substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies

Thick copper substrate

By increasing the finished copper thickness to around 210μm, it can also accommodate high current circuits!

We would like to introduce the "thick copper substrate" handled by Matsuwa Sangyo Co., Ltd. The typical copper foil thickness for printed circuit boards is 18μm or 35μm, but by increasing the finished copper thickness to about 210μm, it can accommodate high current circuits. In recent years, thick copper substrates (high current substrates) have been increasingly required, particularly for automotive and power electronics applications, and the demand is growing. [Example of Thick Copper Substrate Manufacturing Specifications] ■ Copper foil thickness: 70μm, 105μm, 140μm, 175μm (excluding copper foil thickness below 35μm) ■ Finished copper thickness after plating: can be 210μm or more *For more details, please refer to the related links or feel free to contact us.

Company：松和産業本社
Price：Other

Printed Circuit Board
substrate

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Copper inlay substrate

By directly contacting heat-generating components with copper, which has a high thermal conductivity, excellent heat dissipation is achieved!

We would like to introduce the "Copper Inlay Substrate" handled by Matsuwa Sangyo Co., Ltd. This substrate is designed to partially improve heat dissipation characteristics by using copper pins pressed directly under heat-generating components. By making direct contact with heat-generating components, it achieves high heat dissipation due to the high thermal conductivity of copper. Compared to metal-based substrates, it can reduce weight, and it is also advantageous that the existing layer structure of substrates can be applied as is. 【Features】 ■ A substrate aimed at partially improving heat dissipation characteristics ■ Achieves high heat dissipation by making direct contact with heat-generating components using high thermal conductivity copper ■ Reduces weight compared to metal-based substrates ■ Existing layer structures of substrates can be applied as is *For more details, please refer to the related links or feel free to contact us.

Company：松和産業本社
Price：Other

Printed Circuit Board
substrate

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Copper bump substrate

Effective when it is required to make contact between the substrate pad and mounted components at a high position!

We would like to introduce the "copper bump substrate" handled by Matsuwa Sangyo Co., Ltd. Thanks to a special plating method, it is possible to form bumps of approximately 30 to 100 μm in the necessary areas of the pattern. This is effective in cases where it is required to make contact between the substrate pad and mounted components at a high position. 【Copper Bump Substrate Manufacturing Specifications Example】 ■Bump Diameter/Bump Size: φ0.4mm/0.3mm×0.25mm ■Bump Height: 100μm *For more details, please refer to the related links or feel free to contact us.

Company：松和産業本社
Price：Other

Printed Circuit Board
substrate

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Heat dissipation substrate

Cool down the substrate!

In printed circuit boards, heat dissipation measures have become a very significant issue. Our company offers various heat dissipation substrates, including metal bases, thick copper, copper inlays, conductive paste filling, and thermal conductive materials such as ceramics. Please feel free to contact us.

Company：松和産業本社
Price：Other

Printed Circuit Board
substrate

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"Automatic Quotation System" Quick! Showa

【Zero Waiting Time for Estimates!】 By simply filling out the necessary information, you can achieve an estimate response with "zero waiting time." We won't keep you waiting for PCB manufacturing estimates!

"Oh no~ I can't reach the sales representative!" "I want the estimate as soon as possible!" "When will the estimate come?" Matsuwa Sangyo responds to such words. Matsuwa Sangyo prides itself on being the fastest in domestic circuit board manufacturing. Of course, we confidently respond with "Fast!" to various inquiries, including estimates, but we are also striving to further shorten the response time for estimates by providing the automatic estimate system "Saku! to SHOWA." Just enter the necessary items from the URL below and click! Now, let's get those estimates quickly! Saku! to SHOWA https://www.showanet.jp/estimate/

Company：松和産業本社
Price：Other

Printed Circuit Board
substrate

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＼Exhibiting at JPCA Show 2024／ Printed circuit boards will be shipped tomorrow!

We will be exhibiting at the JPCA Show 2024 from June 12 to 14! Here’s a sneak peek of our timely delivery response.

