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substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. null/null
  3. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  4. 4 スクリーンプロセス Kanagawa//others
  5. 5 JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office Tokyo//Ceramics
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substrate Product ranking

Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
This ranking is based on the number of page views on our site.

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office
  3. Tokyo Machine and Tool Co., Ltd. Business Introduction 東京マシン・アンド・ツール
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 Noda Screen Co., Ltd. Company Profile NODASCREEN CO.,LTD.

substrate Product List

451～480 item / All 1931 items

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Lighter than aluminum, with the rigidity of steel - the birth of Super Material SA001.

Lighter than aluminum, with the rigidity of steel - the birth of Super Material SA001.

The silicon/aluminum composite material SA001, created by our unique composite technology, is lighter than aluminum and has the Young's modulus of cast iron, while also accommodating hollow structures through bonding technology.

We have developed a composite material SA001 made of metallic silicon and aluminum. This super material is lighter than aluminum, has a higher Young's modulus than cast iron, and boasts a specific stiffness that is twice that of aluminum. Thanks to our joining technology, it can also accommodate hollow structures and built-in flow paths. ● Adoption achievements: Parts for high-precision 3D measuring machines, parts for semiconductor manufacturing equipment ● Application proposal: Temperature control plates for electrostatic chucks * By changing the material from aluminum to SA001, we can resolve the thermal expansion difference issue with alumina ESC.

  • Other metal materials
  • aluminum
  • Composite Materials
  • substrate

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3D processing ceramic products

3D processing ceramic products

The use of ceramics has expanded due to high-precision processing of complex shapes and curved surfaces using 5-axis machining.

The introduction of a 5-axis machining machine, which adds the C-axis (table rotation) and A-axis (table tilt axis) to the X, Y, and Z axes, has made it possible to achieve high-precision machining of complex shapes and curved surfaces, thereby expanding the applications of ceramics. Cost reduction is also expected due to the reduction in setup time.

  • Fine Ceramics
  • Other molds
  • Other machine elements
  • substrate

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Formation of thin-film integrated circuits on stepped ceramic substrates.

Formation of thin-film integrated circuits on stepped ceramic substrates.

We have made it possible to form thin-film integrated circuits on "stepped ceramic substrates," which eliminate the need for customer bonding processes and reduce thermal conduction loss.

This product was originally used by users who bonded two circuit boards together (after joining with solder, paste, and adhesive), and it was created with the concept of providing it as a "single integrated component." By making it a single component, (1) the user's effort and costs for joining are reduced, and (2) thermal conduction loss from joining materials has been eliminated. Furthermore, it has become possible to form thin-film integrated circuits on stepped ceramic substrates. [Application Example] The step difference between the upper and lower circuit boards is adjusted to match the thickness of the laser element, which is mounted on the lower board. This allows the top surface of the laser element and the upper circuit board to be at the same height, enabling wire bonding at the shortest distance.

  • High frequency/microwave parts
  • Fine Ceramics
  • substrate

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Contracting business for electronic components

Contracting business for electronic components

Short delivery times and small lot electronic circuit board manufacturing! We can accommodate a wide range of needs from design to shipping at any stage.

At Tosa Electronics Co., Ltd., we engage in the "contract business for electronic components," providing support for a series of operations from design, assembly, processing, adjustment, inspection, to shipping. As the assembly and related operations of electronic components shift from Japan to overseas, we support a series of operations from processing to shipping of electronic circuit boards in small lots and short delivery times, based on the manufacturing know-how we have cultivated over more than 20 years since our founding. 【Features】 ■ Wide-ranging support from any stage, including design, inspection, and shipping ■ Capable of manufacturing electronic circuit boards with short delivery times, small lots, and a variety of types *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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[Specification] H8 Control Board

[Specification] H8 Control Board

Introduction of the specification document that includes explanations of each section, development preparations, and sample programs!

