We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 561 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Jan 07, 2026~Feb 03, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 07, 2026~Feb 03, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 スクリーンプロセス Kanagawa//others

Substrate Product ranking

Last Updated: Aggregation Period:Jan 07, 2026~Feb 03, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社 和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  3. Handbook for Circuit Board Noise Countermeasures グロース
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Understand in 3 minutes! A substrate that dissipates heat faster [Materials available]. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所

Substrate Product List

1186~1200 item / All 1900 items

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Achieving a thickness of 0.98mm with 12 layers! 'High-Density High-Multilayer Flexible Circuit Board'

When you want to implement high-density wiring with over 200 pins in a limited space! It can be bent for use, allowing for high-density wiring in a compact space.

The "High-Density High-Multilayer Flexible Circuit Board" is an FPC developed for devices that require many signals. Despite having a 12-layer structure, it achieves a thickness of less than 1mm. The cable section can be bent for use, enabling high-density wiring in compact spaces. 【Features】 ■ The harness section can be bent for use. ■ Ideal for applying high-density wiring with over 200 pins in limited spaces. *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Substrate

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Slit flexible substrate" *can also accommodate "twisting" and "torsion.

Widely used as alternatives for fine coaxial cables, wire harnesses, and cables for medical devices. The spacing and width of the slits can be specified!

The "slit flexible substrate" is a flexible substrate with excellent bendability that has been processed with slits, allowing for "twisting" and "torquing." It is widely used as an alternative to fine coaxial cables, wire harnesses, and cables for medical devices, and since the spacing and width of the slits can be specified, it offers greater freedom for customers. 【Features】 ■ A bendable cable flexible substrate with 0mm slits processed between patterns ■ Can be used with "twisting" and "torquing" compared to conventional products ■ The spacing and width of the slits can be specified *For more details, please refer to the PDF materials or feel free to contact us.

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  • Wiring materials
  • Substrate

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Metal-based heat dissipation substrate with low thermal expansion coefficient

For the electrical wiring in the engine room and the gasoline tank meter! Compared to glass epoxy substrates, it has a lower coefficient of thermal expansion and stronger resistance to heat.

The "metal-based heat dissipation substrate" is a substrate that improves heat dissipation through thermal conduction, alleviating thermal issues. There are applications in high-brightness LED lighting (for vehicles and floodlights), as well as in automotive electrical components, ECUs, EPS, and DC/DC converters. Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat. 【Features】 ■ A substrate that improves heat dissipation through thermal conduction by using metal as the base ■ Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat *For more details, please refer to the PDF materials or feel free to contact us.

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  • Wiring materials
  • Substrate

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Standard specification product 'BigElec (high current FPC)' for connection between terminal screws.

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

BigElec is a flexible printed circuit board designed for high current wiring, intended as an alternative to busbars and wire harnesses, featuring a slim and flat design. Similar to printed circuit boards, it can accommodate pattern formation and assembly according to your requirements. We have newly introduced the "BigElec Standard Specification Products," which are easy to implement for connections between screw terminals. The BigElec Standard Specification Products have no initial costs, allowing for reduced upfront expenses. 【BigElec Standard Specification Product Specifications】 ■ Layers: 2 layers, 4 layers, 6 layers, 8 layers ■ Wiring width: 8mm to 11mm (integers only) ■ Total length: 30mm to 210mm (integers only) ■ Terminal screw diameters: M3 (hole diameter φ3.8mm), M4 (hole diameter φ4.4mm), M5 (hole diameter φ5.4mm), M6 (hole diameter φ6.5mm), M8 (hole diameter φ8.5mm) *For more details, please download the PDF or contact us.

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  • Wiring materials
  • Substrate

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Flexible substrates for medical devices: long lengths / slitting / ultra-fine circuits

For applications such as endoscopes, catheters, CT scans, and analytical devices! Introducing our products for medical equipment.

We would like to introduce flexible circuit boards suitable for medical device applications among the products we handle. 【Long-Length Flexible Circuit Boards】 By using crank shapes and spiral shapes, we can accommodate lengths in the meter range. ◎Features◎ ■ Capable of manufacturing with a board outline width of less than 1mm ■ Compatible with the mounting of 0402 size components 【Slit Flexible Circuit Boards】 By applying slitting processing, we can achieve a wide range of flexibility, including horizontal and twisting directions. ◎Features◎ ■ Improved bendability and weight reduction ■ Flexible support for the number of slits and slit widths 【Ultra-Fine Circuit Flexible Circuit Boards】 Using the Semi-Adhesive Process (SAP), we can process fine circuits with a minimum L/S of 20/20μm. ◎Features◎ ■ Contributes to miniaturization and weight reduction of products through high density ■ Capable of supporting high-speed communication applications due to the use of LCP as the core material *For more details, please refer to the PDF materials or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Prototype Services
  • Substrate

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FPC forming (bending) delivery

Bend and deliver, ready to use. Achieve labor savings and space-saving design with FPC processing!

The "FPC Forming Processing Service" provided by Yamashita Material Co., Ltd. is a service that delivers flexible printed circuit boards (FPC) manufactured by our company, pre-bent into shapes according to customer specifications. The delivered FPC is in a state ready for immediate assembly, significantly reducing the labor hours at the assembly site and contributing to space-saving design. We can accommodate custom bending shapes and sizes upon consultation. We also have numerous examples of forming that utilize flexible materials such as liquid crystal polymer (LCP) and polyimide (PI), allowing us to flexibly respond to complex shapes.

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  • Other electronic parts
  • Substrate

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Technical Data: Printed Circuit Board Resist Curing Device 'DEON'

Curing device using superheated steam! Curing the inside and outside of the ink simultaneously!