Don't you have experience wanting a circuit board by tomorrow? The greatest strength of Matsuwa Industries is undoubtedly our ultra-short delivery times. We deliver everything from through-hole boards to build-up boards, FPC boards, and rigid FPC boards at the industry's fastest levels! 2-layer to 10-layer through-hole boards in as little as 1.05 days! Through-hole resin-filled boards in as little as 2.1 days! 1-2-1 build-up boards in as little as 3 days! 1-layer and 2-layer FPC boards in as little as 2 days! 4-layer rigid FPC in as little as 5 days! Not only are our delivery times fast, but we also ensure that we deliver on your requested deadline (with a compliance rate of 99.94%). Naturally, our inspection system is equipped with the latest facilities, so you can rest assured about quality. We will thoroughly promote the secrets of our delivery times and more at the exhibition. If you are attending, please stop by the Matsuwa Industries booth at [5F-23]! Register for the JPCA Show here ⇓

Company：松和産業本社
Price：Other

Printed Circuit Board
substrate

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Exhibiting at the Nepcon Autumn Show @ Makuhari Messe! Leave printed circuit boards to Matsuwa Sangyo!

We will be exhibiting at the Nepcon Japan Autumn Exhibition at Makuhari Messe from September 4 to 6! Please feel free to consult us about anything related to circuit boards!

Build-up substrates, high-frequency substrates, FPC and rigid FPC substrates... All of these are manufactured in-house at our own factory with a fully integrated process! The ultra-short delivery times achieved by eliminating outsourcing are astonishingly fast! Through-hole substrates ⇒ as short as 1.05 days! Through-hole resin-filled substrates ⇒ as short as 2.1 days! 1-2-1 build-up substrates ⇒ as short as 3 days! FPC substrates ⇒ as short as 2 days! 4-layer rigid FPC substrates ⇒ as short as 5 days! Surface treatment with gold flash is also handled in-house, so there are no fluctuations in delivery times! Not only the delivery times but also the wide range of materials we handle is one of the attractions of Matsuwa Sangyo. Even for materials we have no processing experience with, we are flexible in our response! We accept orders for any type of substrate, even in small quantities, so if you have even a slight desire to "want to make a substrate..." Why not start with a light consultation? We will be exhibiting at the Nepcon Japan Autumn Exhibition held at Makuhari Messe from September 4 (Wed) to September 6 (Fri)! On the day, members who can consult on technology will be gathered at our booth, so please stop by the Matsuwa Sangyo booth [6-37]! Pre-registration for your visit can be done here↓!

Company：松和産業本社
Price：Other

Printed Circuit Board
substrate

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High-frequency substrates with the fastest domestic delivery times!

Because the era is high frequency.

Matsuwa's high-frequency substrates are very speedy! We always have low Dk and low Df materials in stock. We can accommodate everything from multilayer boards to hybrid laminated structures and back drilling, even for small quantities and short delivery times. We are also actively working on new materials and welcome inquiries not only for regular projects but also for various research and development purposes. Matsuwa Industries is here for high-frequency substrates! Thank you.

Company：松和産業本社
Price：Other

Printed Circuit Board
substrate

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【Ultra-Short Delivery Response】For last-minute requests during the New Year holidays, contact Matsuwa Sangyo!

With the "Breakthrough Course," you can ship printed circuit boards in as little as 12 hours! Let's make circuit boards this year and welcome a refreshing New Year!

The year 2024 is about to come to an end in the blink of an eye. Are there any circuit boards you are about to give up on arranging for delivery by the end of the year? If you consult with Matsuwa Sangyo, known for its ultra-short delivery times, we can accommodate your desired schedule even with tight timelines. Common year-end and New Year’s issues can be resolved with Matsuwa, making us a strong ally for your company! - Through-hole boards ⇒ as fast as 1.05 days! - Through-hole resin-filled boards ⇒ as fast as 2.1 days! - 1-2-1 build-up boards ⇒ as fast as 3 days! - FPC boards ⇒ as fast as 2 days! - 4-layer rigid FPC boards ⇒ as fast as 5 days! Furthermore… with our unbeatable <Limit Break Course>, - 4-layer through-hole boards ⇒ 17 hours - 6-layer through-hole resin-filled boards ⇒ 24 hours - 1-2-1 build-up ⇒ 48 hours - 6-layer 2-2-2 build-up ⇒ 72 hours to complete the boards! Our impressive delivery capabilities are made possible by Matsuwa Sangyo’s fully in-house manufacturing and 24-hour factory operations. Additionally, our compliance rate of 99.94% is another attractive feature. We guarantee delivery by the promised deadline. For more details, please refer to our catalog or feel free to contact us through our website.

