Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
241～270 item / All 1884 items
We will propose a polishing machine tailored to your needs!
This is an introduction to the flat grinding system mirror polishing machine from Nappu Industrial Co., Ltd. It provides high-precision mirror polishing for stainless steel, aluminum, glass, and plastic.
From alumina ceramic substrates to finished products, all manufactured in-house! Leave hybrid ICs to IAM Electronics!
This is an announcement from AIEIM Electronics regarding "Hybrid ICs and Thick Film Printed Circuit Boards."
A high-reliability electronic material substrate with baked electrode materials and resistive materials.
The "Alumina Thick Film Circuit Board" is a high-reliability electronic material substrate that has excellent heat dissipation and heat resistance, with electrode materials and resistive materials baked onto an alumina substrate. Our company produces and sinters alumina substrates at our affiliated company, "Ina Ceramic Co., Ltd.," and has established a consistent high-quality line that includes circuit printing, sintering, resistance value adjustment, component mounting, molding, and electrical testing. It can be utilized in main applications such as automotive electronic components, communication industrial equipment, power supplies, and safety devices. 【Features of Alumina Substrate】 ■ Material: 96% Alumina ■ Color: White ■ Specific Gravity: 3.8±0.1 ■ Water Absorption (%): ≧0.1 ■ Flexural Strength (MPa): 215≦ ■ Hardness (GPa): 13.7±2.4 ■ Insulation Breakdown Voltage (V/mm): 1×10^7≦ *For more details, please refer to the PDF document or feel free to contact us.
Excellent insulation and corrosion resistance! The thermal conductivity ratio compared to PWB is about 50 times, sintered at approximately 1500°C!
"Alumina ceramic substrates" are products that can create electronic circuit boards using thick film printing technology. They are suitable for heat dissipation and high-reliability substrates. Circuits are formed on this product using thick film printing technology with silver-palladium, silver-platinum, gold, and other materials. They can suppress the temperature rise of electronic components and can be utilized for LED lighting and automotive electronic substrates. 【Features】 ■ Excellent heat resistance: Sintered at approximately 1500°C ■ Excellent heat dissipation: Thermal conductivity about 50 times that of PWB ■ Excellent insulation and corrosion resistance ■ Capable of creating electronic circuit boards using thick film printing technology ■ Suitable for heat dissipation and high-reliability substrates *For more details, please refer to the PDF materials or feel free to contact us.
For anything related to pattern design, please leave it to Ritz Corporation - RITZ.
For any inquiries regarding various types of circuit board design, please consult Ritz Co., Ltd. - RITZ.
A monitoring system that allows testing independent of the test tank manufacturer. It will be an original collection/analysis software that reflects the voices of our customers.
- A monitoring system that allows testing independent of the test chamber manufacturer. - An original data collection/analysis software that reflects the voices of our customers. We are utilized by many customers, including various manufacturers (semiconductors, electrical components, materials, resins), private and national research institutions, and contract testing companies.
![[Contracted Services] Reverse Engineering Plus Case Examples](https://image.mono.ipros.com/public/product/image/db6/2000485579/IPROS75961800570631170613.jpeg?w=280&h=280)
Providing the value of "Plus"! We have various achievements, including automatic navigation systems and wireless chargers.
In our contracted service "Reverse Engineering Plus," we provide added value through operation principle clarification, function estimation/principle analysis, and evaluation, in addition to standard disassembly and analysis. For example, in foundation redesign (design contracting), we propose solutions by leveraging the diverse technical expertise cultivated by WTI. We have various case studies available. Please feel free to consult us. [Providing the value of "Plus"] ■ Operation principle clarification ■ Function estimation/principle analysis ■ Evaluation (environment setup/automation) ■ Suggestions for improvement ■ Actual design contracting (modifications/new designs) *For more details, please refer to the PDF materials or feel free to contact us.
This is the industry's first system (according to our research) that supports both DC and AC measurements! As long as a thermocouple can be inserted, it can also be used in test tanks of liquid vessels!
