We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 561 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社　和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社　和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1501～1530 item / All 1884 items

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Conversion Board "CVB Series"

Conversion Board "CVB Series"

It is also possible to create a conversion board that reflects the customer's intentions!

We offer an emergency response component mounting service using conversion boards. The "CVB Series" is an original conversion board that resolves issues such as design errors and component procurement mistakes. We address various concerns, such as: - "The components I had arranged for are unavailable, and work is stalled." - "I mistakenly purchased unnecessary components with the wrong shape, resulting in excess inventory." 【Examples of Solutions】 - Re-arranging the components that are actually needed. - The board was manufactured, but the component pads do not match, making it impossible to mount. - It was specified for discrete components. - The board was designed for surface-mount components, but it was specified for discrete components. - Unable to mount on the board due to differences in component sizes, etc. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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High Thermal Conductivity Substrate "FGHP"

High Thermal Conductivity Substrate "FGHP"

Dramatic reduction of heat source temperature, increased output, and miniaturization achieved by FGHP heat spreader!

"FGHP" is a flat heat pipe-type heat spreader that forms a sealed space and wick (capillary structure) inside an ultra-thin metal sheet. It supports the reduction of thermal density and efficient heat dissipation by uniformly spreading the high-density heat generated by a small, high-output heat source across the surface through its excellent thermal diffusion capability. 【Features】 ■ Excellent thermal diffusion (heat pipe structure) ■ Thin design (micro-etching technology) ■ Lightweight (hollow structure) ■ High reliability (high-strength sealed structure) ■ Can be installed vertically (internal microstructure) *For more details, please download the PDF or contact us.

  • Board to Board Connectors
  • substrate

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Special Precision Machinery Co., Ltd. Nasu Factory

Special Precision Machinery Co., Ltd. Nasu Factory

A problem-solving and proposal-based company that provides high-quality, high-performance electronic circuit boards!

At the Nasu Factory of Tokushu Seiki Co., Ltd., we manufacture electronic devices, communication equipment, and precision instruments. Our company began manufacturing circuit boards in the 1970s when printed circuit boards started to become widespread in Japan. We have produced high-quality circuit boards for various fields, including communication base stations, medical devices, and automotive applications. With a quality control system centered around five inspection processes, we will continue to provide high-quality and high-performance electronic circuit boards. 【Our Strengths】 ■ High mounting technology and quality control system ■ A reliable partner for electronic circuit board prototyping ■ "Quality" is built from the upstream *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • EMS
  • substrate

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Supercapacitor "NX120V"

Supercapacitor "NX120V"

We will upgrade the old 2kW data center to be equivalent to the latest model.

The "NX120V" is an advanced ICT device that enables the continued operation of facilities built around the year 2000 without the need for complete updates or renting space from other centers, allowing for operation with the current equipment as is. In an old data center with a 2kW specification, it is possible to operate at the equivalent of 4-6kW without changing the facility equipment. 【Features】 ■ Improved overall performance with better peak power extraction compared to average power ■ Power consumption is less than half that of conventional Xeon servers (Ave 50w) ■ CPU options include Intel XeonD with 4/6/8/12/16 cores, and memory can be maxed out at 128GB (ECC) ■ Storage includes M.2-512GB for system use (transfer speed 2GB/S) ■ Capable of operation in high-temperature environments up to 45℃, among other features *For more details, please download the PDF or feel free to contact us.

  • Other server related
  • server
  • substrate

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Printed Circuit Board Manufacturing Delivery Schedule

Printed Circuit Board Manufacturing Delivery Schedule

The printed circuit boards will be shipped tomorrow. Industry-leading ultra-short delivery times! Please give it a try!!

We have been in the printed circuit board business for over 30 years. We have steadily and diligently accumulated know-how for short lead-time manufacturing with honesty and sincerity. We have absolute confidence in our express and short lead-time manufacturing. Please feel free to consult with us.

  • Printed Circuit Board
  • substrate

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[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board

[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board

Effective even in cases where component mounting is limited! Here are examples of rigid-flexible circuit board manufacturing.