Company：松和産業本社
Price：Other

Printed Circuit Board
substrate

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Special substrate

The era is 【SPECIAL PCB!】

Recently, the specifications for substrates have diversified, and at Matsuwa Industries, we are trying various special substrates. The substrates listed all started from customer requests. We have been working together with customers who have said, "Other companies have turned us down, but perhaps Matsuwa Industries can make it happen?" Thick copper substrates ⇒ MAX 500μ * foil thickness 400μ in stock, inner layer core material foil thickness 140μ Copper inlays ⇒ round and square shapes * board thickness t1.0 to t3.0mm, round: φ1.0 to φ8.0mm, square: please consult Rigid FPC (build structure) ⇒ available in 1-layer and 2-layer Matsuwa Industries has established a prototype development room, so please contact us at the following for inquiries. TEL: 0598-52-1855

Company：松和産業本社
Price：Other

Circuit board design and manufacturing
EMS
Printed Circuit Board
substrate

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Low Noise Amplifier "SA Series"

Ultra-low noise, excellent stability, wideband ultra-small signal detection amplifier.

The "SA Series" is a low-noise amplifier that pursues technology to suppress factors that hinder measurement, such as noise and environmental influences, to the utmost limit. We offer the voltage input "SA-200 Series/SA-400 Series," which achieves low noise that was not attainable with previous amplifiers, and the current input "SA-600 Series," which realizes high gain and wide bandwidth. Please choose the model that matches the signal from your sensor. *For more details, please refer to the PDF document or feel free to contact us.

Company：エヌエフ回路設計ブロック
Price：100,000 yen-500,000 yen

Other electronic parts
substrate

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Examples of subcontracting for parts assembly: Looking for companies that can be requested during peak production planning periods.

This is a case where a client, troubled by the need to outsource assembly work for electrical appliances during peak production planning periods, has approached our company for assistance.

At our company, which manufactures the heart of leakage circuit breakers, we operate with the mission that "not a single defect is allowed among millions." This commitment to quality is why our defect rate is exceptionally low. We are confident that we can be a wonderful partner for customers who prioritize high quality. This time, we would like to introduce a case of a company that was struggling to find someone to handle the assembly work of electrical products related to home appliances during a peak production planning period. [Challenge] The company was in need of outsourcing the assembly work of electrical products related to home appliances during a concentrated production planning period. [Proposal] Since we had previously worked together and received positive feedback on our quality, we proposed to visit their workspace and take on the assembly of parts. [Solution] Even for high-difficulty tasks, we were able to quickly identify the causes of difficulties and create jigs as solutions by the next day. Additionally, we prepared items like cards to prevent misidentification of similar parts without needing to be asked. They appreciated our constant consideration for improvement methods.

Company：ペアコム
Price：Other

Contract manufacturing
substrate

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Kyoei Electronics Co., Ltd. Company Profile

Contributing to the manufacturing industry in Japan! Our company is a group of handy professionals well-versed in the procurement of electronic components and devices.

Kyouwa Electronics Co., Ltd. is a handy group well-versed in the procurement of electronic components and devices. For half a century, we have continued to supply electronic components as a handy service in the electric town of Akihabara. In addition to selling parts, we assist in manufacturing by providing kitting, assembly on printed circuit boards, product assembly, control panels, and equipment assembly. Leveraging our extensive network of suppliers, we deliver anything you need. Please feel free to contact us when you require our services. 【Business Description】 ■ Trading company (Sales of electronic and electrical components) *For more details, please refer to the PDF document or feel free to contact us.