This document is the specification sheet for the "H8 control board" handled by Tosa Electronics, which engages in the processing, assembly, and inspection of electronic components and electronic circuit boards. It includes descriptions of various parts such as sensor input terminals, as well as development preparations and sample programs. [Contents] ■ Description of each part ■ Development preparations ■ Sample programs *For more details, please refer to the PDF document or feel free to contact us.

  • Converters and Transducers
  • substrate

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[Specification] Motor Shield Board (with Bluetooth)

[Specification] Motor Shield Board (with Bluetooth)

Introducing the specification document that includes connection diagrams and the development environment for Arduino programs!

This document is the specification sheet for the "Motor Shield Board (with Bluetooth)" handled by Tosa Electronics, which engages in the processing, assembly, and inspection of electronic components and electronic circuit boards. It includes descriptions of various parts such as motor control terminals, connection configuration diagrams, and the Arduino programming development environment. 【Contents】 ■ Description of each part ■ Connection configuration diagram ■ Arduino programming development environment ■ Bluetooth communication specification *For more details, please refer to the PDF document or feel free to contact us.

  • Converters and Transducers
  • substrate

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Specification Document: Mighty Shield Circuit Board

Specification Document: Mighty Shield Circuit Board

Introducing the specification document that includes descriptions of each part of the product and the development environment for Arduino programs!

This document is the specification sheet for the "Mighty Shield Board" handled by Tosa Electronics, which engages in the processing, assembly, and inspection of electronic components and electronic circuit boards. It includes descriptions of various parts such as the stepping motor control terminals, connection configuration diagrams, and the Arduino programming development environment. [Contents] - Descriptions of various parts - Connection configuration diagrams - Arduino programming development environment - Bluetooth communication specification *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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[Specification] Arduino_DAC_SHIELD Board

[Specification] Arduino_DAC_SHIELD Board

Introducing the specifications of a shield board that performs 8-channel DAC output controlled by SPI for Arduino Uno!

This document is the specification sheet for the "Arduino_DAC_SHIELD board" handled by Tosa Electronics, which engages in the processing, assembly, and inspection of electronic components and electronic circuit boards. It includes product descriptions, usage instructions, and sample programs. The "Arduino_DAC_SHIELD board" is a shield board for Arduino Uno that provides 8-channel DAC output controlled via SPI. [Contents] ■ Product Description ■ Usage Instructions ■ Sample Programs ■ Circuit Diagram *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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Board "RasPi_HAT (Raspberry Pi HAT)"

Board "RasPi_HAT (Raspberry Pi HAT)"

You can freely solder and use the free through holes! Introducing the expansion HAT board.

The "RasPi_HAT" is an expansion HAT board that can connect three HAT boards to a Raspberry Pi. You can mount a Raspberry Pi 3 or Raspberry Pi ZERO (WH) on the lower left part of the board, and attach other HAT boards elsewhere. There are free through-holes on the lower right part of the board, allowing you to solder as you wish, similar to a universal board. 【Features】 ■ All GPIO pins are connected to the array ■ Pins for UART and I2C are provided for external connections (JST EH connector) ■ Power can be supplied to the Raspberry Pi mounted on the lower left via USB, from a DC jack on the board, or from the EH connector *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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BMSspot

BMSspot

Lithium-ion battery management system board

We will utilize BMSspot to develop various energy solutions with abundant experience and high technology.

  • Integrated operation management
  • substrate

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Yuki Corporation - Equipment Development Achievements

Yuki Corporation - Equipment Development Achievements

We will conduct development in various technical fields, including digital, analog, high frequency, and industrial applications.