We would like to introduce an example of our "Rigid-Flexible Printed Circuit Board" manufacturing. This board integrates rigid and flexible substrates. It is effective for use in compact spaces, such as small modules, or in cases where component placement is limited. Please feel free to contact us when you need assistance. 【Overview】 ■ 6-layer IVH structure (FPC layers L4-5) ■ 4-layer 1-2-1 build-up structure (FPC layers L2-3) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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High-frequency substrate manufacturing example: Long slit TH substrate

High-frequency substrate manufacturing example: Long slit TH substrate

Forming guard patterns! Introducing examples of manufacturing and processing long slit TH substrates.

We would like to introduce an example of manufacturing and processing of the "Long Slit TH substrate." By providing a pattern on the edge of the substrate, a guard pattern is formed. Please feel free to contact us when you need assistance. 【Overview】 ■ Long Slit TH substrate ■ Similar processing technology (edge TH) *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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High-Frequency Substrate Manufacturing Example: Hybrid Structure Substrate

High-Frequency Substrate Manufacturing Example: Hybrid Structure Substrate

Using high-frequency materials for specific interlayers while employing different materials for other interlayers! Here are some examples of manufacturing processes.

We would like to introduce an example of the manufacturing process for "hybrid structure substrates." Specific interlayers are made of high-frequency materials, while other interlayers use different materials (such as FR-4). Please feel free to contact us when you need assistance. 【Composition Example】 ■ High-frequency material (core material) ■ FR-4 (PP) ■ FR-4 (core material) *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Single-sided board / Double-sided board

Single-sided board / Double-sided board

Used in a wide range of fields as a general-purpose substrate! The interlayer connection of the double-sided board is formed by TH.

We would like to introduce the "single-sided and double-sided PCBs" handled by Matsuwa Sangyo Co., Ltd. These printed circuit boards have conductor patterns formed on one or both sides of an insulating board. They are widely used in various fields as general-purpose substrates, and the interlayer connections of double-sided boards are formed by TH (through-hole) technology. We offer materials such as FR-4, CEM-3, FR-1, halogen-free materials, high heat-resistant materials, aluminum materials, and low dielectric constant materials, with board thicknesses ranging from t0.1mm to t3.2mm. We also accommodate various copper foil thicknesses from 9μm to 175μm. 【Fastest Delivery Record】 ■ 1 layer ⇒ 1 day (data by 8 AM ⇒ same-day shipment) ■ 2 layers ⇒ 1.05 days (data by 8 PM ⇒ shipment the next day) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Build-up substrate

Build-up substrate

Multi-stage builds, stackable vias, filled vias plating, all handled with in-house integrated manufacturing!

We would like to introduce the "Build-Up Substrate" handled by Matsuwa Sangyo Co., Ltd. After forming the core layer (2-layer through to multi-layer through), we sequentially laminate insulation layers and conductor layers one by one from the core layer to the surface layer, and perform interlayer connections using lasers to create a multilayer printed circuit board. By using laser vias (non-through vias) for interlayer connections, flexible wiring design is possible, and in recent years, the demand and applications for this have been increasingly expanding. 【Shortest Delivery Record】 ■ 4 layers (1-2-1) ⇒ Shipped on the 3rd day ■ 6 layers (2-2-2) ⇒ Shipped on the 4th day *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Impedance control compatible board

Impedance control compatible board

We propose appropriate line widths, clearances, and layer configurations during pattern design!

We would like to introduce the "Impedance Control Compatible Boards" handled by Matsuwa Sangyo Co., Ltd. In recent years, there has been a significant increase in the demand for boards that require impedance control for the purpose of stabilizing signal quality and reducing noise due to high-speed communication in circuits. With our extensive manufacturing experience and achievements cultivated over many years, we support various impedance simulations such as characteristic, differential, common, and coplanar, as well as TDR measurements, and we propose appropriate line widths, clearances, and layer configurations during pattern design. 【Features】 ■ Supports various impedance simulations including characteristic, differential, common, and coplanar, as well as TDR measurements ■ Proposes appropriate line widths, clearances, and layer configurations during pattern design *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Thick copper substrate

Thick copper substrate

By increasing the finished copper thickness to around 210μm, it can also accommodate high current circuits!

