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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

766～780 item / All 1843 items

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GNSS High Gain LNA NJG1187A-A

GNSS High Gain LNA NJG1187A-A

AEC-Q100 grade 2 and VDA 6.3 automotive component standard compliant GNSS high-gain LNA

We have strengthened our lineup of products that comply with AEC-Q100*1 grade 2 and VDA6.3*2, capable of realizing GNSS multi-band. The NJG1187A-A is a low noise amplifier (LNA) product characterized by high gain and low noise figure, supporting the 1.5 GHz band (1559–1610 MHz) and the 1.1–1.2 GHz band (1164 MHz–1300 MHz), contributing to improved reception sensitivity and reduced positioning time for GNSS receivers. Additionally, since the matching of the first and second stage LNAs is done outside the package, the circuit configuration can be flexibly changed according to the application. The package of this product adopts a wettable flank package, making it easier to implement automatic visual inspection. *1 AEC-Q100 is a global standard for the reliability of automotive electronic components. *2 VDA6.3 is a process audit standardized by the German Automotive Industry Association.

  • Other semiconductors

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PTFE buildup

PTFE buildup

It is a fluororesin substrate with excellent high-frequency performance!

We offer a fluoropolymer substrate with excellent high-frequency performance, called 'PTFE Build-Up.' It features an AnyLayer configuration using laser vias and employs thermosetting BF, making it possible to achieve with standard multilayer methods. Please feel free to consult us if you have any requests. 【Other Products】 ■ Fluoropolymer Substrate (PTFE) ■ PPE Substrate - Low Dielectric Constant Substrate ■ Ceramic Substrate ■ High-Frequency Hybrid Substrate *For more details, please download the PDF or feel free to contact us.

  • Other electronic parts
  • Other machine elements
  • Circuit board design and manufacturing

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Technical challenges of embedded substrates

Technical challenges of embedded substrates

Electronic Patent Technology Trend Survey Report on Technical Issues of Embedded Boards

You can view patent information categorized by the following technical classifications: - Mechanical properties - Electrical properties - Thermal properties - Reliability

  • others

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We also accept various custom orders.

We also accept various custom orders.

For custom ceramics, choose Serize.

【Custom-made Ceramic Products Available★】 For custom ceramic items, choose Cerize. We accept custom-made orders. We can produce in any genre. 【Features of Cerize】 No molds required, from prototypes to short delivery times, from 1 piece to mass production (custom orders available). Cerize is a company that handles everything from material procurement to assembly. 【Ceramic Kenzan】 The photo above shows a ceramic kenzan (flower frog). There is no worry about rust or metal stains. It is aesthetically pleasing and white, and it also offers deodorizing and filtering effects unique to ceramics.

  • nut

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Achieve automation and efficiency of various business processes with V7!

Achieve automation and efficiency of various business processes with V7!

V7 utilizes image analysis technology to achieve automation and efficiency in business processes such as quality control and inventory management across various industries, including manufacturing and logistics.

V7 is a platform designed to solve the challenges of AI development in the manufacturing industry. In manufacturing, many operations such as quality control, inventory management, production planning, and fault detection are based on visual judgments. However, automating these operations requires a large amount of high-quality training data. V7 provides features to streamline the creation and management of training data, including: - Detection of defective products and automatic classification of packages - Fast automatic labeling using generative AI - Support for multiple annotation types and pixel-perfect labels - Version control and filtering of datasets - Library management of personal models and pre-trained models - Workflows that enable combinations of humans and models, as well as automatic quality control - Collaboration with experts and professional labelers V7 is characterized by high-accuracy annotations, making it well-suited for AI utilization in manufacturing.

  • Company：B7
  • Price：Other
  • Image analysis software

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Polycrystalline super high thermal conductivity optical grade diamond substrate

Polycrystalline super high thermal conductivity optical grade diamond substrate

Optimal for laser output windows, etc.

The diamond window not only has excellent light transmittance at pump wavelengths, but its thermal conductivity is unmatched by other materials. The ultra-high thermal conductivity of CVD diamond allows for the rapid dispersion of heat generated by the laser medium into the surrounding environment. The precise polishing process enhances thermal conduction by ensuring close contact between the diamond window and the laser crystal, improving the efficiency and accuracy of laser output.

  • Fine Ceramics

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[Demo Unit Rental] Control Panel 'Membrane Display'

[Demo Unit Rental] Control Panel 'Membrane Display'

Introducing an ultra-thin control panel that integrates everything: 7SEG LED, CPU, sensors, LCD, and more!

The "Membrane Display" we handle is a product that integrates original components into a thin panel of around 4mm. It supports multilayer circuit boards that allow for a slim design, as components can be mounted on both sides. Additionally, the thin 7-segment display allows for flexible size selection. Height adjustment of the mounted components is unnecessary, and the surface embossing and tact switches provide a clear operational feel and high durability. 【Features】 ■ Ultra-thin (standard 3.6mm, minimum 2.0mm) ■ Excellent switch with no uneven click sensation ■ High reliability (switch durability of 3 million cycles) ■ Waterproof specification equivalent to IP64, customers can "just stick it on" ■ No height adjustment needed for mounted components ■ Components can be mounted on both sides *【Demo units available for loan!】Please contact us through "Inquiries" if you would like to request one. *For more details, feel free to contact us.