Yuki Corporation aims to be a "circuit board company that understands electronics" by adding the support of products as electronic equipment engineers to its main business of circuit board design and manufacturing. Additionally, with the establishment of the Equipment Development Department, we have created a system where all steps from planning and development of electronic devices to product inspection and shipping can be conducted in-house at Yuki. In our fruit (industrial product) sorting and management system, we determine grades (size, color, presence of defects) through image processing of fruits (such as pears, persimmons, watermelons, peaches, chestnuts, plums, apples, etc.) and have built a comprehensive system that covers sorting, invoice issuance, and shipping management. Our hydroponic plant LED lights can create an optimal light environment for plant growth by controlling the ratio of red, blue, and green (the three primary colors of light) using a computer. 【Features】 - Development is possible across various technical fields - Staff in the Equipment Development Department have extensive experience and achievements in product development - Support for products as electronic equipment engineers - All steps from planning and development of electronic devices to product inspection and shipping can be conducted in-house at Yuki Corporation - Development of small items such as switching power supplies, standalone FPGA designs, and software-only products is also possible For more details, please contact us or download the catalog.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • LED lighting
  • substrate

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Printed circuit board - 4-layer board

Printed circuit board - 4-layer board

The shortest 24 hours! A four-layer board that leads your business to success.

Yuki Corporation responds to customer requests with the technical expertise cultivated over many years. To achieve goals such as stable quality, improved operational rates, and avoiding duplication of capital investment, experts from printed circuit board manufacturers and partial processing manufacturers have joined forces to establish a printed circuit board manufacturing company with an in-house integrated production system. We are committed to "manufacturing" and have built a production line that meets customer demands for small quantities, diverse varieties, and short delivery times. Furthermore, we will continue our unwavering efforts to deliver "valuable products," "services," and "peace of mind" as a company based on high quality and excellent technology. **Features** - Consistent support from design to printed circuit board manufacturing to component mounting. - Partial processing of surface treatment is also handled in-house. → Metal masks, various metal etching, electroplating, electroless gold, etc. - Ultra-short delivery times. Medium-volume products can also be delivered quickly. - Actively responding to high-layer, high-density, and high-difficulty products. → High-layer boards up to 20 layers, high-density boards with 5 pins between. - Actively working on environmental measures such as halogen-free materials and lead-free options. For more details, please contact us or download the catalog.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • substrate

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Yuki Corporation Business Introduction

Yuki Corporation Business Introduction

We support everything related to substrate manufacturing. We can handle the entire process or just a single step.

In the printed circuit board business of Yuki Corporation, we respond to ultra-short delivery times. In the electronics business, we also engage in software development and electronic device development. We handle everything from prototypes to mass production. We can provide a consistent response from printed circuit board design to board manufacturing to component assembly. We support metal masks, various metal etching, electroplating, electroless gold, and thick gold bonding, among others. "More than one" is our company policy. We actively respond to high-layer, high-density, and high-difficulty products (high-layer up to 20 layers, high-density up to 5 pins between vias). We are also actively working on environmental measures such as halogen-free materials and lead-free RoHS compliance. 【Business Content】 ○ Development, manufacturing, and sales of printed circuit boards and electronic devices For more details, please contact us or download the catalog.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • substrate

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World's thinnest 0.6mm supercapacitor "G/H Series"

World's thinnest 0.6mm supercapacitor "G/H Series"

Achieves ultra-thin, flat, compact design with low ESR (Equivalent Series Resistance).

CAP-XX's electric double-layer capacitors (supercapacitors) are the world's thinnest at 0.6mm thick, compact yet high-capacity, and feature a high energy density, allowing for high output even under peak load due to their low ESR (equivalent series resistance). They are available in a wide range of options to suit various usage conditions and applications.

  • Capacitor
  • substrate

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Single Crystal Substrate Crystals: A-Z

Single Crystal Substrate Crystals: A-Z

We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.

We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class company in the industry. You can purchase from as little as one piece. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.

  • Secondary Cells/Batteries
  • Other metal materials
  • substrate

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Ceramic Substrate: A-Z

Ceramic Substrate: A-Z

We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.

We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class supplier in the industry. You can purchase as little as one item. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.

