List of Bonding Equipment products
- classification：Bonding Equipment
1～45 item / All 176 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
Easy operation! Results such as wire trajectories are displayed visually!
- Bonding Equipment
Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.
- Bonding Equipment
Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.
- Bonding Equipment
A controllable current transducer and frequency that continuously monitors wire deformation.
- Bonding Equipment
Achieving high-quality bonds optimized for automotive powertrains.
- Bonding Equipment
The optimal bonding solution for the aerospace field, which requires high reliability.
- Bonding Equipment
High-precision bonding solutions that meet miniaturization needs.
- Bonding Equipment
Providing the optimal bond for high-brightness LED manufacturing.
- Bonding Equipment
Reliable bonding solutions that support the robustness of industrial robots.
- Bonding Equipment
Bonding solutions that contribute to improving productivity and reducing costs in home appliance manufacturing.
- Bonding Equipment
Providing optimal and high-quality bonding that supports multi-pin configurations.
- Bonding Equipment
Providing the ideal bond for manufacturing high-sensitivity sensors.
- Bonding Equipment
Easily connect copper wire chips with innovative laser heating.
- Bonding Equipment
Easier wedge bonding of copper wire using heating technology.
- Bonding Equipment
Expansion of productivity! The large work area allows for batch processing of multiple devices.
- Bonding Equipment
Providing optimal and high-quality bonds that correspond to high currents.
- Bonding Equipment
Providing bonds that contribute to improving durability in the renewable energy sector.
- Bonding Equipment
Providing optimal and high-quality bonds that support high-speed transmission.
- Bonding Equipment
Providing optimal adhesive for large-capacity bonding for EV batteries.
- Bonding Equipment
An innovative technology that heats the bond, making it easier to wedge bond copper wire.
- Bonding Equipment
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
- Bonding Equipment
Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.
- Bonding Equipment
Processing capacity of 60,000 units per hour. Contributes to quality assurance and productivity improvement by performing six-sided inspections of dies without reducing speed.
- Bonding Equipment
Equipped with two chromatic confocal line sensors. Achieves high-speed and high-precision dual-side thickness analysis at 2×384,000 data points per second.
- Bonding Equipment
Achieves high-resolution 3D optical measurement within a maximum range of 350×350mm². Supports extensive surface analysis with six types of sensor technologies.
- Bonding Equipment
Achieving high-speed processing of over 40,000 units per hour and high precision of less than 5μm. Supports multi-faceted assembly such as face-up and flip chip.
- Bonding Equipment
Achieving a processing capacity of 48,000 units per hour and 100% optical inspection. It robustly supports RFID inlay manufacturing, accommodating various web materials such as paper.
- Bonding Equipment
A method to triple production capacity without expanding the clean room!
- Bonding Equipment
Combining display devices with cover panels and films! Contributes to the enhancement of functionality and design.
- Bonding Equipment
- Processing Contract