Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:May 13, 2026～Jun 09, 2026
This ranking is based on the number of page views on our site.
1081～1110 item / All 1946 items
Please consult us for short delivery times for double-sided and multilayer PCBs. We can accommodate orders starting from one piece.
Please consult us for short delivery times for double-sided and multilayer PCBs. We can accommodate orders starting from one piece. Standard shipping for 4-layer PCBs is possible within 3 days. For more details, please contact us.
The check program makes instant judgments! Compact computer and cable checker.
The "Wire Box 64" is a PC cable checker that allows for low-cost and high-speed verification of complex multi-core connectors and cable connections using a computer. The main unit is compact and lightweight, fitting in the palm of your hand, and can quickly transform into a high-performance inspection device simply by combining it with a computer. All pin disconnections, short circuits, and connection errors are displayed simultaneously on the screen, enabling rapid judgment of good or bad conditions. 【Features】 ■ Compact ■ Easy operation ■ Data displayed all at once ■ Capable of determining the quality of special connections ■ Supports up to 128P when connecting two units *For more details, please refer to the PDF documentation or feel free to contact us.
![[IH Soldering Case] Large Heat Capacity Substrate](https://image.mono.ipros.com/public/product/image/515/2001053178/IPROS28199257971935562579.png?w=280&h=280)
A field where the IH method excels! Introducing a case study that achieved soldering on a 6-layer thick copper substrate.
We would like to introduce a case of IH soldering on a large heat capacity substrate for automotive products. With the rise of electric vehicles (EVs), the use of large heat capacity substrates in automotive components has increased. The IH method not only heats the terminals but also the large patterns and solder, significantly improving soldering quality. IH soldering is a specialty in the field of large heat capacity substrates. 【Case Overview】 ■ Heating Target ・ 6-layer thick copper substrate ・ □0.64 *For more details, please refer to the PDF document or feel free to contact us.
We can implement any type of BGA or CSP without a mask. Wiring from BGA is also possible. We are open to any inquiries regarding the circuit board!
Prototype and modification of printed circuit boards. Fine pitch 0.3 can be mounted with manual work! We also respond to customers' requests for short delivery times! (Nighttime support available) Assembly is possible from just one piece! BGA and CSP can be mounted without a mask! (Any type is fine) We can also continue jumper wiring to pitch 0.5 with 100 wires! Wiring from BGA is also possible! We can reball and install BGA as well!
![[Example] Conductor Resistance Automatic Monitoring System (Continuity Resistance Monitoring)](https://image.mono.ipros.com/public/product/image/1b9/2000097958/IPROS32035394018965538528.png?w=280&h=280)
Real-time analysis possible simultaneously with data collection! Original data collection and editing functions that reflect customer feedback. Hardware/software that is not limited to specific test chamber manufacturers.
- A system that can automatically monitor conductor resistance in conjunction with the test chamber. - Real-time analysis is possible simultaneously with data collection. - Standard number of channels: 192ch, using high-lifetime relay contacts rated for 100 million cycles (10V/100mA). - Control linked with testing equipment (thermal shock testing machine) is possible. - Adoption of high-temperature resistant custom measurement cables.
Introduction of a project that can train professional engineers from the beginner level.
"We need to implement IoT, but we don't have any engineers in the company." "There is no one to train engineers." "We lack the technical know-how to differentiate our products." For customers facing such issues, our 'IoT Professional Engineer Training Project' is ideal. This project consists of two steps, allowing us to train professional engineers from the beginner level. [IoT Professional Designer Training Project] ■ Engineer education services through courses ■ IoT technology consulting *For more details, please refer to the PDF document or feel free to contact us.
We will consider services based on your concerns! We will diagnose thermal issues in the early stages of product development.