Company：共和電子
Price：Other

Other electronic parts
Harness
Printed Circuit Board
substrate

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BLE Module T-BLE01 Development Board

Development board for the BLE module T-BLE01 equipped with nRF51822.

We handle the "BLE Module T-BLE01 Development Board," which has obtained construction design certification (Technical Standards Compliance) from the Ministry of Internal Affairs and Communications. All input and output terminals are laid out on a 2.54mm grid and can be mounted on a universal board using pin headers. Please feel free to contact us if you have any requests. 【Features】 ■ AVDD can select between VDD and DC/DC converter output ■ Equipped with RS232C interface circuit for communication by connecting to any terminal ■ Includes T-BLE01 ■ All pins of T-BLE01 are brought out with a 2.54mm pitch ■ Equipped with RS-232C level conversion device, etc. *For more details, please download the PDF or contact us.

Company：トータス
Price：Other

Other electronic parts
substrate

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Platform "Leafony" *Easily build IoT systems

Easily build ultra-compact IoT systems! This platform achieves ultra-compactness by stacking circuit boards with a 20mm corner.

"Leafony" is a platform that achieves ultra-miniaturization by stacking 20mm square circuit boards, allowing for integration into devices with minimal space requirements. By selecting and combining various prepared modules (referred to as "leaves"), a wide range of configurations can be created according to the project needs. Additionally, connections can be easily assembled by anyone using dedicated rubber connectors. 【Features】 ■ Ultra-compact ■ Expandability with a variety of leaves ■ Reduction of software development time and costs ■ Development potential through collaboration with the University of Tokyo and participating companies *For more details, please download the PDF or contact us.

Company：大和無線電機
Price：Other

Other semiconductors
substrate

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High-precision multilayer substrate FPC (Red Board Co.)

We handle the "High-Precision Multi-Layer PCB FPC" manufactured by Red Board!

Red Board Electronics Ltd. was founded in 1988 and is a manufacturer of FPC and Rigid-FPC capable of supporting high-definition designs such as HDI. *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

Company：三幸セミコンダクター本社
Price：Other

Other electronic parts
substrate

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MPO cable checker

SM fiber/MM fiber, compatible with 12 cores/24 cores! Quality can be checked quickly.

The "MPO Cable Checker" is a tester that can automatically check the fiber continuity, connector end face, and polarity of optical cables with MPO connectors. By combining a light source unit, observation probe, and connector chip, it is possible to quickly check the quality of all MPO cables, including SMF/MMF and 12-core/24-core cables. With the mobile application "ConnectorMax Analysis Software," which has pass/fail judgment and reporting functions, users can easily perform inspections on-site and check the results. 【Features】 ■ Supports APC, UPC, male (with pins), and female (without pins) connectors ■ Automatic PDF reporting function ■ A mobile device application that allows management of results in one app *For more details, please download the PDF (English version) or feel free to contact us.

Company：セブンシックス
Price：Other

Other measurement, recording and measuring instruments
substrate

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Printed circuit board

Leave your printed circuit board needs to us.

Our company produces a wide variety of printed circuit boards. We handle double-sided printed wiring boards, which are formed by applying conductor layers (copper foil) to both sides of an insulating material and etching the conductor layers to create circuits. We also produce multilayer printed wiring boards, where conductor patterns (circuits) are formed on copper-clad laminates using insulating materials such as prepreg made of glass epoxy resin, and these are laminated and bonded together to create a single board. Please feel free to contact us if you have any requests. 【Product Lineup】 ■ Double-sided printed wiring boards ■ Single-sided printed wiring boards ■ Multilayer printed wiring boards ■ Insect-resistant printed wiring boards *For more details, please contact us.

Company：新旭電子工業
Price：Other

Printed Circuit Board
substrate

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Piergiacomi (Italy) High-Frequency Pulse Welding Machine

High energy efficiency with special waveforms! Welding of high multi-layer products is possible.

