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Substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

  1. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. null/null
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

  1. Understand in 3 minutes! Solder Resist Formation Technology [Materials Provided] プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm] 共栄電資
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

Substrate Product List

991～1020 item / All 1922 items

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Glass substrate

Glass substrate

Glass substrate

【Features】 The glass substrate not only has excellent transparency but also exhibits minimal warping and dimensional changes, resulting in superior flatness. It has high stability in material coefficients such as dielectric constant, excellent chemical resistance and heat dissipation, and is a cost-effective and easy-to-handle product that offers high precision and performance compared to ceramic substrates. Additionally, by using thin-film metal formation technology for circuit formation, not only the substrate but also the circuit itself achieves high smoothness, making it optimal for high-frequency signal transmission. For these reasons, our company believes that glass substrates are the leading candidates for next-generation high-performance substrates. 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓 For more details, please refer to "Contact Us" and "Catalog Download." 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓

  • Printed Circuit Board
  • Substrate

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3D metal substrate, flexible heat dissipation substrate

3D metal substrate, flexible heat dissipation substrate

Industry first! We can manufacture bendable metal substrates!

Curved lighting substrates, LED lighting, and light source substrates that match the casing and design are optimal. It is possible to bend a single substrate to fit the curves of automotive and scooter turn signals and tail lamps. The basic specifications as a heat dissipation substrate are equivalent to those of standard aluminum substrates, with the added performance of being bendable, making it the latest metal substrate.

  • Printed Circuit Board
  • Substrate

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Insulated substrate

Insulated substrate

This is a high heat dissipation, high insulation metal substrate that achieves "thin film high insulation" by applying a 20μ thick layer of Nippon Paint's "Insulid" using ED electrophoretic coating.

Insulreed is applied to the base metal plate during the bath to form an electroplated coating, creating an insulation layer. The 20μ thick Insulreed insulation layer has an insulation performance of over 5kV and is the highest specification resin layer for thin film high insulation. On top of the insulation layer, circuits can be low-temperature fired with a highly conductive paste, allowing all processes to be completed through printing. Since it does not require treatment with strong acids or strong alkalis involved in substrate manufacturing, it is possible to directly print circuits onto die-cast molded products or heat sinks exceeding 200mm in height as an integrated heat dissipation substrate. As everything is manufactured using printing methods, it is also an eco-friendly substrate that is gentle on the environment.

  • Printed Circuit Board
  • Substrate

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Substrate "High Heat Resistance and High Thermal Conductivity Insulating Resin Substrate"

Substrate "High Heat Resistance and High Thermal Conductivity Insulating Resin Substrate"

A DBC alternative substrate ideal for applications such as power device circuit boards and high-brightness LED boards!

The substrate is a metal base substrate made of high heat-resistant and high thermal conductivity resin. It is mainly used for power device circuit substrates and high-brightness LED substrates. The substrate consists of copper foil with a thickness of 18μm to 800μm, an insulating layer, and a base metal. 【Features】 ■ Uses high heat-resistant and high thermal conductivity resin ■ Suitable for power devices *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Special Printed Circuit Board "Metal Substrate"

Special Printed Circuit Board "Metal Substrate"

Metal materials can be selected from aluminum and copper! Utilizing thermal conductivity to enhance thermal diffusion.

A "metal substrate" is a printed circuit board that enhances thermal diffusion by utilizing the thermal conductivity of metal. Metal materials can be selected from aluminum or copper, and when using a copper core substrate, through-hole conduction with the copper core is also possible, allowing for applications such as ground and thermal conduction through-holes. As a common heat dissipation method, metal base substrates dissipate heat through the base metal on the back via heat sinks or enclosures, while metal core substrates can be mounted on the circuit side of the board or machined to expose the base metal, allowing contact with heat sinks or enclosures for heat dissipation. 【Features】 ■ Enhances thermal diffusion by utilizing the thermal conductivity of metal ■ Two types: metal base substrate and metal core substrate ■ Metal materials can be selected from aluminum or copper ■ Through-hole conduction with the copper core is possible when using a copper core substrate *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • Substrate

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Special Printed Wiring Board "Mirror Cavity Substrate"

Special Printed Wiring Board "Mirror Cavity Substrate"

We will solve all the problems related to the decrease in reflectivity due to aging degradation and countermeasures against sulfide!

