Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.
1171～1200 item / All 1924 items
Ultra-thin, high transmittance, very transparent quartz glass optical substrate.
Quartz glass optical substrate Wafer: Maximum 6 Inch diameter 300mm, thickness: 0.5mm and above Square: Within 300*300mm, thickness: 0.5mm and above Flatness: 0.01mm We will challenge at a low cost.
We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.
We provide custom structure MOCVD epitaxial growth on InP substrates ranging from 2 inches to 4 inches. We offer comprehensive services for InP epitaxial substrates to companies, universities, and scientific research institutions, including epitaxial structure design, epitaxial materials, and testing analysis.
![[Example] Module production using a small CMOS image sensor](https://image.mono.ipros.com/public/product/image/1be/2001010839/IPROS31911419374192082684.jpeg?w=280&h=280)
Soldering a separate board to a CMOS-equipped board! A successful example of achieving special product specifications.
We would like to introduce a case study on module production using a small CMOS image sensor. The customer had the challenge of wanting to fit a very small image sensor into a space of □1.5mm and a length of 5mm or less, aiming for device miniaturization. Since bending the module can easily cause cracks, the CMOS mounting section and the ceramic capacitor mounting section were placed on separate substrates and later soldered together. This approach allowed for a reduction in size compared to previous models while also achieving strength at the joint, significantly reducing the occurrence of cracks at the joints. 【Case Overview】 ■ Mounting Method: Soldering ■ Substrate Size ・Φ1.35mm×0.2mm ・2mm×1mm×0.2mm ■ Substrate Material: Glass epoxy substrate ■ Lot Size: 5 to 10 units *For more details, please refer to the PDF document or feel free to contact us.
![[Case Study] Improvement of Heat Dissipation and Bonding Strength of Substrates by Reducing Voids](https://image.mono.ipros.com/public/product/image/b2c/2001010844/IPROS46839266335862517870.jpeg?w=280&h=280)
Mounting the chip while scrubbing during solder melting! Examples of increased bonding strength and thermal conductivity.
We would like to introduce a case study on improving the heat dissipation and bonding strength of substrates through void reduction. To efficiently transfer the temperature during chip operation, we received an inquiry about using a high thermal conductivity material for the bonding between the plate and the base plate. By using a high thermal conductivity adhesive sheet, we improved the thermal conductivity. Additionally, by scrubbing the chip during solder melting, we successfully reduced the voids that were present inside the solder during the initial melting. 【Case Overview】 ■ Mounting Method: Flip Chip Mounting ■ Substrate Size: Plate 25mm x 25mm x 3mm, Base Plate 40mm x 40mm x 3mm ■ Substrate Material: Both the plate and base plate are aluminum (with Ni plating treatment on the entire surface) ■ Lot Quantity: A few pieces (for sampling) ■ Delivery Time: 1.5 months including preliminary evaluation *For more details, please refer to the PDF document or feel free to contact us.
Free samples available! This product is made from polyethylene as the raw material.
F Package flexibly responds to changes in the environment, aims for harmony with society, and works on creating rich communities. Please feel free to consult us regarding the design, processing, and sales of packaging materials, package production, cutting, etc. Additionally, we can also cut materials such as urethane foam and expanded polystyrene. Miramat is a product made from polyethylene as the raw material.
We provide quick and short-term services for small-scale and prototype printed circuit board design and development.
Expect More. Pay Less. With over 30 years of experience, FINPO ELECTRONIC is a rare presence in the Taiwanese PCB industry. We offer quick and short-term services for small quantities and prototypes, from design to development of printed circuit boards. We can accommodate a wide range of needs and have numerous achievements with major companies, from Japan's large firms H and T to major companies in Europe and the United States. Please feel free to contact us.
![High Current Flexible Circuit Board [*FPC Technology Catalog Available]](https://image.mono.ipros.com/public/product/image/c7d/2000477292/IPROS51770483967615096271.png?w=280&h=280)
Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.
Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!
The "Card Edge Compatible Multi-Layer Flexible Printed Circuit Board (FPC)" provided by our company is a multi-layer flexible circuit board designed to accommodate card edge connectors with double-sided contacts. By reducing the connection points between printed circuit boards and flexible circuit boards, a stable impedance line is formed, which is expected to improve signal integrity at high frequencies of 10 GHz and above. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, making it suitable for installation in tight spaces. 【Features】 ■ A partially bendable structure that has similar functionality to rigid-flex boards, enabling the formation of highly reliable vias. ■ A structure that integrates flexible and rigid parts without connection points or via transitions, allowing for the formation of stable impedance lines. ■ High-density wiring is possible with 100μm pitch wiring and vias with a land diameter of 300μm or less. ■ Integration of connections between boards contributes to a reduction in assembly labor. *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.
Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.
The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.
Compared to polyimide, it has low dielectric constant, low dielectric loss tangent, and low water absorption, resulting in excellent high-frequency transmission characteristics! It also has long-term heat resistance of 240°C.
The "High-Temperature Durable and Oil-Resistant Flexible Printed Circuit Board (FPC)" made entirely of LCP substrate excels in long-term heat resistance and passes the flexibility test (AB test) equivalent to MOT 180°C required by UL standards. Additionally, it has better high-frequency transmission characteristics due to its low dielectric constant, low dielectric loss, and low water absorption compared to polyimide. In the oil resistance test, there were almost no changes in conduction resistance and appearance before and after the test, and the conductor peel-off test also met the standard values. 【Features】 ■ Uses liquid crystal polymer (LCP) for the base and cover materials ■ Has long-term heat resistance of 240°C ■ Exhibits oil resistance against engine oil, brake pedals, and ATF *For more details, please refer to the PDF document or feel free to contact us.
Passed long-term heat resistance test at 200℃ for 1000 hours! High-temperature durable flexible substrate with insulation characteristics exceeding JIS standards.
The "Long-term High-Temperature Durable Flexible Circuit Board" is an FPC that achieves long-term heat resistance without the use of epoxy-based adhesives, making it suitable for harsh conditions in high-temperature environments. Even after undergoing our unique long-term high-temperature test conditions of 200°C for 1000 hours, the insulation resistance, continuity resistance change rate, and dielectric strength meet the JIS passing standards. 【Main Features】 1. Achieves high-temperature durability with a structure that does not use epoxy-based adhesives. 2. Heat resistance suitable for long-term use in high-temperature environments. 3. Insulation properties are maintained even after the long-term high-temperature test of 200°C for 1000 hours. For more details, please refer to the PDF document or feel free to contact us.
Supports high-speed transmission up to 15GHz! We have combined the high-speed transmission connectors from Irisoh Electronics with our flexible substrates.
The "Flexible substrate compatible with high-speed transmission connectors" combines the high-speed transmission connectors from Irisoh Electronics, [IMSA-11600S-30Y900 and IMSA-11501S-30Y900], with our YFC series (LVDS type microstrip line) RFM. By integrating them, it supports high-speed transmission up to 15GHz. 【Features】 ■ The LVDS-compatible FPC has been slotted. ■ It is easy to bend and can also be twisted for use. *For more details, please refer to the PDF document or feel free to contact us.
It can suppress discoloration during heating. Here are the test results using a double-sided panel.
The "High Heat Resistant Radiation Flexible Printed Circuit Board (FPC)" is an FPC that uses Okitsumo's heat-resistant solder resist "TAINEX." TAINEX is suitable for high-temperature environments up to 150°C and suppresses discoloration during heating. It also achieves radiation heat dissipation, and in our heat dissipation experiments, when combined with a thermal conduction layer, it has been shown to maintain temperatures more than 30 degrees lower compared to typical resist specifications for FPCs. *This result is based on tests conducted on double-sided boards. 【Features】 ■ FPC using Okitsumo's heat-resistant solder resist "TAINEX" ■ Thermal measures: Achieves a radiation rate of over 90% *For more details, please refer to the PDF document or feel free to contact us.
