We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 561 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors

substrate Product ranking

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社 和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社 和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

541~570 item / All 1884 items

Displayed results

[Exhibition Report] We exhibited at NEPCON Japan 2025!

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆   ~ Touch, Compare, Experience FPC! ~    ● Comparison of weight between rigid boards and FPC    ● Reduction of board area through high-density wiring    ● Difference in heat generation temperature due to copper thickness    ● Improved work efficiency with transparent FPC, etc.   ~ Technology Topics ~    ● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results    ● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring    ● Pattern via fill FPC... Achieving high-density wiring and pad-on-via    ● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆    By achieving teaching-less implementation through visual feedback control,    eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆    TY-VISION XAIS AI-based defect detection and false report reduction     ・M111SC (manual machine) high-definition (package) board × high-resolution inspection     ・M109SC (manual machine) diverse workpieces × large format

  • Printed Circuit Board
  • Visual Inspection Equipment
  • Transport and handling robots
  • substrate

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TTL Exhibition Participation Guide: JPCAShow 2025

Newly developed material.

◆FPC (Flexible Printed Circuit Board)◆    ~Taiyo Techno-Rex's Strengths in FPC Manufacturing Processes~      FPC manufacturing requires multiple critical processing steps.      Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development.      This time, we will introduce the "strengths" we have cultivated over many years in each process!      <Design> Circuit design, artwork, S-parameter analysis      <Layer Connection> Build-up FPC, filled vias, small-diameter vias      <Circuit Formation> MSAP method, thin copper, thick copper      <Insulation Treatment> High precision openings ±20μm, LCP coverlay      <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.)      <Post-Processing> High precision outline processing ±50μm, diverse tools      <Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Materials◆    Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆    Proposals for utilizing FA and collaborative robots

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  • Printed Circuit Board
  • substrate

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[Exhibition Report] We exhibited at JPCAshow 2025!

I would like to briefly introduce the successful exhibition content of FPC.

◎Introducing Our Company's "Strengths" in the Processing Engineering   >> There are multiple important processing steps in FPC manufacturing.     Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development.     We have introduced the "strengths" we have cultivated over many years in each process:      <Design>   Circuit design, artwork, S-parameter analysis      <Layer Connection> Build-up FPC, filled vias, small-diameter vias      <Circuit Formation> MSAP method, thin copper, thick copper      <Insulation Processing> High-precision openings ±20μm, LCP coverlay      <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.)      <Post-Processing> High-precision contour processing ±50μm, a variety of tools      <Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing   >> Normally, there are no opportunities to see anything other than the finished product,     but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing.      *Through-hole drilling, exposure/development, etching, contour processing, etc.

  • Printed Circuit Board
  • Visual Inspection Equipment
  • Transport and handling robots
  • substrate

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FPC - "Technical Information" - Updated September 2025

I would like to introduce the "Technical Information" related to FPC.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

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  • Printed Circuit Board
  • substrate

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【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025

Wakayama's manufacturing opens up the future of space!

【Dates】November 5 (Wed) - 7 (Fri), 2025, 10:00 AM - 5:00 PM 【Venue】Port Messe Nagoya, Hall 1 (Nagoya Port, Kinjo Pier) Special Exhibition: Space Approach EXPO We will be exhibiting at the Wakayama Prefecture booth, No. 40. With our long-standing experience, we strongly support the space industry modules with our FPC small-lot production technology.

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  • Printed Circuit Board
  • High frequency/microwave parts
  • substrate

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[Exhibition Report] We exhibited at NEPCON Japan 2026!

