ユーシー・ジャパン List of Products and Services

The "Ultrasonic Sieve Unit" transmits special ultrasonic vibrations to each individual stainless steel mesh wire, resolving issues with sieve frames and hoppers (such as clogging, adhesion, and bridging). 【Features】 Improves classification efficiency in powder sieving processes and contributes to time savings! - Achieves dry sieving with high mesh sizes such as 20μm. - Compatible with standard JIS sieve frames from Φ75 to Φ400, allowing for one-touch installation with clamp-type fixtures. - The ultrasonic hopper addresses surface adhesion, bridging, rat-hole issues, and enhances discharge capacity. - Removes foreign substances through ultrasonic sieving at the hopper discharge outlet, and breaks down clumps into fluffy powders, which is advantageous for transport in the next process. - Enables coordinated management with electronic scales through quantitative supply transport using ultrasonic vibrations. - The ultrasonic sieve machine (two-stage) allows for even finer dry classification. Consulting services for ultrasonic vibration application are available. We also accept comparative verification with other equipment currently used or under consideration by customers. *For more details, please refer to the PDF materials and the product introduction video on YouTube. Feel free to contact us with any inquiries. Additionally, we will be exhibiting at the "International Powder Industry Exhibition Osaka" from October 15 to 17, 2025. We look forward to your visit.

• Sieve/Shaker

We propose the "High-Frequency Cleaning Unit" for stripping and cleaning. We believe many customers with painting processes are considering the removal of paint or vapor-deposited layers from jigs and the reuse of these jigs. There are likely many customers who wish to stop using difficult-to-handle chemicals such as caustic soda and hydrocarbons. We offer detergents and cleaning processes tailored to your needs. By maximizing the use of existing equipment, we can improve the workplace environment with minimal investment. 【Features】 ■ By optimizing the cleaning process, it is possible to reduce cleaning time to one-fifth. ■ Since it can be verified based on experimental results, you can implement it with confidence. *For more details, please refer to the PDF document or feel free to contact us.

• Ultrasonic Cleaner

We propose a "high-frequency cleaning unit" for semiconductor manufacturing processes. Many customers using sputtering equipment or CVD equipment may be requesting the regeneration of fixtures from manufacturers. In specific cases, ultrasonic cleaning can cause damage to parts. Our ultrasonic technology maintains stable performance even at low output levels, making it suitable for cleaning delicate components. We assist in improving cleaning quality by utilizing various frequencies of ultrasound to recover more precious metals, such as gold, while simultaneously enhancing the cleanliness of fixtures and completely removing metal ions. [Features] - Achieves uniform power distribution within large cleaning tanks, which are often required. - Optimizes cleaning power with a wide range of output adjustments. *For more details, please refer to the PDF materials or feel free to contact us.

• Ultrasonic Cleaner

The "AL1010" is a compact solvent cleaning device developed by FORWARD TECHNOLOGY, a group company of CREST ULTRASONICS. As a mass production model, it offers cost advantages and is designed for the use of low flash point solvents (such as IPA and acetone). It supports immersion cleaning and is equipped with CREST's advanced ultrasonic cleaning system. 【Features】 - For immersion cleaning, options of 58kHz, 132kHz, and 192kHz from Crest are available. - The freeboard is designed at 100%. - Circulation pump and filter can be implemented. - Easy operation with a built-in sequencer. - Equipped with an automatic shutter. - Capable of incorporating a solvent regeneration device. *For more details, please refer to the PDF materials or feel free to contact us.

• Ultrasonic Cleaner

This document provides a detailed explanation of the hydrocarbon cleaning system. It introduces the features of the equipment, the standard system flow, safety aspects, automatic fire extinguishing equipment, and examples of systems. Additionally, it includes useful tips on ultrasonic cleaning that you may want to read before making a selection, as well as a comprehensive catalog of high-frequency cleaning units. 【Contents (partial)】 ■ Features of the equipment ■ Standard system flow ■ Safety aspects ■ Automatic fire extinguishing equipment ■ Examples of systems *For more details, please refer to the PDF document or feel free to contact us.