This device is a high-frequency pulse welding machine designed and manufactured for multilayer boards, aimed at improving the soldering speed of packets while simultaneously reducing energy costs, thereby facilitating the preparation of multilayer printed circuit boards. The operating principle of the system involves using a thermal introduction chip that acts with variable pressure according to the number of inner layers favorable for localized reactions of the prepreg, performing multiple soldering along both sides of the packet to bond the inner layers and the prepreg. Thanks to the synergy between the high-efficiency SHE (Smart Energy Head) and the "Smart Bonding" software, excellent results can be achieved in terms of reducing bonding time and saving energy. 【Features】 ■ Bonding speed improved up to 100% ■ Reduction of bonding area to maximize panel utilization ■ Elimination of special patterns in inner layers ■ Up to 80% high energy savings ■ Realization of intelligent computer control, etc. *For more details, please download the PDF or contact us.

Company：シーエスワイ
Price：Other

Welding Machine
substrate

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WISE Corporation Printed Circuit Board Hole Filling Paste Removal Grinding Device

A completely different polishing method from the conventional one! It demonstrates high capability in removing resin, paste, and ink after the filling process.

We would like to introduce the "Filling Paste Removal Polishing Device" manufactured by WISE (Italy), which we handle. This product utilizes a completely different polishing method from conventional ones, demonstrating high capability in removing resin, paste, and ink after the filling process. The processing range for substrates is 650 and 760 mm. It can accommodate panel thicknesses from 0.3 mm up to a maximum of 12 mm. 【Features】 ■ A completely different polishing method from conventional ones ■ High capability in removing resin, paste, and ink after the filling process ■ Processing range for substrates: 650 and 760 mm ■ Panel thickness: 0.3 mm ■ Maximum panel thickness: 12 mm *For more details, please refer to the PDF document or feel free to contact us.

Company：シーエスワイ
Price：Other

Wafer processing/polishing equipment
substrate

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Piergiacomi High-Frequency Pulse Welding Machine

Achieving intelligent computer control! Introducing the SBM1000 and MBM4000.

The device is a high-frequency pulse welding machine designed and manufactured to facilitate the preparation of multilayer printed circuit boards by improving the pad welding speed while simultaneously reducing energy costs. The operating principle of the system consists of a high-frequency pulse HEAD that acts according to the number of inner layers favorable for local reactions of the prepreg, and by performing multiple soldering along both sides of the pad, it combines the inner layers and the prepreg. Thanks to the synergy between the high-efficiency SHE (Smart Energy Head) and the "Smart Bonding" software, excellent results can be achieved in terms of reduced bonding time and energy savings. 【Features】 ■ High energy efficiency due to special waveforms ■ The head is almost at room temperature ■ Capable of welding high multilayer products ■ Minimal dents and burn marks *For more details, please refer to the PDF document or feel free to contact us.

Company：シーエスワイ
Price：Other

Welding Machine
substrate

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SiSi Wafer Solution

Small leaks, high quality, small warps, and low defect density! Offered as a cost-effective material.

We provide customers manufacturing semiconductor devices with Silicon-Silicon bonded wafers as a cost-effective alternative to traditional materials such as thick epitaxial and inverted epitaxial wafers, which have been conventionally used for power devices and PiN diodes. By using direct wafer bonding technology, it is possible to create silicon substrates that include various single crystal silicon types. The resistance range of these materials is from 1 mΩ-cm to 10 kΩ-cm. 【Features】 ■ Orientation direction can be arranged with N-type or P-type materials ■ Low leakage, high quality, minimal warping, and low defect density ■ Variation in layer thickness can be kept to +/-0.5 μm or less ■ Transition levels from high concentration to low concentration can be adjusted sharply or softly according to customer applications *For more details, please refer to the PDF document or feel free to contact us.

Company：アイスモス・テクノロジー・ジャパン
Price：Other

Other semiconductors
substrate

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Electronic Component Reel Management - Parts Management System 'MYTower'

Manage, ship, and replace electronic component reels quickly and easily! Due to its compact design, it can be placed near the electronic circuit board assembly line! Case study materials are also available.