The "Conductive Resistance Monitoring System" is a system that can monitor changes in conductive resistance and capacitance in real-time across multiple channels. It is particularly effective for applications that evaluate the connection reliability of component and material joints. Additionally, it supports both DC and AC measurements and achieves multi-channel capabilities of up to 288 channels. It has a function to count cycles based on thermocouple information, allowing it to be used regardless of the type of test chamber. 【Features】 ■ Can be used with liquid test chambers as long as a thermocouple can be inserted ■ Custom heat-resistant cables designed with consideration for narrow cable openings ■ Data analysis can be performed on the accompanying PC as well as on personal PCs ■ Capable of handling multiple test chambers simultaneously ■ Can be used with test chambers that do not have communication functions *For more details, please refer to the PDF materials or feel free to contact us.
Prepare for the efficiency improvement of development and design during this time! Are there any delays in your development and design tasks?
"In home-based operations, we cannot handle product evaluations, so development and design are not progressing." "When the situation stabilizes, we must make up for the delays until then." In these times, are you experiencing delays in development and design operations? By considering and preparing for the efficiency of development and design during this period, it will be possible to resume development with a 'rocket dash' after the situation stabilizes. Our company has all the design teams necessary for product development, and by taking on these tasks collectively and collaborating closely within the company, we can produce products optimized for design, cost, and performance. Please feel free to consult us regarding meetings for development requests, progress meetings, etc., via web conferencing, email, or phone. 【Service Contents】 ■ Reliability evaluation support ■ Waterproof testing and EMI measurement agency services ■ EOL support (discontinuation and production halt) ■ Reverse Engineering Plus *For more details, please refer to the PDF materials or feel free to contact us.
![[Information] It's Never Too Late to Ask! EMI Countermeasures: Capacitor Edition](https://image.mono.ipros.com/public/product/image/ecd/2000580882/IPROS19673836847957409717.jpeg?w=280&h=280)
About capacitor resonance! We publish know-how shared by our engineers!
This document introduces questions and answers regarding capacitors for EMI countermeasures. It includes information on the impedance of capacitors, the equivalent impedance Z when two capacitors are connected in parallel, frequency characteristics, and more. It is a book that provides explanations in an easy-to-understand manner with characters. [Contents] ■#066 EMI Countermeasures - Resonance of Capacitors 1 ■#067 EMI Countermeasures - Resonance of Capacitors 2 ■#068 EMI Countermeasures - Resonance of Capacitors 3 ■#069 EMI Countermeasures - Resonance of Capacitors 4 ■#071 EMI Countermeasures - Resonance of Capacitors 5 ■#075 EMI Countermeasures - Resonance of Capacitors 6 *For more details, please refer to the PDF document or feel free to contact us.
![[Data] Technosherpa Blog January 2018 - March 2018](https://image.mono.ipros.com/public/product/image/80e/2000588613/IPROS01202463149205388700.jpeg?w=280&h=280)
Information about location detection technology provided by Techno-Sherpa and engineer training is published!
"Techno-Sherpa" is a service brand of Wave Technology Inc. that contributes to the development of in-house talent. This document summarizes the Techno-Sherpa blog from January 29, 2018, to March 23, 2018. It includes articles such as "About the Techno-Sherpa Logo" from January 29, 2018, "No Time to Wait for IoT Engineer Development!" from February 6, 2018, and "Techno-Sherpa's Engineer Education" from February 20, 2018. Please take a moment to read it. [Contents] ■ January 29, 2018: About the Techno-Sherpa Logo ■ February 6, 2018: No Time to Wait for IoT Engineer Development! ■ February 14, 2018: What is the Location Detection Technology Provided by Techno-Sherpa? ■ February 20, 2018: Techno-Sherpa's Engineer Education ■ February 27, 2018: Understanding IoT Divided into Three Parts *For more details, please refer to the PDF document or feel free to contact us.
From electronic components to thermal measurements of indoor spaces! Introducing our "Thermal Measurement Service."
The temperature of components can lead to incorrect judgments if not measured correctly. Our company holds a patent for accurately measuring the temperature of semiconductors, and we can accommodate everything from electronic components to thermal measurements of indoor spaces. If you would like to understand the temporal changes in component temperature or thermal resistance, please feel free to consult us. [Overview] ■ Items to be prepared by the customer - Measurement samples - Peripheral equipment necessary for the operation of measurement samples - Measurement specifications (operating conditions, measurement locations, measurement environment) ■ Deliverables - Report (measured results, discussion) *For more details, please refer to the PDF document or feel free to contact us.
