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substrate Product List and Ranking from 561 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors

substrate Product ranking

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社 和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社 和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1561~1590 item / All 1884 items

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On-board equipment and circuit board

We handle control boards for vehicle batteries and vehicle LED units, among other products.

Our company provides high manufacturing quality globally based on design technology and manufacturing know-how aimed at achieving zero defects in automotive quality. We can offer high-quality products thanks to our capability to comply with the international standard for the automotive industry, "IATF16949," as well as our expertise in high-density mounting and mass production design technology. Please feel free to contact us if you have any requests. 【Main Product Achievements】 ■ Control boards for automotive batteries ■ Automotive LED units ■ Control units for construction machinery ■ Business operation management systems ■ CAN communication units for agricultural machinery *For more details, please download the PDF or feel free to contact us. *Our company changed its name to LIMNO Corporation in January 2023.

  • Company:LIMNO
  • Price:Other
  • Circuit board design and manufacturing
  • Contract manufacturing
  • Other optical parts
  • substrate

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Polycrystalline ultra-high thermal conductivity optical grade diamond substrate

Multi-crystal ultra-high thermal conductivity optical grade wafer/sheet

Laser, optoelectronic devices, high output heat dissipation, and other high-end applications.

  • Ceramics
  • substrate

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Single crystal super high thermal conductivity diamond substrate

Highest grade thermal conductivity

High-output electronic devices, laser systems, heat dissipation management, etc.

  • Ceramics
  • substrate

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Substrate manufacturing

Select and propose suitable manufacturers for the project! Procurement is possible not only from domestic but also from overseas PCB manufacturers.

At Tokai Corporation, we can manufacture from a single printed circuit board. We support a variety of boards, including "rigid boards (single-sided to high multilayer)," "IVH and BVH boards," "build-up boards," and "special boards (such as Teflon, aluminum, glass, etc.)." We will select and propose the most suitable manufacturers based on specifications, quality, and cost for each project. Additionally, we can procure from domestic as well as overseas board manufacturers, so please feel free to consult us when needed. 【Supported Boards (partial)】 ■ Rigid boards (single-sided to high multilayer) ■ IVH and BVH boards ■ Build-up boards ■ Flexible boards (single-sided to multilayer) ■ Rigid-flex boards *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Printed circuit board for electronic component evaluation

We respond to the various needs for printed circuit boards required in the development of electronic components and the production process!

We would like to introduce our "Printed Circuit Boards for Electronic Component Evaluation." We can offer various printed circuit boards required at each stage of the engineering chain and value chain for electronic component manufacturers. We provide a seamless service for all tasks related to printed circuit board development. With the LDI process, both patterns and solder resist (SR) can be finished with high precision. 【Benefits for Customers】 ■ We can provide a seamless service for all tasks related to printed circuit board development. ■ The LDI (Laser Direct Imaging) process allows for high-precision finishing of both patterns and solder resist (SR). ■ There is no concept of end-of-life (EOL) due to the absence of original artwork, film plates, and screen plates, allowing for orders to be placed at any time. *For more details, please download the PDF or feel free to contact us.

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OKI Circuit Technology Pattern Design

Achieving short delivery times! Smooth flow from pattern design to circuit board manufacturing to assembly.

Our company offers pattern design focused on the manufacturing of printed circuit boards. We achieve short delivery times through simultaneous parallel design. We have approximately 10,000 design achievements ranging from communication and measurement equipment to space and defense products. Furthermore, all designers hold first and second-class qualifications as printed circuit board manufacturing technicians and can propose analyses through various simulations. 【Features】 ■ Short delivery times ■ Abundant track record ■ Pattern design considering board quality and assembly quality ■ Design quality check system through the introduction of proprietary verification tools ■ All designers hold qualifications as printed circuit board manufacturing technicians An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Printed Circuit Board: Various Custom Printed Circuit Board Catalogs

Printed Circuit Board: Introducing OKI Circuit Technology's custom printed circuit boards.

This document is a catalog of "various custom printed circuit boards" handled by OKI Circuit Technology Co., Ltd., which develops, designs, and manufactures printed circuit boards. We introduce various custom printed circuit boards, including "copper coin (heat dissipation structure) printed circuit boards" embedded with copper coins for efficient heat dissipation from heat-generating parts, "high current, high voltage, and high heat dissipation compatible printed circuit boards" for applications requiring high current and voltage, and "high-speed, large-capacity transmission compatible printed circuit boards" supporting high-speed transmission of 25 to 400 Gbps. [Contents] ■ Copper coin (heat dissipation structure) printed circuit boards ■ High current, high voltage, high heat dissipation specification printed circuit boards ■ High-speed, large-capacity transmission printed circuit boards ■ High-density component compatible printed circuit boards ■ High-density build-up printed circuit boards ■ Flex-rigid printed circuit boards ■ Composite board thickness printed circuit boards (T-SEC-Board) An article from our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years] https://monoist.atmarkit.co. *For more details, please download the PDF or feel free to contact us.

