Copper foil cutting substrate
Simplified prototyping of the circuit board! If the conditions are limited, such as a prototype of a prototype and specific verification items, this method is also possible!
The substrate is created by cutting copper foil. There are constraints on pattern width and insulation distance to omit circuit formation in the general printing process, and it is mainly for prototyping purposes. It is effective for shortening delivery times and cost reduction until completion.
- Company:クレバー産業
- Price:Other