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆FPC (Flexible Printed Circuit Board)◆   ~Touch, Compare, Experience FPC!~    ●Comparison of weight between rigid boards and FPC    ●Reduction of board area through high-density wiring    ●Improved work efficiency with transparent FPC    ●Introduction of black coverlay, etc.   ~Technical Topics~    ●High-frequency compatible FPC / High-frequency analysis measurement... Proposing optimal designs and materials based on analysis results    ●Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring    ●Pattern via fill 4-layer FPC... Achieving high-density wiring and pad-on-via    ●6-layer stack via FPC... High-density wiring with stack via structure   ~Our Initiatives~    ●Introduction of "Space" related business    ●Demonstration of "Leak Detection Device" ◆Various Boards and Ceramic Material Systems◆    Introduction of AI technology, final appearance inspection equipment, and electrical inspection equipment    (Semi-automatic appearance inspection equipment TY-VISION M105SC II) Live demonstration ◆Efficiency and Automation◆    Proposal for utilizing FA and collaborative robots    (Appearance inspection system + ASSISTA = Efficiency) Live demonstration

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  • Printed Circuit Board
  • Cosmetic containers and packaging
  • Pharmaceutical containers and packaging
  • substrate

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Ideal for UV-C sterilization devices! Inverter (board type)

TOZAI's inverter shipment record exceeds 10 million units. Feel free to leave custom orders for sterilization devices to us!

【Domestic Production Inverter Board】 The inverter is essential for the use of ultraviolet sterilization lamps. With the technology and experience cultivated by TOZAI over many years, we will contribute to the development of your sterilization lamp equipment. 【Features】 - Reliable domestic production - A wide range of lineups tailored to various power sources - Flexible support for various customizations such as residual heat processing and non-light detection - Lightweight, energy-efficient, and high luminous efficiency compared to copper-iron stabilizers We also offer a variety of other sterilization lamps and sockets for sterilization lamps. Please feel free to consult with us. We have a rich lineup that supports sterilization lamps from GL4 to GL40 in straight tube starter types. For more details, please feel free to contact us. Please note that the dimensions and electrical characteristics of the fluorescent lamp 30W (FL30) and the sterilization lamp (GL30) differ. *Please check the JIS standards for details. *It is necessary to confirm the matching of the lamp you will use with the inverter (this is not a confirmation of sterilization effectiveness). We have evaluation units available, so please feel free to inquire.

  • Air purifiers
  • Inverter
  • inverter
  • substrate

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Alto Industry Co., Ltd. Company Profile

For reliable electronic circuit boards, trust Alto Industries!

Alto Industrial Co., Ltd. is a company based in Kanagawa Prefecture that designs and manufactures various electronic circuit boards for industrial equipment. Using technical know-how developed over many years in electronic circuit design for major brand products, we create patterns through CAD design and carry out board manufacturing on a fully integrated production line. We provide our customers with the benefits of "domestic in-house production," ensuring high reliability, safety, and quality that pays attention to the finer details characteristic of Japanese craftsmanship. 【Business Description】 ■ Design and manufacture of various electronic circuit boards for industrial equipment *For more details, please contact us or download the catalog.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • substrate

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Substrate procurement

The compatible board types are IVH/BVH boards and via boards with hole filling processing! A wide range of component procurement is possible through unique purchasing.

Our company selects circuit board manufacturing factories with a wide variety of specialties on behalf of our customers and chooses suppliers for components to meet diverse needs. Prototyping parts procurement can be done through purchasing from market inventory. We achieve procurement focused on speed and delivery time for prototypes. The types of circuit boards we handle include IVH/BVH boards and filled via boards, and by managing quality ourselves, we ensure that our customers do not have to worry about it. 【Types of Circuit Boards We Handle】 ■ IVH/BVH boards ■ Filled via boards ■ Impedance matching and inspection-compatible boards ■ Halogen-free, PB-free, Teflon boards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • substrate

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Mountaineer "Z:LEX YSM20WR"

Support for W356 width dual lane implementation in high-speed machines! Introduction of the mounter handled by Masu Shoji.

