We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 563 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors

substrate Product ranking

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社 和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社 和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

181~210 item / All 1907 items

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Ceramic substrate

It is widely used as a substrate for high-frequency modules and IC packages.

The LTCC substrate from KOA is a "low-temperature co-fired ceramic substrate" made by simultaneously firing wiring conductors and ceramic substrates at temperatures below 900°C. Since wiring patterns can be formed on both the surface and inner layers, multilayering is easy. 【Product Lineup】 LTCC Substrate

  • Semiconductor inspection/test equipment
  • Printed Circuit Board
  • power supply
  • substrate

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[Document] TCS1-/TCS2- Calibration Board Manual

±0.3% high precision load pad equipped! Custom calibration kit can be manufactured.

We would like to introduce the calibration board manual for "TCS1-/TCS2-" handled by Techno Probe Co., Ltd. It includes information such as pad size, pad pitch, pattern names, component symbols, applications, and the positions of components. The product's top view is also included, making it a useful reference when considering implementation. 【Contents】 1. Pattern List 2. Substrate Top View *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit Board Inspection Equipment
  • substrate

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[Document] TCS3-400 Calibration Board Instruction Manual

Equipped with ±0.3% high-precision load pads! Introducing pattern names and applications.

This document includes the positions of elements on the calibration board "TCS3-400," which can be custom-manufactured for dedicated calibration kits. Applications include SOLT, TRL, and Loop Back Thru (8.98 ps delay). It is a simple and easy-to-reference book. Please take a moment to read it. 【Contents (partial)】 ■ Pattern Name ■ Mounted Element Symbols ■ Applications ■ Element Positions *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Document] TCS4-100/150 Calibration Board Instruction Manual

Manufacturing of dedicated calibration kits available (custom)! Introducing TCS4-100/150.

This document contains the specifications for the calibration board "TCS4-100/150" handled by Techno Probe Inc. It features a high-precision load pad with an accuracy of ±0.3%, and is a SOLT/TRL calibrator. It is a simple and easy-to-reference booklet. We encourage you to read it. 【Contents (partial)】 ■Substrate top view ■Pattern list ・Top ・Bottom *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Chiller repair

We provide repair services for various types of chillers!

We can accommodate everything from large chillers to older models. We also offer circuit board repairs. For more details, please contact us.

  • Other semiconductor manufacturing equipment
  • Thermostatic water bath
  • Temperature and Humidity Control
  • substrate

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Development Board Example: "DC24V Heater Control Board"

Introducing examples of development boards created using advanced embedded technology!

At Toyo Electric Co., Ltd., which engages in engineering business, we handle various development boards. The "DC24V Heater Control Board" is a remote I/O unit that notifies the PLC of the input signals collected from thermocouples and performs temperature control based on the PLC's instructions. Our company supports everything from circuit design to embedded software development, providing development tailored to our customers' needs. 【Features】 ■ External Interface - CC-Link ×1ch - IO Port ×10ch ■ Thermocouple Input ×10ch *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Circuit board design and manufacturing
  • Control Panel
  • substrate

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Development Board Example: "Power Control Board"

Introducing examples of development boards created using advanced embedded technology!

At Toyo Electric Co., Ltd., which engages in engineering business, we handle various development boards. The "Power Control Board" is a board that controls voltage in the range of 15V to 24V based on instructions from external FPGAs or microcontrollers. This board can control five circuits simultaneously. Our company supports everything from circuit design to embedded software development, providing development tailored to our customers' needs. 【Features】 ■ Number of control circuits: 5 circuits ■ Input voltage: 24V ■ Output voltage range: 15V to 24V *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Circuit board design and manufacturing
  • Control Panel
  • substrate

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Solenoid Control Board "Multi Controller A"

Just connect the power and press the switch to operate the solenoid!

We handle the solenoid control board "Multi Controller A." The solenoid operates simply by connecting the power supply and pressing the switch. Up to 4 solenoids can be controlled from the switches on the board or from a microcontroller. 【Features】 ■ Solenoid operates just by connecting the power supply and pressing the switch ■ Up to 4 solenoids can be connected ■ Can also be connected to a microcontroller ■ Power supply can be AC adapter, battery, etc. (microUSB is also acceptable) *For more details, please refer to the PDF document or feel free to contact us.

