We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 561 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors

substrate Product ranking

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社 和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社 和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

271~300 item / All 1884 items

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Direct Imaging System

It is now possible to create high-difficulty fine patterns like never before!

Our company has introduced the "LI-9200 Mercurex" manufactured by SCREEN PE Solutions. This has made it possible to create fine patterns with higher difficulty than ever before. 【Direct Imaging System】 ■ Manufactured by SCREEN PE Solutions ■ "LI-9200 Mercurex" *For more details, please refer to the PDF document or feel free to contact us.

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Printed Circuit Board Specifications

Information on various materials that can be handled and manufacturing conditions that can be accommodated by our company.

This is an introduction to various materials and manufacturing conditions that we can handle. For specifications not listed, please feel free to consult with us. 【Printed Circuit Board Specifications】 <Minimum L/S> ■ Outer layer 18μm: 100/100μm ■ Outer layer 35μm: 150/150μm ■ Outer layer 70μm: 250/250μm ■ Outer layer 12μm: 80/80μm (pad-on-via mixing not allowed) ■ Inner layer 35μm: 80/80μm ■ Inner layer 70μm: 200/200μm *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Printed Circuit Board
  • Other electronic parts
  • substrate

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<High Quality> Direct Imaging System

The pad pitch is 0.5mm! It is suitable for fine pattern products.

We would like to introduce our "Direct Imaging System." It is suitable for fine pattern products such as substrates with 0.3mm to 0.65mm pitch BGA and CSP, as well as flip chip mounted substrates. Additionally, it is applicable to products requiring high alignment accuracy. Please feel free to contact us when you need assistance. 【Features】 ■ High-difficulty fine patterns ■ Fine pattern formation ■ Resist formation *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Impedance control

Supports the manufacturing of various impedance substrates! We propose the necessary values for your design.

Our company conducts impedance simulation and coupon measurement. In recent years, there has been a growing demand for substrates that implement impedance control. To meet such needs, our company is capable of manufacturing various impedance substrates. Before or during the design phase, by providing us with specifications for impedance from our customers, we can propose the necessary values for the design. 【Introduction of Software and Equipment】 ■ Polar Instruments Impedance Simulator Si8000m v12.01 ■ Polar Instruments Impedance Measurement Device CITS880s4 *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Pad on Beer (Permanent Hole Filling)

Supports plate thickness up to 4.8t! We can achieve permanent hole filling for Via according to customer requests.

We offer "Pad on Via (permanent filling)" services. We support the manufacturing of pad on vias in the BGA and CSP areas. The filling of pad on vias can accommodate board thicknesses up to 4.8t. Additionally, the permanent filling ink is processed smoothly through polishing, allowing us to achieve permanent filling of vias according to customer requests. 【Features】 ■ Supports the manufacturing of pad on vias in the BGA and CSP areas ■ Filling of pad on vias can accommodate board thicknesses up to 4.8t ■ Achieves permanent filling of vias according to customer requests ■ Permanent filling ink is processed smoothly through polishing *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • substrate

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[NJ Component] Piezo Buzzer

The piezoelectric buzzers and sounders developed and manufactured by NJ Components can be helpful for new developments and considerations for replacing discontinued products from other companies!

NJ Components offers a range of piezoelectric buzzers and sounders that meet needs such as high sound pressure and wide frequency range. These products are used in various fields, including home appliances and office equipment where compactness and lightweight design are required, as well as in disaster prevention equipment that demands high volume and reliability. Our company has its own factory in Japan and uses proprietary piezoelectric ceramics material development technology to produce piezoelectric elements, allowing for integrated production of piezoelectric buzzers and sounders from raw materials to finished products. Seiwa Co., Ltd. acts as an authorized distributor for NJ Components, handling a wide range of their products, including piezoelectric buzzers, sounders, and multilayer power inductors. In addition to new developments, we encourage you to consider replacements for discontinued products from other companies.

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Op-Amp Circuit Board PX1010

You can assemble circuits without wiring!!

The op-amp board "PX1010" can accommodate two 8-pin dual op-amps or one 14-pin quad op-amp, allowing for the easy construction of many basic op-amp circuits by simply placing circuit components in the appropriate positions, much like a jigsaw puzzle. The compatible op-amp packages are DIP with a pin pitch of 2.54 mm or SOP with a pin pitch of 1.27 mm. In addition to axial and radial components, 1608 chip components can also be used for other circuit parts. There is a sister product, the universal board "PX0001" for single DIP op-amps.