  • Touch Panel

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High-frequency fluororesin FPC substrate

High-frequency fluororesin FPC substrate

Effective in millimeter wave bands such as 5G communication! Products with low transmission loss, low dielectric constant, and high flexibility.

The "High-Frequency Fluororesin FPC Substrate" manufactured by Sumitomo Electric Industries enables low-loss data transmission of high-frequency signals ranging from 20GHz to 100GHz. As a type of flexible substrate, it allows for wiring in tight spaces, contributing to the miniaturization and lightweight design of devices. When used with millimeter-wave planar antennas, it can achieve either antenna miniaturization or enhanced performance per antenna size. 【Features】 ■ Low Transmission Loss: Can be utilized as a wiring material that achieves low transmission loss in high-frequency signal transmission. ■ Thinness and Narrow Pitch: Achieves both thinness and narrow pitch, while offering high design flexibility, contributing to airflow within enclosures and high-density designs. ■ Excellent Gain: By routing antenna circuits on a fluororesin substrate, it can be utilized as an antenna with efficient space usage and excellent gain. *For more details, please download the PDF or feel free to contact us.

  • 高周波用フッ素樹脂製FPC基板2.jpg
  • Printed Circuit Board

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Cyclone-type soldering iron cleaner "Senpujin"

Cyclone-type soldering iron cleaner "Senpujin"

Usable without selecting the tip shape. Reduces deterioration of the tip without contact.

"Wash Wind Rapid" is a cyclone-type soldering iron cleaner that generates a vortex airflow through air blows from multiple directions, allowing for non-contact removal of dirt from the soldering tip. Even with repeated use, it consistently delivers stable cleaning power. It is maintenance-free with no consumable parts like cleaning brushes, and cleaning simply involves removing the accumulated solder debris from the drawer. 【Features】 ■ Non-contact design reduces deterioration of the soldering tip ■ Maintains cleanliness on-site and the shine of the soldering tip ■ Maintenance-free with no consumables like cleaning brushes ■ Extends the lifespan of the soldering tip ■ Minimal temperature variation of the soldering tip allows for quick transition to work ■ Reduces cleaning time *For more details, please download the PDF or feel free to contact us.

  • Solder

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Support for high-density build-up structures

Support for high-density build-up structures

We can accommodate high-density build-up structures, such as 4-layer full-stack prototypes!

Our company enables the mounting of narrow-pitch components through a high-density build-up structure. In the interlayer thick structure, the interlayer thickness is set to 100-120μm, achieving high insulation reliability. Additionally, we support mass production of three-tier full stacks and skip via structures. Please feel free to contact us when you need our services. 【Specifications Supported】 ■ Narrow pitch support ■ Thick copper foil specifications ■ Mixed IVH & LVH ■ High-frequency support An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Mass production of copper coin printed circuit boards is possible for high-speed, high-frequency applications and high multilayer substrates. The unique copper coin structure achieves high heat dissipation.

Our company is capable of providing copper coin (heat dissipation structure) wiring boards. With the advancement of high-performance 5G communication devices, managing the heat generated by high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. *Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Independently developed equipment for embedding copper coins, flexibly adapting to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing

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Printed circuit boards (wiring boards) for space and defense equipment.

Printed circuit boards (wiring boards) for space and defense equipment.

We supply printed circuit boards for space and defense applications. The printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products.

OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html

  • Printed Circuit Board

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Millimeter-wave radar compatible printed circuit board (substrate)

Millimeter-wave radar compatible printed circuit board (substrate)

We would like to propose a printed circuit board equipped with a millimeter-wave antenna!

Our company will realize products that support the millimeter wave frequency range of 30 to 300 GHz. Do you have any concerns such as "I would like to consider next-generation millimeter wave radar-equipped devices"? We will support you in solving challenges for product commercialization. We will make proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. [We solve the following concerns] ■ I would like to consider substrates for millimeter wave radar applications. ■ I would like to consider substrates for next-generation high-frequency applications. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. An article about our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

Supports high frequency and millimeter wave frequency bands from 30 to 300 GHz! "I want to consider high frequency printed circuit boards, but it's difficult." We will solve such problems!

Our company will realize products that support high-frequency and millimeter-wave frequency bands from 30 to 300 GHz. Do you have any concerns such as "I want to consider next-generation high-frequency printed circuit boards, but it's difficult to realize"? We will support you in solving challenges towards product commercialization. We will provide proposals tailored to your needs, such as adopting new high-frequency materials, evaluating frequency characteristics, and assessing environmental resistance together. [We solve the following concerns] ■ I want to consider next-generation high-frequency application substrates ■ I want to consider millimeter-wave radar application substrates ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to keep costs down for high-speed high-frequency compatible substrates ■ I want to know about printed circuit boards for the fifth-generation mobile communication system (5G) ■ I want to learn about the latest lamination technology and pattern design ■ I want to know about selecting suitable printed circuit board materials, etc. *For more details, please refer to the PDF document, or feel free to contact us if you wish to have a technical consultation.

  • Circuit board design and manufacturing

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