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substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. null/null
  3. 三和電子サーキット Osaka//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 松和産業 Mie//Electronic Components and Semiconductors 本社
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substrate Product ranking

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
  2. Aluminum foil etched circuit board
  3. Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.
  4. 4 Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

substrate Product List

136～150 item / All 672 items

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Low Concentration Ozone Generation Substrate "OZ-S"

Low Concentration Ozone Generation Substrate "OZ-S"

It has been discovered that low-concentration ozone gas has the effect of reducing the risk of infection from the novel coronavirus!!

The "OZ-S" is an ozone generation substrate that produces low-concentration ozone using a high-voltage power supply. It is expected to have sterilization and deodorization effects!! Successful digital control with a microcontroller! Management operation via communication is also possible!! 【Challenges / Results】 ■ I want to control the amount of ozone generated. → Control of output voltage through voltage feedback and time division control using a microcontroller. ■ I want to control the amount of ozone generated. → Compatible with a wide variety of power supplies, including mobile batteries and automotive power sources. ■ I want to improve reliability and reduce size. → Achieved improved reliability and miniaturization of the substrate through urethane potting. ■ I want it to operate when no one is around. → It is also possible to operate when no one is present by coordinating with sensors. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Ozone Generator

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Wireless power supply board

Wireless power supply board

Wireless power transmission board capable of delivering 30W of medium power.

【Issues / Results】 ■ The mainstream Qi standard cannot achieve more than 5W 　→ Independently developed a 30W type aimed at medium capacity. ■ A transmission distance of 20mm is desired 　→ Tuned the resonant capacitor and frequency to accommodate a 20mm gap. ■ It takes 5 seconds to start with other manufacturers' products 　→ Achieved a startup time of 0.3 seconds. ■ I want it to stop automatically 　→ Safely stops power transmission during abnormal conditions or when the receiving coil is not found. Reduces reactive power and minimizes the risk of magnetic interference. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Reverse Engineering of Printed Circuit Boards Restoration and Reproduction [Rivaen]

Reverse Engineering of Printed Circuit Boards Restoration and Reproduction [Rivaen]

Achieve high reproducibility! (Track record: approximately 80% or more) Leave the optimization of verification, components, and functions to prototype verification to us. *CPU is subject to consultation.

We will fully support the [restoration and reproduction] of various issues such as [absence of developers], [lack of drawings due to old development products], and [concerns about supply due to overseas procurement]. [Kaeroski's Achievements] With over 250 circuit development (board development) projects in the past 7 years, we have identified issues and proposed countermeasures through noise, heat, and EOL measures, as well as verification against Kaeroski standards. Based on this knowledge, we will assist with reverse engineering of boards without drawings, in the absence of developers, and outsourced boards. If you fall into any of the following categories, we believe we can help: - Developed in-house several decades ago, but renewal is necessary for performance improvement/EOL measures. There are no remaining documents and we would like support from a knowledgeable company. - We want to analyze an (in-house) board without a developer, create drawings, leave design evidence, and conduct verification and improvement discussions regarding functionality and reliability. - We want to develop a board that has been procured overseas in-house. - Due to company growth, we are lacking development resources. We would like our engineers to lead the development (reverse engineering) support. And so on.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Thick film printed circuit board

Thick film printed circuit board

RoHS and Pb-free compliant! Thick film printed circuit boards with selective layouts based on conductor characteristics are available.

The "thick film printed circuit boards" we handle utilize various technologies based on the properties of alumina ceramics, providing "heat resistance" and "high reliability" to meet customer needs. We comply with RoHS and lead-free standards, and can perform through-hole filling printing from Φ0.15mm. Additionally, we can achieve selective layouts based on conductor characteristics, focusing on bonding properties or migration resistance. 【Features】 ■ Capable of printing conductors made of silver-palladium, silver-platinum, silver, and copper, which excel in heat resistance. ■ Gold plating is available for terminal electrode solder joints, offering excellent migration resistance (high migration-resistant material). ■ Compliant with RoHS and lead-free standards. ■ Various resistors can be formed through printing methods. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Printed circuit board manufacturing - single-sided board

Printed circuit board manufacturing - single-sided board

Standard materials: Galapagos substrate, paper phenol, composite.

