Substrate Product List and Ranking from 576 Manufacturers, Suppliers and Companies

Kyodo Electronics Co., Ltd. "Company Profile"

For those struggling with heat management, trust the high thermal conductivity and high heat resistance substrates from Kyodo Electronics!

We, Kyoudo Electronics, specialize in thick film printed circuit boards. In product development, we not only design and manufacture according to our customers' requests but also incorporate various software features that give our products unique characteristics. We are fully committed to the development and design of hybrid ICs, focusing on the miniaturization of industrial electronic devices, and we respond to each request individually. Kyoudo Electronics' thick film substrates, born from hardware, have been recognized for their high quality and have received high praise from numerous customers. 【Business Description】 Manufacturing and sales of electronic devices and their components (mainly thick film printed circuit boards) and related services. *For more details, please refer to the catalog available for download. If you have any questions, feel free to contact us.

Company：協同電子
Price：Other

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Aluminum nitride substrate

Introducing a super high thermal conductivity substrate with over 300℃ high heat resistance, approximately 7 times that of alumina substrates!

The "aluminum nitride substrate" is a substrate with a very high cooling effect for mounted components. It can also be patterned with resistors in any shape and can be manufactured as a heat source (high-temperature heater substrate). Long heater substrates that would crack due to thermal expansion on alumina substrates can also be produced. Please contact us when you need our services. 【Features】 ■ High heat resistance (over 300°C) ■ High thermal conductivity (170W/m·K) ■ Low thermal expansion (4.6×10^−6) ■ High solvent resistance ■ High degree of freedom in substrate shape (three-dimensional shapes are also possible) ■ Inorganic material *For more details, please refer to the PDF document or feel free to contact us.

Company：協同電子
Price：Other

Circuit board design and manufacturing
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Alumina substrate

A high thermal conductivity material approximately 70 times greater than FR-4! Introducing a substrate with excellent Q.C.D.

"Alumina substrate" is a common ceramic material used for substrates and has excellent Q.C.D. It is approximately 70 times more thermally conductive than FR-4, providing sufficient cooling effects for mounted components. It is also possible to pattern resistors in any shape, and it can be manufactured as a heat source (high-temperature heater substrate). [Features] ■ High heat resistance (over 300°C) ■ High thermal conductivity (25W/m·K) ■ Low thermal expansion (7.2×10^−6) ■ High solvent resistance ■ High degree of freedom in substrate shape (three-dimensional shapes are also possible) ■ Inorganic material *For more details, please refer to the PDF document or feel free to contact us.

Company：協同電子
Price：Other

Circuit board design and manufacturing
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Film substrate

Ideal for wearable devices! Can be patterned on PET, PI, and stretchable materials.

"Film substrates" are products that can be patterned not only on PET and PI but also on stretchable materials used in wearable applications. It is also possible to pattern silver chloride (AgCl), which can sense the bio-signals emitted by the human body. Additionally, it is possible to pattern resistors in any shape, and they can be manufactured as heating sources (heater substrates). [Features] ■ Can be patterned on PET, PI, and stretchable materials ■ Capable of patterning silver chloride (AgCl) ■ Can be patterned on three-dimensional shapes such as syringes and tubes *For more details, please refer to the PDF document or feel free to contact us.

Company：協同電子
Price：Other

Circuit board design and manufacturing
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Metal substrate

Patterning on screws and metal housings! Dead space can be effectively utilized.

A "metal substrate" is a substrate based on materials such as aluminum and stainless steel. Compared to etching-type metal substrates, it offers high heat resistance (over 300°C) and can be patterned for screws and metal housings. Dead space can be effectively utilized. Additionally, it is possible to pattern resistors in arbitrary shapes, allowing it to be manufactured as a heat source (high-temperature heater substrate). 【Features】 ■ Can be patterned on aluminum, stainless steel, etc. ■ Can be patterned on three-dimensional shapes such as screws and pipes *For more details, please refer to the PDF document or feel free to contact us.

Company：協同電子
Price：Other

Circuit board design and manufacturing
Other metal materials
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TSB circuit board

A meticulous support system from circuit and pattern design to prototyping and mass production within Japan.