• Ultrasonic Cleaner

This catalog features ultrasonic cleaning units and systems from CREST ULTRASONICS, one of the largest manufacturers of ultrasonic cleaning machines in the world. We introduce the precision cleaning system "PCS Series," which is compatible with ultra-pure water clean rooms, as well as the parts cleaning system "OC Series," the simplified cleaning system "OCJ Series," and the ultrasonic oscillation device "GENESIS." Each product is detailed with specifications, making it a useful reference when considering implementation. We encourage you to take a look. [Contents (partial)] ■ Features of CREST ULTRASONICS ■ Ultrasonic cleaning systems ■ Ultrasonic oscillation device GENESIS ■ High-efficiency ultrasonic oscillation devices ■ High-frequency oscillation devices *For more details, please download the PDF or feel free to contact us.

• Ultrasonic Cleaner

We would like to introduce the "Solvent-based Cleaning Systems" manufactured by CREST ULTRASONICS, which we handle. We offer a lineup including the low-flashpoint solvent-compatible cleaning system "SA Series" and the cost-effective solvent-compatible cleaning system "ER Series." CREST ULTRASONICS, the world's largest manufacturer of ultrasonic cleaning machines, takes environmental conservation into consideration in all of its ultrasonic cleaning units and systems. 【Features of CREST ULTRASONICS】 ■ System configurations suitable for each cleaning item ■ Multi-frequency ultrasonic units (40kHz) ■ Effective use of resources ■ Excellent research and development *For more details, please refer to the PDF materials or feel free to contact us.

• Ultrasonic Cleaner

"Vertiflow" is a management system for sub-micron contaminant particles that are essential for ultra-precision cleaning (Patent Pending). It supplies a large volume of cleaning solution filtered through a high-performance filter from the bottom of the tank. A special mechanism inside the tank instantly causes contaminants distributed within the tank to float and overflow. The ultrasonic intensity is efficiently generated even under large-volume filtration circulation due to the special mechanism inside the tank. 【Features】 ■ Large volume circulation is introduced from the bottom of the tank ■ A special base is applied to the lower part of the tank ■ The flow of liquid inside the tank is uniform, moving from the bottom to the top ■ Ultrasonic transducers are installed on both sides of the tank, allowing ultrasonic waves to act more efficiently even under large circulation ■ Removed contaminants efficiently float and are eliminated *For more details, please refer to the PDF document or feel free to contact us.

• Ultrasonic Cleaner

In this document, we introduce "Tips for Ultrasonic Cleaning," which you may want to read before making a selection. We provide a detailed explanation of the mechanisms of ultrasonic cleaning, frequency selection, uneven cleaning due to standing waves, and how to improve cleaning efficiency. Ultrasonic cleaning involves a wide variety of combinations of cleaning solutions and ultrasonic frequencies, from degreasing to precision cleaning, so please consult us for detailed selection. [Contents (partial)] ■ What is ultrasonic cleaning ■ Frequency selection ■ Uneven cleaning due to standing waves ■ How to improve cleaning efficiency ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Ultrasonic Cleaner

We would like to introduce the "Ultrasonic Cleaning Systems" manufactured by CREST ULTRASONICS that we handle. We offer various systems including the "PCS Series," which is compatible with ultra-pure water clean systems, the "OC Series" for parts cleaning, and the "OCJ Series," which is a simplified cleaning system. We cater to various needs, from manual systems to fully automated production systems, tailored to the specific cleaning items. 【Features of CREST ULTRASONICS】 ■ System configurations suitable for each cleaning item ■ Multi-frequency ultrasonic units ■ Effective resource utilization ■ Excellent research and development *For more details, please refer to the PDF materials or feel free to contact us.

• Ultrasonic Cleaner

This catalog introduces high-frequency cleaning units. It features "MEGASONIC" from MEGASONIC SWEEPING, a member of the CREST ULTRASONIC group, as well as the high-efficiency ultrasonic unit "Hi-Frequency" that utilizes a ceramic stack. Additionally, we have included the CREST GROUP Worldwide Support Map. Please feel free to consult us when needed. [Contents] ■MEGASONIC ■Hi-Frequency ■CREST GROUP WORLDWIDE SUPPORT MAP *For more details, please refer to the PDF document or feel free to contact us.

• Ultrasonic Cleaner

We would like to introduce the 'MEGASONIC <470kHz・1MHz>' that we handle. MEGASONIC SWEEPING, part of the CREST ULTRASONIC group, has successfully adopted a sweeping function for ultrasonic waves at 470kHz and 1MHz. This is effective for sub-micron cleaning of wafers and HDD disks. 【Features】 ■ Successful adoption of a sweeping function for ultrasonic waves at 470kHz and 1MHz ■ Low variation in sound pressure ■ Effective for sub-micron cleaning of wafers and HDD disks *For more details, please refer to the PDF document or feel free to contact us.