The electronic component reel management system "MYTower" is a component management system that plays a vital role in the pre-process of circuit board assembly (SMT). It allows for systematic management and shipping of multiple electronic component reels, making replacements easy. Additionally, its compact design enables it to be installed close to the circuit board assembly line, saving space. In particular, there are numerous achievements with EMS providers who frequently replace electronic component reels or perform multi-variety circuit board assembly. It can also flexibly respond to replenishment needs during stock shortages. Case study materials are also available. **Features** - No mix-ups with various electronic component reels (increased productivity) - Automatically tracks all stored reels and component quantities - Ensures that the correct components are always shipped and received - Compact design allows for placement near the circuit board assembly line (increased efficiency) - Can store up to 740 reels in a floor area of 1 square meter - Easy one-reel shipping for replenishment using a handheld scanner - A dual terminal option is available, considering the movement lines of people and materials *For more details, please refer to the PDF materials or feel free to contact us.*

Company：マイクロニックアセンブリソリューションズ
Price：Other

Production Management System
substrate

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FPC (Flexible Printed Circuit Board)

We accommodate everything from small lots to a wide variety of products!

Our company handles FPC (Flexible Printed Circuit Boards) and provides a consistent production system from design to prototyping and mass production. We can supply products to China and overseas with single-sided, double-sided, printed punch, double access, multilayer (4 layers), long-length (up to 700mm) flexible boards, and manual assembly. Please feel free to contact us if you have any requests. 【Features】 ■ SMT assembly (handled by subcontractors) ■ In-house mold manufacturing ■ Halogen-free substrate support ■ Lead-free solder plating/Au plating (electrolytic/non-electrolytic) *For more details, please download the PDF or feel free to contact us.

Company：JOIE
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
substrate

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Sales of affordable high-quality single crystal SiC substrates and support for SiC bonded substrates.

A wide range of products including ingots and 4-inch, 6-inch, and 8-inch wafers! Leave the procurement of high-quality, low-cost SiC wafers to us.

At Toho Steel Works, we handle single crystal SiC substrates and SiC bonded substrates for power semiconductors. Utilizing our unique procurement network, we also support the supply of SiC substrates from Chinese manufacturers, achieving high quality, low cost, and stable supply. For single crystal SiC substrates, we offer a wide range including ingots and 4-inch, 6-inch, and 8-inch substrates. With our dual bonding technology for SiC bonded substrates, we combine high-quality SiC layers with low-cost substrates to provide SiC substrates that achieve both high performance and cost reduction. Additionally, we welcome inquiries regarding the procurement of various semiconductor substrates, including SiC wafers, for both research and development and mass production applications. 【Features】 ■ We can propose products tailored to specific applications and specifications. ■ We can also support the sale of SiC substrates and related products from Chinese manufacturers. ■ In addition to SiC wafers, we handle a wide range of various semiconductor wafers and substrates.

Company：東邦エンジニアリング
Price：Other

Wafer
substrate

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Brewing wine aging substrate

It accelerates the aging of sake and wine in 5 to 10 minutes.

This is a brewing alcohol aging substrate for machine embedding. It emits special electromagnetic waves that act on liquids.

Company：クルミ電子
Price：Less than 10,000 yen

Printed Circuit Board
substrate

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Electronic Component Reel Management System "Smart Reel Rack"

A rack system that realizes the efficiency of electronic component reel inventory management. Production efficiency increased by approximately 6 times!

The smart reel rack system provided by our company is an intelligent solution for storing electronic component reels supplied to electronic circuit board assembly lines, significantly improving the overall production efficiency of the electronic circuit board manufacturing line. This smart reel rack performs smooth and fast inbound and outbound operations of electronic component reels while dramatically reducing the burden on operators and minimizing operational errors by collaborating with upper systems and assembly machines. It has been particularly well-received by customers who manage many reels manually in small lots of various types. 【Features】 ■ Automatically generates outbound lists based on production plans and remaining parts information ■ Equipped with a first-in, first-out function for outbound operations from older reels ■ Shortens work pathways and improves work efficiency through free location management ■ Issues an alarm when a reel without an LED indicator is taken, preventing incorrect outbound operations ■ Can be linked with customers' upper systems and certain manufacturers' assembly machines ■ Reduces the time required for model switching, thereby decreasing operational errors ■ Can be linked with certain manufacturers' assembly machines *For more details, please refer to the materials. Feel free to contact us with any inquiries.