  • Solenoid Actuators
  • Other machine elements
  • substrate

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Solenoid Control Board "Multi Controller USB"

You can connect the 5V solenoid with a board (SSAH0830, SSBH0830) to the solenoid kit!

We handle the solenoid control board "Multi Controller USB." It can be connected to 5V board solenoids (SSAH0830, SSBH0830) and solenoid kits. Up to 4 solenoids can be controlled from a switch on the board or from a microcontroller. 【Features】 ■ The solenoid operates simply by connecting the power and pressing the switch. ■ Up to 4 solenoids can be connected. ■ Can also be connected to a microcontroller. ■ Compatible with 5V board solenoids and solenoid kits. *For more details, please refer to the PDF document or feel free to contact us.

  • Solenoid Actuators
  • Other machine elements
  • substrate

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ZU15, 25 compatible attachment board

We handle both attachment boards and MG series implementations!

This product is a compatible attachment board that can be used with the alternative models "MG15, 30 series" due to the discontinuation of the ZU15, 25 series. It has the same pin configuration as the "ZU15, 25 series." We offer a total of four types of compatible attachment boards. 【Features】 ■ Equipped with MG15, 30 series ■ Same pin configuration as ZU15, 25 series ■ A total of four types of compatible attachment boards available ■ Attachment board + MG series implementation *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Mirror Polishing Machine "SMAP-III Type"

A larger indoor space than the SMAP-II type! The workspace is more than three times larger, and both rough and finished work can be done with this one machine.

The "SMAP-III type" is a medium-sized mirror shot machine that excels in balance. The workspace is more than three times that of the "SMAP-II type," and it can handle both rough and finishing work with this one machine. There are also power-type and finishing-specialized models available in the same size. Please feel free to contact us when you need assistance. 【Specifications (excerpt)】 ■ Input power supply: Three-phase 200V 50/60Hz 9A ■ Air inlet/usage: Φ6 100L/min (0.6MPa) ■ Body dimensions (excluding side doors): W865×H1900×D975 (mm) ■ Weight: 200kg ■ Power: Main motor 400W, elevator motor 40W, dust collector 400W ■ Media usage: 6L *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • substrate

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Mirror Polishing Machine "SMAP-A1 Type"

By adopting a pencil-type nozzle, it is possible to precisely process fine details!

The "SMAP-A1 type" is a mirror shot machine specifically designed for ultra-fine shapes. It is specialized for processing extremely small parts and fine details. By adopting a pencil-type nozzle, it enables precise machining of intricate areas. With SS media (exclusive to A1 type, ultra-small size), even finer polishing of details can be achieved. Please feel free to contact us when you need assistance. 【Specifications (excerpt)】 ■ Input power: Single-phase 100V 150W ■ Air inlet/usage: Φ8 150L/min (0.6MPa) ■ Main body dimensions (excluding side door): W500×H1570×D750 (mm) ■ Weight: 90kg ■ Media usage: 1L *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • substrate

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Mirror Polishing Machine "SMAP-II Type"

It's an entry-level model, but it has high versatility! It can handle both rough and finished work with just this one machine.

The "SMAP-II type" is a compact general-purpose mirror shot machine. It is an entry-level model, but it has high versatility. It can handle everything from rough to finishing polishing with this one machine. Additionally, we have sales records for it. Please feel free to contact us when you need it. 【Specifications (excerpt)】 ■ Input power: Three-phase 200V 50/60Hz 7A ■ Air outlet/usage: Φ6 100L/min (0.6MPa) ■ Main body dimensions (excluding side door): W530×H1735×D850 (mm) ■ Weight: 120kg ■ Power: Main motor 400W, elevator motor 25W, dust collector 350W ■ Media usage: 3L *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • substrate

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Special technology metal substrate

Printed circuit board with enhanced heat dissipation and heat resistance.