  • Printed Circuit Board
  • substrate

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RF probe and calibration board [Wide frequency range, pitch, excellent durability!]

An RF probe and calibration board with a wide frequency range, pitch, and excellent durability!

Our company offers RF probes and calibration substrates with a wide frequency range, pitch, excellent durability, all at a low price. Thanks to our unique tip shape, stable contact can be achieved with minimal skating during contact, reducing damage to devices and ensuring high reproducibility. The calibration assist software already has product data for the "Allstron TITAN Probe Series" registered, allowing you to use it immediately by simply selecting a probe. 【Product List】 ■Allstron RF Probe "TITAN" ■Allstron RF Probe "TITAN-RC" ■RF Calibration Substrates "AC" ■Calibration software "QAlibria" *For more details, please request materials or view the PDF data available for download.

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BS3G30MP Parallel Control Board

This is a board that controls the BS3G30 digital step attenuator with a 6-bit parallel interface.

● By combining with BS3G30, the attenuation can be varied in 0.5dB steps up to a maximum of 31.5dB. ● This board operates with a single +5V power supply. ● A +5V AC adapter is not included, so please prepare one that is compatible with the specifications of this board.

  • High frequency/microwave parts
  • substrate

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Transparent flexible printed circuit board (transparent FPC)

A transparent flexible substrate with wiring that cannot be seen with the naked eye.

It is a flexible substrate with invisible wiring that has a total light transmittance of 92.0% and allows for component mounting.

  • Printed Circuit Board
  • Touch Panel
  • Sensors
  • substrate

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Film substrate for transparent antennas

Transparent antenna substrate for the fifth generation mobile communication system that cannot visually see more wiring.

It is a transparent 5G antenna film. It can be used for antennas and reflectors in areas that are not visible to the eye. The sheet resistance of the wiring is low at 1.42 mΩ/□, allowing for the creation of high-performance antennas.

  • antenna
  • IC tag
  • High frequency/microwave parts
  • substrate

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Polycarbonate substrate

A polycarbonate substrate that seems like it should exist but doesn't.

【Product Features】 1. Stronger than resins such as acrylic and polyethylene terephthalate. 2. Compatible with a wide range of environments, from low to high temperatures. 3. Excellent affinity and processability for film insert molding.

  • Printed Circuit Board
  • substrate

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Printed circuit board assembly high-density thin substrate

We handle everything from the design and development of various microcontroller controllers to printed circuit board assembly and controller assembly.

We will strive for further "evolution and development" under the theme of "Creation, Evolution, and Development Enterprises."

  • Circuit board design and manufacturing
  • substrate

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Printed circuit board assembly fine pitch board

We provide support for everything from the design and development of various microcontroller controllers to printed circuit board assembly and controller assembly.

We will strive for further "evolution and development" under the theme of "Creative, Evolving, Developing Enterprises."

  • Circuit board design and manufacturing
  • substrate

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Printed circuit board assembly low-cost board

We provide support from the design and development of various microcontroller controllers to printed circuit board assembly and controller assembly.

We will strive for further "evolution and development" under the theme of "Creation, Evolution, and Development Enterprises."

  • Circuit board design and manufacturing
  • substrate

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Printed circuit board

We deliver from prototypes to mass-produced products in a short lead time. Please feel free to consult us about anything related to circuit boards.

Each manufacturing process is carried out with thorough quality control by skilled workers. We produce single-sided boards, multilayer boards, flexible boards, aluminum boards, edge-through-hole boards, thin boards, build-up boards, BGA boards, wire bonding boards, and white LED boards.

  • Printed Circuit Board
  • substrate

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Aluminum foil etched circuit board

Low-cost large-area flexible printed circuit boards! Lightweight and long, they can also be supplied in roll form.

We are etching laminated materials of aluminum foil and film to form circuits. The thickness of the aluminum foil and the type and thickness of the film can be adjusted according to your requirements.

  • aluminum
  • substrate

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Purifying Ceramic Ball - Essence of Water

Easily delicious water.