Company：JFE商事エレクトロニクスプロセスソリューション営業部実装プロセス営業室
Price：Other

Mounter
substrate

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Smart Reel Rack for Warehouses "PSP7" (1344)

We contribute to improving your inventory efficiency with a large-capacity smart reel rack that can store 1344 reels (reel size 7").

The "PSP7" (1344) is a smart reel rack for warehouses with 6 shelf levels. The dimensions are W2260×D400×H1710mm. The weight is 123KG. Based on your requirements, we will propose the optimal shelf specifications. If you have any requests, please feel free to contact us. 【Specifications】 ■ Size: W2260×D400×H1710mm ■ Weight: 123KG ■ Capacity (number of reels): 1344 (reel size 7") ■ Number of shelf levels: 6 ■ Input power: 100V–240V ■ Output power: 12V ■ Peak power: 350W *For more details, please refer to the PDF document or feel free to contact us.

Company：JFE商事エレクトロニクスプロセスソリューション営業部実装プロセス営業室
Price：Other

Mounter
Substrate transport device (loader/unloader)
Circuit board processing machine
substrate

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We provide total solutions with a diverse range of products and high technical capabilities!

We provide total solutions for implementation through implementation-related equipment and systems, starting with Panasonic, to solve our customers' implementation challenges!

In our department, we provide a total solution for assembly that meets the demands of our customers, who are globally expanding, particularly in China, Thailand, Malaysia, and Vietnam, by focusing on Panasonic Smart Factory Solutions' excellent assembly equipment to support high performance, miniaturization, and lightweight electronics products. This includes not only peripheral equipment but also technical support and maintenance, all delivered with a diverse range of products and high technical expertise. You can view our company introduction video at the following link: https://www.jfe-shoji-ele.co.jp/pv-2016/ 【Business Activities】 ■ Providing total solutions from design and development to production of various semiconductor products, as well as sales of peripheral and measuring equipment, and product planning. ■ Sales, installation, and maintenance of equipment and peripheral devices related to the assembly, inspection, and mounting of electronic components. ■ Sales and maintenance of industrial cleaning equipment and various cleaning agents. ■ Sales and maintenance of products and solutions that contribute to factory automation and smart manufacturing.

Company：JFE商事エレクトロニクスプロセスソリューション営業部実装プロセス営業室
Price：Other

Other mounting machines
Other semiconductor manufacturing equipment
Semiconductor inspection/test equipment
substrate

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Introduction of the "Smart Reel Rack" electronic component shelf with anti-misdelivery alarm function!

An electronic component shelf that achieves efficient warehouse space-saving for the management of electronic component reel inventory! Realizing zero incorrect shipments with an alarm to prevent shipping errors!

The "Smart Reel Rack" is an electronic component shelf that can achieve zero mis-shipments through a mis-shipment prevention alarm. Our product, also known as the "Intelligent Storage Management System," can solve issues such as: - It takes time to find the target reel because a storage location is designated for each reel... - There is a lot of wasted space because each reel has a designated storage location... - It is difficult to manage first-in, first-out, and it is unclear which one to use first... By linking the "Smart Reel Rack" with your existing assembly equipment, we have achieved approximately a 6-fold increase in production efficiency and about a 50% reduction in warehouse space! We can propose racks and systems tailored to your needs, so please feel free to contact us. [Contents (Excerpt)] - System Overview - System Configuration Diagram - List of Standard Functions - Benefits of Implementation - Improvement Cases - Implementation Cases *We can also propose X-ray component reel counters. *For more details, please refer to the PDF materials or feel free to contact us.