We are currently offering an introduction to the printed circuit board resist curing device 'DEON' from Murakami Electronics, a manufacturer of prototype and mass production multilayer boards from double-sided substrates. The document clearly explains the differences between the existing ink curing principles and the ink curing principle adopted in our product (the internal and external simultaneous curing and drying method using nano high-temperature particles) with the help of illustrations. [Contents] ■ Existing ink curing principles ■ Ink curing principles with DEON ■ Nano high-temperature particles = Characteristics of nano-sized high-temperature superheated vapor ■ General characteristics of high-temperature superheated vapor ■ Regarding the moisture content in the resist *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Substrate

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[Case Study] Flexible Circuit Board Product Delivery Record

Introducing a case study on the implementation of flexible substrates by Murakami Electronics Co., Ltd.!

Murakami Electronics Co., Ltd. is a manufacturer of both double-sided and multilayer printed circuit boards, specializing in prototyping and mass production. We will introduce examples of flexible circuit board applications, including "4-layer flex," "4-layer rigid flex," and "aluminum substrates." 【Case Studies】 ■ Double-sided electrolytic gold plating coverlay reinforcement board (PI) ■ 4-layer flex coverlay flux ■ 4-layer rigid flex flux ■ Aluminum substrate *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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The substrate technology for control panels proposed by analog circuit engineers.

By conducting a functional analysis of the mounted devices during substrate integration, we will propose and implement the optimization of over-spec components and inefficient sequences.

Through circuit board technology, we were able to significantly reduce costs, labor, and size by reducing the number of components and then creating the circuit board. Reduction examples: wiring labor by 70%, size by 75%, and component costs by 20%. Key points when creating a circuit board: While it is possible to reduce size and labor by creating a circuit board with the same functionality, it is also possible to significantly slim down by breaking down the functions one by one and minimizing the necessary components. Of course, we consider the scalability of functions and future risks, conducting hearings with customers to make proposals. Therefore, in some cases, it may be better not to create a circuit board for areas with high scalability. While we cannot completely predict issues such as component shortages or discontinued parts, we can provide advice on inventory management based on trends. As an example of our proposals: - Optimization of power capacity components according to the current-carrying parts (using large-capacity components in small-capacity areas) - Optimization of functional components (for instance, replacing two component functions with one component) It is not uncommon for new products to be launched that did not previously exist as components on circuit boards. Please feel free to consult with Kairoski, specialists in circuit board components.

  • power supply
  • relay
  • Control Panel
  • Substrate

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IoT-enabled devices with control infrastructure and smartphone apps! [Distribution of system case study materials]

Examples of sensor measurement systems using Bluetooth and Wi-Fi! In-house integrated support for circuit board and software development!

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." By connecting a control board with communication functionality to a device, it becomes possible to send device data to a smartphone. The data collected from the device can be transmitted to a server using the smartphone's internet communication capabilities, allowing for data viewing and management on servers or PC terminals. [Key Points of Our IoT Development] ★ We handle board and software development consistently in-house. ★ Leveraging our experience in MAC development, we specialize in iOS application development. - Sensor measurement systems using Bluetooth/Wi-Fi - Development of communication control boards - Development of dedicated control/viewing applications - Data transfer to cloud servers, etc. ◇ We also have numerous achievements in in-house and contract development! Please feel free to consult with us! ◇ ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.

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Bluetooth-based sensor measurement system: IoT development case study

We provide consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■Example: Sensor measurement system using Bluetooth → Development of Bluetooth communication control board and measurement application (iPad) 1. Collect information from various sensors installed on the machine. Control is performed by the control board. 2. Communicate between the machine and the control board using Bluetooth. Information can be viewed from a dedicated application on a tablet. Measurement results are also automatically sent to terminals in offices, etc. 3. Information such as operational status can be viewed in real-time in offices, etc. Information obtained from various sensors is aggregated. ★ We have many other achievements in both in-house development and contract development! ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.

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Measurement sensor, iPad and Bluetooth integrated control IoT development case study.

We provide consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT of devices through the integration of "control boards" and "smartphone applications." ■Example: Development of control boards for measuring sensors and Bluetooth integration with tablets (iPads) for measurement applications. 1. Measure the load capacity of transport vehicles using measuring sensors. 2. Share information from the measurement application via Bluetooth through the communication control board. 3. In offices, capture and aggregate vehicle numbers, loading dates, locations, and quantities. Information on work status and movements can be viewed in real-time. ★ We have many other achievements in in-house development and contract development! ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.

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Production Line Work Record System IoT Development Case Study

Consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone apps." ■ Case Study: Production Line Work Recording System 1. Record the work details for factories 1 to 3 individually on each tablet. 2. Save all work records to a single cloud for centralized management of multiple lines. 3. Information from each line can be monitored in real-time. ★ We also have numerous achievements in in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.

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Real-time factory operation confirmation system IoT development case study

We provide consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■ Case Study: Real-Time Factory Operation Monitoring System Enables management of real-time operational status of each factory from PCs at various locations. 1. Record and manage the operational status of each factory on their respective PCs. 2. Collect records from each factory via the cloud for centralized management. 3. As a security measure, restrict access to devices that can connect to the cloud, preventing information leakage. ★ We also have numerous achievements in both in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.

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Examples utilizing cloud, control boards, and smartphone applications.

Introduction of examples such as load measurement sensor Bluetooth control systems and remote monitoring systems for gas facilities.

In our IoT development, we realize the IoTization of devices through "control boards" and "smartphone apps." Furthermore, it is possible to manage information using the cloud, link with in-vehicle information, and connect with health management and advisory services. Based on specific examples, we will introduce in detail what kind of systems are available and how they can be utilized. *Details of the examples can be viewed through the related links. For more information, please feel free to contact us.*

  • Embedded system design service
  • Substrate

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