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Support for flex-rigid structures

Achieving miniaturization, high density, and high reliability through flex-rigid integration!

Our company creates many benefits through integrated flex-rigid technology. We solve issues such as "high initial costs preventing prototype development" and "wanting to ensure high reliability." We contribute to miniaturization and high density through connector-less designs, as well as reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction of mold expenses through router processing ■ Possible multilayer structure for flex layers ■ Use of liquid crystal polymer materials for flex layers Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Support for high-density components

High-density component mounting such as narrow pitch CSP is possible! We will propose specifications according to your application.

Our company enables high-density component mounting such as narrow-pitch CSP. We offer specifications tailored to applications, including measures to prevent solder blowout during the mounting of via-in-pad structures. Please feel free to contact us when you need assistance. 【Specification Proposals】 ■ Increased wiring density for inner and outer layers → Build-up, IVH structure ■ Measures to prevent solder blowout during the mounting of via-in-pad structures → Pad-on-hole structure ■ High-density CSP mounting with a pitch of 0.65mm or less → Build-up, pad-on-hole structure An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, multi-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Integrated design and manufacturing solution services

All of our printed circuit boards, including special products, can be accommodated for assembly!

Our company provides a consistent solution service for design and manufacturing. We offer services utilizing OKI-EMS's comprehensive capabilities, including circuit design, firmware development, mechanical design, and AW design. Additionally, all of our printed circuit boards, including special products, are capable of implementation. 【Features】 ■ FPGA IP (image, audio, communication, embedded systems) ■ DSP platform ■ Wireless EtherCAT analog support ■ Enclosure and mechatronics design An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Composite board thick wiring board "T-SEC-Board"

Increase the number of layers to match the pin count of the mounted components! We can accommodate thick multilayer printed circuit boards.

Introducing the PCI-Express compatible wiring board "T-SEC-Board." In addition to increasing the freedom of characteristic impedance wiring width, the use of inner layer metals (copper, aluminum) is possible. This is a high-function wiring board equipped with multi-pin BGA, which allows for partial control of the board thickness at the terminal connector section. 【Features】 ■ Layer count can be increased according to the number of pins of the mounted components ■ Increased freedom of characteristic impedance wiring width ■ Inner layer copper foil thickness can be increased for heat dissipation purposes ■ Adoption of inner layer metals is possible (improving strength and heat dissipation, etc.) Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

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Custom and special purpose circuit boards

Developed with proven technology over many years! Pre-verification of characteristics through simulation is possible.

We provide printed circuit boards that combine functional materials tailored to various characteristic requirements. We can accommodate industrial applications and small quantities, and pre-validation of characteristics through simulation is possible. Developed with proven technology over many years, we guarantee long-term reliability. 【Features】 ■ Aluminum-based substrate - Achieves high heat dissipation and lightweight design ■ Edge shielded substrate - Suppresses radiated noise by shielding the edges - Adopts the ED method to accommodate special shapes ■ Millimeter-wave substrate - Hybrid structure of low-loss material and FR4 - High-precision patterning *For more details, please refer to the PDF document or feel free to contact us.

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Substrate lineup

Supports specific functional materials such as capacitors and heat dissipation! Balances performance and cost.

We provide printed circuit boards that combine functional materials tailored to various characteristic requirements. By using a hybrid structure of functional materials such as low-loss materials and capacitor materials along with general materials, we achieve a balance between performance and cost. Additionally, we accommodate low-loss materials both domestically and internationally. 【Application Example】 <Embedded Capacitor> ■ Number of Layers: 20 layers ■ Base Material: Faradflex + Megtron6 ■ Application Example: Networks, semiconductor testing *For more details, please refer to the PDF document or feel free to contact us.

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Copper coin embedded printed circuit board

Improving thermal conductivity by embedding copper coins! Introducing printed circuit boards that efficiently dissipate heat.