We would like to introduce the "thick copper substrate" handled by Matsuwa Sangyo Co., Ltd. The typical copper foil thickness for printed circuit boards is 18μm or 35μm, but by increasing the finished copper thickness to about 210μm, it can accommodate high current circuits. In recent years, thick copper substrates (high current substrates) have been increasingly required, particularly for automotive and power electronics applications, and the demand is growing. [Example of Thick Copper Substrate Manufacturing Specifications] ■ Copper foil thickness: 70μm, 105μm, 140μm, 175μm (excluding copper foil thickness below 35μm) ■ Finished copper thickness after plating: can be 210μm or more *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Copper inlay substrate

Copper inlay substrate

By directly contacting heat-generating components with copper, which has a high thermal conductivity, excellent heat dissipation is achieved!

We would like to introduce the "Copper Inlay Substrate" handled by Matsuwa Sangyo Co., Ltd. This substrate is designed to partially improve heat dissipation characteristics by using copper pins pressed directly under heat-generating components. By making direct contact with heat-generating components, it achieves high heat dissipation due to the high thermal conductivity of copper. Compared to metal-based substrates, it can reduce weight, and it is also advantageous that the existing layer structure of substrates can be applied as is. 【Features】 ■ A substrate aimed at partially improving heat dissipation characteristics ■ Achieves high heat dissipation by making direct contact with heat-generating components using high thermal conductivity copper ■ Reduces weight compared to metal-based substrates ■ Existing layer structures of substrates can be applied as is *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Copper bump substrate

Copper bump substrate

Effective when it is required to make contact between the substrate pad and mounted components at a high position!

We would like to introduce the "copper bump substrate" handled by Matsuwa Sangyo Co., Ltd. Thanks to a special plating method, it is possible to form bumps of approximately 30 to 100 μm in the necessary areas of the pattern. This is effective in cases where it is required to make contact between the substrate pad and mounted components at a high position. 【Copper Bump Substrate Manufacturing Specifications Example】 ■Bump Diameter/Bump Size: φ0.4mm/0.3mm×0.25mm ■Bump Height: 100μm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Heat dissipation substrate

Heat dissipation substrate

Cool down the substrate!

In printed circuit boards, heat dissipation measures have become a very significant issue. Our company offers various heat dissipation substrates, including metal bases, thick copper, copper inlays, conductive paste filling, and thermal conductive materials such as ceramics. Please feel free to contact us.

  • Printed Circuit Board
  • substrate

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"Automatic Quotation System" Quick! Showa

"Automatic Quotation System" Quick! Showa

【Zero Waiting Time for Estimates!】 By simply filling out the necessary information, you can achieve an estimate response with "zero waiting time." We won't keep you waiting for PCB manufacturing estimates!

"Oh no~ I can't reach the sales representative!" "I want the estimate as soon as possible!" "When will the estimate come?" Matsuwa Sangyo responds to such words. Matsuwa Sangyo prides itself on being the fastest in domestic circuit board manufacturing. Of course, we confidently respond with "Fast!" to various inquiries, including estimates, but we are also striving to further shorten the response time for estimates by providing the automatic estimate system "Saku! to SHOWA." Just enter the necessary items from the URL below and click! Now, let's get those estimates quickly! Saku! to SHOWA https://www.showanet.jp/estimate/

  • Printed Circuit Board
  • substrate

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＼Exhibiting at JPCA Show 2024／ Printed circuit boards will be shipped tomorrow!

＼Exhibiting at JPCA Show 2024／ Printed circuit boards will be shipped tomorrow!

We will be exhibiting at the JPCA Show 2024 from June 12 to 14! Here’s a sneak peek of our timely delivery response.

