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Substrate - メーカー・企業577社の業務用製品ランキング | イプロスものづくり

更新日： 集計期間:May 06, 2026～Jun 02, 2026
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Substrateのメーカー・企業ランキング

更新日： 集計期間:May 06, 2026～Jun 02, 2026
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  1. 共栄電資 Tokyo//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 null/null
企業ランキングへ

Substrateの製品ランキング

更新日： 集計期間:May 06, 2026～Jun 02, 2026
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  1. Busbar for Data Centers - High Current Board 共栄電資
  2. FPC for the space industry 太洋テクノレックス 本社　和歌山
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  5. 5 CAN/CANFD communication is possible with the sequencer! CANNEX サンプロシステム

Substrateの製品一覧

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Flexible Printed Circuit (FPC) "Long-Length FPC"

Flexible Printed Circuit (FPC) "Long-Length FPC"

Achieving a length of 100m! Introducing a flexible circuit board that can handle long-distance wiring.

The "Long-Length FPC" is a flexible printed circuit board (FPC) that can accommodate lengths of up to 100 meters without seams or folds. In addition to being thin, light, soft, and able to take on various shapes, it achieves wiring lengths comparable to traditional cables. It can be used in large FA equipment and large lighting devices, and is also adopted for wiring in space development equipment such as satellites. 【Features】 ■ Can be used as an alternative to cables ■ Weighs about 1/100th compared to cables, making it lightweight ■ Thickness is approximately 0.1mm at most, allowing for installation in minimal spaces ■ Reduces the likelihood of miswiring compared to cables, improving work efficiency during assembly *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Heat-resistant substrate (FPC) "Heat-resistant FPC"

Heat-resistant substrate (FPC) "Heat-resistant FPC"

An FPC that can withstand continuous use for 1,000 hours at a high temperature of up to 150℃ has been developed.

The "Heat-Resistant FPC" is a heat-resistant substrate (FPC) that excels in heat resistance, allowing for continuous use in high-temperature environments. By leveraging the inherent characteristics of FPC, such as high-density wiring, collective connectivity, and lightweight design, which were previously impossible in high-temperature environments, it contributes to new wiring styles in fields such as medical, lighting, and industrial equipment. 【Features】 ■ Can be used without issues in electrical characteristics even after 1,000 hours at 150°C ■ Maintains adhesion strength of the insulating film ■ Allows for the direct use of conventional FPC design rules *For more details, please refer to the PDF document or feel free to contact us.

  • Board to FPC connector
  • Substrate

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Leave it to us for printed circuit boards! Technology development to meet new market needs.

Leave it to us for printed circuit boards! Technology development to meet new market needs.

Leave it to us for all your substrate needs! We respond to various requests regarding substrates and provide direct support at any stage.

Our company is engaged in technology development with an eye toward the future, collaborating with material and component manufacturers to meet the needs of new technological areas and markets. Leveraging our advanced technological capabilities, we provide products that meet customer needs, ranging from general through-hole substrates to high-density wiring substrates for smartphones, high-frequency support that underpins the evolution of IoT and mobility, heat dissipation solutions that are robust in harsh environments, and flexible substrates. Additionally, we are also developing high heat dissipation high-frequency substrates using a "high-speed thick copper plating method" that contributes to heat dissipation measures for power semiconductors and high heat dissipation high-frequency components. 【Products Offered】 ■ High-density wiring substrates ・ Build-up substrates ・ IVH substrates ・ Any-layer substrates ■ High-frequency support/heat dissipation substrates ■ Flexible substrates *For more details, please refer to the related links or feel free to contact us.

  • Contract manufacturing
  • Substrate

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Complete in-house one-stop solution from development to mass production.

Complete in-house one-stop solution from development to mass production.

Achieve a shorter development period and reduced total costs! Comprehensive in-house support from circuit design, PCB design, PCB manufacturing, component procurement to assembly!