The "Mirror Surface Cavity Substrate" is a substrate that achieves sulfurization countermeasures and high reflectivity. It eliminates the need for silver plating, preventing the occurrence of reflectivity reduction due to sulfurization. Furthermore, the circuit improves bonding performance through gold plating, achieving a stable reflectivity of 95%. 【Features】 ■ Achieves sulfurization countermeasures and high reflectivity ■ No need for silver plating ■ No occurrence of reflectivity reduction due to sulfurization ■ Improved bonding performance through gold plating in the circuit ■ Stable reflectivity of 95% *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • Substrate

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Special Printed Wiring Board "Iron Base Substrate"

Special Printed Wiring Board "Iron Base Substrate"

Low thermal expansion iron-based substrates can be manufactured! We support everything from quick-turn prototypes to mass production.

The "iron-based substrate" is an optimal substrate for preventing solder cracks in ceramic packages and other applications due to its low thermal expansion. Iron-based substrates with low thermal expansion can be manufactured. The metal part features an 8μ high thermal conductivity resin coating on both sides, significantly improving voltage resistance and rust prevention. We can accommodate everything from short lead-time prototypes to mass production, so please feel free to contact us. 【Features】 ■ Iron-based substrates with low thermal expansion can be manufactured ■ Insulation layer: Thermal conductivity 2W/mk ■ Base metal: Iron PCM (pre-coated metal) adopted ■ Ideal for preventing solder cracks in ceramic packages and other applications ■ Support from short lead-time prototypes to mass production *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • Substrate

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Flat Cable Checker "KE8001"

Flat Cable Checker "KE8001"

Simple Cable Checker: A checker specialized for testing crimp-type flat cables. *Focused only on necessary functions to achieve a low price.

A cable checker that simplifies inspections such as checking the connections of pressure-welded cables and harnesses. We keep the price down by narrowing down the compatible connectors. It is intended for use as a simple harness checker. Existing harness checkers are multifunctional but expensive, and many responsible individuals may find it troublesome to purchase due to unnecessary connectors or functions. In such cases, this harness checker allows for efficient checks with only the minimum necessary functions. *The types of connectors can be changed according to your preferences, so please feel free to contact us. *This product is not RoHS compliant.

  • サブ写真.JPG
  • cable
  • Testing Equipment and Devices
  • Image Processing Equipment
  • Substrate

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Introduction of high-performance FPC made in China

Introduction of high-performance FPC made in China

Flexible printed circuit boards with high quality and technology achieved at low prices through guidance from a Japanese team.

Strict calibration of equipment and completion of UL certification for materials. Suzhou Zhengxin Electronic Technology Co., Ltd. maximizes the above features to provide customers with both "Japanese standard" quality and responsiveness, as well as "Chinese standard" pricing. ＝＝＝＝＝You can also view samples of FPC in the electronic book below＝＝＝＝＝

  • Other semiconductors
  • Substrate

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Printed circuit board (for DIY amplifiers, etc.) T-AMP01/02

Printed circuit board (for DIY amplifiers, etc.) T-AMP01/02

This is a convenient printed circuit board! (Can be used for DIY amplifiers, etc.)

○ Ideal for situations such as "a little gain is lacking" or "wanting to convert impedance due to equipment constraints" in the production of measurement and control devices and systems. High-performance operational amplifiers that meet these demands. ○ Four types of lineup according to application: ・T-AMP01/T-AMP01B Typical amplifier circuit board using a single OPAMP stage. ・T-AMP02/T-AMP02B Typical amplifier circuit board using a two-stage OPAMP. ○ Custom-made options are also available.

  • Printed Circuit Board
  • Substrate

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Printed circuit board (for DIY amplifiers, etc.) T-AMP03/04/05

Printed circuit board (for DIY amplifiers, etc.) T-AMP03/04/05

This is a convenient printed circuit board! (Can be used for DIY amplifiers, etc.)

○ Ideal for situations such as "a bit more gain is needed" or "want to convert impedance due to equipment constraints" in the production of measurement and control devices and systems. High-performance operational amplifiers that meet these requirements. ○ Three types of lineup according to application: [T-AMP03] Amplifier circuit board with output buffer for output current enhancement. [T-AMP04] OPAMP single-stage amplifier circuit, dual-channel board. [T-AMP05] Amplifier circuit board with input buffer for increased input resistance and reduced noise. ○ Board dimensions: 74×43×1.6mm ○ Mounting holes: φ3.4×6 ○ Mounting hole pitch: 54×33mm ○ Custom-made options are also available.