Don't you have experience wanting a circuit board by tomorrow? The greatest strength of Matsuwa Industries is undoubtedly our ultra-short delivery times. We deliver everything from through-hole boards to build-up boards, FPC boards, and rigid FPC boards at the industry's fastest levels! 2-layer to 10-layer through-hole boards in as little as 1.05 days! Through-hole resin-filled boards in as little as 2.1 days! 1-2-1 build-up boards in as little as 3 days! 1-layer and 2-layer FPC boards in as little as 2 days! 4-layer rigid FPC in as little as 5 days! Not only are our delivery times fast, but we also ensure that we deliver on your requested deadline (with a compliance rate of 99.94%). Naturally, our inspection system is equipped with the latest facilities, so you can rest assured about quality. We will thoroughly promote the secrets of our delivery times and more at the exhibition. If you are attending, please stop by the Matsuwa Industries booth at [5F-23]! Register for the JPCA Show here ⇓

  • Printed Circuit Board
  • substrate

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Exhibiting at the Nepcon Autumn Show @ Makuhari Messe! Leave printed circuit boards to Matsuwa Sangyo!

Exhibiting at the Nepcon Autumn Show @ Makuhari Messe! Leave printed circuit boards to Matsuwa Sangyo!

We will be exhibiting at the Nepcon Japan Autumn Exhibition at Makuhari Messe from September 4 to 6! Please feel free to consult us about anything related to circuit boards!

Build-up substrates, high-frequency substrates, FPC and rigid FPC substrates... All of these are manufactured in-house at our own factory with a fully integrated process! The ultra-short delivery times achieved by eliminating outsourcing are astonishingly fast! Through-hole substrates ⇒ as short as 1.05 days! Through-hole resin-filled substrates ⇒ as short as 2.1 days! 1-2-1 build-up substrates ⇒ as short as 3 days! FPC substrates ⇒ as short as 2 days! 4-layer rigid FPC substrates ⇒ as short as 5 days! Surface treatment with gold flash is also handled in-house, so there are no fluctuations in delivery times! Not only the delivery times but also the wide range of materials we handle is one of the attractions of Matsuwa Sangyo. Even for materials we have no processing experience with, we are flexible in our response! We accept orders for any type of substrate, even in small quantities, so if you have even a slight desire to "want to make a substrate..." Why not start with a light consultation? We will be exhibiting at the Nepcon Japan Autumn Exhibition held at Makuhari Messe from September 4 (Wed) to September 6 (Fri)! On the day, members who can consult on technology will be gathered at our booth, so please stop by the Matsuwa Sangyo booth [6-37]! Pre-registration for your visit can be done here↓!

  • Printed Circuit Board
  • substrate

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High-frequency substrates with the fastest domestic delivery times!

High-frequency substrates with the fastest domestic delivery times!

Because the era is high frequency.

Matsuwa's high-frequency substrates are very speedy! We always have low Dk and low Df materials in stock. We can accommodate everything from multilayer boards to hybrid laminated structures and back drilling, even for small quantities and short delivery times. We are also actively working on new materials and welcome inquiries not only for regular projects but also for various research and development purposes. Matsuwa Industries is here for high-frequency substrates! Thank you.

  • Printed Circuit Board
  • substrate

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【Ultra-Short Delivery Response】For last-minute requests during the New Year holidays, contact Matsuwa Sangyo!

【Ultra-Short Delivery Response】For last-minute requests during the New Year holidays, contact Matsuwa Sangyo!

With the "Breakthrough Course," you can ship printed circuit boards in as little as 12 hours! Let's make circuit boards this year and welcome a refreshing New Year!

The year 2024 is about to come to an end in the blink of an eye. Are there any circuit boards you are about to give up on arranging for delivery by the end of the year? If you consult with Matsuwa Sangyo, known for its ultra-short delivery times, we can accommodate your desired schedule even with tight timelines. Common year-end and New Year’s issues can be resolved with Matsuwa, making us a strong ally for your company! - Through-hole boards ⇒ as fast as 1.05 days! - Through-hole resin-filled boards ⇒ as fast as 2.1 days! - 1-2-1 build-up boards ⇒ as fast as 3 days! - FPC boards ⇒ as fast as 2 days! - 4-layer rigid FPC boards ⇒ as fast as 5 days! Furthermore… with our unbeatable <Limit Break Course>, - 4-layer through-hole boards ⇒ 17 hours - 6-layer through-hole resin-filled boards ⇒ 24 hours - 1-2-1 build-up ⇒ 48 hours - 6-layer 2-2-2 build-up ⇒ 72 hours to complete the boards! Our impressive delivery capabilities are made possible by Matsuwa Sangyo’s fully in-house manufacturing and 24-hour factory operations. Additionally, our compliance rate of 99.94% is another attractive feature. We guarantee delivery by the promised deadline. For more details, please refer to our catalog or feel free to contact us through our website.

