[Exhibition Report] We exhibited at NEPCON Japan 2025!
Here is a brief introduction to the successful exhibition content.
<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ ~ Touch, Compare, Experience FPC! ~ ● Comparison of weight between rigid boards and FPC ● Reduction of board area through high-density wiring ● Difference in heat generation temperature due to copper thickness ● Improved work efficiency with transparent FPC, etc. ~ Technology Topics ~ ● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results ● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring ● Pattern via fill FPC... Achieving high-density wiring and pad-on-via ● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ By achieving teaching-less implementation through visual feedback control, eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ TY-VISION XAIS AI-based defect detection and false report reduction ・M111SC (manual machine) high-definition (package) board × high-resolution inspection ・M109SC (manual machine) diverse workpieces × large format
- Company:太洋テクノレックス 本社 和歌山
- Price:Other