We will propose a design based on mass production manufacturing at overseas partner factories, aiming for total cost reduction. Our experienced designers, who are well-versed in electrical characteristics such as digital/analog circuits, impedance, and crosstalk, will provide optimal circuit design using simulations and other methods. Our manufacturing technicians, stationed at each overseas partner factory, will directly manage the manufacturing process and quality, and we will also achieve low-cost supply through strengthened management of production and inspection processes.

Company：ティー・エス・ビー
Price：Other

Printed Circuit Board
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Tokai Shin'e Electronics Industry Single-Sided Circuit Board

We have a variety of products available to meet our customers' diverse needs.

This is a substrate with copper foil on only one side of the paper phenol or glass epoxy insulating board. There is no copper foil on the walls of the holes. (It is produced using the line from the first factory.)

Company：東海神栄電子工業
Price：Other

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FPC (Flexible Printed Circuit)

Leave it to us for anything related to FPC, including small quantities, a variety of products, short delivery times, prototypes, and mass production!

We would like to introduce our domestic factory's response to FPC (Flexible Printed Circuit Board). Our factory features a fully integrated production line for rapid manufacturing. In "Pattern Design," professionals in implementation technology provide pattern designs suitable for the required specifications, while in "Manufacturing Design," we verify all design data before production. Additionally, in our "Manufacturing Line," we produce all types of flexible, rigid boards, and rigid-flex boards in-house. We also provide assembly services for printed boards in-house. 【Features】 ■ Super-fast delivery with an in-house integrated line ■ Supports small lots and a variety of products, accepting orders from a single repeat ■ Cost reduction through efficient manufacturing processes for small lots ■ High reliability achieved with over 20 years of manufacturing know-how ■ Flexibility and responsiveness made possible by a small, elite team *For more details, please refer to the related links or feel free to contact us.

Company：伸和プリント工業
Price：Other

Circuit board design and manufacturing
Printed Circuit Board
Substrate

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High Heat Dissipation Flow Path Substrate

Introducing our product lineup that covers everything from printed circuit board design and manufacturing to component assembly and assembly.

The "High Heat Dissipation Flow Path Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.

Company：アロー産業
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Other machine elements
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Copper core substrate

Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component assembly and assembly.

The "Copper Core Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.

Company：アロー産業
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Other machine elements
Substrate

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Copper bump substrate

Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component assembly and assembly.

The "Copper Bump Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services ranging from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF materials or feel free to contact us.

Company：アロー産業
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Other machine elements
Substrate

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High Current Compatible Board

We propose suitable heat dissipation measures for devices that carry large currents! Introducing a substrate compatible with large currents!

The "High Current Compatible Substrate" is a metal substrate designed to accommodate high-output devices by incorporating thick copper foil into the heat dissipation characteristics of a metal base substrate. We propose suitable heat dissipation measures for devices that carry high currents. 【Features】 ■ Incorporates thick copper foil into the heat dissipation characteristics of the metal base substrate ■ Proposes suitable heat dissipation measures for devices that carry high currents *For more details, please refer to the PDF document or feel free to contact us.

Company：アロー産業
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Other machine elements
Substrate

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Water-cooled flow circuit board

Effective for thermal management of low energy conversion efficiency devices like UV LEDs! Water-cooled flow circuit substrate.

The "Water-Cooled Flow Path Circuit Board" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It directly bonds a water-cooled unit to a metal base substrate, effectively addressing heat issues for low energy conversion efficiency devices such as UV LEDs. 【Features】 ■ Directly bonds a water-cooled unit to a metal base substrate ■ Effectively addresses heat issues for low energy conversion efficiency devices such as UV LEDs *For more details, please refer to the PDF document or feel free to contact us.

Company：アロー産業
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Other machine elements
Substrate

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Multilayer metal base substrate

Introducing a multilayer metal base substrate that supports high-density wiring!

The "Multi-layer Metal Base Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. By laminating double-sided printed circuit boards and multi-layer printed circuit boards onto a metal surface with an insulating layer or a high thermal conductivity insulating sheet, it enables higher density wiring and component mounting compared to single-sided metal base substrates. 【Features】 ■ Metal substrate compatible with high-density wiring *For more details, please refer to the PDF document or feel free to contact us.