Our "Thermal Issue Simplified Diagnosis Service" diagnoses thermal issues in the early stages of product development. We predict product temperatures from the conceptual stage and report on the presence of thermal issues along with one-point advice. We provide feedback on the validity of product size and heat dissipation strategies (such as the necessity of fans) in the early design phase. Additionally, we also offer a "Design Value Calculation Service." 【Features】 ■ Response within 3 days ■ Predict product temperatures from the conceptual stage ■ Report on the presence of thermal issues and provide one-point advice ■ Feedback on the validity of product size and heat dissipation strategies in the early design phase ■ Avoid costly heat dissipation measures and significant design revisions *For more details, please refer to the PDF document or feel free to contact us.
![[Information] President's Blog April 2017 - March 2018](https://image.mono.ipros.com/public/product/image/be1/2000562567/IPROS96135904157276490014.jpeg?w=280&h=280)
This article discusses the applications of wireless power transfer and the formation of engineer careers in the era of ultra-long lifespans!
This document summarizes the president's blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" aimed at solving the shortage of engineers, from April 13, 2017, to March 30, 2018. It introduces various topics, including the need for experience and know-how in the design of wireless power transmission on April 13, 2017, the relationship between the number of engineers in design/development companies and business execution on July 18, 2017, and a solid follow-up on the progress of in-house development on October 3, 2017. Additionally, it contains a wealth of useful information related to products and industries. We encourage you to read it. [Published Content (Excerpt)] ■ April 13, 2017 - April 30, 2017 ■ May 8, 2017 - May 31, 2017 ■ June 1, 2017 - June 29, 2017 ■ July 4, 2017 - July 28, 2017 ■ August 4, 2017 - August 31, 2017 *For more details, please refer to the PDF document or feel free to contact us.
![[Information] President's Blog April 2020 - August 2020](https://image.mono.ipros.com/public/product/image/685/2000562577/IPROS77790458968635548886.jpeg?w=280&h=280)
Requirements for Online Meetings - Contributions through WTI Technology!
This document summarizes the president's blog of Wave Technology Co., Ltd., which is engaged in "development and design promotion business" to solve the shortage of engineers, from April 1, 2020, to August 21, 2020. It introduces the current situation as of April 21, 2020, and the increasing importance of technology, as well as what is required for the online meeting on May 7, 2020 – contributing with WTI's technology – and the announcement on July 17, 2020, that WTI has finally started disseminating information in English. Additionally, it includes a wealth of useful information related to products and industries. We encourage you to read it. [Contents] ■ April 1, 2020; April 21, 2020 ■ May 7, 2020; May 29, 2020 ■ June 12, 2020 ■ July 2, 2020 – July 31, 2020 ■ August 21, 2020 *For more details, please refer to the PDF document or feel free to contact us.
![[Data] WTI Blog April 2017 - March 2018](https://image.mono.ipros.com/public/product/image/a07/2000565472/IPROS74604021505352766594.jpeg?w=280&h=280)
Reasons why WTI is chosen, including "technological capabilities," as well as information about optical communication and optoelectronic conversion devices!
This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" to solve the shortage of engineers, from April 4, 2017, to March 27, 2018. The reason WTI was chosen on April 4, 2017, is due to its "technical capabilities," and it introduces topics such as optical communication and optoelectronic conversion devices from May 9, 2017, and types of packages from June 13, 2017. In addition, we have published a wealth of useful information related to products and industries. We encourage you to read it. 【Contents (excerpt)】 ■ April 4, 2017 - April 25, 2017 ■ May 9, 2017 - May 30, 2017 ■ June 6, 2017 - June 27, 2017 ■ July 4, 2017 - July 25, 2017 ■ August 8, 2017 - August 29, 2017 *For more details, please refer to the PDF document or feel free to contact us.
![[Data] WTI Blog April 2020 - August 2020](https://image.mono.ipros.com/public/product/image/e87/2000565487/IPROS71317692361161110483.jpeg?w=280&h=280)
Points to consider when creating embedded software and the importance of screws in waterproof design are featured!