Comprehensive manufacturer of printed circuit boards "Kyoden" will solve your concerns regarding delivery times, prices, and technology in "monozukuri" (manufacturing)! ■ Full support from prototyping to mass production ■ Owns four domestic factories in Tohoku, Nagano, Shizuoka, and Osaka, as well as a factory in Thailand ■ Achieves reliable domestic production and global supply ■ Approximately 5,000 design projects annually ■ Supports various types of boards from single-sided to multi-layer and build-up ■ Equipped with 7 SMT lines, and assembly services are also robust ■ Strengthening facilities in the four domestic factories If you are having trouble with electronic components, please consult with us. We will procure suitable parts from a network of about 300 companies both domestically and internationally. We have four SMD towers, ensuring reliable inventory management. Please contact Kyoden for high quality, low prices, and short delivery times! *For more details, please download the catalog or contact us.

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  • Printed Circuit Board
  • Substrate

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[Free Materials Available!] Can't Ask Now! Build-Up Substrate

[Free Materials Available!] Can't Ask Now! Build-Up Substrate

We will provide a free handbook that covers the basic knowledge of build-up substrates, their benefits, and actual case studies!

Do you know what a build-up substrate is and what advantages it has? Recently, with the trend towards miniaturization of products, there has been an increase in ultra-small components such as ICs and capacitors. The demand for smaller printed circuit boards that accommodate these components is rising, and achieving this requires build-up substrates. Kyoden, which has been manufacturing build-up substrates for over 30 years and continues to accumulate know-how, will introduce the basics of build-up, its advantages, and examples of manufacturing achievements! [Contents] ■ What is a build-up substrate? ■ Features of Kyoden's build-up substrates ■ Introduction of case studies, etc. *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Substrate

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What is a printed circuit board?

What is a printed circuit board?

A clear explanation of the "types," "structures," and "applications" of printed circuit boards!

As represented by 5G, IoT, and AI, the wave of digitalization in society is advancing increasingly, and electronic devices are being used in various fields and for a wide range of applications. The possibilities of printed circuit boards, which are the core components, are limitless. This time, we will clearly introduce the types and structures of printed circuit boards. - What is a printed circuit board? - Types of printed circuit boards - Classification by structure - Expanding areas of activity *For more details, please refer to the related links or contact us.

  • Printed Circuit Board
  • Substrate

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Core System Co., Ltd. 【Comprehensive Catalog】

Core System Co., Ltd. 【Comprehensive Catalog】

Printed circuit board production: "We handle everything from prototypes to mass production!"

Core System Co., Ltd. is a professional printed circuit board service provider in Hong Kong. We would like to introduce our efforts regarding printed circuit board production (from prototyping to mass production).

  • Circuit board design and manufacturing
  • Substrate

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Mount "KE-3010A, KE-3020VA"

Mount "KE-3010A, KE-3020VA"

Next-generation adaptability! A high-speed flexible mounter that responds with high versatility.

The new KE series, which has achieved further evolution, is here. It enables the construction of a flexible, high-speed, high-quality electric line. With laser recognition, it is capable of recognizing various component shapes, from 0402 ultra-small parts to PLCC, SOP, and QFP up to 33.5mm square. Laser recognition is unaffected by variations in component characteristics such as electrode shape and gloss, ensuring stable recognition and mounting. 【Features】 ○ JUKI's unique laser recognition technology boasts high recognition capability and quality ○ Component check function improves mounting quality ○ Independent control of XYΘ axes ○ Full closed-loop control ○ Image recognition possible with laser head (optional for KE-3010) For more details, please contact us or download the catalog.

  • Mounter
  • Substrate

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Mountaineer "RX-6R/RX-6B"

Mountaineer "RX-6R/RX-6B"

High productivity, versatility! High-speed compact modular mounter.

The high-speed compact modular mounter "RX-6R/RX-6B" boasts high productivity with a maximum speed of 42,000 CPH while maintaining versatility to accommodate a wide variety of components, all in a compact size. 【Features】 ○ Space-saving design with a width of 1.25m ○ Standard placement monitor inspection function for achieving even higher quality production * Only compatible with the 6-nozzle head of the RX-6R. Optional for the RX-6B. ○ Optimal line construction according to changes in production items through head replacement ○ High-speed mounting with high-speed non-stop image recognition * Optional for the RX-6B. ○ Compatible with tall components, large components, and large PCBs For more details, please contact us or download the catalog.

