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substrate Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. トリコ 東京支店 Tokyo//Industrial Electrical Equipment
  2. null/null
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 DAIKIN FINETECH, LTD. Nara//Resin/Plastic
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substrate Product ranking

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. Equipment Repair and Lifespan Extension: Trico's Repair Service for Industrial Equipment トリコ 東京支店
  2. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  3. Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Noise countermeasures in the artwork design of DC/DC converters グロース

substrate Product List

1741～1755 item / All 1848 items

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5C-SSM evaluation kit_box

5C-SSM evaluation kit_box

Evaluation kit equipped with an odor sensor, "CEK box"

Evaluation kit consisting of three components: CMOS-type odor sensor "5C-SSM," interface board, and flow path fixture, all housed in a casing. The accompanying software includes automatic setting functions for sensor drive parameters and pixel selection, allowing for simple data acquisition. The CEK box (official name: 5C-SSM evaluation kit_box) is available for purchase starting from one set.

  • O2 sensor evaluation test device
  • Other Sensors

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Introduction of overseas expansion case in West Virginia, USA: Factory expansion and development in Mexico.

Introduction of overseas expansion case in West Virginia, USA: Factory expansion and development in Mexico.

Responding to large new orders! Strengthening the production system for transformer-reactor components and control boards.

We would like to introduce a case where Diamond Electric Holdings (Japan) expanded its business in the automotive and air conditioning markets by establishing a presence in the United States and Mexico. In 2021, the company expanded its subsidiary, Diamond Electric Manufacturing (WV) in the United States, and in 2023, it established a subsidiary in Mexico as a subsidiary of Diamond Electric Manufacturing in the U.S., strengthening the production system from transformer reactor components to control boards. The reason for the expansion is to respond to large new orders from several domestic automobile manufacturers in the U.S. [Case Overview (Partial)] ■ Location: Eleanor, WV ■ Area: 37,000 sqft. ■ Expansion Investment Amount: $3.74 million ■ New Equipment Investment Amount: $18.61 million *For more details, please refer to the PDF document or feel free to contact us.

  • Other Auto Parts

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FSM Adapter Board

FSM Adapter Board

The substrate dimensions are 70×47×1.4mm! A product for the RZ/V2M Evaluation Board Kit.

We would like to introduce the "FSM Adapter Board for RZ/V2M Evaluation Board Kit" that we handle. This product is compatible with the "RZ/V2M ISP Support Package" provided by Renesas Electronics. It allows you to connect FRAMOS sensor modules to the V2M_EVK. Please feel free to contact us if you have any inquiries. 【Features】 ■ Image sensor conversion board for RZ/V2M Evaluation Board Kit ■ Capable of connecting FRAMOS sensor modules to V2M_EVK ■ Compatible with the "RZ/V2M ISP Support Package" provided by Renesas Electronics *For more details, please refer to the PDF document or feel free to contact us.

  • Evaluation Board

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Ultra-low transmission loss substrate (MEGTRON6)

Ultra-low transmission loss substrate (MEGTRON6)

Ultra-Low Transmission Loss Substrate (MEGTRON6)

Design will be conducted using high-frequency substrates and high-speed transmission substrates.

  • others

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Puriken Co., Ltd. - Printed Circuit Board Design Resources and Achievements

Puriken Co., Ltd. - Printed Circuit Board Design Resources and Achievements

Achievements in high-speed transmission lines, analog, and power-related areas! We also introduce CAD tools for design resources.

We would like to introduce our company's "Design Resources and Achievements." We have design achievements in high-speed transmission lines such as USB 3.0, SDI, HDMI, and LAN, as well as analog systems for various sensors, inverter boards for three-phase motors for electric bikes, UPS, and power supplies like AC adapters. Additionally, our design resources include CAD tools "CR-8000 Design Force" and "CR-5000 Board Designer." 【Design Resources (Partial)】 ■ CAD Tools ・CR-8000 Design Force ・CR-5000 Board Designer ・Options *For more details, please feel free to contact us.

  • Circuit board design and manufacturing

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PuriKen Co., Ltd. Free Webinar on Printed Circuit Boards

PuriKen Co., Ltd. Free Webinar on Printed Circuit Boards

Is it still getting smaller? Trends in power electronics technology visible from the disassembly of the power control unit of the new Prius - Miniaturization technology 'busbar' and more.

We will hold a free webinar titled "Is it still getting smaller? Trends in power electronics technology revealed through the disassembly of the new Prius power control unit." In this webinar, we will provide insights into the challenges faced by power electronics engineers and potential solutions. Additionally, we will discuss trends in power electronics miniaturization technology, the effectiveness of front-loading development methods, and how Scideam reduces simulation time (developed by the Smart Energy Research Institute). We will also introduce the combination of printed circuit boards and busbars as a miniaturization technology for high-voltage and high-current printed circuit boards. [Webinar Overview] ■ Date and Time - Day 1: July 16 (Tuesday) 11:00-12:00 - Day 2: July 23 (Tuesday) 11:00-12:00 ■ Organized by - Ryosan Co., Ltd. *For more details, please refer to the related link URL below or feel free to contact us.

  • Printed Circuit Board

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PuriKen Co., Ltd. - A substrate that dissipates heat faster from printed circuit boards.

PuriKen Co., Ltd. - A substrate that dissipates heat faster from printed circuit boards.

A suitable design! We propose a substrate that dissipates the heat from the heating element more quickly.

We would like to introduce our "substrate that dissipates heat faster." With the emergence of high-output power semiconductors, new implementation methods and thermal management strategies are required. From the perspective of printed circuit board manufacturing, we propose a substrate structure that can dissipate heat more quickly. Additionally, we customize the substrate to optimize the arrangement and shape of thermal vias according to usage, allowing for greater heat dissipation. 【Features】 ■ Simple thermal calculations conducted from the perspective of substrate manufacturing ■ Suitable designs presented based on calculation results ■ Proposals for substrate structure and heat dissipation strategies by our technical department *For more details, please download the PDF or feel free to contact us.

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  • Printed Circuit Board

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Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].

Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].

We are currently offering materials that explain the comparison of thermal vias and copper pins in terms of thermal conductivity, as well as the effects of changing the filling materials inside TH.

We are pleased to present materials introducing "substrates that dissipate heat faster." This document provides a detailed comparison of the structural differences between thermal vias and copper pins, noting that while their cross-sections may appear similar, the filling materials inside the thermal vias differ. It also includes information on "high thermal conductivity substrates" and more. The explanations are supported by graphs, tables, and formulas, making the content easy to reference. We encourage you to download it and read through it. [Contents] ■ Structural comparison of thermal vias and copper pins ■ What are high thermal conductivity substrates? ■ Comparison of thermal conductivity between thermal vias and copper pins ■ Effects of changing the filling material in thermal vias *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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