This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development and Design Promotion Business" aimed at solving the shortage of engineers, from April 7, 2020, to August 25, 2020. It introduces various topics, including the short-circuit test of power devices on May 12, 2020, key points for creating embedded software on June 23, 2020, and the importance of screws in waterproof design on August 4, 2020. Additionally, it contains a wealth of useful information related to products and industries. We encourage you to read it. 【Contents】 ■ April 7, 2020 - April 28, 2020 ■ May 12, 2020 - May 26, 2020 ■ June 2, 2020 - June 30, 2020 ■ July 7, 2020 - July 28, 2020 ■ August 4, 2020 - August 25, 2020 *For more details, please refer to the PDF document or feel free to contact us.
![[Information] It's Never Too Late to Ask! EMI Countermeasures: Filter Edition](https://image.mono.ipros.com/public/product/image/229/2000583750/IPROS52099283118953417909.jpeg?w=280&h=280)
Inductors and capacitors! Publishing know-how shared by our engineers.
This document introduces questions and answers about filters for EMI countermeasures. It includes know-how shared by our engineers regarding inductors and capacitors. It is a book that explains the concepts in an easy-to-understand manner. [Contents] ■#047 EMI Countermeasures - Filter (Inductor Part 1) ■#048 EMI Countermeasures - Filter (Inductor Part 2) ■#052 EMI Countermeasures - Filter (Capacitor Part 1) ■#053 EMI Countermeasures - Filter (Capacitor Part 2) *For more details, please refer to the PDF document or feel free to contact us.
In an era of engineer shortages, engineers are shifting from "enhancement" to "co-creation"! Introduction of the professional designer training project.
We would like to introduce our "Techno-Sherpa." In our "Engineer Training Services," we support the development of practical engineers, including new graduates and non-electrical engineers, with a comprehensive technical education menu. Additionally, in our "Technical Consulting Services," we provide solutions to the technical challenges faced by our customers, including location detection technology, EMC countermeasures, waterproof enclosure design, and thermal/stress simulation. 【Engineer Training Services (Excerpt)】 ■ Basic Course in Electronic Circuits PLUS (2-day course) ■ Basic Course in Electronic Circuits (5-day course) ■ Power Electronics Course ■ Basic EMC Course *For more details, please refer to the PDF materials or feel free to contact us.
Are you having trouble with measures against defects in your developed products, such as "waterproofing measures" or "EMI measures"?
This document introduces the support provided by Wave Technology Co., Ltd. It includes "Waterproofing Support," which allows for estimating the limits of waterproof measures, as well as "Vibration Testing Support," which addresses issues caused by vibrations during transportation and operation (actual usage conditions). Please feel free to download and take a look. 【Contents (excerpt)】 ■ Waterproofing Support ■ Temperature Cycle Testing Support ■ Vibration Testing Support ■ Drop and Impact Support ■ EMI Countermeasure Support *For more details, please refer to the PDF document or feel free to contact us.
電波法認証 技術基準適合証明の事前評価 申請の代行／品含有化学物質調査・環境負荷物質調査の代行をさせていただきます。
当社では、『電波法認証技術基準適合証明（技適）の事前評価申請の代行』 『製品含有化学物質調査・環境負荷物質調査の代行』をさせていただきます。 製品開発で必要となる全ての設計部隊（電気、機構、基板、ソフト）が 揃っており、これらを一括で受託し社内で綿密に連携して設計を進めるため、 デザイン、コスト、性能などを最適化した製品に仕上げることが可能です。 また、位置検出、ワイヤレス給電、信号処理、画像認識、AIなど近年の 製品開発でニーズの多い要素技術についても社内外のネットワークを活用し 製品に組み込むことが可能です。 【特長】 ■製品開発のトータルコーディネートが可能 ■製品開発で必要となる全ての設計部隊揃っている ■一括で受託し社内で綿密に連携して設計を進める ■デザイン、コスト、性能などを最適化した製品に仕上げることが可能 ■社内外のネットワークを活用し製品に組み込むことが可能 ※詳しくはPDF資料をご覧いただくか、お気軽にお問い合わせ下さい。
![[Data] Shirutoku Report No. 13 # Characteristic Impedance](https://image.mono.ipros.com/public/product/image/d70/2000684348/IPROS83889589797061925643.jpeg?w=280&h=280)
The concept of distributed constant circuits is becoming necessary! An explanation of characteristic impedance and substrate design.
