Board Manufacturing ■ Circuit Board Assembly *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Limited Liability Company R.I.F. Business Introduction

Leave electronic circuit design, electronic system design, and embedded board design to us!

RIF Co., Ltd. specializes in electronic circuit design, electronic system design, and the sale of embedded circuit board design. We offer a wide range of products, including LED digital thermometers, simple infrared remote control repeaters, and LANC mode selectors. Additionally, we can produce prototypes and evaluation boards at low prices for small-scale production and hobby projects, so please feel free to contact us with your requests. 【Features】 ■ We can make some modifications to related products or develop new ones. ■ Depending on the content, we can produce even one unit. *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Dissimilar copper thick coexistence substrate

A high-current substrate suitable for miniaturized power devices!

The "Hybrid Copper Thickness Coexistence Substrate" is a high-current substrate that allows for the coexistence of 300μm thick copper foil and 70μm thin copper foil within the same layer, enabling switching between them. It achieves a reduction in assembly processes and component count, making it suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 ■ Switchable between 300μm and 70μm ■ 300μm and 70μm can be interwoven ■ Combination of copper inlays is possible *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High current substrate

With a rich lineup of copper foil thicknesses, we can accommodate current values from a few amperes to several hundred amperes!

The "High Current Substrate" is a printed circuit board that can carry large currents ranging from several tens to several hundred amperes, featuring thick copper foil. We offer "Ultra Thick Copper High Current Substrates" that use copper thicknesses of 300μm, 400μm, and 500μm, exceeding the conventional copper thickness of 105 to 240μm, as well as "Irregular Copper Thickness Coexisting Substrates" suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 - In the case of 300μm, coexistence with 50μm thin copper foil is possible in the same layer. - For thicknesses of 500μm or more, it is possible to draw copper foil out of the substrate from the inner or outer layers. - Exposure within the substrate is also possible. - Terminal processing, bending processing, and three-dimensional shaping of the substrate are possible. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Copper inlay substrate

A high-current, high-heat-dissipation substrate that achieves effective heat dissipation!

The "copper inlay substrate" is used in a wide range of fields and is particularly adopted as a critical component related to human life in automotive applications, being a high-current and high-heat-dissipation substrate. It achieves an excellent cost-performance heat dissipation method. By pressing copper directly beneath heat-generating components, it effectively dissipates heat. Additionally, eliminating the need for screw fastening for each heat-generating component enhances reliability, reduces costs, and decreases assembly labor. 【Features】 ■ Compared to aluminum heat dissipation substrates, the lower coefficient of thermal expansion of copper improves the reliability of solder joints. ■ Compared to aluminum heat dissipation substrates, it allows for the use of high multilayer substrates and double-sided mounted substrates, increasing design flexibility. ■ Increased circuit efficiency due to greater freedom in component placement. ■ Miniaturization. ■ Both SMD and lead components can adopt the same heat dissipation structure. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High multi-layer, large printed circuit boards (PCBs) and backplanes manufactured overseas.

Our company's circuit board manufacturing specializes in high-layer and large circuit boards up to 60 layers. We will develop solutions for your interconnection issues.

For over 30 years, our technological advancements in PCBs and backplanes have enabled several key innovations in high-speed networking and computing products. 【Services Offered】 ■ PCB layout, CAD, design for manufacturability and cost ■ Quick-turn PCB prototyping for PCBs, backplanes, and flex circuits ■ Mass production and global manufacturing in North America and Asia ■ Advanced technologies: laminated boards, HDI, any layer through structure, multiple sequential laminations ■ Manufacturing services utilizing SVP (Simultaneous Via Partitioning™) and intellectual property licensing opportunities ■ Manufacturing of high-layer-count and large PCBs *For more details, please refer to the PDF document or feel free to contact Sanmina.

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Overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, etc.

We have strengths in advanced technology for high multilayer and ultra-fine pitch developed for aerospace applications, and we respond to the needs for procuring advanced substrates overseas.

We would like to introduce our overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, and more. Our company is a PCB manufacturing company with a long track record of providing PCB solutions for major markets in high-speed telecom, networking, computing, ATE, mission-critical defense and aerospace (MIL-PRF-31032, AS9100), automotive, and medical sectors. 【Features】 ■ Global footprint (two locations in the U.S., four factories in Singapore and China) ■ Design for PCB layout, CAD, productivity improvement, and cost reduction ■ Complete NPI support ■ Material technology ■ Technical leadership (multilayer boards, HDI, etc.) 【We will be exhibiting at NEPCON Japan 2025!】 Date: January 22 (Wed) - 24 (Fri), 2025, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight (Booth # E28-17) *Please register your visit via the link below and stop by our booth! (No waiting time)

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  • Circuit board design and manufacturing
  • Substrate

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High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate

The cup angle and bottom size can be freely selected! After implementation, the height of the board can be kept low.

This product is a "high-precision device substrate" that allows for a low profile of the board after mounting by installing an IC in the seat groove. It is designed for LED light reflectors, and the cup angle and bottom surface size can be freely selected. In addition, we also offer "high heat dissipation device substrates" and "ultra-thin glass cloth multilayer substrates." 【Features】 <High-Precision Device Substrate> ■ Enables a low profile of the board after mounting ■ Cup angle and bottom surface size can be freely selected <High Heat Dissipation Device Substrate> ■ Combines various heat dissipation technologies to meet advanced requirements ■ Copper pillars do not damage through-hole plating as they are not press-fitted *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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