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substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. null/null
  3. 三和電子サーキット Osaka//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 松和産業 Mie//Electronic Components and Semiconductors 本社
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substrate Product ranking

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
  2. Aluminum foil etched circuit board
  3. Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.
  4. 4 Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

substrate Product List

241～255 item / All 673 items

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Printed circuit board

Printed circuit board

We specialize in the manufacturing of "single-sided printed circuit boards" and "double-sided printed circuit boards"!

Our company specializes in the manufacturing of printed circuit boards up to "30mm round or 30mm square" and "50mm round or 50mm square" among wiring boards. We are also skilled in small lot production, working with copper-clad laminates ranging from 1 to about 30 sheets as the work size, cutting materials into panels (boards) sized from 255mm square to 340mm square, with our preferred lot size being the production of 10 to 300 panels (boards) per lot. Additionally, we focus on the rare production of "paper phenolic resin boards" in Japan, achieving stable supply. 【Our Features】 ■ Preferred board sizes are small items (compact and small sizes) ■ Preferred lot sizes are small quantities ■ Resist using thermosetting inks and UV-cured inks ■ Basic production involves "repeat production" with press processing ■ Specializing in rigid boards with "single-sided and double-sided" options *Please feel free to contact us for more details.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Ultra-flat substrate

Ultra-flat substrate

It is possible to assist with processing management, time reduction, cost reduction, and yield improvement!

We would like to introduce our "Ultra-High Flatness Substrate." We have achieved high flatness even for small-diameter substrates of conventional semiconductor single crystal substrates. In standard processing, the limit for flatness (TTV) was ≦3um, but we have realized TTV ≦1um, and we can respond to even higher flatness requirements depending on specifications. The high flatness of the base substrate offers advantages in bonding substrates and photolithography, and it also contributes to the uniformity of various deposition films formed on the substrate, expanding its applications to devices that require precision in the future. Additionally, as a substrate manufacturer, we can adjust substrate thickness and achieve symmetry in edge shapes from the ingot stage, which can help reduce the cumbersome processing management, shorten time, cut costs, and improve yield for our customers. 【Effective Examples】 ■ We want to reduce the time and cost of thinning and flattening support substrates for bonding. ■ Improving yield in the outer peripheral area. *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Countdown display control board

Countdown display control board

Customization according to your requests is also possible!

This is a control board for display that performs a countdown. By connecting your preferred 7-segment display, it will show "0" on the specified date and time. It can be used for events, new product announcements, store openings (new, renewal, relocation), and more. 【Features】 ■ Selectable character size (character height: 60–300mm) ■ Red display for outdoor visibility, other colors are also possible ■ Additional display digits can be added (optional) ■ In addition to countdown, count-up is also possible

  • LED Module

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Build-up substrate

Build-up substrate

All processes are handled in our own factory! Just like other circuit boards, we promise ultra-short delivery times and high quality.

We would like to introduce our "Build-Up Circuit Boards." At Matsuwa Industries, we have also introduced equipment such as CO2 gas laser drilling machines, via-fill copper plating lines, and vacuum hole filling machines. We handle all processes in-house at our factory, even for high-density wiring boards like build-up boards and through resin-filled boards. Of course, just like with other boards, we guarantee ultra-short delivery times and high quality. 【Features】 ■ All processes are manufactured in-house ■ Delivery through 24-hour operations ■ Continuous introduction of new equipment ■ Realization of high-spec boards ■ No fluctuations in gold flash delivery times *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board

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High reliability substrate

High reliability substrate

Manufacturing management of the core components of printed circuit boards (through-holes, pattern formation, resist exposure)

We would like to introduce our "High Reliability Boards." Pattern formation and resist exposure utilize the new DI (Direct Imager) method, achieving L/S = 40/40μm and resist position accuracy of 15μm. We have also quickly adopted inkjet for silk printing, successfully achieving a character height of 500μm, a character width of 90μm, and a position accuracy of 20μm. Our company is a manufacturer that thoroughly manages a wide variety of new equipment and chemicals, delivering high reliability boards faster than anyone else. We ensure high reliability and long lifespan, comply with delivery deadlines, and provide rapid analysis in case of troubles. 【Features】 ■ Pattern formation and resist exposure use the new DI method ■ Early adoption of inkjet for silk printing ■ Thorough management of a wide variety of new equipment and chemicals ■ High reliability and long lifespan, compliance with delivery deadlines, and rapid analysis in case of troubles *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Through-hole resin embedded substrate

Through-hole resin embedded substrate

The number of layers ranges from 2 to 20, and there is a proven track record of resin filling up to a thickness of 3.2mm!