We use FR-4 (glass epoxy substrate), FR-1 (paper phenolic), and CEM-3 (composite) as standard materials. We offer a wide range of thicknesses from 0.5mm to 2.0mm to meet our customers' needs. *Other thicknesses can also be accommodated by using double-sided materials. We can ship within the shortest possible working days of 1 day. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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Printed circuit board manufacturing double-sided flexible circuit board

Printed circuit board manufacturing double-sided flexible circuit board

The thinnest flexible substrate with a total thickness of 100μ is possible. Halogen-free options are also available.

Like one-sided flex, we have a variety of materials in stock. The thinnest option allows for a total thickness of 100μ for flex PCBs, and of course, we can also accommodate halogen-free requirements. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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Printed circuit board manufacturing - build-up boards

Printed circuit board manufacturing - build-up boards

This is a method of forming a build-up layer on top of a core substrate.

The precision of printed circuit boards has advanced, leading to an increased demand for printed wiring boards using the build-up method. The build-up method is a construction technique that forms build-up layers on top of a core substrate. The connection between the core substrate and the build-up layers is made using laser vias. By using this method, it becomes possible to achieve higher density wiring. Currently, we can accommodate up to two-layer builds (two layers of build-up layers above and below). Additionally, we can also handle stack vias and filled vias. We have a track record of manufacturing rigid-flex boards and multilayer flex boards using the build-up method. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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Special Printed Circuit Board Manufacturing - Impedance Control Board

Special Printed Circuit Board Manufacturing - Impedance Control Board

Control the pattern width and interlayer thickness to perform impedance control.

Based on our extensive past experience, we control the pattern width and layer thickness to perform impedance control. By using the Polar company's impedance simulation software 'Si8000', we can pre-calculate the impedance values of the completed circuit boards, enabling accurate impedance control. Additionally, we can simulate the layer configuration, line width, and spacing during the pattern design phase, allowing us to propose specifications that facilitate easier impedance control. For measuring the impedance of the completed circuit boards, we use the 'MZPC50' measuring instrument from Microcraft Co., Ltd., and we can provide measurement results (using the TDR method). For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

This is a circuit board with resin embedded in the through holes and pads placed on top.

This is a circuit board designed to secure the mounting space for components by embedding resin in through-holes and providing pads on top. With the trend towards narrower pitches for components such as BGA and CSP, the demand has increased. Resin and metal paste are embedded using vacuum printing. For more details, please contact us or refer to the catalog.

  • Printed Circuit Board

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NI-X expansion FPGA board

NI-X expansion FPGA board

Expansion FPGA board for National Instruments X Series

The NI-X expansion FPGA board is used in combination with National Instruments' X series boards. (It can also be used independently.)

  • Board materials
  • Other electric meters
  • Printed Circuit Board

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Ultra-thin multilayer printed circuit board

Ultra-thin multilayer printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-Sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. 【Features】 The thinnest 4-layer printed circuit board with a thickness of 0.15mm * For detailed information such as "specifications," please refer to the catalog. * For more information, please contact us or download the catalog.

  • Printed Circuit Board

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Single-sided flexible printed circuit board (single-sided FPC)

Single-sided flexible printed circuit board (single-sided FPC)

The most standard specifications at a low cost.

This is the most basic structure of an FPC with a conductor pattern formed only on one side.

  • Printed Circuit Board

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Component Mounting Flexible Circuit Board (Component Mounting FPC)

Component Mounting Flexible Circuit Board (Component Mounting FPC)

Support for component mounting is also available.

This is an FPC with electronic components mounted.

  • Printed Circuit Board

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[Processing Results] Large-scale LBO Single Crystal Substrate

[Processing Results] Large-scale LBO Single Crystal Substrate

The distortion of the wavefront achieved an excellent polishing precision of 0.26μm! We have successfully processed the polishing of LBO single crystal substrates.

This is an introduction to the polishing processing results of the "large LBO single crystal substrate" (100×100×1.5mm). The disturbance of the transmitted wavefront achieves an excellent polishing accuracy of 0.26μm. We have successfully polished the LBO single crystal substrate, which is used in the LFEX laser. 【Overview】 ■ Shape accuracy: PV0.26μm, Measurement device: Zygo Verifire ATZ ■ Surface roughness: Sa0.44nm, Measurement device: Zygo NewView 8300 ■ Substrate size: 100×100×1.5mm *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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