  • Mounter
  • Substrate

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Mounting machine "RS-1R" (SMT surface mount)

Mounting machine "RS-1R" (SMT surface mount)

High-speed modular mounter achieving a throughput of 47,000 CPH!

The "RS-1R" is a high-speed modular mounter that achieves a maximum cluster tact of 47,000 CPH. The advanced "Takumi Head" features a height-adjustable recognition sensor, providing optimal line balance and the highest level of throughput. With nozzle traceability functionality and support for large nozzle ATC, it accommodates a wide range of components from 0201 to large irregular parts. 【Features】 ■ High-speed performance with a maximum cluster tact of 47,000 CPH ■ Equipped with the height-adjustable "Takumi Head" ■ Achieves optimal line balance and the highest level of throughput ■ Wide compatibility with components ranging from 0201 to large irregular parts ■ Suitable for LED mounting *For more details, please refer to the PDF document or feel free to contact us.

  • Mounter
  • Substrate

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Gold / Silver / Aluminum / ITO Coated Substrate

Gold / Silver / Aluminum / ITO Coated Substrate

Gold / Silver / Aluminum / ITO coated substrate (slide glass / cover slip / silicon wafer / mica)

Surface plasmon resonance (SPR), microarrays, biosensors, nanotechnology, neurobiology, self-assembled monolayers (SAM), X-ray diffraction (XRD), semiconductors, and a variety of research applications can utilize atomic force microscopy (AFM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), and other electron microscopy techniques. In addition to slide glass, we also offer silicon wafers and mica substrates. The main coatings are gold (Au), silver (Ag), aluminum (Al), and ITO. High-reflectivity gold-coated slides are ideal for observing backscattered electron images (BSE) (10-15 eV) and secondary electron images (SE) (5 eV) using SEM. For backscattered electron images <BSE>, a gold thickness of 10 nm is recommended, while for secondary electron images <SE>, products of 50/100 nm are suggested.

  • Glassware and containers
  • Other inspection equipment and devices
  • Other consumables
  • Substrate

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Power semiconductor substrate (DCB)

Power semiconductor substrate (DCB)

Over 10 years of manufacturing experience for substrates for thermoelectric modules (Peltier elements). For power devices, solid-state relays (SSR), and more!

This is an insulating substrate for heat dissipation, which has a copper circuit board bonded to an alumina ceramic substrate using the DCB (Direct Copper Bond) method. *DCB (Direct Copper Bond) method refers to the technique of bonding a copper circuit board to a ceramic substrate through eutectic reaction. **Features** - Over 10 years of manufacturing experience for substrates used in thermoelectric modules (Peltier elements). - Manufactured at a 100% wholly-owned subsidiary in China. - Options for alumina ceramic white boards from Japan, Germany, or China. - The ceramic substrate can flexibly accommodate various external dimensions through mold processing, laser processing, etc. - The ceramic white board and copper plate are bonded using in-house equipment, and copper plating processes such as etching are applied before shipment. - The surface of the copper circuit can be treated in various ways, including untreated, Ni plating, and Ni + Au plating. *For more details, please contact us or download the PDF.*

  • Printed Circuit Board
  • Other semiconductors
  • Substrate

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[Medical Devices, Healthcare, Development Achievements] Medical (ME) Device Development

[Medical Devices, Healthcare, Development Achievements] Medical (ME) Device Development

Support from prototype development to mass production preparation! We have extensive experience in medical device development.

At ERI, we have responded to various requests so far. Utilizing the manufacturing technologies cultivated through embedded device development, we collaborate with medical device manufacturing and sales companies to support product development for ME devices, from prototype development to preparation for mass production. Please feel free to contact us when needed. 【Features】 ■ Development achievements through collaboration with manufacturing and sales companies - Hardware, software, FPGA, mechanics, harnesses ■ Jig development is also available - Manufacturing inspection equipment (including board FCT) - Manufacturing assembly jig development *For more details, please refer to the PDF document or feel free to contact us.

  • Embedded system design service
  • Substrate

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Substrate "MD"

Substrate "MD"

This is a product that utilizes advanced nano-level polishing and plating technologies!