When you want to implement high-density wiring with over 200 pins in a limited space! It can be bent for use, allowing for high-density wiring in a compact space.
The "High-Density High-Multilayer Flexible Circuit Board" is an FPC developed for devices that require many signals. Despite having a 12-layer structure, it achieves a thickness of less than 1mm. The cable section can be bent for use, enabling high-density wiring in compact spaces. 【Features】 ■ The harness section can be bent for use. ■ Ideal for applying high-density wiring with over 200 pins in limited spaces. *For more details, please refer to the PDF document or feel free to contact us.
It is possible to form through holes with a diameter of 25μm or less on double-sided FPC. Additionally, it is also possible to form holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm.
"Ultra-small diameter through holes" are formed with a diameter of φ20μm on both sides of the FPC through laser processing. It is possible to create holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm. By using through-hole plating to fill the holes and arranging the through holes on the pattern, it enables narrower pitch and contributes to the miniaturization of the product. 【Features】 ■ Formation of through holes with a diameter of Φ25μm or less on both sides of the FPC is possible. ■ The holes are filled with 15μm through-hole plating specifications. *For more details, please refer to the PDF document or feel free to contact us.
Widely used as alternatives for fine coaxial cables, wire harnesses, and cables for medical devices. The spacing and width of the slits can be specified!
The "slit flexible substrate" is a flexible substrate with excellent bendability that has been processed with slits, allowing for "twisting" and "torquing." It is widely used as an alternative to fine coaxial cables, wire harnesses, and cables for medical devices, and since the spacing and width of the slits can be specified, it offers greater freedom for customers. 【Features】 ■ A bendable cable flexible substrate with 0mm slits processed between patterns ■ Can be used with "twisting" and "torquing" compared to conventional products ■ The spacing and width of the slits can be specified *For more details, please refer to the PDF materials or feel free to contact us.
For the electrical wiring in the engine room and the gasoline tank meter! Compared to glass epoxy substrates, it has a lower coefficient of thermal expansion and stronger resistance to heat.
The "metal-based heat dissipation substrate" is a substrate that improves heat dissipation through thermal conduction, alleviating thermal issues. There are applications in high-brightness LED lighting (for vehicles and floodlights), as well as in automotive electrical components, ECUs, EPS, and DC/DC converters. Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat. 【Features】 ■ A substrate that improves heat dissipation through thermal conduction by using metal as the base ■ Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat *For more details, please refer to the PDF materials or feel free to contact us.
Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.
BigElec is a flexible printed circuit board designed for high current wiring, intended as an alternative to busbars and wire harnesses, featuring a slim and flat design. Similar to printed circuit boards, it can accommodate pattern formation and assembly according to your requirements. We have newly introduced the "BigElec Standard Specification Products," which are easy to implement for connections between screw terminals. The BigElec Standard Specification Products have no initial costs, allowing for reduced upfront expenses. 【BigElec Standard Specification Product Specifications】 ■ Layers: 2 layers, 4 layers, 6 layers, 8 layers ■ Wiring width: 8mm to 11mm (integers only) ■ Total length: 30mm to 210mm (integers only) ■ Terminal screw diameters: M3 (hole diameter φ3.8mm), M4 (hole diameter φ4.4mm), M5 (hole diameter φ5.4mm), M6 (hole diameter φ6.5mm), M8 (hole diameter φ8.5mm) *For more details, please download the PDF or contact us.
For applications such as endoscopes, catheters, CT scans, and analytical devices! Introducing our products for medical equipment.