  • Secondary Cells/Batteries
  • Other metal materials
  • substrate

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Screw press: Small powder molding machine for low load.

Screw press: Small powder molding machine for low load.

By simply turning the handle lightly, a load of up to 5,000N can be applied.

The screw press is a molding machine for low loads. With simple operation by just turning the handle, it can apply a load of up to 5,000N (500kgf). Being a screw-type press, it allows for easy "pressurization," "holding," and "depressurization." As a compact machine, it is ideal for molding within a glove box. Heater specifications can also be manufactured.

  • Powder Molding Machine
  • substrate

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STH technology

STH technology

Implementation of components directly above the through hole and solder balls is possible! Achieving high density in the circuit board.

The "STH technology" is a technique that enables the mounting of components directly above the through-hole by filling the through-hole section. Since pads can be formed directly above the through-hole, it allows for chip component mounting, ball mounting, and wire bonding, making high-density mounting possible. Additionally, it excels in moisture resistance and chemical resistance compared to conventional S/R ink filling, thereby improving the reliability of the through-hole. 【Features】 ■ Enables component mounting directly above the through-hole ■ Allows for high-density mounting ■ Moisture resistance and chemical resistance ■ Improved reliability of the through-hole ■ Can form STH directly under the chip and be used as a thermal through-hole *For more details, please refer to the catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • substrate

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Build-up technique

Build-up technique

Complex structures can be realized by combining machining technology, STH technology, and others!

Our build-up substrates enable complex structures through a combination of proprietary technologies (such as milling technology and STH technology), meeting the demands for high density and high functionality. We have a proven track record of drilling holes using laser vias in various materials that possess characteristics such as high heat resistance, high Tg, and chemical resistance. Additionally, our unique vacuum hot press method ensures that there are no voids in the inner layers, allowing for highly reliable build-up substrates with excellent flatness and positional accuracy between inner layer patterns. 【Features】 ■ Capable of forming laser holes directly above through holes in combination with STH technology ■ Fill via method allows laser holes to be filled with Cu plating ■ Achieves even higher density *For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other electronic parts
  • substrate

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Hirayama Fine Tech Co., Ltd. Business Introduction

Hirayama Fine Tech Co., Ltd. Business Introduction

We aim to create products that our customers can trust and feel secure about.

Heiyama Fine Tech Co., Ltd. was founded in 1910, initially engaged in industrial engraving, and has evolved into a manufacturer of printed circuit board design and production, supported by tradition and technical expertise. In 2008, we established a new factory in Uenohara City, Yamanashi Prefecture, and introduced state-of-the-art equipment. Additionally, we have implemented IT integration through electronic tags across all processes, utilizing this data not only for production management but also for quality improvement, and are committed to continuous enhancement. We always maintain a sense of gratitude, value "monozukuri" (craftsmanship) from the customer's perspective, and will continue to promote various technological innovations and value creation. 【Business Content】 ○ Design and manufacturing of printed circuit boards For more details, please contact us or download our catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Alumina ceramic substrate for chip resistors

Alumina ceramic substrate for chip resistors

High-reliability substrates born from a unique production system.

This is an alumina ceramic substrate made using high-purity alumina raw materials that excel in electrical and thermal properties, and is produced through advanced processing technology to achieve excellent dimensional accuracy and divisibility. We use high-purity alumina raw materials tailored to specific applications, maintaining stable quality and outstanding characteristics while adhering to a strict quality control system during production. 【Features】 ■ Manufacturing with high precision in thickness and dimensions is possible ■ High-precision through-hole forming and divided groove forming are achievable ■ Can be produced at a relatively low cost compared to other ceramic materials ■ Proposal of "high-reflective ceramics" considering cost-effectiveness ■ Suitable for porous applications with a high porosity rate *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Start of sample provision for high-purity alumina substrates (99.6%).

Start of sample provision for high-purity alumina substrates (99.6%).