![[Data] WTI Blog: Substrate Design Edition 2017-2020](https://image.mono.ipros.com/public/product/image/dbc/2000656950/IPROS46298715543124515505.jpeg?w=280&h=280)
Is there actually a deep relationship? Full of our company's technical know-how such as 'Circuit Board Structure and Component Packaging'!
This document summarizes the WTI blog of Wave Technology Co., Ltd., a "development design promotion business" that addresses the shortage of engineers, covering the period from 2017 to 2020, focusing on circuit board design. Starting with "The Importance of Telepathic Communication with Circuit Designers in Circuit Board Design" from October 17, 2017, it also introduces "Are Circuit Board Structure and Component Packaging Actually Deeply Related?" from December 3, 2019, and "Tips for Reducing Printed Circuit Board Costs" from June 30, 2020. In addition, we provide a wealth of useful information related to products and industries. We encourage you to read it. [Contents (excerpt)] ■ October 17, 2017: The Importance of Telepathic Communication with Circuit Designers in Circuit Board Design! ■ November 13, 2018: Circuit Board Revision with Cover Data? ■ May 19, 2019: Characteristic Impedance and Circuit Board Design ■ August 27, 2019: Do You Know? Types of Equipment and Their Uses ■ December 3, 2019: Are Circuit Board Structure and Component Packaging Actually Deeply Related? *For more details, please refer to the PDF document or feel free to contact us.
![[Data] Shirutoku Report No. 4 #Interface Circuit](https://image.mono.ipros.com/public/product/image/35b/2000678175/IPROS97857531509888044634.jpeg?w=280&h=280)
Promoting development design! Custom measurement and interface circuits.
★★Shirutoku Report: Useful Information You Can Benefit From★★ This report introduces the utilization of "interface circuits" that make measurement convenient, which is being worked on by the Custom Technology Division. Our company occasionally prepares original "interface circuits" with high versatility, and this time we are featuring one of those examples. Proposing solutions to our customers' challenges is a hallmark of our services. We look forward to hearing from those who are interested. 【Contents (Excerpt)】 ■ Providing services centered around custom measurement ■ What is an interface circuit? ■ Image of the configuration of an interface circuit (analog isolation circuit board) ■ Production board for interface circuits (analog isolation circuit board) *For more details, please refer to the PDF document or feel free to contact us.
![[Data] Shirutoku Report No. 6 #Daisy Chain Sample](https://image.mono.ipros.com/public/product/image/9c6/2000680730/IPROS07693868881905156949.jpeg?w=280&h=280)
Responding to various customer inquiries based on the experience and knowledge gained from previous design and evaluation.
★★Shirutoku Report: Useful Information You Can Benefit From★★ Our company is involved in the development of semiconductor package mounting technology and mounting reliability technology. We mainly focus on packages known as BGA (Ball Grid Array). In this report, we will introduce the daisy chain sample used for evaluating the mounting reliability of semiconductor packages. [Contents] ■ Daisy chain sample for identifying breakage locations ■ Daisy chain sample for identifying breakage locations - Case studies from customer inquiries *For more details, please refer to the PDF document or feel free to contact us.*
![[Data] Shirutoku Report No. 18 # Substrate Structure and Package](https://image.mono.ipros.com/public/product/image/8bd/2000686744/IPROS58686476474672545015.jpeg?w=280&h=280)
A suitable structural examination is necessary due to the mounted components and wiring density! An explanation of the structure of the substrate.
★★Shirutoku Report: Useful Information You Should Know★★ This report introduces the "Structure of PCBs." It includes topics such as "Classification by PCB Structure," "Conductor Materials and Solder Resist," and "The Importance of Initial Considerations in PCB Structure." Our company is also capable of PCB design starting from initial considerations, including PCB structure. If you have any concerns, please feel free to reach out to us. 【Contents】 ■ Classification by PCB Structure ■ Conductor Materials and Solder Resist ■ The Importance of Initial Considerations in PCB Structure ■ About Flexible PCBs *For more details, please refer to the PDF document or feel free to contact us.*
Sensors can be replaced with various types! They can be applied to equipment condition monitoring devices and more.
