Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
61～75 item / All 675 items
Flexible printed circuit boards with high design freedom are our specialty. We can accommodate designs using customer-specified materials.
We will prepare your preferred printed circuit board! Our flexible printed circuit boards, known for their high design freedom, are suitable for mass production. You can view our flexible printed circuit boards by downloading the catalog. → If you are considering mass production, please contact us.
We will form circuit patterns of thick copper on glass using the subtractive method and semi-additive method.
It has a high transmittance and can be used for substrates of optical passive components. It has a low coefficient of thermal expansion, excellent dimensional stability, and mounting reliability. It has minimal warping, excellent flatness, and is easy to mount.
Dielectric laser mirrors and precision flat mirror substrates for metal coatings.
Spectral Optics offers precision flat mirror substrates for dielectric laser mirrors and metal coatings. These are ideal for optical path bending, various imaging systems, and laser applications.
This is a power supply board for the original LED backlight of the Kenik system.
The "KSLBC-2" is an LED backlight power supply board for Kyocera's 5.7-inch LCD (LED backlight type). 【Features】 - It can be easily configured with a general-purpose microcontroller for ON/OFF and brightness adjustments. Additionally, it can be directly controlled from our LCD controller. - It uses a device with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 60×15mm. *For more details, please visit our website or contact us.
Achieving a length of 100m! Introducing a flexible circuit board that can handle long-distance wiring.
The "Long-Length FPC" is a flexible printed circuit board (FPC) that can accommodate lengths of up to 100 meters without seams or folds. In addition to being thin, light, soft, and able to take on various shapes, it achieves wiring lengths comparable to traditional cables. It can be used in large FA equipment and large lighting devices, and is also adopted for wiring in space development equipment such as satellites. 【Features】 ■ Can be used as an alternative to cables ■ Weighs about 1/100th compared to cables, making it lightweight ■ Thickness is approximately 0.1mm at most, allowing for installation in minimal spaces ■ Reduces the likelihood of miswiring compared to cables, improving work efficiency during assembly *For more details, please refer to the PDF document or feel free to contact us.
An FPC that can withstand continuous use for 1,000 hours at a high temperature of up to 150℃ has been developed.
The "Heat-Resistant FPC" is a heat-resistant substrate (FPC) that excels in heat resistance, allowing for continuous use in high-temperature environments. By leveraging the inherent characteristics of FPC, such as high-density wiring, collective connectivity, and lightweight design, which were previously impossible in high-temperature environments, it contributes to new wiring styles in fields such as medical, lighting, and industrial equipment. 【Features】 ■ Can be used without issues in electrical characteristics even after 1,000 hours at 150°C ■ Maintains adhesion strength of the insulating film ■ Allows for the direct use of conventional FPC design rules *For more details, please refer to the PDF document or feel free to contact us.
Gold / Silver / Aluminum / ITO coated substrate (slide glass / cover slip / silicon wafer / mica)
Surface plasmon resonance (SPR), microarrays, biosensors, nanotechnology, neurobiology, self-assembled monolayers (SAM), X-ray diffraction (XRD), semiconductors, and a variety of research applications can utilize atomic force microscopy (AFM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), and other electron microscopy techniques. In addition to slide glass, we also offer silicon wafers and mica substrates. The main coatings are gold (Au), silver (Ag), aluminum (Al), and ITO. High-reflectivity gold-coated slides are ideal for observing backscattered electron images (BSE) (10-15 eV) and secondary electron images (SE) (5 eV) using SEM. For backscattered electron images <BSE>, a gold thickness of 10 nm is recommended, while for secondary electron images <SE>, products of 50/100 nm are suggested.
Over 10 years of manufacturing experience for substrates for thermoelectric modules (Peltier elements). For power devices, solid-state relays (SSR), and more!
This is an insulating substrate for heat dissipation, which has a copper circuit board bonded to an alumina ceramic substrate using the DCB (Direct Copper Bond) method. *DCB (Direct Copper Bond) method refers to the technique of bonding a copper circuit board to a ceramic substrate through eutectic reaction. **Features** - Over 10 years of manufacturing experience for substrates used in thermoelectric modules (Peltier elements). - Manufactured at a 100% wholly-owned subsidiary in China. - Options for alumina ceramic white boards from Japan, Germany, or China. - The ceramic substrate can flexibly accommodate various external dimensions through mold processing, laser processing, etc. - The ceramic white board and copper plate are bonded using in-house equipment, and copper plating processes such as etching are applied before shipment. - The surface of the copper circuit can be treated in various ways, including untreated, Ni plating, and Ni + Au plating. *For more details, please contact us or download the PDF.*
We will provide high-quality substrates just in time.
We provide high-quality printed circuit boards just in time. From prototyping to mass production, we offer a wide range of responses tailored to the needs of both domestic and overseas PCB manufacturers. 【Features】 - Flexible printed circuit boards (FPC) - PET boards - IC tag inlets - Rigid single-sided to high multilayer - IVH/BVH boards - Build-up boards - Metal core boards - Aluminum boards - High current boards - Halogen-free compliant *For details, please request our materials.
We consistently carry out everything from crystal growth of single crystal sapphire to cutting, grinding and polishing, PSS processing, GaN epitaxial growth, and special processing!
In the doujin industry, we mainly provide sapphire materials using the Kyropoulos method. Our sapphire substrates are produced in domestic factories as well as through contract manufacturing with reputable overseas manufacturers.
We offer single crystal lithium niobate (LN / LiNbO3) ingots, wafers, and special processing.
Product Name: Single Crystal Lithium Niobate (LN / LiNbO3) Size: Φ2”, Φ3”, Φ4”, Φ6” Orientation: Specifiable Thickness: 250um, 350um, 500um, Specifiable Finish: Single-sided mirror, Double-sided mirror, Others Quantity: 10 pieces or more, Mass production available Manufacturing: Made in Japan, Made in China