  • Printed Circuit Board
  • Substrate

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Printed circuit board (for DIY amplifiers, etc.) T-AMP08/T-AMP-PS

Printed circuit board (for DIY amplifiers, etc.) T-AMP08/T-AMP-PS

This is a convenient printed circuit board! (Can be used for DIY amplifiers, etc.)

○ Ideal for situations such as "a little gain is lacking" or "I want to change the impedance due to equipment constraints" in the production of measurement and control devices and systems. High-performance operational amplifiers that meet these requirements. ○ Two types available according to application: [T-AMP08] 12dB or 18dB/OCT LPF or HPF board [T-AMP-PS] Power supply board ○ Board dimensions: 90 (or 74) × 43 × 1.6 mm Mounting holes: Φ3.2 × 6 Mounting hole pitch: 54 × 33 mm, etc. ○ Custom-made options are also available.

  • Printed Circuit Board
  • Substrate

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Would you like to start in-house production of implementation jigs?

Would you like to start in-house production of implementation jigs?

Easily, quickly, and at low cost, anyone can create implementation jigs! Strongly supports reducing manufacturing costs and shortening delivery times.

"Meister" is a manufacturing system for assembly jigs that strongly supports the reduction of lead times and costs in the jig creation process. By collaborating with "MeisterCAM," it enables in-house production of high-precision jigs with easy operation. It achieves in-house production of jig manufacturing, which is required for high precision, ease of operation, and applicability in production sites, while reducing assembly costs. Additionally, we will be exhibiting at the 38th "Internepcon Japan Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight. We sincerely look forward to your visit. 【Features】 ■ In-house production of assembly jigs and parts ■ Abundant processing materials ■ High safety and clean environment ■ Quick creation of processing data *For more details, please refer to the PDF materials or feel free to contact us.

  • Assembly Jig
  • Processing Jig
  • Other mounting machines
  • Substrate

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Component Mounting Data Creation Support System 'PC-MountCAM'

Component Mounting Data Creation Support System 'PC-MountCAM'

Subscription plan has also started! Available with support for the latest version for 3 months or 1 year.

★We have launched a subscription plan! With support included, you can use the latest version for 3 months or 1 year. You can reduce initial costs, and managing the increase or decrease of licenses is also easy. 'PC-MountCAM' is a system that streamlines component mounting operations. By inputting CAD information (Gerber data, component placement coordinates, bill of materials) output in various formats, information can be quickly disseminated to mounters, manual assembly, inspection processes, and more. In particular, it can significantly shorten the setup man-hours for component mounting drawings and specifications. Additionally, we will be exhibiting at the 38th "Internepcon Japan Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight. We sincerely look forward to your visit. 【Examples of features included】 ■ Conversion of mounting data and bill of materials ■ Creation of mounting quick reference tables ■ Creation of mounting drawings ■ Component mounting guides ■ Creation of mounting data ■ Support for component inspection *For more details, please refer to the PDF materials or feel free to contact us.

  • Other CAM related software
  • Other production management systems
  • Substrate

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"Total support for setup work at the implementation site" PC-MountCAM

"Total support for setup work at the implementation site" PC-MountCAM

Achieving a dramatic improvement in work efficiency! Introduction of a component mounting data creation support system.

"PC-MountCAM" is a component mounting data creation support system that provides total support for setup tasks at the assembly site. It is a new concept platform centered around component mounting data, achieving significant reductions in setup time, suitable work support for on-site workers, and digitization of data, leading to remarkable improvements in work efficiency. Work instructions for each process directed at on-site workers can be created in a short time, and the created work instructions can be displayed on tablets or monitors using a dedicated viewer. Additionally, we will be exhibiting at the 38th "Internepcon Japan Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight. We sincerely look forward to your visit. 【Features】 ■ Board image display function ■ Mounting data and Bill of Materials (BOM) conversion function ■ Assembly drawing creation function ■ Component expert library *For more details, please refer to the PDF materials or feel free to contact us.

  • Other production management systems
  • Substrate

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Bidirectional isolation converter board

Bidirectional isolation converter board

It is a rack-mountable size with an built-in isolation transformer.

The bidirectional insulated converter board is designed to accommodate rack mounting and includes an integrated isolation transformer. Additionally, various customizations in shape and other specifications are possible. We can support everything from circuit and mechanical design of power electronics products to component design, such as copper bars, and the final completion of the product. For more details, please download the catalog.

