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substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Jul 16, 2025~Aug 12, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jul 16, 2025~Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. null/null
  3. 三和電子サーキット Osaka//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 モリマーエスエスピー Osaka//Resin/Plastic 本社

substrate Product ranking

Last Updated: Aggregation Period:Jul 16, 2025~Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
  2. Aluminum foil etched circuit board
  3. Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.
  4. 4 Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

substrate Product List

46~60 item / All 675 items

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Printed circuit board "Microfabrication printed circuit board"

Achieving narrow pitch and space-saving with precision processing substrates!

Print Electronics Research Institute Co., Ltd. responds to customer requests through microfabrication of flexible substrates, rigid substrates, and more. We are confident that we can manufacture products tailored to customer needs with our diverse lineup of materials. Please feel free to consult with us! 【Features】 ○ Production is possible with single-sided L/s (line & space) = 50/50μ and double-sided L/s = 60/60μ ○ Further miniaturization is possible due to high-density wiring For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Flexible printed circuit board (FPC). Bendable!

Conducting electrical inspections and comprehensive inspections! Laminates are available up to a maximum size of 500mm × 2000mm.

The product is a flexible printed circuit board that can be bent. It is compact, thin, and lightweight, allowing for a reduction in connections with connectors that can be integrated into small spaces. It can be used in digital cameras, laptops, smartphones, printers, and other small devices. We provide a detailed introduction to the manufacturing process in the PDF document, so please download and take a look. 【Features】 ■ Flexible and bendable ■ Reduces connections with connectors that can be integrated into small spaces ■ Compact, thin, and lightweight *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Substrate "Alumina substrate"

Alumina substrate with excellent thermal conductivity, insulation, heat resistance, strength, acid resistance, and cost-effectiveness!

The "alumina substrate" is a substrate made of alumina ceramics that excel in thermal conductivity, insulation, heat resistance, strength, acid resistance, and cost-effectiveness. The warping of the substrate is extremely small, and it can also be used for thin films. It is a product with excellent lubricity. Additionally, it has high dimensional accuracy and stable slits and through-holes, making it suitable for high breakability applications, including chip network substrates and ultra-small chip substrates. 【Features】 ■ Stable slits and through-holes ■ Extremely small warping of the substrate ■ High dimensional accuracy ■ Excellent lubricity ■ High breakability *For more details, please refer to the catalog or feel free to contact us.

  • Electronic Components

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Thick film alumina substrate

We can accommodate irregular shapes such as circles! We can provide alumina substrates with holes as small as approximately 0.08mm!

We would like to introduce our "Thick Film Alumina Substrate." Improvements in the molding method have resulted in characteristics related to breakage and the condition of the break edge. In addition to standard sizes, we can accommodate non-standard dimensions ranging from 100mm to 120mm in diameter and thicknesses of 1.2 to 1.5mm, as well as other shapes such as circular forms. The smoothness of the substrate surface, the size of voids (pores on the substrate surface), and the number per unit area are among the highest quality standards in the industry. [Features] - Expected to be suitable for thin film applications - Characteristics related to breakage and the condition of the break edge due to improvements in the molding method - Accommodates dimensions other than standard sizes - Capable of providing alumina substrates with holes as small as approximately 0.08mm *For more details, please refer to the PDF document or feel free to contact us.

  • Ceramics

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Printed circuit board

We can propose primarily single-sided, double-sided, and multi-layer flexible printed circuit boards. We achieve short delivery times for prototypes, small-batch products, and mass-produced items.

- Meiko offers a variety of cutting-edge products, including any-layer build-up (full-layer free connection) boards that accommodate the miniaturization and thinness of mobile phones, and high heat dissipation and high current boards that can withstand harsh environments such as automotive engine rooms and solar power generation systems. - Yamashita Material can support up to 14-layer boards, and IVH and BVH are also possible. All products can be made halogen-free and lead-free. - Elna achieves total support from design to manufacturing processes through close collaboration between the design and manufacturing departments. With agile responsiveness, they have earned the trust of many customers and respond to numerous requests. - The printed circuit boards produced by Japan CMK are used in a wide range of products, from those commonly seen in daily life, such as automobiles and smartphones, to less visible products like automatic faucets and LED-related products, which enhance everyday living. - Kyoden's printed circuit board manufacturing possesses a variety of material lineups and manufacturing methods. Therefore, even within a single manufacturing process, several methods can be selected, allowing for production tailored to the desired characteristics of the customer.

  • PLC
  • Printed Circuit Board
  • Signal Generator

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Ceramic substrate

It is widely used as a substrate for high-frequency modules and IC packages.

The LTCC substrate from KOA is a "low-temperature co-fired ceramic substrate" made by simultaneously firing wiring conductors and ceramic substrates at temperatures below 900°C. Since wiring patterns can be formed on both the surface and inner layers, multilayering is easy. 【Product Lineup】 LTCC Substrate

  • Semiconductor inspection/test equipment
  • Printed Circuit Board
  • power supply

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Glass substrate

We manufacture various glass substrates such as soda glass, borosilicate glass, and quartz.