We would like to introduce our "Wireless Power Transfer Demo Unit." A brightness sensor, temperature sensor, and receiving circuit are installed on a rotating table, allowing for wireless power transfer from the transmission circuit to the receiving circuit. The transmission circuit collects sensor information simultaneously with wireless power transfer. The sensors can be replaced with various types, making it possible to install them in locations that were previously not feasible. 【Features】 ■ Brightness sensor, temperature sensor, and receiving circuit installed on a rotating table ■ Wireless power transfer from the transmission circuit to the receiving circuit ■ Activation of each sensor connected to the receiving circuit ■ The transmission circuit collects sensor information simultaneously with wireless power transfer ■ Monitor sensor information on a PC *For more details, please refer to the PDF document or feel free to contact us.
Wireless power supply is possible in enclosed spaces! The receiving circuit can be individually recognized by ID.
We would like to introduce our "Wireless Power Transfer Demonstration Device." The receiving circuit is installed underwater, and wireless power is transmitted through glass from the power transmission circuit to the receiving circuit. The power transmission circuit collects sensor information simultaneously with wireless power transfer. This can be applied to monitor the vacuum level of a vacuum chamber, as well as the temperature inside a constant temperature bath. 【Features】 ■ Receiving circuit installed underwater ■ Wireless power transfer through glass from the power transmission circuit to the receiving circuit ■ Water temperature measured with a temperature sensor mounted on the receiving circuit ■ Power transmission circuit collects sensor information simultaneously with wireless power transfer ■ Monitored temperature displayed on a PC ■ Receiving circuit can be individually recognized by ID *For more details, please refer to the PDF document or feel free to contact us.
A compact, high-capacity electric double-layer capacitor. It is environmentally friendly and is used as a simple backup power source for OA and AV equipment.
A large-capacity capacitor that allows unlimited charging and discharging in seconds. It is proposed for applications such as memory backup and power peak assist. Electric double-layer capacitors (supercapacitors) have a very large capacitance of several tens of millifarads or more, excellent charge and discharge cycle characteristics, rapid charging and discharging capabilities, and features such as a wide temperature range and environmental friendliness.
![[Analysis Case] Measurement of Impurity Concentration on the Surface and Inside of SiC Substrates](https://image.mono.ipros.com/public/product/image/b28/2000999624/IPROS35315001111634549606.jpeg?w=280&h=280)
Analysis of the substrate surface and interior is separated using ICP-MS and GDMS.
Impurities contained in semiconductor materials can affect product quality, leading to issues such as leakage current and early device failure. Therefore, understanding the amount of impurities in the materials is crucial for improving product quality. This document presents a case study on SiC substrates, which are gaining attention as power device materials, analyzing impurities adhered to the substrate surface using ICP-MS and impurities within the substrate using GDMS. Measurement methods: ICP-MS, GDMS Product fields: Power devices, manufacturing equipment, components Analysis purpose: Trace concentration evaluation For more details, please download the document or contact us.
PCB design for high-speed signals in semiconductor test boards.
In semiconductor test boards, we accommodate the design of high-speed signals of various standards. Based on our past experience, we provide appropriate PCB design.
Using thick copper to ensure current.
If it is not possible to increase the wiring width due to reasons such as wanting to carry a large current, not being able to change the substrate size, or not being able to secure component space, we propose a design that uses thick copper to ensure the current capacity.
One-stop service from design development to mass production, achieving quality and short delivery times!
We are expanding our business areas related to printed circuit boards and have established a consistent production system (ADAMS) that encompasses everything from the design of product software and hardware to manufacturing and assembly, all conducted in-house. By leveraging the new technological capabilities and manufacturing abilities that arise from the communication environment and human resource development cultivated through our integrated "design-manufacturing-implementation" system, we continue to provide enhanced business services and flexibly respond to our customers' increasingly diverse and sophisticated needs.
High-resolution SEM images available! Contract services for image observation of semiconductor substrates, LCD substrates, electronic device substrates, and more.
Rin Junyaku Kogyo Co., Ltd. has been developing and evaluating functional chemicals such as etching solutions and stripping solutions as a manufacturer of chemical solutions for electronic materials. Based on the know-how gained from development and evaluation, we can perform image observation tailored to your needs. For image observation, we can provide high-resolution SEM images using ultra-high-resolution FE-SEM (in-lens). Additionally, we can accommodate detailed image observation through processing at specific locations using FIB equipment. We also flexibly support chemical processing (Dip, Spray). We conduct image observation and chemical processing for semiconductor substrates, LCD substrates, electronic device substrates, and contribute to improving evaluation efficiency. 【Recommended for those who:】 ■ Need high-resolution SEM images ■ Do not own observation equipment ■ Have a large volume of image observation tasks ■ Want to improve evaluation efficiency ■ Do not own chemical processing equipment *For more details, please refer to the PDF materials or feel free to contact us.
