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substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. null/null
  3. 三和電子サーキット Osaka//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 モリマーエスエスピー Osaka//Resin/Plastic 本社
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substrate Product ranking

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
  2. Aluminum foil etched circuit board
  3. Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.
  4. 4 Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

substrate Product List

106～120 item / All 676 items

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DC input constant current circuit board

DC input constant current circuit board

Compatible with LEDs manufactured by Nippon Kayaku and Lumileds.

This product is a constant current board compatible with LEDs from Nichia Chemical and Lumileds. The board size is 65mm in length, 65mm in width, and 25mm in height, with an output current of approximately 0.07A to 2.7A. Current adjustment is possible using the dimming volume located on the board. In addition to this board, we offer a variety of constant current boards, so please feel free to contact us. 【Features】 ■ Compatible with LEDs from Nichia Chemical and Lumileds ■ Current adjustment available *For more details, please refer to the catalog or feel free to contact us.

  • LED
  • Other electronic components and modules

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Various ceramic substrates

Various ceramic substrates

Patterning is possible on various ceramics such as zirconia and barium titanate!

We would like to introduce the "various ceramic substrates" that we handle. Not only aluminum nitride and alumina, but also various ceramics can be patterned. We will procure materials. Please consult with us first. 【Lineup】 ■ Dielectric ceramics ■ PZT ■ Sapphire ■ Zirconia ■ Ferrite ■ Mica ■ Steatite ■ Beryllia ■ Barium titanate ■ Forsterite, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Ceramics

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Glass substrate

Glass substrate

Introducing substrates suitable for devices that require high transparency, such as solar panels, sensors, and LEDs!

The "glass substrate" is a substrate based on soda lime, Tempax, quartz, etc. It has very high transparency and is recommended for applications such as vehicle collision avoidance systems (detection sensors) like lasers and cameras, display devices, solar panels, sensors, and LEDs. It is also possible to pattern the resistive elements into any shape, and it can be manufactured as a heat source (heater substrate). Please contact us if you need assistance. 【Features】 ■ Patterning is possible on soda lime, Tempax, quartz, etc. ■ Patterning can also be done on three-dimensional shapes like test tubes and beakers. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Glass

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Arrow Industries Printed Circuit Board

Arrow Industries Printed Circuit Board

With the technology cultivated over many years, we will meet our customers' needs.

Since starting the prototype of single-sided printed circuit boards in 1972, we have been dedicated to manufacturing printed wiring up to the present day. We are also involved in the design of printed wiring patterns and the production of nameplates.

  • Printed Circuit Board

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UV high-reflective resist substrate

UV high-reflective resist substrate

Heat dissipation performance and durability are fused! UV high-reflective resist enables long lifespan for mounted components and substrates.

The developed UV high-reflective resist substrate features a metal substrate (copper or aluminum) with high heat dissipation properties, which is used as a heat dissipation substrate. By applying a self-developed inorganic resist ink, it prevents the degradation of the resist on the substrate. Furthermore, this resist ink has successfully achieved over 80% reflection of ultraviolet light (UV-A, UV-B, UV-C). In the case of standard white resist, prolonged exposure to UV light causes the resist applied on the substrate to yellow and degrade. By using our self-developed UV high-reflective resist, we can prevent substrate degradation and efficiently reflect UV-LED light. 【Features】 ■ Self-developed product ■ Maintains high reflectivity even in the UV-C range ■ Requires long-term reliability *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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Printed circuit board "Side plating / Dissimilar material bonding / Cavity substrate"

Printed circuit board "Side plating / Dissimilar material bonding / Cavity substrate"

Achieve shield effect! Side plating substrate capable of forming half-through holes on the side parts.

At Meito Electric Co., Ltd., we manufacture and sell printed circuit boards such as "side-plated substrates," "dissimilar material laminated substrates," and "cavity substrates." The "side-plated substrate" achieves a shielding effect by applying plating treatment to the outer edge surface of the substrate. The "dissimilar material laminated substrate" allows for combinations tailored to your needs, such as laminating high-frequency materials with epoxy resin. The "cavity substrate" can be produced more easily than structures that embed electronic components into the substrate. 【Features】 ○ Side-plated substrate: → Half through-holes can be formed on the side surface → Plating can also be formed around the entire circumference of the substrate's side surface ○ Dissimilar material laminated substrate: → Various sizes are available to accommodate small quantities of diverse multilayer workpieces → Supports surface treatments such as heat-resistant flux, lead-free solder leveling, and gold plating ○ Cavity substrate: → Enables low-profile modules *For more details, please refer to the PDF document or contact us directly.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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ATE substrate

ATE substrate

Leave the semiconductor inspection device substrate (ATE substrate) to Cygnus.