We would like to introduce the YAMAHA manufactured mount 'Z:LEX YSM20WR' handled by Masu Shoji. We have newly developed the ALF (Auto Loading Feeder) that innovates the replenishment of tape components with skill-less operation. In single lane mode, it standardly supports super-large substrates up to L810×W742, and it can also standardly accommodate super-large substrates with a maximum thickness of 8.0mm and a maximum weight of 10kg. 【Features】 ■ Supports dual lane mounting with a width of W356 for high-speed machines ■ Standardly supports super-large substrates up to L810×W742 in single lane mode ■ Can standardly accommodate super-large substrates with a maximum thickness of 8.0mm and a maximum weight of 10kg ■ Options to improve line operating rates without stopping the machine ■ Non-stop pallet exchange ATS (Auto Tray Sequencer) "sATS30NS" ■ Non-stop feeder bulk exchange system *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • substrate

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Mount "Σ-G5SII"

Reviewing details for further reliability improvement! A mounter that ensures high mounting quality.

We would like to introduce the YAMAHA manufactured mounter 'Σ-G5SII' handled by Masu Shoji. This model has evolved the "1-head solution" that achieves high productivity with two new types of heads, capable of handling ultra-small components such as 0201 (0.25mm x 0.125mm) as well as large components. By expanding the internal buffer size, it reduces transport loss for large PCBs. 【Features】 ■ Capable of handling ultra-small components like 0201 (0.25mm x 0.125mm) to large components ■ Expanded detection range for component holding state ensures high mounting quality ■ Reduces transport loss for large PCBs by increasing internal buffer size ■ Detailed review for further reliability improvement ■ Ensures compatibility with conventional models *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • substrate

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Mountaineer "Σ-F8S"

Introducing a mounter that achieves 150,000 CPH with a compact chassis featuring 4 beams and 4 heads!

We would like to introduce the YAMAHA manufactured mounter 'Σ-F8S' handled by Masu Shoji. It features a rotary head for a one-head solution, achieving speed, versatility, and high operational rates. The variety of parts is up to 80 types, with dimensions of L 1,280 x W 2,240 x H 1,450 mm. 【Features】 ■ One-head solution with a rotary head ■ Achieves speed, versatility, and high operational rates ■ Delivers 150,000 CPH with a compact body using 4 beams and 4 heads ■ Direct drive head that realizes high speed and high precision ■ SL feeder (Super Loading Feeder) that innovates parts supply operations *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • substrate

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Mountaineer "S10"

Pursuit of versatility in setup! A mounter with flexible parts/model compatibility.

We would like to introduce the YAMAHA manufactured mounter 'S10' handled by Masu Shoji. It has enhanced board compatibility and can be expanded for 3D MID mounting. The board dimensions range from a minimum of L50 x W30mm to a maximum of L1,330 x W510mm (standard L955), with a maximum board transport speed of 900mm/sec. 【Features】 ■ Expansion for 3D MID mounting ■ Enhanced board compatibility ■ Flexible component/variety compatibility ■ Setup designed for versatility *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • substrate

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Mountaineer "S20"

The substrate transfer speed is up to 900mm/sec! Introducing a mounter with flexible component/variety compatibility.

The "S20" is a Yamaha-made mounter that enhances substrate compatibility. It features an expansion for 3D MID (three-dimensional molded circuit components) mounting, and it is characterized by its versatility in setup. Additionally, the components that can be mounted include 0201 to 120×90mm BGA, CSP, connectors, and other irregular components (standard 0402 and above). 【Features】 ■ Expansion for 3D MID mounting ■ Enhanced substrate compatibility ■ Flexible component/variety compatibility ■ Versatile setup for general use *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • substrate

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Mountaineer "ALF"

Innovation in parts supply! Introducing YAMAHA's mount with excellent workability.

We would like to introduce the YAMAHA manufactured mount 'ALF' handled by Masu Shoji. The target tape has a width of 8mm and a maximum thickness of 1mm. The mounting width is equivalent to 12mm pitch based on 8mm, and the minimum tape length that can be loaded is 400mm or more. We offer four types of feeders: S (1005), M (1608), L (2012), and LL (3216). 【Features】 ■ Innovation in parts supply ■ Automatic supply of tape components ■ Excellent workability *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • substrate

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Chino Giken Co., Ltd. Business Introduction

For the design and manufacturing of printed circuit boards, contact Chino Giken Co., Ltd.!

