Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
76～90 item / All 675 items
Using thick copper to ensure current.
If it is not possible to increase the wiring width due to reasons such as wanting to carry a large current, not being able to change the substrate size, or not being able to secure component space, we propose a design that uses thick copper to ensure the current capacity.
Filling holes on pads is possible for a board thickness of up to 4.8t! We support the manufacturing of BGA and CSP areas.
"Pad on Via" is a printed circuit board that supports the manufacturing of BGA and CSP areas. The filling of Pad on Via holes can accommodate a board thickness of up to 4.8t, with drill diameters ranging from φ0.105mm to φ1.0mm. (Consultation available depending on specifications) Additionally, we can achieve permanent filling of vias according to customer requests. The permanent filling ink is processed smoothly through polishing. 【Process Example】 ■ NC drilling ■ Primary copper plating ■ Hole filling ■ Curing and polishing ■ Secondary copper plating ■ Pattern formation *For more details, please refer to the PDF document or feel free to contact us.
You can assemble circuits without wiring!!
The op-amp board "PX1010" can accommodate two 8-pin dual op-amps or one 14-pin quad op-amp, allowing for the easy construction of many basic op-amp circuits by simply placing circuit components in the appropriate positions, much like a jigsaw puzzle. The compatible op-amp packages are DIP with a pin pitch of 2.54 mm or SOP with a pin pitch of 1.27 mm. In addition to axial and radial components, 1608 chip components can also be used for other circuit parts. There is a sister product, the universal board "PX0001" for single DIP op-amps.
![RF probe and calibration board [Wide frequency range, pitch, excellent durability!]](https://image.mono.ipros.com/public/product/image/8e8/2000345762/IPROS2066429142905764199.png?w=280&h=280)
An RF probe and calibration board with a wide frequency range, pitch, and excellent durability!
Our company offers RF probes and calibration substrates with a wide frequency range, pitch, excellent durability, all at a low price. Thanks to our unique tip shape, stable contact can be achieved with minimal skating during contact, reducing damage to devices and ensuring high reproducibility. The calibration assist software already has product data for the "Allstron TITAN Probe Series" registered, allowing you to use it immediately by simply selecting a probe. 【Product List】 ■Allstron RF Probe "TITAN" ■Allstron RF Probe "TITAN-RC" ■RF Calibration Substrates "AC" ■Calibration software "QAlibria" *For more details, please request materials or view the PDF data available for download.
This is a board that controls the BS3G30 digital step attenuator with a 6-bit parallel interface.
● By combining with BS3G30, the attenuation can be varied in 0.5dB steps up to a maximum of 31.5dB. ● This board operates with a single +5V power supply. ● A +5V AC adapter is not included, so please prepare one that is compatible with the specifications of this board.
A transparent flexible substrate with wiring that cannot be seen with the naked eye.
It is a flexible substrate with invisible wiring that has a total light transmittance of 92.0% and allows for component mounting.
Transparent antenna substrate for the fifth generation mobile communication system that cannot visually see more wiring.
It is a transparent 5G antenna film. It can be used for antennas and reflectors in areas that are not visible to the eye. The sheet resistance of the wiring is low at 1.42 mΩ/□, allowing for the creation of high-performance antennas.
A polycarbonate substrate that seems like it should exist but doesn't.
【Product Features】 1. Stronger than resins such as acrylic and polyethylene terephthalate. 2. Compatible with a wide range of environments, from low to high temperatures. 3. Excellent affinity and processability for film insert molding.
We handle everything from the design and development of various microcontroller controllers to printed circuit board assembly and controller assembly.
We will strive for further "evolution and development" under the theme of "Creation, Evolution, and Development Enterprises."
We provide support for everything from the design and development of various microcontroller controllers to printed circuit board assembly and controller assembly.
We will strive for further "evolution and development" under the theme of "Creative, Evolving, Developing Enterprises."