There are two types of printed circuit boards that enhance heat dissipation and heat resistance: a metal base substrate with circuits formed on a metal plate, and a metal core substrate with a metal plate sandwiched inside the substrate. The metal materials can be selected from aluminum, copper, and others.

  • Printed Circuit Board
  • substrate

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Substrate "High Current Substrate (Thick Copper Circuit Substrate)"

A high-current board that can minimize current loss compared to the design value!

The substrate is a high-current board that allows for the selection of circuit formation methods based on conductor thickness. If the conductor thickness is 300μm or more, half-etching can be accommodated. This method can reduce the top and bottom widths of the pattern compared to conventional etching methods, minimizing current loss relative to design values. 【Features】 ■ Selection of circuit formation methods based on conductor thickness ■ Half-etching can be accommodated with a conductor thickness of 300μm or more ■ Ability to reduce the top and bottom widths of the pattern ■ Minimal current loss relative to design values *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Special Printed Circuit Board "Aluminum Heat Sink Substrate"

High heat dissipation aluminum heat sink substrate with an integrated structure of aluminum base substrate and heat sink.

The "Aluminum Heat Sink Substrate" is a substrate that layers a high thermal conductivity insulating layer and circuits onto extruded aluminum heat sink material. It features surface roughening effects and weather resistance due to anodizing treatment, securing more than five times the surface area compared to conventional products. By combining with high thermal conductivity resin, it offers heat dissipation specifications that far exceed those of conventional products. There is absolutely no thermal transport loss, unlike retrofitted heat sinks. It also enables cost reduction in assembly due to its integrated structure, leading to a decrease in total costs. 【Features】 ■ Significantly improved heat dissipation characteristics ■ No thermal transport loss ■ Increased design flexibility for fins ■ Increased design flexibility for enclosures ■ Reduction in assembly costs ■ No need for material procurement *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • substrate

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Special Printed Circuit Board "High Current Board"

It is possible to handle large currents on the printed circuit board due to the thick copper pattern!

The "Thick Copper Substrate" enables the realization of circuits with copper thicknesses up to 2000μm, making it possible to handle large currents. It is highly effective for miniaturizing devices with high loads. Additionally, due to its excellent thermal characteristics, it can also be used as a substrate that has a GND function while excelling in thermal diffusion. Furthermore, by stacking the conventional external bus bar as an inner layer circuit, EMI control becomes easier, reducing noise interference with peripheral devices. It frees you from three-dimensional wiring, reduces bus bar processing costs and assembly costs, and achieves space-saving. 【Features】 ■ Enables handling of large currents on printed circuit boards with thick copper patterns ■ Achieves a circuit thickness of 2000μm ■ Ideal for mounting power devices ■ Patent obtained *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • substrate

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Printed circuit board (for DIY amplifiers, etc.) T-AMP06/T-AMP07

This is a convenient printed circuit board! (Can be used for DIY amplifiers, etc.)

○ Ideal for situations such as "a little gain is lacking" or "wanting to convert impedance due to equipment constraints" in the production of measurement and control devices and systems. High-performance operational amplifiers that meet these requirements. ○ Two types are available according to application: [T-AMP06] Feedback and other multi-purpose OPAMP amplifier circuit board. [T-AMP07] Voltage level offset and other multi-purpose OPAMP amplifier circuit board. ○ Board dimensions: 74×43×1.6mm Mounting holes: Φ3.2×6 Mounting hole pitch: 54×33mm, etc. ○ Custom-made options are also available.

  • Printed Circuit Board
  • substrate

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Printed circuit board (for DIY amplifiers, etc.) T-AMP09/T-AMP11

This is a convenient printed circuit board! (Can be used for DIY amplifiers, etc.)

○ Ideal for situations such as "the gain is a bit insufficient" or "I want to change the impedance due to equipment constraints" in the production of measurement and control devices and systems. High-performance operational amplifiers that meet these requirements. ○ Two types are available in the lineup according to application: [T-AMP09] Absolute value circuit (full-wave rectifier circuit) [T-AMP11] Differential input measurement amplifier, with variable resistor for common mode rejection and variable resistor for offset setting of each OP-AMP. ○ Custom-made options are also available.