A rich lineup tailored to various applications! Featuring flexible printed circuit boards!
This catalog features the "Flexible Printed Circuit Boards (FPC)" from Okiden Cable Co., Ltd. Our products are printed circuit boards designed to be bendable, using a thin insulating material (plastic film) as the substrate. They can accommodate component mounting and can be used as connection wiring. In addition to standard products, we offer "High-Flex FPC" that demonstrates excellent bending performance even in narrow spaces, and "Self-Supporting Sliding FPC" that can bend while standing in mid-air. 【Featured Products (Partial)】 ■ Standard Products (Single-Sided FPC, Double-Sided FPC, Flex-Rigid) ■ High-Flex FPC ■ High-Speed Transmission FPC ■ Long-Length FPC ■ Long-Length High-Speed Transmission FPC *For more details, please refer to the PDF document or feel free to contact us.
Reliable technology to achieve required functions and performance! Introducing our hardware development business.
Cosmo Information Systems Co., Ltd. has been engaged in research, development, design, manufacturing, and maintenance of various control devices based on the extensive experience we have accumulated so far. In our "Hardware Development Business," we provide design technology for microcontroller and CPU-equipped circuits. Focusing on Microchip Technology's PIC microcontrollers, we can accommodate a variety of architectures for different microcontrollers/CPUs. [Development Areas] ■ Analog and digital mixed electronic circuit design technology ■ Design technology for various microcontroller-equipped unit boards ■ Firmware development technology for various microcontrollers *For more details, please refer to our catalog or feel free to contact us.
One-of-a-kind, also accommodating multiple productions! Universal board manufacturing with circuit diagrams and specified component placement.
Optolink Co., Ltd. is a company that deals with a wide range of light-related products, including LEDs. In addition to the sale of electronic components primarily focused on LEDs, we also engage in design, development, import, and export, as well as the design and development of circuit boards and circuits, and the design, development, and sale of PCB assembly products. 【Recruitment Achievements】 - Manufactured universal circuit boards based on circuit diagrams and specified component placement - Capable of producing both one-off and multiple units For more details, please contact us or download the catalog.
We manufacture a variety of flat through-hole printed circuit boards.
By filling in only the BGA/CSP section, we are able to flatten the surface mount pads (compatible with 0.35mm pitch) and permanently fill all mini Via holes, among other variations, allowing us to manufacture a wide range of flat through-hole PCBs according to product specifications.
Filling holes on pads is possible for a board thickness of up to 4.8t! We support the manufacturing of BGA and CSP areas.
"Pad on Via" is a printed circuit board that supports the manufacturing of BGA and CSP areas. The filling of Pad on Via holes can accommodate a board thickness of up to 4.8t, with drill diameters ranging from φ0.105mm to φ1.0mm. (Consultation available depending on specifications) Additionally, we can achieve permanent filling of vias according to customer requests. The permanent filling ink is processed smoothly through polishing. 【Process Example】 ■ NC drilling ■ Primary copper plating ■ Hole filling ■ Curing and polishing ■ Secondary copper plating ■ Pattern formation *For more details, please refer to the PDF document or feel free to contact us.
We respond to diverse needs, focusing on the prototype manufacturing of printed circuit boards from single-sided boards to multilayer boards!
Screen Process was established with the aim of providing screen printing plate services and expanded into the printed circuit board business in 1992, continuing to the present day. Printed circuit boards are often referred to as the heart of the electronics industry, and due to remarkable technological innovations in recent years, they have transitioned to high density, high functionality, and high multilayering. Our company strives to meet various customer needs by pursuing high quality, high precision, and short delivery times, while also making efforts to respond accurately to the demand for lower prices. Furthermore, we aim to deliver products that anticipate future directions and contribute to a prosperous future. 【Business Content】 ■ Printed Circuit Boards (multilayer boards, BGA/CSP high-density substrates, pad-on-via, aluminum substrates, and prototypes of other special wiring boards for consumer and industrial use) ■ Laser drawing, CAM editing, precision industrial photography, and a full range of screen plate services *For more details, please refer to the PDF document or feel free to contact us.