  • Printed Circuit Board
  • substrate

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Special substrate

Special substrate

The era is 【SPECIAL PCB!】

Recently, the specifications for substrates have diversified, and at Matsuwa Industries, we are trying various special substrates. The substrates listed all started from customer requests. We have been working together with customers who have said, "Other companies have turned us down, but perhaps Matsuwa Industries can make it happen?" Thick copper substrates ⇒ MAX 500μ * foil thickness 400μ in stock, inner layer core material foil thickness 140μ Copper inlays ⇒ round and square shapes * board thickness t1.0 to t3.0mm, round: φ1.0 to φ8.0mm, square: please consult Rigid FPC (build structure) ⇒ available in 1-layer and 2-layer Matsuwa Industries has established a prototype development room, so please contact us at the following for inquiries. TEL: 0598-52-1855

  • Circuit board design and manufacturing
  • EMS
  • Printed Circuit Board
  • substrate

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Low Noise Amplifier "SA Series"

Low Noise Amplifier "SA Series"

Ultra-low noise, excellent stability, wideband ultra-small signal detection amplifier.

The "SA Series" is a low-noise amplifier that pursues technology to suppress factors that hinder measurement, such as noise and environmental influences, to the utmost limit. We offer the voltage input "SA-200 Series/SA-400 Series," which achieves low noise that was not attainable with previous amplifiers, and the current input "SA-600 Series," which realizes high gain and wide bandwidth. Please choose the model that matches the signal from your sensor. *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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Kyoei Electronics Co., Ltd. Company Profile

Kyoei Electronics Co., Ltd. Company Profile

Contributing to the manufacturing industry in Japan! Our company is a group of handy professionals well-versed in the procurement of electronic components and devices.

Kyouwa Electronics Co., Ltd. is a handy group well-versed in the procurement of electronic components and devices. For half a century, we have continued to supply electronic components as a handy service in the electric town of Akihabara. In addition to selling parts, we assist in manufacturing by providing kitting, assembly on printed circuit boards, product assembly, control panels, and equipment assembly. Leveraging our extensive network of suppliers, we deliver anything you need. Please feel free to contact us when you require our services. 【Business Description】 ■ Trading company (Sales of electronic and electrical components) *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Harness
  • Printed Circuit Board
  • substrate

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BLE Module T-BLE01 Development Board

BLE Module T-BLE01 Development Board

Development board for the BLE module T-BLE01 equipped with nRF51822.

We handle the "BLE Module T-BLE01 Development Board," which has obtained construction design certification (Technical Standards Compliance) from the Ministry of Internal Affairs and Communications. All input and output terminals are laid out on a 2.54mm grid and can be mounted on a universal board using pin headers. Please feel free to contact us if you have any requests. 【Features】 ■ AVDD can select between VDD and DC/DC converter output ■ Equipped with RS232C interface circuit for communication by connecting to any terminal ■ Includes T-BLE01 ■ All pins of T-BLE01 are brought out with a 2.54mm pitch ■ Equipped with RS-232C level conversion device, etc. *For more details, please download the PDF or contact us.

  • Other electronic parts
  • substrate

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Platform "Leafony" *Easily build IoT systems

Platform "Leafony" *Easily build IoT systems

Easily build ultra-compact IoT systems! This platform achieves ultra-compactness by stacking circuit boards with a 20mm corner.

"Leafony" is a platform that achieves ultra-miniaturization by stacking 20mm square circuit boards, allowing for integration into devices with minimal space requirements. By selecting and combining various prepared modules (referred to as "leaves"), a wide range of configurations can be created according to the project needs. Additionally, connections can be easily assembled by anyone using dedicated rubber connectors. 【Features】 ■ Ultra-compact ■ Expandability with a variety of leaves ■ Reduction of software development time and costs ■ Development potential through collaboration with the University of Tokyo and participating companies *For more details, please download the PDF or contact us.