Company：アロー産業
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Other machine elements
Substrate

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Metal (copper, aluminum) bump substrate

Direct heat dissipation from the LED's neutral terminal! A substrate with a structure that efficiently releases heat.

The "Metal (Copper, Aluminum) Bump Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It features a structure that directly connects the heat dissipation fins of UV LEDs, high-brightness LEDs, and high-power semiconductors to the metal bump section, allowing heat to escape efficiently. 【Features】 ■ Direct heat dissipation from the neutral electrode of the LED ■ Structure that efficiently dissipates heat *For more details, please refer to the PDF document or feel free to contact us.

Company：アロー産業
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Other machine elements
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Metal base single-sided board

Introducing a printed circuit board with an insulating layer on a metal surface, copper foil arranged, and circuits formed on top!

The "metal base single-sided substrate" is a printed circuit board that has an insulating layer and copper foil on a metal surface, with circuits formed on top of it. The insulating layer includes a glass epoxy prepreg type and a high thermal conductivity insulating sheet tailored to specific applications. It is proposed for thermal management of high-brightness LEDs and high-power semiconductors. 【Features】 ■ Insulating layer and copper foil are arranged on the metal surface, with circuits formed on top ■ The insulating layer includes a glass epoxy prepreg type and a high thermal conductivity insulating sheet tailored to specific applications ■ Proposed for thermal management of high-brightness LEDs and high-power semiconductors *For more details, please refer to the PDF document or feel free to contact us.

Company：アロー産業
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Other machine elements
Substrate

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Fuji Print Industry Electronic Equipment Development

We have accumulated many achievements.

From the development, design, and manufacturing of electronic devices to product commercialization support and even product evaluation and analysis, Fuji Print Industry plays a role in supporting cutting-edge manufacturing.

Company：富士プリント工業
Price：Other

Other machine elements
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Component-integrated board SIMPACT [Reducing dead space for miniaturization!]

Support available from just one piece! A component-integrated board that reduces dead space and achieves miniaturization! Ideal for the miniaturization and integration of printed circuit boards!

Recently, in response to the miniaturization and high density of electronic devices, there is a demand for the miniaturization and integration of printed circuit boards. The technology of embedded substrate, which reduces the surface area for component mounting by embedding components within the circuit board and minimizing dead space, is being sought after. SIMPACT is accepting orders for prototypes of embedded substrates. Please feel free to inquire from just one piece. 【Features】 ■ Components can be mounted at low temperatures and in a short time ■ Reduced load on components due to a dry process that eliminates the need for drilling and copper plating after mounting ■ Technology that connects wiring between different layers at arbitrary positions, enabling the shortest possible wiring formation ■ Vertical embedding allows for the embedding of many chips *For details, please request materials or view the PDF data from the download.

Company：富士プリント工業
Price：Other

Printed Circuit Board
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Printed circuit board "aluminum substrate"

Excellent heat dissipation and heat resistance! A substrate that can also be specified with high thermal conductivity type.

Aluminum substrates have excellent heat dissipation and heat resistance that far surpass the commonly used substrate materials FR-4 and CEM-3. Recently, there has been a significant increase in substrates equipped with high-power LEDs. At Fuji Print Industry, we can create single-sided substrates with a pattern formed by laminating an insulating layer and copper foil on an aluminum-based material, as well as double-sided substrates with a core of aluminum, where an insulating layer and copper foil are laminated to create through holes and form patterns. 【Features】 ○ Excellent heat dissipation ○ Excellent thermal conductivity For more details, please contact us or download the catalog.

Company：富士プリント工業
Price：Other

Printed Circuit Board
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Analog/Digital Application Technology Products Control Sequencer Servo

The sequencer board of KAIKEN that leads the era.

A control board for machine embedding aimed at a wide range of applications. It is designed to minimize wiring compared to conventional control devices and is equipped with highly versatile I/O options.

Company：開研本社
Price：Other

Other process controls
Substrate

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Meito Electric Industry Aluminum Substrate (MX Series)

This substrate is laminated and bonded with an insulating sheet of high thermal conductivity between an aluminum plate and copper foil.