We would like to introduce flexible circuit boards suitable for medical device applications among the products we handle. 【Long-Length Flexible Circuit Boards】 By using crank shapes and spiral shapes, we can accommodate lengths in the meter range. ◎Features◎ ■ Capable of manufacturing with a board outline width of less than 1mm ■ Compatible with the mounting of 0402 size components 【Slit Flexible Circuit Boards】 By applying slitting processing, we can achieve a wide range of flexibility, including horizontal and twisting directions. ◎Features◎ ■ Improved bendability and weight reduction ■ Flexible support for the number of slits and slit widths 【Ultra-Fine Circuit Flexible Circuit Boards】 Using the Semi-Adhesive Process (SAP), we can process fine circuits with a minimum L/S of 20/20μm. ◎Features◎ ■ Contributes to miniaturization and weight reduction of products through high density ■ Capable of supporting high-speed communication applications due to the use of LCP as the core material *For more details, please refer to the PDF materials or feel free to contact us.
Bend and deliver, ready to use. Achieve labor savings and space-saving design with FPC processing!
The "FPC Forming Processing Service" provided by Yamashita Material Co., Ltd. is a service that delivers flexible printed circuit boards (FPC) manufactured by our company, pre-bent into shapes according to customer specifications. The delivered FPC is in a state ready for immediate assembly, significantly reducing the labor hours at the assembly site and contributing to space-saving design. We can accommodate custom bending shapes and sizes upon consultation. We also have numerous examples of forming that utilize flexible materials such as liquid crystal polymer (LCP) and polyimide (PI), allowing us to flexibly respond to complex shapes.
Curing device using superheated steam! Curing the inside and outside of the ink simultaneously!
We are currently offering an introduction to the printed circuit board resist curing device 'DEON' from Murakami Electronics, a manufacturer of prototype and mass production multilayer boards from double-sided substrates. The document clearly explains the differences between the existing ink curing principles and the ink curing principle adopted in our product (the internal and external simultaneous curing and drying method using nano high-temperature particles) with the help of illustrations. [Contents] ■ Existing ink curing principles ■ Ink curing principles with DEON ■ Nano high-temperature particles = Characteristics of nano-sized high-temperature superheated vapor ■ General characteristics of high-temperature superheated vapor ■ Regarding the moisture content in the resist *For more details, please refer to the PDF document or feel free to contact us.
![[Case Study] Flexible Circuit Board Product Delivery Record](https://image.mono.ipros.com/public/product/image/a82/2000321565/IPROS5294864867105400836.jpg?w=280&h=280)
Introducing a case study on the implementation of flexible substrates by Murakami Electronics Co., Ltd.!
Murakami Electronics Co., Ltd. is a manufacturer of both double-sided and multilayer printed circuit boards, specializing in prototyping and mass production. We will introduce examples of flexible circuit board applications, including "4-layer flex," "4-layer rigid flex," and "aluminum substrates." 【Case Studies】 ■ Double-sided electrolytic gold plating coverlay reinforcement board (PI) ■ 4-layer flex coverlay flux ■ 4-layer rigid flex flux ■ Aluminum substrate *For more details, please refer to the PDF document or feel free to contact us.
By conducting a functional analysis of the mounted devices during substrate integration, we will propose and implement the optimization of over-spec components and inefficient sequences.
Through circuit board technology, we were able to significantly reduce costs, labor, and size by reducing the number of components and then creating the circuit board. Reduction examples: wiring labor by 70%, size by 75%, and component costs by 20%. Key points when creating a circuit board: While it is possible to reduce size and labor by creating a circuit board with the same functionality, it is also possible to significantly slim down by breaking down the functions one by one and minimizing the necessary components. Of course, we consider the scalability of functions and future risks, conducting hearings with customers to make proposals. Therefore, in some cases, it may be better not to create a circuit board for areas with high scalability. While we cannot completely predict issues such as component shortages or discontinued parts, we can provide advice on inventory management based on trends. As an example of our proposals: - Optimization of power capacity components according to the current-carrying parts (using large-capacity components in small-capacity areas) - Optimization of functional components (for instance, replacing two component functions with one component) It is not uncommon for new products to be launched that did not previously exist as components on circuit boards. Please feel free to consult with Kairoski, specialists in circuit board components.