  • Printed Circuit Board
  • substrate

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Component Mounting Data Creation Support System 'PC-MountCAM'

Significantly reduce the time required for creating drawings and specifications, achieving remarkable efficiency improvements!

In recent years, electronic devices have required a significant acceleration in the development cycle, leading to shorter lead times from the design of printed circuit boards to manufacturing and component assembly. 'PC-MountCAM' is a new concept platform centered around component mounting data, which drastically reduces the time required for creating assembly drawings, specifications, and setup, achieving remarkable efficiency that enhances competitiveness. 【Features】 ■ Mounting data and Bill of Materials (BOM) conversion function Automatically recognizes and converts mounting coordinate text data output from various CAD systems and formats for mounting data for assembly machines. ■ Gerber and drill image display By reading Gerber data and NC data as a board image, it allows for the preparation of assembly drawings and assembly data to begin even before the actual board is completed. *For more details, please refer to the PDF document or feel free to contact us.

  • Software (middle, driver, security, etc.)
  • others
  • substrate

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Selective Soldering Program Creation System "Freedom"

Optimize the soldering program based on CAD data! Software to control the equipment.

"Freedom" is a program creation system for selective soldering equipment. By setting the pins that connect to the ground layer, it automatically adjusts the nozzle's operation and speed considering the required heat amount. When soldering with multiple devices, it can automatically allocate tasks to ensure uniform takt time for each device. It is equipped with a check function and features aimed at reducing data creation time and processing time. Additionally, our company will be exhibiting at the 38th "Internepcon Japan Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight. We sincerely look forward to your visit. [Benefits] ■ Error checking of nearby components before processing is possible ■ Shortening of program creation time by accumulating component information ■ Automatic setting of optimal soldering routes to reduce processing time *For more details, please refer to the PDF materials or feel free to contact us.

  • Other core systems
  • substrate

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Flexible printed circuit board

Flexible printed circuit boards with high design freedom are our specialty. We can accommodate designs using customer-specified materials.

We will prepare your preferred printed circuit board! Our flexible printed circuit boards, known for their high design freedom, are suitable for mass production. You can view our flexible printed circuit boards by downloading the catalog. → If you are considering mass production, please contact us.

  • Printed Circuit Board
  • substrate

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Foresight glass print wiring board

We will form circuit patterns of thick copper on glass using the subtractive method and semi-additive method.

It has a high transmittance and can be used for substrates of optical passive components. It has a low coefficient of thermal expansion, excellent dimensional stability, and mounting reliability. It has minimal warping, excellent flatness, and is easy to mount.

  • Touch Panel
  • substrate

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Foresight Inc. Company Profile

We aim to be a trading company focused on realizing customer solutions as our top priority, through development and proposals.

Foresight Co., Ltd. is not just a traditional trading company that sells mere "products" in the flat panel display industry, but aims to be a development and proposal-oriented trading company that prioritizes realizing customer solutions. In the industrial sector, we are forced to undergo structural reforms, and waves of technological innovation are continuously emerging, demanding rapid changes and developments. In this environment, we will leverage the information network we have cultivated over many years to pursue speedy and dynamic business development. 【Sales Items】 ■ Touch panel related components ■ LCD related components ■ OLED related components ■ Equipment related ■ Lamination process related ■ New development *For more details, please refer to the PDF materials or feel free to contact us.

  • Touch Panel
  • LCD display
  • Processing Contract
  • substrate

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Flat mirror substrate for laser optics

Dielectric laser mirrors and precision flat mirror substrates for metal coatings.

Spectral Optics offers precision flat mirror substrates for dielectric laser mirrors and metal coatings. These are ideal for optical path bending, various imaging systems, and laser applications.

  • Other processing machines
  • substrate

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5.7-inch Kyocera LCD LED backlight power supply board

This is a power supply board for the original LED backlight of the Kenik system.

