List of IT/Network products
- classification：IT/Network
8236～8280 item / All 41010 items
Achievement No. 1: Thermal Analysis Simulation System for Data Centers - A simulation system that enables energy-saving predictions directly usable by DC operations managers.
- Other information systems
TileFlow Japan will exhibit at Data Center Japan 2025.
TileFlow Japan will exhibit at the "Data Center Japan 2025" event, which is held to commemorate the 15th anniversary of the Japan Data Center Association. Date: March 18, 2025 - March 19, 2025 Time: 10:00 AM - 5:00 PM Venue: Tokyo Metropolitan Industrial Trade Center, Hamamatsucho Hall, 4th and 5th floors For more details, please refer to the following URL: https://f2ff.jp/event/dcjapan
Reduces Tx power consumption of Sigfox communication by 45% and Rx power consumption by 33%!
- Communications
A compact and slim design that can be placed anywhere.
- Process Control System
- IC tag reader/writer
Compact desktop RFID reader, easy connection via USB.
- Process Control System
- IC tag reader/writer
Garter-mounted 400MHz band 3λ/4 collapsible element
- Other network tools
SHOUT TS is a compact Iridium beacon receiver equipped with an Iridium SBD modem.
- Other network tools
Despite its ultra-compact design of approximately 0.85 liters, it achieves excellent cost performance.
- Industrial PCs
"File Management Cloud" with a focus on security for businesses.
- Document and Data Management
Supports various peripherals! A fanless industrial embedded computer with excellent expandability.
- Industrial PCs
Easy to carry and usable anywhere! The LCD is designed to be dustproof and splash-proof in accordance with IP54 standards.
- Industrial PCs
Equipped with the 13th generation Intel Core i5-1335U and Core i3-1315U, achieving high performance and low power consumption!
- Industrial PCs
Strengthening the evolving grid, introducing everything from substations to the last mile!
- Industrial PCs
- switch
Introducing the Arm Cortex-A53 quad-core 64-bit computer compatible with LTE/5G and Wi-Fi 6E!
- Industrial PCs
The cellular router and gateway market will reach 2.8 billion USD by 2028.
- Routers, Switches, and Hubs
Equipped with a 400-nit or 1000-nit LCD panel! Excellent screen visibility even under sunlight.
- Industrial PCs
The multi-touch screen uses a projected capacitive method and supports operation while wearing gloves!
- Industrial PCs
Supports a variety of serial interfaces and high-speed IT communication! Enhances network redundancy.
- Industrial PCs
Equipped with Intel Atom x6211E dual-core or x6425E quad-core processor!
- Industrial PCs
Introducing a 10.4-inch multi-interface fanless panel computer!
- Industrial PCs
Introducing a 7-inch multi-interface fanless panel computer!
- Industrial PCs
Sturdy and robust design! Industrial-level durability that can handle dangerous tasks.
- Industrial PCs
8th generation Intel Core processor, IEC-61850 compliant, equipped with 8 gigabit Ethernet ports and 8 to 16 serial ports.
- Industrial PCs
Paperless, CO2 reduction, contributing to the global environment. Real-time process management through the adoption of RFID. Bulk reading by using RFID.
- Production Management System
AMD Ryzen 8000 equipped COM Express Compact Type 6 module: conga-TCR8
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[News] Embedded Technology Blog Japanese Version Volume 10 Released!
The website of Congatec features a blog (in English) by experts in embedded computing and edge computing. The Japanese translations are published periodically on the following site: https://www.incom.co.jp/corporation/custom.php?company_id=4735&custom_page_id=631 The 10th installment is about the conga-TCR8 module equipped with AMD Ryzen Embedded 8000, which won the "Embeddy Award." Check out the highlights of products for edge AI. 【Currently Published Blogs】 1. COM-HPC Mini - Part 1: Size 2. COM-HPC Mini - Part 2: Pinout : 7. COM-HPC Mini - Part 3: Cooling : 10. From an Unsung Hero to an Award-Winning Star: Spotlight on Congatec's conga-TCR8 We hope this will be helpful for your embedded system development and new projects.
[Industrial Temperature Support] SMARC Module with NXP i.MX 95: conga-SMX95
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces New SMARC Module Featuring NXP i.MX 95 Processor Series - Congatec's Module Sets a New Benchmark for Secure Edge AI Applications -
congatec, a leading vendor of embedded and edge computing technology, has announced a new high-performance Computer-on-Module (COM) featuring the NXP i.MX 95 processor, further expanding its portfolio of modules equipped with low-power NXP i.MX Arm processors. This symbolizes congatec's strong partnership with NXP. Customers can leverage a scalable and reliable upgrade path for existing or new energy-efficient edge AI applications with stringent security requirements. For the full press release, click here: https://bit.ly/3WppVEY
Carbon fiber high thermal conductivity sheet that eliminates thermal resistance to the utmost limit.