Chino Giken Co., Ltd. is a company primarily engaged in the design, manufacturing, and sales of printed circuit boards. We have established a consistent production line capable of handling everything from prototypes to medium-volume production, along with an internal system that guarantees reliable quality and delivery times, earning us high praise from numerous customers. We provide high quality at low cost tailored to our customers' needs. Please feel free to consult us. 【Business Activities】 ■ Design, manufacturing, and sales of printed circuit boards *For more details, please refer to our catalog or feel free to contact us.

  • Contract manufacturing
  • Printed Circuit Board
  • substrate

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Printed Circuit Board Delivery Time and Quality

Leave it to us for aluminum base printed circuit boards, from high heat dissipation types to bendable ones.

We handle aluminum base printed circuit boards. For high heat dissipation, we offer two types: 8W/mk and 5W/mk. We can accommodate delivery times through our in-house integrated line, allowing for quick turnaround on prototypes. Additionally, we also offer rigid-flex boards as an evolved version of the bendable type. Please feel free to contact us with your requests. 【Delivery Times (Excerpt)】 ■ Double-sided boards ・Super express line: 1 night, 2 days ・Express line: 2 nights, 3 days ・Standard line: 3 nights, 4 days or more *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • substrate

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Single-sided build-up metal base printed circuit board

We can accommodate even small quantities! Introducing single-sided build-up metal base printed circuit boards.

We would like to introduce the "Single-Sided Build-Up Metal Base Printed Circuit Board" handled by our technology research institute. We offer a lineup that includes the "Single-Sided 2-Layer Aluminum Base Printed Circuit Board" for power modules and the "Single-Sided 3-Layer Aluminum Base Printed Circuit Board," which can accommodate various layer configurations. Our company is equipped with an in-house VIA plating line, allowing us to handle even small quantities. 【Features】 ■ Capable of handling small quantities ■ In-house VIA plating line fully equipped ■ For power modules (Single-Sided 2-Layer Aluminum Base Printed Circuit Board) ■ Capable of accommodating various layer configurations (Single-Sided 3-Layer Aluminum Base Printed Circuit Board) *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • substrate

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Thick copper double-sided printed circuit board

The copper board thickness is 200μm, and the through-hole plating thickness is 25μm! Introducing our printed circuit boards.

We would like to introduce our "Thick Copper Double-Sided Printed Circuit Board." The substrate is R-1766/1661, and the copper thickness is 200μm (using C1100-1/2H). It features high current capacity and excellent heat dissipation. Additionally, we also offer a "High-Temperature Double-Sided Printed Circuit Board" with high heat resistance and high elastic modulus. 【Features】 ■ High current capacity ■ Excellent heat dissipation *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • substrate

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Multilayer Printed Circuit Board 'Beyond 5G'

Use R-5795(N)/R-5680(N)! Introducing our printed circuit boards.

We would like to introduce our multilayer printed circuit board "Beyond 5G." It uses "H-VLP3," which has a glass transition temperature of 220°C/DMA, a dielectric constant (14GHz) of 3.1, and low roughness copper foil. It features high-speed signal transmission, reduced transmission loss, and excellent through-hole reliability. Please feel free to contact us when you need assistance. 【Features】 ■ High-speed signal transmission ■ Reduced transmission loss ■ Excellent through-hole reliability ■ Excellent heat resistance ■ Lead-free solder compatible *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • substrate

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FMC SATA RAID Multi-Channel Adapter Board

RAID development FMC board, capable of connecting up to 10 SATA HDDs/SSDs.

The 【AB09-FMCRAID】 is an FMC board for RAID development that conforms to the FMC standard and converts high-speed serial channels of HPC (High Pin Count) into up to 10 channels of SATA interfaces. It is compatible with various Xilinx official evaluation boards and is ideal for developing RAID systems using SATA-IP cores.