The "KSLBC-2" is an LED backlight power supply board for Kyocera's 5.7-inch LCD (LED backlight type). 【Features】 - It can be easily configured with a general-purpose microcontroller for ON/OFF and brightness adjustments. Additionally, it can be directly controlled from our LCD controller. - It uses a device with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 60×15mm. *For more details, please visit our website or contact us.

  • controller
  • substrate

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Flexible Printed Circuit (FPC) "Long-Length FPC"

Achieving a length of 100m! Introducing a flexible circuit board that can handle long-distance wiring.

The "Long-Length FPC" is a flexible printed circuit board (FPC) that can accommodate lengths of up to 100 meters without seams or folds. In addition to being thin, light, soft, and able to take on various shapes, it achieves wiring lengths comparable to traditional cables. It can be used in large FA equipment and large lighting devices, and is also adopted for wiring in space development equipment such as satellites. 【Features】 ■ Can be used as an alternative to cables ■ Weighs about 1/100th compared to cables, making it lightweight ■ Thickness is approximately 0.1mm at most, allowing for installation in minimal spaces ■ Reduces the likelihood of miswiring compared to cables, improving work efficiency during assembly *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Heat-resistant substrate (FPC) "Heat-resistant FPC"

An FPC that can withstand continuous use for 1,000 hours at a high temperature of up to 150℃ has been developed.

The "Heat-Resistant FPC" is a heat-resistant substrate (FPC) that excels in heat resistance, allowing for continuous use in high-temperature environments. By leveraging the inherent characteristics of FPC, such as high-density wiring, collective connectivity, and lightweight design, which were previously impossible in high-temperature environments, it contributes to new wiring styles in fields such as medical, lighting, and industrial equipment. 【Features】 ■ Can be used without issues in electrical characteristics even after 1,000 hours at 150°C ■ Maintains adhesion strength of the insulating film ■ Allows for the direct use of conventional FPC design rules *For more details, please refer to the PDF document or feel free to contact us.

  • Board to FPC connector
  • substrate

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Leave it to us for printed circuit boards! Technology development to meet new market needs.

Leave it to us for all your substrate needs! We respond to various requests regarding substrates and provide direct support at any stage.

Our company is engaged in technology development with an eye toward the future, collaborating with material and component manufacturers to meet the needs of new technological areas and markets. Leveraging our advanced technological capabilities, we provide products that meet customer needs, ranging from general through-hole substrates to high-density wiring substrates for smartphones, high-frequency support that underpins the evolution of IoT and mobility, heat dissipation solutions that are robust in harsh environments, and flexible substrates. Additionally, we are also developing high heat dissipation high-frequency substrates using a "high-speed thick copper plating method" that contributes to heat dissipation measures for power semiconductors and high heat dissipation high-frequency components. 【Products Offered】 ■ High-density wiring substrates ・ Build-up substrates ・ IVH substrates ・ Any-layer substrates ■ High-frequency support/heat dissipation substrates ■ Flexible substrates *For more details, please refer to the related links or feel free to contact us.

  • Contract manufacturing
  • substrate

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Complete in-house one-stop solution from development to mass production.

Achieve a shorter development period and reduced total costs! Comprehensive in-house support from circuit design, PCB design, PCB manufacturing, component procurement to assembly!

Comprehensive manufacturer of printed circuit boards "Kyoden" will solve your concerns regarding delivery times, prices, and technology in "monozukuri" (manufacturing)! ■ Full support from prototyping to mass production ■ Owns four domestic factories in Tohoku, Nagano, Shizuoka, and Osaka, as well as a factory in Thailand ■ Achieves reliable domestic production and global supply ■ Approximately 5,000 design projects annually ■ Supports various types of boards from single-sided to multi-layer and build-up ■ Equipped with 7 SMT lines, and assembly services are also robust ■ Strengthening facilities in the four domestic factories If you are having trouble with electronic components, please consult with us. We will procure suitable parts from a network of about 300 companies both domestically and internationally. We have four SMD towers, ensuring reliable inventory management. Please contact Kyoden for high quality, low prices, and short delivery times! *For more details, please download the catalog or contact us.

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  • Printed Circuit Board
  • substrate

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