"Water Spirit" is a granular catalyst that normalizes the innate biological defense and repair functions of the human body, creating drinking water that maintains a healthy body. The usage is simple; just place it in water and leave it. Safe water will be ready in one hour. Moreover, it has a long shelf life of one year, requires no troublesome maintenance, and is economical. <Usage Instructions> Use 23g for 1 liter and soak in water for more than one hour. <Ingredients> Zeolite, silver, platinum <Appearance> Silver-colored granules (23g for 1 liter in a PP mesh bag) Effective period: 1 year (with daily use) *Complies with the Ministry of Health's Water Quality Standards No. 56.

  • Ceramics
  • substrate

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MARUWA Alumina substrate

Using carefully selected high-purity alumina.

Our alumina substrates are produced using carefully selected high-purity alumina raw materials and under strict quality control, ensuring consistently stable quality and excellent properties.

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Thin film circuit board, thin film metallization.

MARUWA's thin film circuit boards are substrate materials created as a result of the fusion of various proven ceramic materials and the thin film metallization technology developed over many years.

Thin film circuit substrates are materials created from the fusion of various proven ceramic materials and the thin film metallization technology developed over many years. Customization is possible through diverse pattern formation techniques, such as side metallization. They are used in circuit substrates for optical storage, optical communication, and RF applications. Through the integration of the thin film metallization technology that MARUWA has cultivated over many years and the underlying ceramic material technology, a consistent production process from material to thin film formation has been achieved. By using substrates with excellent heat dissipation properties, such as alumina substrates, aluminum nitride substrates, multilayer substrates, and dielectric ceramics, it is possible to form advanced circuit patterns that meet high integration and electrical characteristics.

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High-Temperature Co-fired Ceramic Multilayer Substrate (HTCC)

Solder with excellent heat resistance for plating electrodes! Achieving high reliability, high density, and multifunctional products for various applications!

We realize the commercialization of various high-density and multifunctional products for applications such as ceramic heaters, optical communication packages, LED packages, sensor packages, and SMD packages.

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Glazed processed substrate

Glazed processed substrate

It is a glazed substrate with an alkaline, lead-free amorphous glass applied to the surface of the alumina substrate, offering excellent surface smoothness and durability. It is used in thermal print heads and similar applications.

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Aluminum nitride substrate

Aluminum nitride products developed using ceramic materials technology.

Aluminum nitride products developed using ceramic materials technology possess excellent thermal conductivity, high electrical insulation, and characteristics such as thermal expansion similar to silicon, making them noteworthy as materials for high thermal conductivity substrates. They are used in power transistor module substrates, LED mount substrates, and IC packages.

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Silicon nitride substrate

Silicon nitride products developed using ceramic materials technology.

Silicon nitride products developed using ceramic material technology are used in applications such as power semiconductor substrates due to their high strength, high toughness, and high thermal conductivity, making them suitable materials for high reliability requirements.

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Substrate Embedded Education & Development Platform

Equipped with ARM Cortex-M3 (STM32F103ZE). Transform new employees into assets within a month. Seamless from training to development.

Ported TOPPERS/ASP, TCP/IP, and file systems to IAR Systems EWARM and created a library. An immediate training tool. Only by mastering debugging tools can one be a professional engineer. A debugging environment equivalent to J-LINK has been integrated onto the board. The accompanying CD contains exercise programs and development tools. A separate PowerPoint for instructors is also provided.

  • Embedded Board Computers
  • substrate

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Introduction to the Fair's Process: Circuit Design

We can also accommodate consumer needs! The electrical circuit CAD we use is OrCAD.

Our company is capable of handling analog circuits such as equipment and power supplies that measure weak current values, as well as high-speed digital circuits. We also excel in mixed analog/digital circuits and have achieved significant results in various fields including control, measurement, communication, medical, video, and power supply. Additionally, we specialize in circuits that incorporate either a CPU, an FPGA, or both, to control various sensors, motors, LEDs, LCDs, memory, and communication modules. [Other Process Examples (Excerpt)] ■ Product Planning ■ CPU Firmware Design ■ Component Procurement ■ Component Assembly ■ Manufacturing, Assembly, Inspection, Packaging *For more details, please refer to the related links or feel free to contact us.

  • Other contract services
  • substrate

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