List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

1201~1260 item / All 5048 items

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For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.

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  • Work gloves

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Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.

Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.

It is suitable for transporting precision machinery and precision components, as well as for sites that require a quiet environment.

  • Other semiconductor manufacturing equipment

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If you are having trouble procuring electrostatic chucks, pin chucks, etc., this is a must-see! We offer high-precision, high-quality ceramic parts produced overseas!

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  • Etching Equipment

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Additional options such as anchor stops and leak prevention pans are available! Introducing features that can be added or modified for safety on the standard model of the mixer!

  • shaker
  • Other semiconductor manufacturing equipment
  • Other painting machines

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Developed high-precision thin-walled seamless pipes with excellent strength and heat resistance. Achieved thin-walled processing with a thickness of less than 100μm, which is difficult to realize with...

  • Other semiconductor manufacturing equipment

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The ultra-thin metal sleeve can be flexed like resin for use and has excellent heat resistance, corrosion resistance, wear resistance, and mechanical strength.

  • Other semiconductor manufacturing equipment

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Significantly improve the thermal conductivity of thin-walled seamless pipes! It is also possible to impart properties such as corrosion resistance and permeability to magnetism due to the characteris...

  • Other semiconductor manufacturing equipment

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Successful practical application of ultra-thin seamless sleeves (thin-walled pipes) made of clad material (multilayer steel)!

  • Other semiconductor manufacturing equipment

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Precision lock nut of the pre-bleeding torque type.

  • Other semiconductor manufacturing equipment

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It is an optical filter that selectively transmits ultraviolet wavelengths (255 nm) while blocking light of other wavelengths (using a substrate from Gohsui Seiko Glass).

  • Other optical parts
  • Sensors
  • Other semiconductor manufacturing equipment

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Thorough Explanation! Added 'Angle Dependence of Optical Thin Film Filters' to the Technical Trend Keywords.

Optical thin-film filters are important optical components designed to transmit and reflect light at specific wavelengths. Optical filters have the troublesome characteristic of "angle dependence," where the transmission and reflection properties change depending on the observation angle and the angle of incidence. This property can be both an advantage and a challenge depending on the usage conditions of the filter. In this article, we will explain in detail the reasons for the angle dependence of optical thin-film filters and its effects, as well as practical considerations and countermeasures. 1. Basics of optical thin-film filters and angle dependence 2. What is angle dependence? 3. Effects of angle dependence and application examples 4. Countermeasures and design considerations for angle dependence A message to designers - from a film manufacturing company For more details, please visit our website.

Finishing can be achieved with a consistent quality without the need for skilled craftsmanship, just like in the buffing process!

  • Wafer processing/polishing equipment

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TiC treatment and TiCN treatment are possible! It can be used under harsher conditions than PVD treatment.

  • CVD Equipment

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Super sonic spraying of water droplets and vapor below 30μm effectively removes stubborn dirt such as cutting oil. Cleaning is possible even in narrow spaces.

  • Other semiconductor manufacturing equipment

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We apply hard DLC (diamond-like carbon) through sputtering, suitable for medical supplies and automotive parts! *Demo tests are currently being conducted.

  • Sputtering Equipment

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DLC film formation (film quality: ta-C domain, surface roughness Ra 0.16 nm, transmittance: 88%) achieved through sputtering, which has had many challenges in the past.

  • Sputtering Equipment

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It is a device that can be transitioned from a pilot line to a mass production line.

  • Sputtering Equipment

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There are five expansion slots, allowing for additional installation of sputter chambers, deposition devices, glove boxes, etc.

  • Sputtering Equipment

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Reduce damage to the substrate by over 60%! Improve film formation speed while maintaining low damage characteristics.

  • Sputtering Equipment

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Announcement of Exhibition at Kansai Metal Japan by Keihin Ramtech

We sincerely thank you for your continued patronage. We are pleased to announce that, following last October, our company will be exhibiting at Kansai Metal Japan held in Osaka. We will showcase the upgraded technologies and lineup of Ramtech, which have been enhanced to withstand the challenges posed by the new coronavirus. We kindly ask for your consideration in visiting us. We look forward to seeing you there.

We have achieved data digitization through our own experience and achievements, along with the cooperation of a specialized manufacturer of chip saws.

  • Wafer processing/polishing equipment
  • Processing Contract

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Would you like to achieve efficiency in repair and maintenance inspection operations and improve customer satisfaction with the core business package "ServAir" for after-sales service?

  • Semiconductor inspection/test equipment

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ServAir Cloud V4.3 has released the "BI Option."

We are pleased to announce the release of the after-sales service core business package, ServAir Cloud V4.3. In V4.3, we will offer a new BI (Business Intelligence) option. You will be able to analyze various data from ServAir and create graphs using the BI tool QuickSight provided by AWS Japan (Amazon Web Services Japan LLC). ServAir's data will be available in a format that can be easily utilized on QuickSight, allowing you to perform data analysis, forecasting, create various graphs, and manage KPIs on your own. This enables you to manage, analyze, and share data tailored to your business goals. V4.3 is scheduled to go on sale on December 15, 2023, and to start shipping on January 26, 2024. Please feel free to contact us for an introduction to the product, including the new features of V4.3.