![IoT-enabled devices with control infrastructure and smartphone apps! [Distribution of system case study materials]](https://image.mono.ipros.com/public/product/image/983/2000354374/IPROS7721001701572451820.jpg?w=280&h=280)
Examples of sensor measurement systems using Bluetooth and Wi-Fi! In-house integrated support for circuit board and software development!
At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." By connecting a control board with communication functionality to a device, it becomes possible to send device data to a smartphone. The data collected from the device can be transmitted to a server using the smartphone's internet communication capabilities, allowing for data viewing and management on servers or PC terminals. [Key Points of Our IoT Development] ★ We handle board and software development consistently in-house. ★ Leveraging our experience in MAC development, we specialize in iOS application development. - Sensor measurement systems using Bluetooth/Wi-Fi - Development of communication control boards - Development of dedicated control/viewing applications - Data transfer to cloud servers, etc. ◇ We also have numerous achievements in in-house and contract development! Please feel free to consult with us! ◇ ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.
We provide consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.
At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■Example: Sensor measurement system using Bluetooth → Development of Bluetooth communication control board and measurement application (iPad) 1. Collect information from various sensors installed on the machine. Control is performed by the control board. 2. Communicate between the machine and the control board using Bluetooth. Information can be viewed from a dedicated application on a tablet. Measurement results are also automatically sent to terminals in offices, etc. 3. Information such as operational status can be viewed in real-time in offices, etc. Information obtained from various sensors is aggregated. ★ We have many other achievements in both in-house development and contract development! ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.
We provide consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.
At KYOWA Engineering Laboratory, we realize the IoT of devices through the integration of "control boards" and "smartphone applications." ■Example: Development of control boards for measuring sensors and Bluetooth integration with tablets (iPads) for measurement applications. 1. Measure the load capacity of transport vehicles using measuring sensors. 2. Share information from the measurement application via Bluetooth through the communication control board. 3. In offices, capture and aggregate vehicle numbers, loading dates, locations, and quantities. Information on work status and movements can be viewed in real-time. ★ We have many other achievements in in-house development and contract development! ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.
Consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.
At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone apps." ■ Case Study: Production Line Work Recording System 1. Record the work details for factories 1 to 3 individually on each tablet. 2. Save all work records to a single cloud for centralized management of multiple lines. 3. Information from each line can be monitored in real-time. ★ We also have numerous achievements in in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.
We provide consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.
At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■ Case Study: Real-Time Factory Operation Monitoring System Enables management of real-time operational status of each factory from PCs at various locations. 1. Record and manage the operational status of each factory on their respective PCs. 2. Collect records from each factory via the cloud for centralized management. 3. As a security measure, restrict access to devices that can connect to the cloud, preventing information leakage. ★ We also have numerous achievements in both in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.
Introduction of examples such as load measurement sensor Bluetooth control systems and remote monitoring systems for gas facilities.
In our IoT development, we realize the IoTization of devices through "control boards" and "smartphone apps." Furthermore, it is possible to manage information using the cloud, link with in-vehicle information, and connect with health management and advisory services. Based on specific examples, we will introduce in detail what kind of systems are available and how they can be utilized. *Details of the examples can be viewed through the related links. For more information, please feel free to contact us.*
Have you ever struggled with short delivery times? K2 Corporation offers quick turnaround for standard rigid boards, flexible boards, and special boards!
At K2 Corporation, we have all the necessary equipment for circuit board manufacturing, and since we have in-house integrated production, we can naturally accommodate short lead times for standard rigid boards, flexible boards, and special boards. Our thorough deadline management using an in-house production management system ensures that there are no gaps in the intermediate processes, and all products are completed on time. Additionally, as a prototype circuit board manufacturer, we have a large production line capacity, allowing us to finish medium-lot products in a short timeframe as well. For more details, please contact us or download our catalog.