We have added "high-purity alumina (99.6%) substrates" to our lineup and prepared standard samples (100x100x0.2).

■Alumina Ceramic Substrates Born from Our Unique Production System■ In recent years, the electronics industry, which is accelerating the pace of evolution, has developed tiny chip components that can now fit on the tip of a finger, advancing the information society. Among these, chip resistors are essential basic electronic components for constructing electronic circuits. Our alumina ceramics use high-purity alumina raw materials that excel in electrical and thermal properties, achieving excellent dimensional accuracy and divisibility through advanced processing technology. For other alumina ceramic products as well, we use high-purity alumina raw materials tailored to their applications, maintaining stable quality and excellent characteristics while producing under a strict quality control system.

  • Fine Ceramics
  • substrate

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Zirconia ceramic substrate

Zirconia ceramic substrate

A specialized manufacturer of high-performance ceramic substrates produces thin zirconia ceramic substrates with toughness and ionic conductivity.

Flexible Ceramic Substrates Utilizing Toughness" Flexible Zirconia Ultra-thin Zirconia Ceramic Substrates Zirconia possesses strong toughness. By combining this with our thin ceramic substrate manufacturing technology, we have realized "flexible ceramic substrates." The ultra-thin ceramic substrate (thickness: 50μm) is also transparent and has the potential to achieve substrate thinning, positioning it as a "next-generation ceramic substrate.

  • Fine Ceramics
  • substrate

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Fine printed circuit board

Fine printed circuit board

Printed circuit boards for small electronic devices: Fine circuit printing is a circuit printing technology primarily for ultra-small electronic components.

In recent years, as the miniaturization, lightweight design, and high performance of electronic devices have progressed, the demands for high implementation and high density in circuit board packages have been increasing year by year. To meet these demands, our company is leveraging its thick film printed circuit board (through-hole) technology to develop even more delicate pattern printing techniques.

  • Printed Circuit Board
  • Fine Ceramics
  • substrate

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For high-performance ceramic substrates, please consult our specialized manufacturer.

For high-performance ceramic substrates, please consult our specialized manufacturer.

We offer ceramic substrates and printed circuit boards. Please also take advantage of our contract processing services utilizing our manufacturing technology (green sheet coating and firing).

Product Lineup ■ Ceramic Substrates - Alumina Ceramic Substrates - Zirconia Ceramic Substrates ■ Printed Circuit Ceramic Substrates - Thick Film Printed Circuit Ceramic Substrates - Fine Printed Circuit Ceramic Substrates ■ Ceramic Substrate Application Products - Ceramic Materials for LED Packages - Ceramic Materials for All-Solid-State Batteries - Ceramic Materials for Ceramic Tile Crafts ■ Functional Ceramic Materials - High Reflective Ceramic Materials - Porous Alumina Ceramic Substrates (Setters) - Powder Forming Ceramics

  • variety _substrates.jpg
  • Fine Ceramics
  • Printed Circuit Board
  • substrate

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Kyoritsu Elex, a specialized manufacturer of high-performance ceramics.

Kyoritsu Elex, a specialized manufacturer of high-performance ceramics.

For high-performance ceramic substrates, please consult our specialized manufacturer.

1. Molding Technology for Ultra-Thin Ceramic Sheets Our company employs a doctor blade method for the coating process of green sheets. We mix carefully selected ceramic raw materials and resin materials, and by molding sheets using the doctor blade method, we produce green sheets with stable thickness and strength. With high-precision gap management of the blade, we are able to achieve green sheets as thin as 20 micrometers. (We are also developing coating technology for layers as thin as 5 micrometers.)

  • Printed Circuit Board
  • substrate

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Ceramic thin plate chip break (segmentation) chocolate break

Ceramic thin plate chip break (segmentation) chocolate break

For high-performance ceramic substrates, please consult our specialized manufacturer.

"Providing split slits for individualization through mold forming" "1. Removal of the frame part", "2. Barb break (strip shape)", "3. Chip break (individualization)" makes individualization easy.