A screen made using etching processing and metal diffusion bonding technology! Introducing with photos.

  • Processing Contract
  • Etching Equipment

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We provide a wide range of services for precision cleaning, from large semiconductor equipment and components to small parts.

  • Other semiconductor manufacturing equipment

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Microfabrication for glass substrates, optical films, and various high-performance films!

  • Etching Equipment
  • Processing Contract

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We can accommodate various quantities from small amounts to mass production! We offer a wide variety of silica sand.

  • Wafer processing/polishing equipment

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Ideal for processing in areas where tools cannot reach! Capable of deburring and adding radii, among other tasks.

  • Wafer processing/polishing equipment

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It is possible to provide a large frictional force instantaneously! Due to its high volumetric efficiency, it excels in mass production.

  • Wafer processing/polishing equipment

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Polishing power 10 to 15 times that of a rotary barrel! Processing can be done in a short time.

  • Wafer processing/polishing equipment

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Minimal grinding unevenness, minimizing damage to the product, and enabling stable precision barrels!

  • Wafer processing/polishing equipment

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Reproducibility in sample grinding

  • Wafer processing/polishing equipment

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Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.

  • Bonding Equipment

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Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.

  • Bonding Equipment

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Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.

  • Bonding Equipment

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We offer a tabletop manual wire bonder with over 9,000 units in operation worldwide, including wedge bonding tools. Our support system is also robust.

  • Other semiconductor manufacturing equipment

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Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.

  • Bonding Equipment

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Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.

  • Bonding Equipment

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We create tapered capillaries with a constant inner diameter using our unique manufacturing technology.

  • Analytical Equipment and Devices
  • Other machine elements
  • Semiconductor inspection/test equipment

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We will exhibit at the 2024 Japan Proteomics Society Annual Meeting and the 20th Joint Meeting of the Japanese Clinical Proteogenomics Society.

Our company will be exhibiting at the Joint Conference of the 2024 Annual Meeting of the Japanese Proteomics Society and the 20th Annual Meeting of the Japanese Clinical Proteogenomics Society, which will be held at Link Station Hall Aomori from June 26 to 28, 2024. At our booth, we will showcase a complete set of interfaces that enable high-sensitivity measurements using capillary electrophoresis-mass spectrometry (CE-MS). We invite anyone using CE-MS, as well as those who own an MS and are interested in utilizing capillary electrophoresis, to visit our booth.

[Domestic Authorized Dealer] LEVITRONIX Bearingless Pump Achieves liquid delivery performance and control performance that meet the demands of advanced processes!

  • CMP Equipment

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Enhance the supply pressure of pure water within the factory to eliminate pressure shortages! Furthermore, suppress fluctuations in pure water supply pressure to achieve a stable supply of pure water.

  • Other semiconductor manufacturing equipment

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Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!

  • Sputtering Equipment

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Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on resin films and metal foils!

  • CVD Equipment

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For experimental use in companies and university laboratories! A compact slit coater that accommodates various coating conditions and materials, achieving high precision in coating uniformity.

  • Coater

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A compact slit coater (die coater) that flexibly accommodates various coating conditions and materials, achieving high-precision coating uniformity.

  • Coater

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For experimental use in companies and university laboratories! A high-precision and compact slit coater (die coater) that accommodates various coating conditions and materials.

  • Coater

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Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on flat substrates such as glass and metal!

  • CVD Equipment

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It is a manual polishing device for a luminescence spectroscopic analysis apparatus.

  • Wafer processing/polishing equipment

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With a space-saving design, the vacuum pump module can be installed up to 18 meters away from the process module.

  • CVD Equipment

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Achieving high-quality polishing that retains the edge through mechanization.

  • Wafer processing/polishing equipment

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We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves the edge through mechanization.

  • Wafer processing/polishing equipment

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We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves edges through mechanization.

  • Wafer processing/polishing equipment

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We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves edges through mechanization.

  • Wafer processing/polishing equipment

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We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves the edge through automation.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Supports wafers up to φ200mm! This is a plasma CVD system capable of both film deposition and etching.

  • Etching Equipment

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Kyoto, the ever-evolving hub of precision sheet metal! Adapting to flexible manufacturing.

  • 3D CAD
  • Other CAD
  • Wafer processing/polishing equipment

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Samples will be displayed at the exhibition. Improved separation from printed circuit boards! Chemical resistance including organic solvents and alkali.

  • Photomask

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The corresponding pipe sizes are OD 38.1mm to 76.2mm! Introducing our pipe outer surface polishing machine.

  • Wafer processing/polishing equipment

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Non-contact transport of wafers and glass substrates using ultrasound! It's a clean transport technology! No contamination from contact! No contamination risk from air blow!

  • Other semiconductor manufacturing equipment
  • Secondary Cells/Batteries
  • Other conveying machines

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We will provide you with the latest information on "Majesty-DI."

  • Printed Circuit Board
  • Photomask
  • Substrate transport device (loader/unloader)

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Conducting ultra-precision grinding processing for core pins of molds for mobile phone connectors!

  • Wafer processing/polishing equipment
  • Processing Contract

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We provide sapphire components with wide transparency characteristics, hardness, chemical stability, heat resistance, and good thermal conductivity.

  • Etching Equipment

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