  • Other semiconductors
  • substrate

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High-precision multilayer substrate FPC (Red Board Co.)

High-precision multilayer substrate FPC (Red Board Co.)

We handle the "High-Precision Multi-Layer PCB FPC" manufactured by Red Board!

Red Board Electronics Ltd. was founded in 1988 and is a manufacturer of FPC and Rigid-FPC capable of supporting high-definition designs such as HDI. *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts
  • substrate

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MPO cable checker

MPO cable checker

SM fiber/MM fiber, compatible with 12 cores/24 cores! Quality can be checked quickly.

The "MPO Cable Checker" is a tester that can automatically check the fiber continuity, connector end face, and polarity of optical cables with MPO connectors. By combining a light source unit, observation probe, and connector chip, it is possible to quickly check the quality of all MPO cables, including SMF/MMF and 12-core/24-core cables. With the mobile application "ConnectorMax Analysis Software," which has pass/fail judgment and reporting functions, users can easily perform inspections on-site and check the results. 【Features】 ■ Supports APC, UPC, male (with pins), and female (without pins) connectors ■ Automatic PDF reporting function ■ A mobile device application that allows management of results in one app *For more details, please download the PDF (English version) or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • substrate

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Printed circuit board

Printed circuit board

Leave your printed circuit board needs to us.

Our company produces a wide variety of printed circuit boards. We handle double-sided printed wiring boards, which are formed by applying conductor layers (copper foil) to both sides of an insulating material and etching the conductor layers to create circuits. We also produce multilayer printed wiring boards, where conductor patterns (circuits) are formed on copper-clad laminates using insulating materials such as prepreg made of glass epoxy resin, and these are laminated and bonded together to create a single board. Please feel free to contact us if you have any requests. 【Product Lineup】 ■ Double-sided printed wiring boards ■ Single-sided printed wiring boards ■ Multilayer printed wiring boards ■ Insect-resistant printed wiring boards *For more details, please contact us.

  • Printed Circuit Board
  • substrate

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Piergiacomi (Italy) High-Frequency Pulse Welding Machine

Piergiacomi (Italy) High-Frequency Pulse Welding Machine

High energy efficiency with special waveforms! Welding of high multi-layer products is possible.

This device is a high-frequency pulse welding machine designed and manufactured for multilayer boards, aimed at improving the soldering speed of packets while simultaneously reducing energy costs, thereby facilitating the preparation of multilayer printed circuit boards. The operating principle of the system involves using a thermal introduction chip that acts with variable pressure according to the number of inner layers favorable for localized reactions of the prepreg, performing multiple soldering along both sides of the packet to bond the inner layers and the prepreg. Thanks to the synergy between the high-efficiency SHE (Smart Energy Head) and the "Smart Bonding" software, excellent results can be achieved in terms of reducing bonding time and saving energy. 【Features】 ■ Bonding speed improved up to 100% ■ Reduction of bonding area to maximize panel utilization ■ Elimination of special patterns in inner layers ■ Up to 80% high energy savings ■ Realization of intelligent computer control, etc. *For more details, please download the PDF or contact us.

  • Welding Machine
  • substrate

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WISE Corporation Printed Circuit Board Hole Filling Paste Removal Grinding Device

WISE Corporation Printed Circuit Board Hole Filling Paste Removal Grinding Device

A completely different polishing method from the conventional one! It demonstrates high capability in removing resin, paste, and ink after the filling process.

We would like to introduce the "Filling Paste Removal Polishing Device" manufactured by WISE (Italy), which we handle. This product utilizes a completely different polishing method from conventional ones, demonstrating high capability in removing resin, paste, and ink after the filling process. The processing range for substrates is 650 and 760 mm. It can accommodate panel thicknesses from 0.3 mm up to a maximum of 12 mm. 【Features】 ■ A completely different polishing method from conventional ones ■ High capability in removing resin, paste, and ink after the filling process ■ Processing range for substrates: 650 and 760 mm ■ Panel thickness: 0.3 mm ■ Maximum panel thickness: 12 mm *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • substrate

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