We would like to introduce the "Through Resin Filled Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This printed circuit board is mainly used for boards that mount narrow pitch BGA components (such as 0.5 to 0.3 mm pitch) and for the purpose of filling through holes (TH). After filling the holes (primary TH) that need to be resin-filled with a permanent hole-filling ink (epoxy resin), through holes (secondary TH) are formed, and it is also possible to create a cover plating on the primary TH section that has been resin-filled. 【Example of Manufacturing Specifications for Through Resin Filled Circuit Board】 ■ 12-layer through resin filled circuit board with 0.4 mm pitch BGA - Board thickness: t1.6 mm - BGA pad diameter: φ0.32 mm - Resist opening: φ0.25 mm - Resin filled TH drill: φ0.2 mm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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IVH substrate

IVH substrate

We can manufacture various products such as BVH and COH by sequentially laminating the conductor layer onto the core material!

We would like to introduce the "IVH substrate" handled by Matsuwa Sangyo Co., Ltd. This is a multilayer printed circuit board that connects only the necessary interlayers (non-through vias) instead of using through vias. Unlike build-up substrates, it does not use laser vias and features the use of NC drills for all interlayer connections. By connecting multiple non-through holes in a multilayer board, it achieves greater freedom in wiring and increased wiring density. 【Example of IVH substrate manufacturing specifications】 ■ 0.4mm pitch BGA mounted 8-layer 6-stage continuous IVH substrate ・ IVH specifications: L1-2/1-3/1-4/1-5/1-6/1-7 IVH + L1-8 through ・ BGA pad diameter: φ0.3mm ・ Hole wall pattern spacing: 0.175mm ・ IVH drill diameter: L1-2/L1-3 = φ0.1mm, L1-4 to L1-7 = φ0.15mm * For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Any-layer substrate

Any-layer substrate

Adopted in many products such as communication devices! Printed circuit boards that enable thinner substrates.

We would like to introduce the "Any Layer PCB" handled by Matsuwa Sangyo Co., Ltd. It has a slightly different structure from build-up PCBs, utilizing laser vias even in the inner core section, enabling the thinning of the PCB through full-layer laser vias and filled via plating. The freedom of wiring has further increased, and it is adopted in many products such as IoT devices, wearable products, and communication equipment (5G). 【Any Layer PCB Manufacturing Specifications Example】 ■ 6-layer 2-2-2 build-up PCB with 0.3mm pitch BGA - Board thickness: t0.6mm - BGA pad diameter: φ0.24mm - Resist opening: φ0.17mm - Laser hole diameter: φ0.1mm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Faradoflex compatible board

Faradoflex compatible board

Improvement of inductance, improvement of impedance, and reduction of noise are possible!

We would like to introduce the "Faradflex-compatible substrate" handled by Matsuwa Sangyo Co., Ltd. Unlike capacitor materials that are built into components, this substrate-integrated capacitor material does not require the creation of cavities within the substrate and is characterized by the ability to form patterned capacitor circuits using standard printed circuit board manufacturing processes. By reducing surface-mounted components, it enhances reliability through fewer connections and enables miniaturization of printed circuit boards. 【Features】 ■ Substrate-integrated capacitor material characterized by the formation of patterned capacitor circuits ■ Enhances reliability through fewer connections by reducing surface-mounted components and enables miniaturization of printed circuit boards ■ Mainly used for high-layer, high-performance routers, server equipment, supercomputers, and MEMS microphones and RF filters aimed at miniaturization *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Fluororesin substrate

Fluororesin substrate

We have introduced a processing device that improves the wettability of plating and resist, enabling in-house integrated manufacturing.