  • converter
  • Substrate

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Foresight Various Glass Substrates

Foresight Various Glass Substrates

We have a variety of glass available.

We accommodate various sizes and processing methods such as cutting, rounding, single-sided polishing, double-sided polishing, drilling, film formation, chemical etching, and frosting, according to your requests.

  • Touch Panel
  • Substrate

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Electrode substrate for FPD (Flat Panel Display)

Electrode substrate for FPD (Flat Panel Display)

High-precision pattern processing of various metal films.

■High-precision pattern processing of various metal films such as ITO, Cr, Al, Ti, Mo, Ni, Ag, etc. ■Pattern processing on color filters. ■Processing up to insulating films and ribs. →Please contact us if you are considering mass production. We will provide detailed materials and information.

  • Other processing machines
  • Substrate

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Foresight Inc. FPC Product Catalog

Foresight Inc. FPC Product Catalog

A wide range of FPC products available!

This catalog features FPC products from a company that develops businesses related to components and materials for FPD, as well as equipment-related businesses. It includes a wide range of products such as "single-sided FPC," which is ideal for applications like the drive units of inkjet printers and RFID antennas, as well as "double-sided FPC" and "multi-layer (MULTI)" options. [Contents] ■Flexible Printed Circuit Board ■Basic Specifications *For more details, please contact us or download the catalog.

  • Other electronic components and modules
  • Electronic Components
  • Substrate

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FPC "Multi-layer (MULTI)"

FPC "Multi-layer (MULTI)"

It's perfect for Mobile Connector and more!

This product is a multi-layer Multi specification FPC suitable for recent trends in high density, high functionality, and lightweight design. We offer two types in our lineup: "4 Layer" and "5 Layer," tailored to various applications. Additionally, our company provides high-quality and cost-effective components and materials required for electronic displays, including LCDs, OLEDs, and touch panels, both domestically and internationally, including automotive applications. Please feel free to contact us for inquiries. 【Features】 ■ Supports high density, high functionality, and lightweight design ■ Multi-layer Multi specification *For more details, please contact us or download the catalog.

  • Other electronic components and modules
  • Electronic Components
  • Substrate

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FPC『RIGID FPCB』

FPC『RIGID FPCB』

FPC with a structure that has both Rigid and Flexible properties!

"RIGID FPCB" is a type of FPC that combines the characteristics of Rigid (hard) and Flexible (soft), making it easy to implement SMD (Surface Mount Device) components. It is suitable for applications requiring high connection reliability between circuit boards. Additionally, we offer two types of lineups to suit different applications. Please feel free to contact us. 【Features】 ■ Combines Rigid (hard) and Flexible (soft) characteristics ■ Ideal for inter-board connection applications *For more details, please contact us or download the catalog.

  • Other electronic components and modules
  • Electronic Components
  • Substrate

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Window substrate for laser optics

Window substrate for laser optics

Laser quality window substrate

We supply high-performance windows for high-power lasers. Substrate material: UV-grade fused silica, BK7 Effective diameter: 85% of the center Surface accuracy: Scratch dig: 10-5 Surface flatness: λ/10 @ 633nm within effective diameter Diameter tolerance: +0.00/0.25mm Thickness tolerance: ±0.25mm Bevel: <0.5mm @ 45° representative value Wedge: less than 5 minutes standard parallel plane, parallel plane less than 10 seconds, wedge plane 30±5 minutes These windows are polished on both sides and are applied in high-power lasers. AR (anti-reflective) coating can be applied on both sides or one side. They are used in plate beam splitters, dichroic filters, and partial reflectors.

  • Laser marker
  • Substrate

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Substrate for SAW devices, roughened backside

Substrate for SAW devices, roughened backside

Ultra-precise blasting processing for wafers! Easy operation, effective as a noise countermeasure from the backside.

We would like to introduce our product, "Backside Roughening Substrate for SAW Devices." It supports wafer sizes of Φ4 and 6 inches and uses fine grinding materials of approximately #1000. The processing is fully automated by simply setting the workpiece at the front of the main unit. The roughness can be specified within the range of Ra0.1 to 1μm. This product addresses issues such as the tendency to crack and break, long processing times on grinding machines, and high running costs. 【Features】 ■ Supports wafer sizes of Φ4 and 6 inches ■ Uses fine grinding materials of approximately #1000 ■ Fully automated processing with easy operation by simply setting the workpiece at the front of the main unit ■ Roughness can be specified within the range of Ra0.1 to 1μm

  • Other processing machines
  • Processing Contract
  • Substrate

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Maruichi High-Tech Co., Ltd. Business Introduction

Maruichi High-Tech Co., Ltd. Business Introduction

Leave your printed circuit board needs to us!