Using this substrate is suitable for applications of printed circuit boards that require heat dissipation due to high current handling and the heat generated by electronic components.

Company：名東電産
Price：Other

LED Module
Substrate

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Lightweight Conductor High Heat Dissipation Substrate "L&H Board"

Achieving lighter weight and higher heat dissipation! Lightweight conductor high heat dissipation substrate using aluminum.

The "L&H Board (Light body and high Heat radiation Board)" is a substrate that achieves lightweight and high heat dissipation by using aluminum. By employing metal conductors, direct soldering for component mounting is possible. It is suitable for applications such as high-brightness LED mounting substrates, automotive substrates (HCV/EV vehicle power substrates), high-current power substrates, various inverter substrates, high-frequency substrates, and solar power generation substrates. 【Features】 - Ensures strong adhesion through proprietary technology - Thickness of core aluminum material and surface aluminum material can be changed - Insulation layers can use both epoxy resin and special resin - Custom manufacturing available according to your needs For more details, please contact us or download the catalog.

Company：名東電産
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Substrate

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Meito Electric Co., Ltd. Company Profile

High technology supporting the industrial society! Meito Electric Co., Ltd. plays a part in that.

Meito Electric Co., Ltd. is involved in the electric and electronic machinery and equipment automotive manufacturing industry, which has undergone significant and diverse transformations. The printed circuit boards and other products handled by Meito Electric have also made great advancements in technology, quality, and quantity. Since its establishment, the company's philosophy in manufacturing has been to "create the best possible products" and to adhere to "quality-oriented" management, which has led to the accumulation of trust from our business partners and stable transactions to this day. 【Business Activities】 - Manufacturing, processing, and sales of printed circuit boards and nameplates - Processing and sales of electrical insulation materials, plastic molded products, and various related materials - Press processing and sales of general metal materials - Processing, assembly, and sales of electrical machinery, automotive parts, and other related components - Manufacturing of precision press molds and jigs, among others For more details, please contact us or download our catalog.

Company：名東電産
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Contract measurement
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Heat dissipation (special) substrate for LED

Heat-dissipating substrates and special substrates available! We develop products tailored to our customers' needs together.

Meito Electric Co., Ltd. is engaged in the development of LED products that are attracting attention as environmentally friendly lighting for the Earth. We offer not only LED lighting suitable for a wide range of applications, such as illuminated signs and indirect lighting for stores, but also various customized LEDs. Additionally, leveraging our expertise in circuit board manufacturing, we also design and manufacture metal heat dissipation substrates. Our company handles heat dissipation substrates, including metal base substrates (such as aluminum base substrates and copper base substrates), as well as substrates for special applications. We are committed to developing products in collaboration with our customers to meet their needs. For more details, please refer to our catalog or feel free to contact us.

Company：名東電産
Price：Other

Circuit board design and manufacturing
LED Module
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If you are struggling with thick copper substrates for inverters, converters, and electric power circuits.

Do you have any requests such as wanting to allow more current to flow than a standard circuit board, wanting to suppress the resulting temperature rise, or not wanting to increase the size of the board?

Do you have any requests such as wanting to flow more current than a standard board while keeping temperature rise to a minimum, or not wanting to increase the size of the board too much? At Meito Electric, as a board manufacturer, we assist in the development of thick copper boards tailored to your needs by considering the line/space during pattern design, the current values flowing through through-holes, selecting copper thickness, and choosing high heat dissipation materials and layer counts. 【Do you have any of the following requests?】 ■ Want to reduce bus bars on the board ■ Want to form power circuits and control circuits on the same board ■ Want to dissipate heat from components to prevent failures 　and more *For detailed information on thick copper, please download the PDF or feel free to contact us.

Company：名東電産
Price：Other

Contract manufacturing
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Technical Support Case: "Operation Display Board"

Introducing a case study related to the control board. Achieved CAN signal analysis and board creation in a short period.