★★Useful Information Report: Knowledge is Power★★ This report introduces the "characteristic impedance (wiring impedance)" of printed circuit boards. With the recent increase in the speed of digital signals, the design of digital circuit boards now requires the concept of distributed constant circuits rather than lumped constant circuits, making it essential to consider the characteristic impedance of the board in the design. So, how do we determine the characteristic impedance of a printed circuit board? [Contents] ■ Characteristic Impedance of Printed Circuit Boards *For more details, please refer to the PDF document or feel free to contact us.*
![[Data] Shirutoku Report No. 24 # Evaluation and Analysis Methods of BGA Packages](https://image.mono.ipros.com/public/product/image/ee2/2000688143/IPROS31247950267528825035.jpeg?w=280&h=280)
A structure in which electrodes are provided on the substrate, solder balls are formed on top, and are joined to the electrodes on the package side!
★★Shirutoku Report: Useful Information You Should Know★★ In this report, we will discuss the analysis methods for "BGA packages." "BGA" stands for "Ball Grid Array," which is a type of package for integrated circuits (ICs). In simple terms, it is a surface mount package that has electrodes (lands) on the substrate, with solder balls formed on top to connect to the electrodes on the package side. For more details, please take a look. [Contents] ■ About BGA Packages ■ Dyeing Analysis ■ Cross-Section Polishing *For more information, please refer to the PDF document or feel free to contact us.*
![[Information] Shirutoku Report No. 75 # Technical Standards Compliance Certification (Giteki) Application](https://image.mono.ipros.com/public/product/image/b46/2000707424/IPROS09478958713445588934.jpeg?w=280&h=280)
What should I prepare for the application for technical standards conformity certification? Information on necessary documents for the application is provided.
★★Shirutoku Report: Useful Information You Should Know★★ In this document, we would like to provide detailed information about "Technical Compliance" (Giteki), which has seen an increase in inquiries. We will explain what is required for a Giteki application using the example of a Bluetooth (BLE) module application. We also include the benefits of requesting a Giteki application from a design company, so please take a moment to read through it. 【Contents】 ■ What is required for a Giteki application... ■ What are the benefits of requesting a Giteki application from a design company? *For more details, please refer to the PDF document or feel free to contact us.*
SVH/IVH and composite high multilayer substrate for build-up.
Leveraging the strengths of our integrated production from in-house design, we are able to accommodate the production of narrow-pitch composite substrates for high-layer-count boards, such as semiconductor tester products, through a clever combination of design rules that consider substrate manufacturing at the design stage and the unique substrate processes of our small-batch, diverse product lines.
Development tailored to your needs, from design, circuits, molding, to assembly! We specialize in custom solutions!
Optolink is a company that deals with a wide range of light-related products, including LEDs. We would like to introduce some of our achievements in contract development. We manufactured a "universal board" based on circuit diagrams and specified component placement. Additionally, for the purpose of reducing electricity costs and preventing the drying of product surfaces due to lighting heat, we have adopted "custom lighting for food" using LED lighting in approximately 200 chain stores. 【Development Achievements (Partial)】 ■ Universal board manufacturing ■ Security operation unit ■ Custom lighting for food ■ Touch switch module with backlight ■ Custom LCD backlight module *For more details, please refer to the related links page or feel free to contact us.
You can insert a PMC specification card into the PCI slot of a computer for use.
The PMC-PCI conversion board "WPMC-PEX" supports 32-bit or 64-bit transfers at 33MHz. (The 32-bit and 64-bit specifications depend on the PMC card.) It is possible to output PMC I/O signals externally using CN1. The CN1 connector outputs I/O signal lines from the J14 connector, which can be selected by the user as needed. PMC specification cards can be used by inserting them into a computer's PCI slot. 【Features】 ○ PMC specification cards can be used by inserting them into a computer's PCI slot ○ Supports 33MHz transfer and 32-bit or 64-bit ○ Capable of outputting PMC I/O signals externally ○ Compliant with PCI revision 2.2, supports PCI 64-bit For more details, please contact us or download the catalog.