- Industrial PCs
- fiber
- Embedded Board Computers
3.5-inch application carrier board for COM-HPC Mini module: conga-HPC/3.5-Mini
- Embedded Board Computers
- Microcomputer
- Other electronic parts
Micro-ATX application carrier board for COM-HPC Server: conga-HPC/uATX-Server
- Embedded Board Computers
- Microcomputer
- Other electronic parts
Application-ready COM-HPC Client with implemented hypervisor and OS: conga-aCOM/cRLP
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces Partnership with Canonical - Providing the Best Ubuntu Pro Experience on Congatec's aReady.COM
congatec, a leading vendor of embedded and edge computing technologies, has announced a partnership with Canonical, the provider of Ubuntu. This partnership will enable congatec to offer the best out-of-the-box experience by bundling Ubuntu Pro with aReady.COM for optimized platforms that provide security, reliability, and stability. Designers across all industries are seeking greater agility, reduced time to market, and lower development costs to respond to an unprecedentedly accelerating innovation cycle and to gain a competitive edge in the market. congatec addresses these needs by providing aReady.COM as a fully validated complete package, including workload integration and layers of OS and functional software, to ensure seamless incorporation into applications for equipment manufacturers. Read the full press release here: https://bit.ly/3Z8c33h
Application-ready COM-HPC Mini module with implemented hypervisor and OS: conga-aCOM/mRLP
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces Partnership with Canonical - Providing the Best Ubuntu Pro Experience on Congatec's aReady.COM
congatec, a leading vendor of embedded and edge computing technologies, has announced a partnership with Canonical, the provider of Ubuntu. This partnership will enable congatec to offer the best out-of-the-box experience by bundling Ubuntu Pro with aReady.COM for optimized platforms that provide security, reliability, and stability. Designers across all industries are seeking greater agility, reduced time to market, and lower development costs to respond to an unprecedentedly accelerating innovation cycle and to gain a competitive edge in the market. congatec addresses these needs by providing aReady.COM as a fully validated complete package, including workload integration and layers of OS and functional software, to ensure seamless incorporation into applications for equipment manufacturers. Read the full press release here: https://bit.ly/3Z8c33h
Multi-edge device for secure IoT connectivity: conga-connect
- Other embedded systems (software and hardware)
The revenue from connected care in North America is expected to reach 60 billion USD by 2028.
- Other operation management software
[AI Compatible] COM Express Compact Type 6 with Intel Core Ultra: conga-TC700
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Releases COM Express Compact Module Featuring New Intel Core Ultra Processor - Next-Generation AI Computing for the Edge
Congatec will release the latest COM Express Compact module equipped with Intel Core Ultra processors. The new module, featuring a unique combination of heterogeneous computing engines including CPU, GPU, and NPU, is ideal for executing AI workloads in demanding edge environments. For the full press release, click here: https://bit.ly/3RwQap4
The installed base of FM systems will reach 27.6 million units by 2028.
- Other operation management software
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Here are seven considerations for implementing industrial network security!
- Firewall and intrusion prevention
COM Express with 13th generation Intel Core, featuring excellent shock resistance and vibration resistance, suitable for industrial temperature applications: conga-TC675r.
- Embedded Board Computers
- Microcomputer
- Other electronic parts
AI-enabled, TI TDA4VM equipped SMARC module: conga-STDA4
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec announces a new SMARC module equipped with TI Jacinto 7 TDA4x and DRA8x processors - processing high-end edge AI and vision with ultra-low power consumption.
Congatec, a leading vendor of embedded and edge computing technology, has announced the release of its latest SMARC computer-on-module featuring TI Jacinto 7 TDA4x or DRA8x processors. These new industrial-grade computer-on-modules are equipped with dual Arm Cortex-A72 processors and powerful AI accelerators, as well as 3D graphics, making them ideal for ultra-low power high-performance AI edge applications. The conga-STDA4 module consumes only 5 to 10 watts, targeting areas such as automated guided vehicles (AGVs) and autonomous mobile robots (AMRs), as well as industrial vehicles that require near-field analysis using 2D/3D cameras, radar, and LIDAR, including construction and agricultural machinery. Additionally, it is suitable for vision-focused industrial automation and medical solutions that require powerful and energy-efficient AI processing at the edge.