To efficiently utilize the thermal conductivity of copper (390 W/m·K) for heat dissipation, we introduce a printed circuit board embedded with copper coins in the heat-generating area. In conventional methods, heat dissipation vias were arranged as much as possible, but due to the inability to increase the cross-sectional area of copper, there were limitations in heat dissipation. In the developed product, the thermal conductivity has been improved by embedding copper coins. 【Comparison of Conductor Cross-sectional Area】 ■ Through Hole (25μm) - φ3.0mm 1 hole: 0.23 mm² - φ8mm area: 1.41 mm² (φ0.4mm TH, 1.0mm pitch, 48 holes) ■ Copper Coin - φ3.0mm 1 hole: 7.07 mm² (approximately 30 times) - φ8mm area: 50.24 mm² (1 hole of φ8mm copper coin) (approximately 35 times) *For more details, please refer to the PDF document or feel free to contact us.

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High-reliability build-up wiring board

High board thickness specifications, low dielectric material specifications, stack via specifications, etc.! We can accommodate various specifications.

We offer build-up wiring boards that support high density and high reliability. We can accommodate various specifications, including 0.4mm pitch, high board thickness, low dielectric material, stacked via specifications, and large interlayer thickness (100-120um). We deliver printed circuit boards with specific functions added for each application, from pattern design to manufacturing in a consistent system. Please feel free to consult us when you need assistance. *For more details, please refer to the PDF materials or feel free to contact us.

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High-speed high-frequency compatible printed circuit board

For those who want to use materials suitable for their products. We propose optimal materials (low dielectric, tangent materials) based on measured data!

In high-speed, high-frequency compatible printed circuit boards, we will assist in the development of printed circuit boards aimed at 25Gbps to 100Gbps. We solve customer issues such as "I want to reduce transmission loss and delay time" and "I want to use materials suitable for the product." We will propose suitable materials (low dielectric, low loss tangent) based on measured data. 【Features】 ■ Proposal of suitable materials (low dielectric, low loss tangent) based on measured data ■ Support from the design stage with pre-simulation (single-ended, differential) ■ Proposals based on measured values of material transmission characteristics (loss, delay) ■ Proposal of composite structure circuit boards using high-frequency materials and FR-4 *For more details, please refer to the PDF document or feel free to contact us.

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High-density compatible printed circuit board

We can propose specifications tailored to your needs! We provide printed circuit boards with structures customized for your applications.

We provide printed circuit boards with structures tailored to your applications. Increased wiring density for inner and outer layers → Build-up printed circuit boards Implementation of blind vias to prevent solder blowout → Pad-on-hole structure printed circuit boards Pitch of 0.65mm or less → Build-up or pad-on-hole structure printed circuit boards We can propose specifications according to your needs. Please feel free to consult us. 【Usage Scenarios】 ■ By Product / Minimum Through-Hole Pitch - Probe Card: 0.65mm - CSP Main Image: 0.40mm - Performance Board: 0.50mm - Burn-in Board: 0.40mm *For more details, please refer to the PDF document or feel free to contact us.

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[Use Case] Supporting IoT integration through wiring wearable devices into clothing.

The conductor resistance value is low, and the change in conductor resistance during expansion and contraction is small! Suitable for applications that were difficult to apply in the past!

We would like to introduce a case where our EMS (design and manufacturing contract services) supported the IoT integration of clothing through the wiring of wearable devices. The customer's challenge was to improve the performance and quality of their own wearable devices. By using copper foil for the circuit conductors, we achieve low conductor resistance and minimal changes in resistance during stretching. This feature allows for wide application in areas that were previously difficult to implement. [Challenges] ■ Desire to improve the performance and quality of their own wearable devices ■ Traditional flexible substrates have issues with lack of elasticity ■ Unable to realize the desired wearable device *For more details, please refer to the PDF document or feel free to contact us.

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Simulation-based substrate design

The appropriateness of the design will be quantitatively assessed through simulation.

At Oki Electric Industry, we support efficient manufacturing by verifying design validity during the development stage. By conducting functional verification before actual production, we reduce cut-and-try efforts. We provide support from identifying causes to planning countermeasures and confirming their effectiveness. We solve issues such as "not functioning" and "taking time for countermeasures" through simulations at the circuit board design stage. 【Features】 ■ Reduces cut-and-try efforts through functional verification before actual production ■ Quantitatively assesses design validity through simulations ■ Supports from cause identification to countermeasure planning and effectiveness confirmation *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Space and defense application printed circuit boards

We supply printed circuit boards for space and defense applications, such as copper coin substrates.