This product is a substrate used in computer storage devices (hard disk drives). Made from aluminum discs, it undergoes processes such as grinding, electroless nickel-phosphorus plating, mirror polishing, and various characteristic inspections. 【Features】 ■ Manufactured using advanced nano-level polishing and plating technologies ■ Dramatically increases storage capacity *For more details, please contact us or download the catalog.

  • Other Machine Parts
  • Other electronic components and modules
  • Substrate

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Sapphire Wafer

Sapphire Wafer

We consistently carry out everything from crystal growth of single crystal sapphire to cutting, grinding and polishing, PSS processing, GaN epitaxial growth, and special processing!

In the doujin industry, we mainly provide sapphire materials using the Kyropoulos method. Our sapphire substrates are produced in domestic factories as well as through contract manufacturing with reputable overseas manufacturers.

  • others
  • Chip type LED
  • diode
  • Substrate

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Lithium Niobate substrate (LN / LiNbO3)

Lithium Niobate substrate (LN / LiNbO3)

We offer single crystal lithium niobate (LN / LiNbO3) ingots, wafers, and special processing.

Product Name: Single Crystal Lithium Niobate (LN / LiNbO3) Size: Φ2”, Φ3”, Φ4”, Φ6” Orientation: Specifiable Thickness: 250um, 350um, 500um, Specifiable Finish: Single-sided mirror, Double-sided mirror, Others Quantity: 10 pieces or more, Mass production available Manufacturing: Made in Japan, Made in China

  • Wafer
  • Fine Ceramics
  • filter
  • Substrate

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Noise countermeasures in the artwork design of DC/DC converters

Noise countermeasures in the artwork design of DC/DC converters

Introducing an experimental study on "How far can we go in countermeasures against pattern noise on circuit boards?"

With the energy-saving of devices and the low voltage of ICs, the use of DC/DC converters with excellent conversion efficiency is increasing. In recent years, DC/DC converters have become very frequently used due to improvements in several drawbacks, including high performance, high functionality, miniaturization, and reduction of external components. However, to effectively utilize them, it is important to minimize noise generation and reduce the impact of generated noise on other circuits. Therefore, assuming that the selection of peripheral components considering noise has been adequately done, we will verify "how much noise countermeasures can be achieved through substrate patterning" with practical examples. *For detailed content of the article, please refer to the related links. For more information, feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Board design that brings the concept of analog into the digital realm.

Board design that brings the concept of analog into the digital realm.

Introducing specific points of focus such as preventing signal degradation and reflection!

Our company designs boards that bring the concept of analog into the digital realm to achieve high system speeds. We avoid issues such as the discontinuity of inductance in the SMA section, the discontinuity of capacitance mainly in the connector section, and the discontinuity of transmission lines caused by vias and right-angle bends, thereby preventing signal degradation. Additionally, we can propose effective reflection prevention measures while appropriately selecting termination locations and methods to avoid increasing the number of components. [Key Points] - Avoid discontinuities on the board to prevent "signal degradation" - Propose optimal placement and methods for termination to prevent "reflection" - Avoid "crosstalk" - Implement board layouts that do not cause "ground bounce" *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Bear chip implementation

Bear chip implementation

Consistent production from circuit board design to bare chip mounting! Abundant experience with high-difficulty projects.

We provide consistent support from circuit board design to ensure the characteristics of the entire module, rather than just partial implementation work, through wire bonding and flip chip mounting. We possess extensive know-how in the fields of wire bonding and flip chip using bare chips, and we may be able to resolve cases that other companies have declined. We are always mindful of cost and delivery time, and we can assist from the planning stage, so if you are a development manager facing challenges with bare chip mounting, please feel free to consult with us. 【Features】 ■ Support for small lots (from 1 piece) ■ Quick turnaround ■ Capable of mixed mounting with SMT components and leaded components *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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ベアチップ実装＜高難度案件に対応＞

ベアチップ実装＜高難度案件に対応＞

豊富な実績で構想段階からご対応！車載、ハイブリッドIC、液晶ディスプレイなどに

当社では、基板設計から「ベアチップ実装」まで一貫生産を 行っております。 ワイヤボンディングをはじめ、フリップチップ、ダイシング といった高難度案件に対応。 微細素子高密度実装試作や高集積化実装、パッケージ開封による 障害解析などの実例がございます。 【サービスメニュー】 ■ワイヤボンディング ■フリップチップ ■ダイシング ※詳しくはPDFをダウンロードしていただくか、お気軽にお問い合わせください。

  • Circuit board design and manufacturing
  • Substrate

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Circuit board design and pattern design

Circuit board design and pattern design

Guaranteed operation with a single prototype! Proven track record from product planning to design and mass production launch.