Each power module adopts a 1CH to 3CH switching regulator! It is compact in size.
The "WFPG-20AC" is a power supply board that incorporates all the power supply functions required by boards equipped with Cyclone family FPGAs into a compact 25x50mm sub-board, allowing for power supply to user boards when added on. Users do not need to consider power supply components in their design, which leads to a reduction in design time and more efficient design, as well as the possibility of reducing board size. Additionally, it features the ability to detect the rise of a 5V input voltage and output a Low-level Reset signal for 20ms. 【Features】 ■ Users do not need to consider power supply components in their design ■ Reduction in design time and efficient design can be achieved ■ Possibility of reducing board size ■ Improved high-speed transient response ■ High-speed load response characteristics of 3A/μs with a recovery time of 7μs *For more details, please refer to the PDF document or feel free to contact us.
Achieve high cost performance!
We handle ceramic balls with various characteristics. You can view a wide range of sizes and achievements in our catalog.
ニーズにお応えする為に高品質・高精度・短納期を追求し、低価格化のニーズにも的確に対応できるように尽力致します。
ハロゲンフリー化及び鉛フリー化に各種、対応しております。
It is a new feature that adds "heat dissipation" and "mechanical rigidity" to the functions of conventional printed circuit boards.
Aluminum substrates are designed to add new functions of "heat dissipation" and "mechanical rigidity" to the conventional printed circuit boards. Additionally, compared to resin-based printed circuit board materials, aluminum substrates have a temperature rise of about 1/10 or less at the same power consumption, making them very suitable for components that generate heat, such as resistors carrying large currents, power transistors, and high-power LEDs.
There are various variations depending on the board thickness and pitch.
There are various variations depending on the thickness of the board and the pitch.
Compatible with minimum hole diameter φ0.125.
The maximum interlayer thickness of IVH is 0.4mm, and it can accommodate a minimum hole diameter of φ0.125. In the future, it is also planned to support multi-layer laminated press specifications.
Impedance measurement creates test coupons outside the product! The design values for the impedance line can be simulated by our company.
In recent years, there has been a growing demand for substrates that implement impedance control. To meet such needs, our company is capable of manufacturing various impedance substrates. By providing us with impedance specifications and other details before or during the design phase, we can propose the necessary values for the design. 【Introduction of Software and Equipment】 ■ Polar Instruments Impedance Simulator Si8000m v12.01 ■ Polar Instruments Impedance Measurement Device CITS800s4 *For more details, please refer to the PDF document or feel free to contact us.
Minimum L/S, manufacturable layer count, board thickness, etc.! Introducing our printed circuit board specifications.
We would like to introduce the "Printed Circuit Board Specifications" handled by Screen Process Co., Ltd. The maximum IVH interlayer thickness can accommodate up to 0.4t and the minimum hole diameter is φ0.1mm. We also support sequential IVH. For more details, please refer to the catalog. 【Minimum L/S】 ■ Outer layer 18μm: 100/100μm ■ Outer layer 35μm: 150/150μm ■ Outer layer 70μm: 250/250μm ■ Outer layer 12μm: 80/80μm (pads and vias cannot be mixed) ■ Inner layer 35μm: 80/80μm ■ Inner layer 70μm: 200/200μm *For more details, please refer to the PDF document or feel free to contact us.
Introducing our substrate specifications, including MCL-E-67 and R-1766!
We would like to introduce the specifications of the substrates handled by Screen Process Co., Ltd. The "NP-140TL" from Nanya has a UL/ANSI grade of FR-4.0, with its main application being general-purpose, and a thermal conductivity of 0.4W/mK. For more details, please refer to the catalog. 【MCL-E-67 Specifications (Partial)】 ■ Substrate Manufacturer: Hitachi Chemical ■ UL/ANSI Grade: FR-4.0 ■ Main Application: General-purpose ■ Glass Transition Temperature ・TMA Method: 120–130 ・DMA Method: 150–160 *For more details, please refer to the PDF document or feel free to contact us.