  • ASIC
  • Board to Board Connectors
  • substrate

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Mark Electronics Co., Ltd. Business Introduction

Technological Innovation & Business Innovation

Mark Electronics Co., Ltd. is a company primarily engaged in the research and development, manufacturing, and maintenance services of medical devices and related measurement instruments. Our company aims to develop innovative new products that create new markets, focusing on "medical and specimen device development," "industry-academia collaborative development," "communication and measurement system development," and "environmental testing of electrical products" as our core business areas. By integrating both development and manufacturing technologies, we provide high-quality services. 【Business Activities】 ■ Development of medical and specimen devices ■ Industry-academia collaborative development ■ Communication and measurement system development ■ Environmental testing of electrical products *For more details, please refer to our catalog or feel free to contact us.

  • Other measurement and measuring equipment
  • Other analytical and testing equipment
  • substrate

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[Examples of Using Mmems Substrates] High Thermal Dissipation Substrate for High Brightness LEDs

A tall copper electrode can be created! The volume of the body has increased, allowing it to handle large currents.

As an example of the use of the "M-MEMS substrate," we would like to introduce the "High Heat Dissipation Substrate for High Brightness LEDs." The LED heat dissipation characteristics are significantly improved by the "M-MEMS substrate." It is possible to reduce the temperature rise by 10 to 40°C compared to conventional methods. Additionally, it can be formed on aluminum nitride, achieving an electrode thickness that allows for high thermal diffusion of 50 to 140 μm. We can also accommodate the special mounting needs of LEDs, so please feel free to consult with us. 【Features】 ■ Capable of handling large currents ■ Can be formed on aluminum nitride with excellent heat dissipation ■ Achievable electrode thickness that allows for high thermal diffusion (50 to 140 μm) ■ Achievable electrode gap that can accommodate narrow pitch LEDs (below 100 μm) ■ Capable of various prototypes, including special electrode structures *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract
  • Other contract services
  • Circuit board design and manufacturing
  • substrate

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"YUSU Glass Tube" achieves a dimensional accuracy of ±0.01!

Achieving a dimensional accuracy of ±0.01 at the same price as standard commercial glass tubes!

The "YUSU Glass Tube" is a first-class borosilicate glass tube manufactured with the same dimensions for both outer and inner diameters as conventional commercially available glass tubes. It is produced using uniquely developed machinery equipped with internal and external diameter measurement sensors, achieving stable quality with dimensional tolerances of ±0.01 for both outer and inner diameters, while maintaining the same commercial price as before. We can freely manufacture outer and inner diameters in increments of 0.1mm that are not available in standard sizes, and we accommodate sales in units of 100 pieces as a standard. 【Features】 ■ Dimensional accuracy ±0.01 ■ Same price as general commercially available glass tubes ■ First-class borosilicate glass tube ■ Easily available for sale in units of 100 pieces ■ Infinite size variations *For more details, please refer to the catalog or feel free to contact us.

  • Glassware and containers
  • Glass
  • substrate

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Automatic Barcode Recognition X-ray Reel Counter 'Assure Pro'

Measure the number of electronic components in the reel, tray, and stick quickly and accurately! A barcode automatic recognition camera has also been added for further automation!

It is an X-ray reel counter. It takes X-ray images of electronic components and counts the remaining quantity. Equipped with a barcode camera inside the device. It automatically captures barcode labels on the surface of the reel and acquires data! 【Features】 ■ Measures the number of components in about 10 seconds ■ Measurement accuracy of 99.9% ■ Counts up to 4 reels simultaneously (up to 7 inches) ■ No prior registration of components required ■ Self-teaching ■ Standard equipped with a label printer ■ Integrates with factory management systems (ERP, etc.) Already integrated with various companies' component towers and storage. 【Self-teaching (automatic component measurement)】 - Automatically recognizes and teaches components not registered in the library, measuring the quantity. - The teaching data used during this process is managed along with the part number, allowing for automatic use of the same teaching data during the next measurement. - Even if components are closely packed, it comprehensively determines the correct quantity based on factors such as size, pitch spacing, and position. *For more details, please refer to the catalog. Feel free to contact us with any inquiries. #Xray #ChipCounter #SurfaceMount #ComponentMeasurement #SMT #SMD #PlacementMachine #Mounter #AutomatedWarehouse #Storage

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  • X-ray inspection equipment
  • substrate

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Substrate "Flat Copper PWB"

Directly mount LEDs onto a copper-based surface!! If you seek heat dissipation, choose 'Flat Copper PWB'.