Our company specializes in "circuit board design and pattern design." Our circuit designers create boards that reliably function in a single prototype for high-speed circuit boards and analog circuit boards. We have strengths in hardware development and circuit design, honed over many years in the set manufacturing industry. 【Strengths in Circuit Board Design】 ■ Extensive experience in developing analog circuits such as amplifiers and power supplies ■ Expertise in hardware development and circuit design cultivated over many years in the set manufacturing industry ■ Knowledge of pattern design that delivers performance and is resistant to noise ■ Knowledge of measures for signal standards and safety standards ■ Proven track record from product planning to design and mass production launch *For more details, please download the PDF or feel free to contact us.

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  • Circuit board design and manufacturing
  • Substrate

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Power supply unit design and development

Power supply unit design and development

Support for miniaturization, high efficiency, and low noise in design! For servers, inspection, industrial equipment, and more.

In our company's efforts in "Power Supply Unit Design and Development," we propose solutions for noise reduction, heat dissipation measures, optimal component selection, and layout design. We share advanced technologies and product trends in collaboration with semiconductor manufacturers. We also accept prototypes of passive components such as power transformers. Additionally, we have numerous achievements in energy harvesting power supplies, battery-free DC-DC converters, chargers for mobile batteries, and low-current power supplies for lighting. 【Features】 ■ Sharing advanced technologies and product trends in collaboration with semiconductor manufacturers ■ Proposing high-efficiency power units through the application of heat dissipation technologies such as copper inlay substrates ■ Designing with a long product lifecycle in mind and updating to advanced technologies ■ Accepting prototypes of passive components such as power transformers *For more details, please download the PDF or feel free to contact us.

  • power supply
  • Other power sources
  • Substrate

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Heat dissipation substrate

Heat dissipation substrate

Achieving both heat dissipation measures for high-heat-generating components and ensuring transmission characteristics! Application to low-loss materials is also possible.

We create "heat dissipation substrates" that allow for the selection of substrate materials and configurations tailored to specific applications and heat dissipation challenges. Thick copper plated substrates form circuits for heat dissipation from heat-generating components directly to conductors and the back surface of the substrate through copper plating. In metal base substrates, a dielectric (insulation layer) and copper foil are laminated on copper or aluminum, and by connecting to copper or aluminum plates through filled vias, high heat dissipation is achieved. Additionally, we have extensive experience in the mechanical design and manufacturing of various heat dissipation carriers and enclosures, as well as the selection and assembly of heat sinks and TIM materials, allowing us to provide consistent support. 【Application Fields】 ■ High Frequency ■ Automotive ■ Power Modules ■ High Power LEDs ■ Inverters *For more details, please download the PDF or feel free to contact us.

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  • Circuit board design and manufacturing
  • Substrate

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Wireless communication module development

Wireless communication module development

Providing a wide range of applications! Proposing high-frequency design technology and wireless communication know-how.

Our company is engaged in the development of wireless communication modules. We have a wealth of experience in developing various types of wireless communication and can propose wireless media tailored to your applications and requirements. We provide gadgets equipped with wireless communication functions through integration with various sensors. Additionally, we support the essential construction design required for the market launch of wireless communication devices. 【Features】 ■ Extensive experience in developing various types of wireless communication ■ Proposals for wireless media based on applications and requirements ■ Provision of gadgets with wireless communication functions through integration with various sensors ■ Suggestions for energy harvesting technologies such as microcurrent charging and solar panels ■ Support for the essential construction design required for the market launch of wireless communication devices *For more details, please download the PDF or feel free to contact us.

  • Communications
  • Other electronic parts
  • Substrate

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

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