  • LED-Pack_5050_V-cut_break_sheet.png
  • LED-Pack_5050_no_V-cut_break_sheet.png
  • Printed Circuit Board
  • Fine Ceramics
  • substrate

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Ceramic substrate for firing setters (development product)

Ceramic substrate for firing setters (development product)

We assist in the firing of ferrite substrates and metal injection molding (MIM) products using optimized "ceramic substrates for setters" in the firing process.

Improving production efficiency in the "batch-type vacuum sintering furnace" used in the sintering process is a significant challenge. One proposal is to enhance production efficiency through "multi-layer stacking." By replacing the conventional ceramic support plate (7mm thick) with "our ceramic substrate for sintering setters (1mm thick)," it becomes possible to increase the number of shelf layers from 16 to 18, resulting in a 12% improvement in sintering loading efficiency. Additionally, it allows for "thicker workpieces" to be sintered with the same number of workpieces, enabling broader utilization of the sintering furnace. The second proposal is "micro-convex porous ceramic processing." Among the process conditions that affect sintering quality, "debinding performance and characteristics" are crucial, and various porous ceramic materials are being utilized creatively. In addition to these porous ceramic substrate technologies, using ceramic support plates for setters that have undergone "micro-convex porous ceramic processing" allows for space to be secured at the bottom of the sintering workpieces, thereby improving debinding efficiency and performance.

  • setter_debinding_less_adhesion.png
  • Ceramics
  • substrate

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Improving thermal conductivity of alumina substrates with printed circuit technology [For mounting power devices!]

Improving thermal conductivity of alumina substrates with printed circuit technology [For mounting power devices!]

Leveraging the strengths of a "ceramics substrate specialized manufacturer," we have achieved "high thermal conductivity of alumina substrates" through via formation technology and printed circuit technology!

In the implementation of power devices, where applications are expanding in areas such as home appliances and EV vehicles, expectations for "thermal conductivity performance of the substrate" are rising significantly. Through the mass production achievements of our flagship high-power LED packages, we have developed technologies to improve heat dissipation performance associated with higher power output. In particular, we have received many inquiries regarding "improving thermal conductivity using general-purpose alumina ceramic substrates compared to aluminum nitride substrates, which excel in thermal conductivity" for ceramic circuit boards. We have achieved improvements in thermal conductivity by applying through-hole processing technology (via formation) and printed circuit technology, filling the via sections of alumina ceramic substrates with "metallic materials," while using general-purpose alumina ceramic substrates. For high-power LED package substrates, we have achieved a thermal conductivity of "369 W/mk" with alumina ceramic substrates. If you are facing challenges with "thermal measures" for ceramic substrate implementation of high-power power devices, please consult with us.

  • Fine Ceramics
  • Circuit board design and manufacturing
  • Other electronic parts
  • substrate

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Notice of Participation in "Nepcon Japan"

Notice of Participation in "Nepcon Japan"

We plan to exhibit "high flame-retardant silicone resin sheets" and "thick film printed circuit ceramic substrates"!

Our company is a specialized manufacturer of high-performance ceramic substrates. We plan to exhibit at the "Semiconductor Forum (Joint Exhibition)" at "NEPCON Japan" held at Tokyo Big Sight. We will showcase products such as "Alumina and Zirconia (Ceramic Substrates)." We sincerely look forward to your visit. 【Exhibition Overview】 ■ Dates: January 21 (Wed) - January 23 (Fri), 2026 ■ Venue: Tokyo Big Sight ■ Booth Number: E23-42 (East Hall 6) ■ Nearest Stations: - Rinkai Line: Get off at "Kokusai Tenjijo" Station and walk about 7 minutes - Yurikamome: Get off at "Tokyo Big Sight" Station and walk about 3 minutes *For more details, please feel free to contact us.

  • Exhibition
  • substrate

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