Oki Electric Industry supplies printed circuit boards for space and defense applications. Printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products. 【Main Products】 ■ Flex-rigid substrates ■ Thick copper substrates ■ Copper coin substrates ■ Various multilayer rigid substrates *For more details, please feel free to contact us.

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Flexible Printed Circuit (FPC) Comprehensive Catalog

A large number of flexible circuit boards that are thin and lightweight, making them excellent for space-saving solutions!

This catalog features a wide range of "Flexible Printed Circuits (FPC)" that our company handles. We offer products such as "High-Flex FPC," which demonstrates excellent bending performance even in narrow spaces, "Self-Supporting Sliding FPC," which can slide and bend while remaining upright in the air, and "Power FPC," which can handle high currents. 【Contents】 ■ FPC Product Concepts ■ Areas of Achievement ■ Process Overview ■ What is a Flexible Printed Circuit (FPC)? ■ Product Introduction *For more details, please refer to the PDF document or feel free to contact us.

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2025 Edition of China Automation Market Analysis

A clear visualization of the overall market in 2025 using numbers and graphs.

Basic Data for Understanding the Movements of the Chinese Market Organizing Product Trends and Industry-Specific Adoption Status in the Automation Field This document consolidates the latest trends in control devices and FA equipment, as well as trends across a wide range of categories including robots, motion, HMI, and industrial software. It organizes growth rates and market shares by product and industry, providing content that will be useful for future market strategies. For manufacturers, trading companies, and system integrators that have already entered or are considering entering the Chinese market, this can serve as a foundational resource for understanding the local market structure and competitive trends. It captures the realities of price competition and differentiation directions, reflecting real changes in the industry through data. [Contents (excerpt)] ■ Overall growth rate and forecast of the Chinese automation market ■ Market size trends by product category (PLC, HMI, robots, etc.) ■ Adoption status by industry (automotive, chemicals, mining, food, etc.) ■ Differences in growth between OEM and project-based markets and areas of focus *Additionally, we offer a variety of reports specialized in various product categories and industries. *Please first check the PDF document.

  • others
  • substrate

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Sales of reused FA equipment (second-hand goods)

If you are having trouble procuring FA equipment that has been discontinued, leave it to us.

Our company handles the procurement and sale of discontinued FA equipment. FA equipment examples: motors, PLCs, inverters, servo amplifiers, actuators, and many others. 【Sales of FA Equipment】 ■ Capable of responding to both domestic and overseas manufacturers We have a wide procurement network, primarily focused on the domestic market as well as the Americas, Europe, Oceania, and Asia, allowing us to source products that other companies may have declined, regardless of the manufacturer. ■ Prompt response Requests made by 5 PM on the same day will receive investigation results via email or phone on the same day or the following business day. ■ Shipment after pre-inspection Products delivered will be inspected by our company or our procurement partners before shipment. ■ Assurance with warranty All products come with a warranty for a certain period. If a defect is returned within the warranty period, we will provide a replacement (equivalent product) or a refund. We also handle repairs, so please consider us if you have any defective items. *For more details, please download the PDF or feel free to contact us.

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Flexible printed circuit board

We respond to any customer requests with flexibility. We accommodate small and medium lots as well as prototypes.

We manufacture flexible printed circuit boards (FPC) tailored to our customers' needs with a diverse range of materials, configurations, and lineups. We are happy to accept orders for just one piece or a single process, and we also provide fine-pitch FPCs with a mass production base for small to medium lots, such as L/S = 50/50μm. Leveraging the surface treatment technology we have built over many years, we respond to our customers' diverse requests under thorough process management. 【Four Reasons to Choose Us】 ■ Years of expertise ■ Support for small and medium lots and prototypes ■ Proven track record of safety and reliability ■ Planning and proposal services available *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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A paper substrate is capable of deformation such as "folding and bending."

Would you like to expand the possibilities of product ideas for decoration using paper-based materials?

A paper circuit board is one that has a silver pattern printed directly on the paper itself, with components mounted on top of it. Paper circuit boards are thin and flexible, allowing for deformation such as "folding and bending," making them suitable for various applications, including products that can be attached to interiors or given as gifts. Post-assembly forming processes are also easy, and circuits can be cut by hand. Website "Paper Circuit Board Mounting" https://www.johnan.com/dms/mounting/paper/ 【Examples】 Products featuring LED components attached to origami and fans. <Presented in a video!> This video clearly demonstrates the flexibility of paper circuit boards. (Approximately 1 minute and 30 seconds) ~I tried folding a paper crane with a paper circuit board~ https://www.youtube.com/watch?v=-5_kg2Uqmrs&t=6s ■Contact Information TEL: 0774-43-1431 Website: https://www.johnan.com/dms/contact/

  • Chip type LED
  • substrate

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Porous Chuck "Porous PE Vacuum Chuck"

A low-cost porous chuck compared to ceramic and metal material products! It has excellent wear resistance and is soft, making it difficult to put stress on the work being held!