We will manufacture items in your desired size using materials such as soda glass, Eagle XG, Tempax, B270 (whiteboard), and quartz.

  • Glassware and containers

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Solenoid Control Board "Multi Controller A"

Just connect the power and press the switch to operate the solenoid!

We handle the solenoid control board "Multi Controller A." The solenoid operates simply by connecting the power supply and pressing the switch. Up to 4 solenoids can be controlled from the switches on the board or from a microcontroller. 【Features】 ■ Solenoid operates just by connecting the power supply and pressing the switch ■ Up to 4 solenoids can be connected ■ Can also be connected to a microcontroller ■ Power supply can be AC adapter, battery, etc. (microUSB is also acceptable) *For more details, please refer to the PDF document or feel free to contact us.

  • Solenoid Actuators
  • Other machine elements

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Solenoid Control Board "Multi Controller USB"

You can connect the 5V solenoid with a board (SSAH0830, SSBH0830) to the solenoid kit!

We handle the solenoid control board "Multi Controller USB." It can be connected to 5V board solenoids (SSAH0830, SSBH0830) and solenoid kits. Up to 4 solenoids can be controlled from a switch on the board or from a microcontroller. 【Features】 ■ The solenoid operates simply by connecting the power and pressing the switch. ■ Up to 4 solenoids can be connected. ■ Can also be connected to a microcontroller. ■ Compatible with 5V board solenoids and solenoid kits. *For more details, please refer to the PDF document or feel free to contact us.

  • Solenoid Actuators
  • Other machine elements

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ZU15, 25 compatible attachment board

We handle both attachment boards and MG series implementations!

This product is a compatible attachment board that can be used with the alternative models "MG15, 30 series" due to the discontinuation of the ZU15, 25 series. It has the same pin configuration as the "ZU15, 25 series." We offer a total of four types of compatible attachment boards. 【Features】 ■ Equipped with MG15, 30 series ■ Same pin configuration as ZU15, 25 series ■ A total of four types of compatible attachment boards available ■ Attachment board + MG series implementation *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Special technology metal substrate

Printed circuit board with enhanced heat dissipation and heat resistance.

There are two types of printed circuit boards that enhance heat dissipation and heat resistance: a metal base substrate with circuits formed on a metal plate, and a metal core substrate with a metal plate sandwiched inside the substrate. The metal materials can be selected from aluminum, copper, and others.

  • Printed Circuit Board

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Substrate "High Current Substrate (Thick Copper Circuit Substrate)"

A high-current board that can minimize current loss compared to the design value!

The substrate is a high-current board that allows for the selection of circuit formation methods based on conductor thickness. If the conductor thickness is 300μm or more, half-etching can be accommodated. This method can reduce the top and bottom widths of the pattern compared to conventional etching methods, minimizing current loss relative to design values. 【Features】 ■ Selection of circuit formation methods based on conductor thickness ■ Half-etching can be accommodated with a conductor thickness of 300μm or more ■ Ability to reduce the top and bottom widths of the pattern ■ Minimal current loss relative to design values *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board

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Special Printed Circuit Board "Aluminum Heat Sink Substrate"

High heat dissipation aluminum heat sink substrate with an integrated structure of aluminum base substrate and heat sink.

The "Aluminum Heat Sink Substrate" is a substrate that layers a high thermal conductivity insulating layer and circuits onto extruded aluminum heat sink material. It features surface roughening effects and weather resistance due to anodizing treatment, securing more than five times the surface area compared to conventional products. By combining with high thermal conductivity resin, it offers heat dissipation specifications that far exceed those of conventional products. There is absolutely no thermal transport loss, unlike retrofitted heat sinks. It also enables cost reduction in assembly due to its integrated structure, leading to a decrease in total costs. 【Features】 ■ Significantly improved heat dissipation characteristics ■ No thermal transport loss ■ Increased design flexibility for fins ■ Increased design flexibility for enclosures ■ Reduction in assembly costs ■ No need for material procurement *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others

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Special Printed Circuit Board "High Current Board"

It is possible to handle large currents on the printed circuit board due to the thick copper pattern!

The "Thick Copper Substrate" enables the realization of circuits with copper thicknesses up to 2000μm, making it possible to handle large currents. It is highly effective for miniaturizing devices with high loads. Additionally, due to its excellent thermal characteristics, it can also be used as a substrate that has a GND function while excelling in thermal diffusion. Furthermore, by stacking the conventional external bus bar as an inner layer circuit, EMI control becomes easier, reducing noise interference with peripheral devices. It frees you from three-dimensional wiring, reduces bus bar processing costs and assembly costs, and achieves space-saving. 【Features】 ■ Enables handling of large currents on printed circuit boards with thick copper patterns ■ Achieves a circuit thickness of 2000μm ■ Ideal for mounting power devices ■ Patent obtained *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others

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