Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
61～90 item / All 1907 items
64-Channel Latching or Momentary Relay Board with Built-in-Test
The VME-2210 provides 64 One Form C (SPDT) contacts to the user via two 96-pin DIN connectors. These relays are the magnetic latching type which means that, once a contact is set it will remain set (even if power is removed from the relay) until it is reset.
Rigid substrate
Rigid substrate for flip chip mounting compatible with various test chips □Product name... JKIT Type1 / JKIT Type2 / JKIT Type3 / JKIT Type4 / JKIT Type5 / JKIT Type6
Metal base CCL substrate for high-power LEDs
Standard indicator LEDs (bulb-type LEDs) have been primarily used with resin substrates (glass cloth epoxy substrates) due to their low heat generation. However, power LEDs used for lighting applications generate more heat, making metal-based substrates effective for improving LED performance and reliability against heat, as well as extending their lifespan due to their excellent thermal conductivity and cost performance. Well's MCCL substrate is based on a ferrous alloy with excellent heat dissipation, designed to keep the temperature rise of high-power LED elements within a certain range. By utilizing the ferrous alloy base material as a heat sink, it is possible to significantly disperse and dissipate heat generated from the LED, thereby reducing the heat generated by the LED itself and minimizing the decrease in LED lifespan. Additionally, by combining this with Well's heat sink coated with carbon nanotubes, we achieve further improvements in heat dissipation characteristics, leading to an extended lifespan for the LEDs.
A patterning manufacturer that provides solutions tailored to customers by utilizing abundant resources.
This document introduces the circuit boards of Toyo Seimitsu Kogyo. We propose suitable processing by combining a wide range of resources such as sputtering, plating, etching, screen printing, sandblasting, and laser processing. By utilizing our extensive in-house processes, we achieve short delivery times and can accommodate various reliability tests. We provide a stable supply of high-quality, highly reliable products. 【Contents (partial)】 ■ Thin film circuit process image ■ Standard design rules ■ Inspection support ■ Reliability testing support ■ Thick film circuit process image *For more details, please refer to the PDF document or feel free to contact us.
![[Examples of Circuit Board Manufacturing] Metal Base Circuit Board](https://image.mono.ipros.com/public/product/image/0ad/2000570832/IPROS63296898710945470966.png?w=280&h=280)
Meeting the needs for heat resistance! Can be applied as a heat dissipation substrate for power semiconductors and as a base substrate for LED mounting.
This is a manufacturing example of metal-based circuit boards that meet the increasing demands for heat dissipation and heat resistance in applications such as high-power LEDs, automotive, and power supply uses. Metal-based circuit boards can be applied as heat dissipation substrates for power semiconductors and as base substrates for LED mounting. Please feel free to consult us when needed. 【Case Overview】 ■ Base materials: Aluminum, copper, etc. ■ High heat dissipation insulating layer: Thermal conductivity 4.4 W/mk, insulation withstand voltage: 4 kV or more ■ Conductor layer: Ag, Ag/Ni/Au, etc. ■ High reflectivity insulating layer (for LEDs): Reflectivity over 90% *For more details, please refer to the PDF document or feel free to contact us.
![[Circuit Board Manufacturing Example] Thin Film Circuit Board](https://image.mono.ipros.com/public/product/image/7b4/2000570851/IPROS60687999797142408463.png?w=280&h=280)
We can accommodate a wide range of processing variations! We can also handle processing on supplied materials or only specific processes.
This is a manufacturing example of thin film circuit substrates that combines vacuum film formation through sputtering and deposition with photolithography. We can accommodate a wide range of processing variations, including hole drilling and contour cutting using lasers and dicing, as well as thin film resistor formation, providing high-quality thin film circuit substrates with a high degree of design flexibility. We can also process supplied materials or handle only specific processes. 【Case Overview】 ■Materials: Alumina, Aluminum Nitride, Quartz Glass, etc. ■Thickness: 0.1 to 1.0 mm ■Conductor Films: Ti/Pd/Au, Ti/Pd/Cu/Ni/Au, Ti/Pt/Au, etc. *For more details, please refer to the PDF document or feel free to contact us.
It is suitable for transporting wafers with warping or those that leak with a suction chuck.
It is suitable for transporting wafers with warping, as well as wafers that leak with suction chucks and thin wafers. The chuck body is made of high-purity alumina ceramics, and only the workpiece suction surface uses porous ceramics. With an average pore diameter of 20μm, it can distribute the suction pressure concentrated in the grooves, which are typically about 1.5mm deep in conventional suction surfaces, thereby minimizing deformation of thin workpieces during suction. Mesh particle sizes can be selected from grades #100, #220, and #400. A conductive Teflon coating treatment can also be applied to the workpiece suction surface.
We provide comprehensive support services to realize the functions that our customers seek!
Suiko Co., Ltd. has introduced plating equipment to respond to a variety of products, small lots, and short delivery times, and we deliver reliable products to meet our customers' needs through a consistent production line. We have established an in-house integrated line for printed circuit boards, component mounting, parts procurement, resin mold manufacturing, and finished products. We are here to assist you from any stage of the process, so please feel free to consult with us. 【Business Activities】 ■ Printed circuit board manufacturing (single-sided, double-sided, multilayer, flexible) (prototype and mass production) ■ Electronic component sales ■ Printed circuit board assembly ■ Mounting ■ Wiring processing ■ Assembly ■ Harness processing ■ Molded products ■ FRP resin-based molded products ■ Molded products ■ LED display manufacturing/sales ■ Building materials sales ■ Various display manufacturing/sales ■ Electronic equipment sales ■ Other services related to printed circuit boards *For more details, please refer to our catalog or feel free to contact us.
We can provide reliable products even from just one piece with a short delivery time!
At Suiko Co., Ltd., we have introduced plating equipment to accommodate a wide variety of products, small lots, and short delivery times, delivering reliable products through a consistent production line. We respond to various requests for printed circuit boards, from single-sided boards to double-sided boards and multilayer boards. With the know-how in printed circuit board manufacturing that we have cultivated over many years, we will solve your concerns, so please feel free to contact us. 【Features】 ■ Quick delivery ■ Consistent production line ■ Capable of handling various printed circuit boards *For more details, please refer to our catalog or feel free to contact us.