We would like to introduce the "fluororesin substrate" handled by Matsuwa Sangyo Co., Ltd. This is a printed circuit board with a fluororesin insulation layer. It has low dielectric constant and low dielectric loss tangent, resulting in minimal loss of high-frequency currents. Leveraging this characteristic, it is used for high-speed communication applications (such as GPS, satellite communication, millimeter-wave radar, and mobile phones). 【Features】 ■ Printed circuit board with a fluororesin insulation layer ■ Minimal loss of high-frequency currents ■ Treatment to improve the wettability of plating and resist (plasma desmear treatment) We have introduced equipment for this, enabling in-house integrated manufacturing of fluororesin substrates. *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Single-sided/Dual-sided flexible circuit board

Single-sided/Dual-sided flexible circuit board

By applying a reinforcement plate, component mounting is also possible! It is often used as a substitute for FFC.

We would like to introduce the "Single-Sided/Dual-Sided Flexible Printed Circuit Boards" handled by Matsuwa Sangyo Co., Ltd. The single-sided (1 layer) type is a common specification for flexible printed circuit boards and is often used as a substitute for FFC. There are types with and without an adhesive layer between the base material and copper foil, and we can accommodate both at our company. The dual-sided (2 layers) type allows for more flexible wiring by incorporating through-holes (TH) into the flexible printed circuit board. Please feel free to consult us about multilayer flexible printed circuit boards with three layers or more. 【Shortest Delivery Record Examples】 ■ 1 layer ⇒ Shortest 2 days (AM data ⇒ shipped the next day) ■ 2 layers ⇒ Shortest 2 days (8 AM data ⇒ shipped the next day) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Aluminum base substrate

Aluminum base substrate

We have products with thermal conductivity of 3 W/m·K and 10 W/m·K in stock, and we can also respond flexibly to other materials!

We would like to introduce the "Aluminum Base Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This printed circuit board has high thermal conductivity and excellent heat dissipation, making it suitable for components that require high heat dissipation, such as high-brightness LEDs and power devices. In recent years, the demand for high thermal conductivity materials has significantly increased due to the spread of LED lighting, and there has been a growing trend to adopt high-brightness LEDs for automotive headlights. 【Example Manufacturing Specifications for Aluminum Base Circuit Boards (Excerpt)】 ■ Maximum outer dimensions: 210×460mm ■ Copper foil thickness: 35μm ■ Insulation layer thickness: 80μm ■ Aluminum base thickness: 1.0mm, 1.5mm, 2.0mm ■ Thermal conductivity: 3W/m·K, 10W/m·K *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Thick-plated board with through holes (TH)

Thick-plated board with through holes (TH)

Recently, there has been an increasing demand for a certain thickness even outside of automotive applications!

We would like to introduce the "Through-Hole (TH) Thick Plated Board" handled by Matsuwa Sangyo Co., Ltd. The typical copper plating thickness required for Through-Holes (TH) is generally around 15 to 20 μm. However, to enhance reliability, there has been an increasing demand for a certain thickness (TH plating ≧ 25 μm) even for applications outside of automotive use. Please feel free to contact us when you need assistance. 【Manufacturing Specifications Example for Through-Hole (TH) Thick Plated Board】 ■ TH plating thickness: Capable of supporting TH thickness ≧ 25 μm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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End face through-hole substrate

End face through-hole substrate

The hole diameter is ≥Φ0.5mm, the land diameter is ≥0.8mm, and the hole pitch is ≥1.0mm!

We would like to introduce the "End Face Through Hole Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This product accommodates hole diameters of ≧Φ0.5mm, land diameters of ≧0.8mm, and hole pitches of ≧1.0mm. The slit through hole circuit board can accommodate a slit width of 1.0mm and a maximum slit length of 30mm (with connections added every 30mm). 【End Face Through Hole Circuit Board Manufacturing Specifications Example】 ■TH Diameter: φ0.5mm ■Land Diameter: φ0.8mm ■Hole Pitch: 1.0mm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Flash conductor substrate

Flash conductor substrate

It is possible to embed resist or insulating resin between patterns (between conductors) to smooth the surface of the substrate!

We would like to introduce the "Flash Conductor Substrate" handled by Matsuwa Sangyo Co., Ltd. By embedding resist or insulating resin between the patterns (conductors), the surface of the substrate can be smoothed. Please feel free to contact us when you need assistance. 【Structure of Flash Conductor (Resist Specification)】 ■ Copper foil ■ Copper plating ■ Resist ■ Base material *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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