We would like to introduce a technical case related to our operational display board. We received a request from an authorized dealer of imported motorcycles to create a control board for a lamp that displays the condition of the transmission and vehicle speed of a training motorcycle. Since it is a CAN-equipped vehicle, even adding just one lamp would change the current, leading to a judgment of abnormality and causing the engine to stop. Additionally, there was a concern about not being able to allocate much development budget for CAN analysis work. Our company analyzed the CAN signals and completed the control board in a very short period. As a result, we were able to keep the development costs within budget. It was discovered that interrupting the CAN was not easy but possible, and the customer was pleased to see the potential for developing other products. 【Case Study】 ■ Concerns - Since it is a CAN-equipped vehicle, even adding just one lamp would change the current, leading to a judgment of abnormality and causing the engine to stop. - The number of units to be produced is limited to just two for the time being, and the budget is also constrained. - There is a limitation on how much development budget can be allocated for CAN analysis work. ■ Response - Analyzed the CAN signals and completed the control board in a very short period. *For more details, please refer to the PDF document or feel free to contact us.

Company：日本ロック技術センター
Price：Other

Circuit board design and manufacturing
Contract manufacturing
Substrate

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"Thin film metallization" and "thick film metallization" on ceramic substrates.

It is possible to form thick film patterns by screen printing on ceramic substrates and thin film patterns using photolithography.

As the main methods of metallization processing, we can accommodate thick film pattern formation through screen printing, and thin film pattern formation through vacuum deposition, plating, photolithography, and etching. In addition to pattern formation, we can also accommodate VIA filling, resistor formation, and through-hole formation. We will propose the optimal metallization processing to achieve the desired functions and performance. <Processing Specification Examples> - Thin Film Metallization Processing Accuracy: Line/Space = 30μm/30μm Processing Method: Vacuum deposition (sputtering or evaporation) + plating + photolithography (resist formation, exposure, development) + etching Other Processing: Through-hole formation (Φ0.1mm and above) / resistor formation - Thick Film Metallization Processing Accuracy: Line/Space = 100μm/100μm Processing Method: Screen printing Other Processing: VIA filling / resistor formation *For more details, please refer to the catalog or website, or feel free to contact us.

Company：清水商会
Price：Other

Sensors
High frequency/microwave parts
Resistors
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Business Description: Printed Circuit Board Manufacturing

We are committed to manufacturing printed circuit boards with a pattern accuracy of 0.1μm.

The patterns manufactured by our company are formed in a way that closely resembles the originally designed patterns with excellent etching precision. This maintains the original functionality and eliminates issues such as thinning and disconnection.

Company：真成電子産業
Price：Other

Circuit board processing machine
Substrate

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[Information] Reship Electronic Newsletter Vol. 9

We will contribute to your company's SDGs! Through parts procurement, we are striving to promote green procurement and the purchase of generic parts!

This document introduces our company's efforts toward the SDGs. It includes information on the use of Pb-free (lead-free) solder and N2 (nitrogen) in "component mounting," "component procurement," and "compliance with the RoHS directive." We contribute to your company's SDGs. Please take a moment to read it. 【Contents (partial)】 ■ Our company's efforts toward the SDGs ■ Component procurement ■ Component mounting ■ Packaging ■ Compliance with the RoHS directive *For more details, please refer to the PDF document or feel free to contact us.

Company：レシップ電子
Price：Other

Circuit board design and manufacturing
Other packaging materials
Substrate

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Hiraguri Co., Ltd. Business Introduction

Demonstrating strengths in the integrated manufacturing of semiconductor manufacturing and control devices, medical equipment, and electronic devices across multiple fields!

Hiraguri Co., Ltd. provides printed circuit boards, units, and cable assemblies for cutting-edge semiconductor manufacturing equipment and heavy electrical machinery. Various certified technicians carry out the production of high-quality and reliable products based on the "Reliability Improvement Movement." 【Business Activities】 ■ Manufacturing and providing printed circuit boards and power supply units ■ Manufacturing and providing cable assemblies ■ Manufacturing and providing control units, wires, and harnesses *For more details, please refer to the PDF document or feel free to contact us.

Company：有限会社平栗
Price：Other

cable
Circuit board design and manufacturing
controller
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Substrate Product List and Ranking from 576 Manufacturers, Suppliers and Companies | IPROS GMS

Substrate Manufacturer, Suppliers and Company Rankings

Substrate Product ranking