"Flat Copper PWB" achieves high heat dissipation effectiveness by directly mounting the LED heat dissipation section onto a copper base surface. 【Features】 ■ Direct mounting of the LED heat dissipation section onto the copper base surface ■ High heat dissipation effectiveness (thermal conductivity: 398W/m·k)

  • Printed Circuit Board
  • Other electronic parts
  • LED Module
  • substrate

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Flip chip LED mounting compatible board [Full flat specification without steps!]

The substrate surface features a fully flat design without any steps! It is a substrate compatible with flip chip LED mounting!

The "FLIP CHIP LED PWB" is a product of Shirato Print Wiring Manufacturing Co., Ltd., which engages in the manufacturing of various printed circuit boards, circuit design of printed circuit boards, and assembly of electronic components. The surface of the substrate is designed to be fully flat without any steps, and it supports copper foil thicknesses starting from 105μm. The heat dissipation material can be selected from aluminum or copper. 【Features】 ■ Weather-resistant white ink with a reflectance of over 95% (in the visible light range) ■ Copper foil thickness supports from 105μm ■ Conductors are designed with half-etching specifications for heat dissipation and high current handling ■ Insulation layer thermal conductivity supports over 5W ■ Heat dissipation material can be selected from aluminum or copper *For more details, please request documents or view the PDF data available for download.

  • Printed Circuit Board
  • Other electronic parts
  • substrate

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High Thermal Conductivity Metal Printed Circuit Board Catalog

Our printed circuit boards are widely used in fields such as construction and machinery, as well as in medical devices!

The "High Heat Dissipation Metal Printed Circuit Board Catalog" features a wide variety of printed circuit boards that are actively used in LED lighting, flip chip LEDs, deep ultraviolet LEDs, COB LEDs, and more. Products utilized in fields such as construction and machinery, medical devices, elevators, vehicles and motorcycles, telecommunications, and lighting are presented along with photos and tables. 【Featured Products】 ■ 3D LED PWB ■ Flip Chip LED PWB ■ DEEP UV-LED PWB ■ Flat Copper PWB ■ High Power LED PWB ■ Thick Copper Substrate ■ High Frequency Compatible Substrate *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts
  • substrate

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Shinko Manufacturing Co., Ltd. Business Introduction

A manufacturer of printed circuit boards that conducts all processes from design to mass production and sales in an integrated manner.

Shinko Manufacturing Co., Ltd. is a company primarily engaged in the design, manufacturing, and sales of printed circuit boards. By combining the know-how cultivated over many years with transmission line simulation, we conduct high-quality designs and provide circuit boards that maintain mass production quality from the prototype stage by manufacturing prototypes on a mass production line. Additionally, we respond to fluctuations in our customers' production plans by reorganizing our production schedules, accommodating not only quality but also delivery dates tailored to our customers' requests. 【Business Activities】 ■ Development, design, manufacturing, and sales of electronic circuit boards *For more details, please refer to our catalog or feel free to contact us.

  • Printed Circuit Board
  • substrate

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A rich lineup for communication modules and LEDs! Printed circuit boards.

Filters, capacitors, various devices, lineup for communication modules and LEDs.

We would like to introduce the "Printed Circuit Boards" handled by Shinkou Seisakusho. We offer a lineup including "double-sided printed circuit boards" suitable for filters, capacitors, various devices, and communication modules, as well as "double-sided multi-layer LED circuit boards" and "thin high-density printed circuit boards." Additionally, we also provide "multi-layer printed circuit boards" and "thin high-density printed circuit boards" for LEDs, as well as "cavity printed circuit boards." 【Lineup (excerpt)】 <Applications: Filters, capacitors, various devices, communication modules, etc.> ■ Double-sided printed circuit boards ■ Multi-layer printed circuit boards ■ Double-sided multi-layer LED circuit boards ■ Thin high-density printed circuit boards *For more details, please refer to the PDF materials or feel free to contact us.

  • Wiring materials
  • substrate

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