Maruichi High-Tech Co., Ltd. is engaged in the manufacturing of printed circuit boards. We have established a production line that can meet delivery deadlines by stabilizing quality and product precision, maintaining excellent cost performance through automation, and reducing changeover time by streamlining the setup process. Primarily focusing on single-sided and double-sided boards, we offer a wide range of multilayer boards and metal boards tailored to our customers' diverse needs. 【Products Offered】 ■ Single-sided boards ■ Double-sided boards ■ Multilayer boards ■ Aluminum boards ■ PCB assembly *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Contract manufacturing
  • Processing Contract
  • Substrate

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Universal LCD LED backlight power supply board

Universal LCD LED backlight power supply board

Kenik System original LED backlight power supply board

The "KSLBC-3" is an LED backlight power supply board that supports up to 6 strings. 【Features】 - It can simultaneously light up and dim up to 6 strings of LEDs. - ON/OFF and brightness adjustments can be easily set using a general-purpose microcontroller. - It uses devices with built-in overvoltage protection, so even if an LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.

  • controller
  • Substrate

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Kyocera high-brightness LED LCD backlight power supply board

Kyocera high-brightness LED LCD backlight power supply board

This is the original LED backlight power supply board from Kenik System.

The "KSLBC-3(K2)" is an LED backlight power supply board for high-brightness LCDs manufactured by Kyocera. 【Features】 - It can be easily configured using a general-purpose microcontroller for ON/OFF and brightness adjustment. - It uses devices with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.

  • controller
  • Substrate

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Densitron SVGA LCD LED backlight power supply board

Densitron SVGA LCD LED backlight power supply board

This is the original LED backlight power supply board from Kenik System.

The "KSLBC-3(D1)" is an LED backlight power supply board for SVGA LCDs made by Densitron. 【Features】 - It can be easily configured using a general-purpose microcontroller for ON/OFF and brightness adjustments. - It uses a device with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.

  • controller
  • Substrate

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Densitron SVGA, VGA LCD LED backlight power supply board

Densitron SVGA, VGA LCD LED backlight power supply board

This is the original LED backlight power supply board from Kenik System.

The "KSLBC-4(D4)" is an LED backlight power supply board for SVGA and VGA LCDs manufactured by Densitron. 【Features】 - It can be easily configured with a general-purpose microcontroller for ON/OFF and brightness adjustment. - It uses devices with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.

  • controller
  • Substrate

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Flexible Printed Circuit (FPC) Catalog

Flexible Printed Circuit (FPC) Catalog

A wide range of products including single-sided FPC, double-sided FPC, and flex-rigid are featured.

The "Flexible Printed Circuit (FPC) Catalog" is a catalog that widely introduces high-quality FPC products nurtured by Okiden Cable in a clean environment. The feature of Okiden Cable's Roll to Roll (RtoR) line is its ability to handle both single-sided and double-sided FPCs. All equipment is installed in a clean room with management considerations for dust prevention. [Contents] ■ Okiden Cable's FPC Product Concept ■ Areas of Achievement ■ Process Overview ■ What is a Flexible Printed Circuit (FPC)? ■ Product Introduction *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Flexible Printed Circuit Board (FPC) "Long-Length High-Speed Transmission FPC"

Flexible Printed Circuit Board (FPC) "Long-Length High-Speed Transmission FPC"

Achieves a transmission distance more than three times that of a typical high-speed transmission FPC!

The "Long-Length High-Speed Transmission FPC" is a flexible printed circuit board (FPC) that enables the transmission of high-speed signals over long distances, achieved through the fusion of our long-length technology and high-speed transmission technology. It can be used for high-speed signal transmission wiring in large equipment and is also adopted in astronomical observation devices. 【Features】 ■ Transmission distance is more than three times that of typical high-speed transmission FPCs. ■ Enables long-length high-speed transmission comparable to cables while maintaining the thinness and lightness of FPCs. ■ By using low-breakage materials and unique pattern design, it can transmit up to 1 meter under the "USB3.0" standard. ■ Supports measurement of various transmission characteristics such as characteristic impedance, loss, and crosstalk. *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Substrate

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