We would like to introduce the "Porous PE Vacuum Chuck" that we handle. It is low-cost compared to ceramic and metal material products, and when clogging occurs in the porous material, it can be easily replaced with a spare part. Additionally, when using porous materials with an average air pore diameter of less than 5μm, partial adsorption is possible, and it is not only excellent in wear resistance but also soft, making it difficult to put stress on the workpiece being adsorbed. 【Features】 - Low-cost compared to ceramic and metal material products - Approximately 80% lighter than ceramic and metal material products - Easy to replace with a spare part when clogging occurs in the porous material - Partial adsorption is possible when using porous materials with an average air pore diameter of less than 5μm - Excellent wear resistance and soft, making it difficult to put stress on the workpiece being adsorbed *For more details, please refer to the PDF document or feel free to contact us.

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Connector for board-to-board (FPC) connections | FB35AA series

Connector with a height of 0.8mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35AA series connector is designed for connecting PCBs to FPCs with a 0.35mm pitch, a mating height of 0.8mm, and a depth of 1.8mm. It adopts a metal cap method where the metal is integrally molded at the plug end, providing a robust structure that enhances strength against damage in case of misalignment. 【Features】 - The adoption of the metal cap method achieves a robust structure. - The tabs can carry up to 3A as power contacts, allowing for a reduction in the number of contact pins and contributing to space-saving. - It features a highly reliable two-point contact structure. - A recess is provided in the plug contact to improve the click feel and extraction force during insertion. *For more details, please refer to the PDF materials or feel free to contact us.*

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Connector for board-to-board (FPC) connection | FB35AT5 series

Connector with a height of 0.5mm, 0.35mm pitch, compact, ultra-low profile, and narrow pitch.

The FB35AT5 series connector is a connector for board-to-board (FPC) connections with a pitch of 0.35mm, a mating height of 0.5mm, and a depth of 1.65mm. 【Features】 ■ Pitch of 0.35mm, product width of 1.65mm, mating height of 0.5mm ■ Number of contacts available: 8 contacts ■ Adoption of a metal cap design for a robust structure ■ Metal placed in the center of the receptacle connector: further strength enhancement through an inner metal armor structure ■ The metal cap can carry up to 3A as a power contact → achieving space-saving due to reduced number of contact pins ■ Highly reliable two-point contact structure ■ Plug contact recess structure: improves the click feel and extraction force during mating *For more details, please refer to the PDF document or feel free to contact us.

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Connector for board-to-board (FPC) connection | FB3BA5 series

Height of 0.5mm, 0.3mm pitch, ultra-low profile and ultra-compact connector in the smallest class in the industry.

The FB3BA5 series connector is a board-to-board (FPC) connector with a 0.3mm pitch, a mating height of 0.5mm, and a depth of 1.55mm. 【Features】 ■ Pitch: 0.3mm, Mating height: 0.5mm, Product width: 1.55mm ■ Number of pins available: 24, 36 pins ■ Adoption of a metal cap design for a robust structure ■ The metal cap can carry up to 3.0A as a power contact ■ Metal is placed in the center of the receptacle connector: enhanced strength due to the inner metal armor structure ■ Reliable two-point contact structure ■ Achieves a good click feel during mating and improved extraction force *For more details, please refer to the PDF document or feel free to contact us.

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Connector for board-to-board (FPC) connection | FB35AT8 series

Connector with a height of 0.8mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35AT8 series connector is a connector for board-to-board (FPC) connections with a pitch of 0.35mm, a mating height of 0.8mm, and a depth of 1.65mm. 【Features】 ■ Pitch of 0.35mm, product width of 1.65mm, mating height of 0.8mm ■ Available core counts: 12 and 16 cores ■ Adoption of a metal cap design for a robust structure ■ Metal placed in the center of the receptacle connector: further strength enhancement with an inner metal armor structure ■ The metal cap can carry up to 3A as a power contact → realization of space-saving due to reduced contact core count ■ Highly reliable two-point contact structure ■ Plug contact recess structure: improved click feel and extraction force during mating *For more details, please refer to the PDF document or feel free to contact us.

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