We manufacture ATE boards at a top-tier overseas manufacturer. We have numerous achievements in probe cards, performance boards, burn-in boards, and more. AW design support (domestic) is also available.

  • Printed Circuit Board

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Custom power supply circuit board for railway vehicles.

Custom power supply circuit board for railway vehicles.

We will provide power supply units with excellent mass production capabilities, utilizing the extensive production know-how cultivated in the implementation industry.

The characteristic of our in-house power supply is its excellent mass production capability. To reduce mass production costs and improve mass production quality, we will make the most of our 35 years of implementation know-how and component procurement know-how. Additionally, regarding production locations, we can choose from Japan (Tochigi Prefecture) and China (Shenzhen in Guangdong Province, Wuxi in Jiangsu Province), regardless of lot size. We have established a system where all bases can perform production at the same level.

  • Circuit board design and manufacturing

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TAB flexible substrate

TAB flexible substrate

Quality improvement is achievable through the non-contact method using the reel-to-reel process! Please consult us first, regardless of large lots.

The printed circuit board "TAB flexible board" supports a variety of FPCs from prototyping to mass production through R to R lines. Additionally, we conduct simulations from the circuit design stage to provide high-performance, high-quality products. All products are quality assured through automatic visual inspection and electrical testing. We possess a variety of analytical equipment to confirm quality and measure/length at each stage. We offer FPCs compliant with RoHS and made from flame-retardant materials. 【Features】 ■ Mass production of FPCs is realized through R to R ■ We have Ni (nickel)/Au (gold) electroplating equipment to achieve quality that meets customer needs ■ The structure formation of inner leads for connection points is realized *For more details, please request materials or view the PDF data available for download.

  • Printed Circuit Board

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Interposer flexible substrate

Interposer flexible substrate

Are you having trouble procuring build-up substrates for the main board?

By adopting it for the IC substrate of the locally high-density part of the main board, it achieves a reduction in the specifications of the main board, which can be used for semiconductor packages and lead frames.

  • Other semiconductors

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Flexible printed circuit board [Reel to Reel method]

Flexible printed circuit board [Reel to Reel method]

We can accommodate everything from mass production to small-batch, diverse production! We contribute to the miniaturization and slimness of modules, expanding design flexibility!

We would like to introduce our "Flexible Printed Circuit Board Production." With the "Reel to Reel Method," we achieve high productivity through automation, including feeding and winding, and can produce high-quality TAB/COF using a non-contact method that minimizes human intervention. Additionally, we also conduct production in sheet form, allowing us to meet a wide range of customer demands. 【Features】 ■ Capable of producing from mass production to small quantities of various types - Supported by both reel to reel method and sheet production ■ Production of high-density fine wiring flexible substrates ■ Line/Space: Below 30μm pitch ■ VIA hole filling copper plating *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Other electronic parts

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[Component Assembly and Various Manufacturing] Flexible Circuit Boards, FPC, Flexible Boards

[Component Assembly and Various Manufacturing] Flexible Circuit Boards, FPC, Flexible Boards

From precision component micro-assembly to assembly wiring and electrical testing, leave it all to us!

- SMD mounting, POP mounting - Bare chip mounting (wire bonding, flip chip mounting) - Device resin encapsulation - Cable and housing assembly - Component replacement, modification - Electrical inspection, operational verification

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis

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【Substrate Analysis Service】FPC・Flexible Substrate

【Substrate Analysis Service】FPC・Flexible Substrate

We will support and propose ideas to enhance development capabilities, working closely with the development technology personnel! FPC

- Circuit investigation - Component investigation (creating parts list, investigating constants and sizes, collecting catalogs) - Design specification investigation (minimum hole diameter, minimum L/S investigation) - Substrate destruction investigation (layer composition, plating thickness, inner layer pattern arrangement) - Substrate non-destructive investigation (X-ray transmission, CT images) - Assembly analysis investigation (solder composition, wettability, bonding strength, etc.) - Quality investigation (thermal shock testing, temperature and humidity cycles, etc.) FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis

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Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)

Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)

It is a flexible substrate that combines heat resistance and transparency. FPC

Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis

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Stretchable flexible printed circuit board (FPC/flexible board)

Stretchable flexible printed circuit board (FPC/flexible board)

It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC

While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis

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