13th Generation Intel Core equipped COM-HPC Mini Size Module: conga-HPC/mRLP
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Welcomes Approval of COM-HPC 1.2 Standard with Addition of COM-HPC Mini - Achieving Maximum Performance in a Compact Size -
congatec, a leading vendor of embedded and edge computing technology, welcomes the approval of the COM-HPC 1.2 standard by PICMG, which includes the newly added COM-HPC Mini form factor. This new standard delivers high performance in a compact form factor of just 95mm x 70mm. Even devices with limited space can take advantage of the excellent bandwidth and interfaces of COM-HPC, such as PCIe Gen 5 and Thunderbolt. For the full press release, click here: https://bit.ly/3LWZlgJ
13th/14th Generation Intel Core equipped COM-HPC Client Size C Module: conga-HPC/cRLS
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces New Carrier Board Design Training Program - Accelerating the Acquisition of Technical Knowledge -
congatec, a leading vendor of embedded and edge computing technology, has announced a new carrier board design training program to share best practices for design methods using state-of-the-art computer-on-modules such as the COM-HPC and SMARC standards. The goal is to enable system architects to quickly, easily, and efficiently delve deeply into the design rules of these PICMG and SGET standards. This training course will explain the fundamentals of design for all mandatory and recommended items of the standards, and by providing best practice schematics for computer-on-module carrier boards, it will allow developers to efficiently start their own carrier board design projects. The focus is on designing carrier boards that comply with the standards, allowing participants to learn about the essential interoperability, scalability, and durability needed to build custom embedded computing platforms. The target audience includes developers from OEMs, VARs, and system integrators.
13th Generation Intel Core equipped COM-HPC Client Size A Module: conga-HPC/cRLP
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces New Carrier Board Design Training Program - Accelerating the Acquisition of Technical Knowledge -
congatec, a leading vendor of embedded and edge computing technology, has announced a new carrier board design training program to share best practices for design methods using state-of-the-art computer-on-modules such as the COM-HPC and SMARC standards. The goal is to enable system architects to quickly, easily, and efficiently delve deeply into the design rules of these PICMG and SGET standards. This training course will explain the fundamentals of design for all mandatory and recommended items of the standards, and by providing best practice schematics for computer-on-module carrier boards, it will allow developers to efficiently start their own carrier board design projects. The focus is on designing carrier boards that comply with the standards, allowing participants to learn about the essential interoperability, scalability, and durability needed to build custom embedded computing platforms. The target audience includes developers from OEMs, VARs, and system integrators.
13th Generation Intel Core equipped COM Express Compact Type 6 module: conga-TC675
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces New Carrier Board Design Training Program - Accelerating the Acquisition of Technical Knowledge -
congatec, a leading vendor of embedded and edge computing technology, has announced a new carrier board design training program to share best practices for design methods using state-of-the-art computer-on-modules such as the COM-HPC and SMARC standards. The goal is to enable system architects to quickly, easily, and efficiently delve deeply into the design rules of these PICMG and SGET standards. This training course will explain the fundamentals of design for all mandatory and recommended items of the standards, and by providing best practice schematics for computer-on-module carrier boards, it will allow developers to efficiently start their own carrier board design projects. The focus is on designing carrier boards that comply with the standards, allowing participants to learn about the essential interoperability, scalability, and durability needed to build custom embedded computing platforms. The target audience includes developers from OEMs, VARs, and system integrators.
COM-HPC Server Size D module with Intel Xeon D-2700/2800: conga-HPC/sILH
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec expands the modular edge server ecosystem with μATX server carrier boards and new COM-HPC server-on-module featuring the latest Intel Xeon processors.
congatec, a leading vendor of embedded and edge computing technology, has expanded its modular edge server ecosystem. The new products include a server carrier board in the μATX form factor and a COM-HPC server-on-module featuring the latest Intel Xeon D processors (Ice Lake). The new μATX server board for COM-HPC modules is designed for compact real-time servers used in edge applications and critical infrastructure. Along with the new product modules equipped with the latest Intel Xeon D-1800 and D-2800 processors, a space-saving, robust design that meets high-performance requirements is provided on the μATX platform, ready for immediate application use. For the full press release, click here: https://bit.ly/4appdeG
The shipment of telematics hardware for the aftermarket and OEM is expected to reach 116 million units in 2023.
- Other embedded systems (software and hardware)