• Ultrasonic Cleaner

"Hi-Frequency" is a high-efficiency ultrasonic unit that has successfully achieved very low impedance characteristics for the third harmonic wave by adopting a ceramic stack. It reduces the load on the power supply and realizes efficient oscillation characteristics. In examples of cleaning results for hard disk components, it is evident that the particle size that can be removed increases as the frequency becomes higher compared to other frequencies. 【Features】 ■ Adoption of ceramic stack ■ Reduction of load on the power supply ■ Realization of efficient oscillation characteristics *For more details, please refer to the PDF document or feel free to contact us.

• Ultrasonic Cleaner

Ultrasonic bonding of battery laminated foils requires the application of a controlled amplitude under stable pressure for a certain period of time. Our servo press achieves "pressure that follows the behavior changes between laminated foils," which is difficult to control with air press machines, enabling high-quality and stable bonding of multilayer battery foils. This device can bond 140 layers of laminated foil with Al terminals, leading to further efficiency improvements in secondary battery power extraction. Additionally, the position information of the high-speed tracking motor and ultrasonic output information are acquired as part of an automated system via Ethernet/IP, significantly contributing to big data generation that will serve as a standard for mass production quality. *We welcome inquiries for various metal bonding experiments and equipment demonstrations. Please feel free to contact us. *Furthermore, we will be exhibiting at the "International Secondary Battery Expo (Battery Japan)" held at Makuhari Messe from October 2 (Wednesday) to October 4 (Friday). We sincerely look forward to your visit. 【Exhibition Information】 ■Exhibition Name: International Secondary Battery Expo (Battery Japan) ■Venue: Makuhari Messe, Booth Location E19-10 ■Date: October 2 (Wednesday) to October 4 (Friday) ■Exhibited Equipment: Ultrasonic Metal Bonding Machine, Ultrasonic Wire Splicer, Ultrasonic Powder Sifter, Ultrasonic Cleaning Machine

• Secondary Cells/Batteries

The Artech ultrasonic sieve machine makes it easy to achieve high-mesh dry classification below 50µm, which is difficult with conventional hand sieving or vibrating sieves alone, thereby improving battery quality and significantly enhancing work efficiency. (There are achievements in dry particle size classification at the 20μm level and wet slurry classification in micrometers.) Additionally, the ultrasonic sieve can be easily attached to general-purpose vibrating sieve machines using JIS test sieve frames (such as electromagnetic, motor-driven, and air turbine types). The synergistic effect of different vibration principles (physical ultrasonic vibration from wire mesh and oscillatory vibration from motors, etc.) enables further productivity improvements. The ultrasonic oscillator is also available in explosion-proof specifications compliant with ATEX ZONE 22. *Demo machines are available for free rental. Please contact us if you are interested.

• Other metal materials

The "Ultrasonic Sieve Unit" transmits special ultrasonic vibrations to each individual stainless steel mesh wire, resolving issues such as clogging, adhesion, agglomeration, and bridging in sieves and hoppers. It improves the classification efficiency in powder sieving processes and contributes to time savings! It achieves dry sieving with high mesh sizes such as 20μm and can be installed on mass production machines ranging from standard JIS mesh frames to large Φ1200 models. 【Features】 ■ Ultrasonic hoppers address surface adhesion, bridging, rat holes, and improve discharge capacity. ■ Removal of foreign substances and disintegration through ultrasonic sieving at the hopper discharge, making fluffy powders advantageous for transport in the next process. ■ Quantitative supply transport through ultrasonic vibrations allows for integrated management with electronic scales. ■ The ultrasonic sieve machine (two-stage) enables even finer dry classification. Consulting services for applying ultrasonic vibrations are available. We also accept comparative verification with other equipment that customers are currently using or considering. * For more details, please refer to the PDF materials and the product introduction video on YouTube. Feel free to contact us. Additionally, we will be exhibiting at the "International Powder Technology Exhibition Tokyo" from November 27 to November 29, 2024. We look forward to your visit.

• Sieve/Shaker

The ultrasonic metal bonding machine 'USDB' is an ultrasonic metal bonding machine that achieves high-speed cycle operation, high-speed data transfer, and high-precision position control. The servo motor press pressure control with a one-axis rigid structure realizes ultra-fine position accuracy and high-speed load tracking, providing stable ultrasonic energy addition and dramatically improving processing reproducibility. The new Ethernet/IP connection simplifies the operation management of automated lines and converts all bonding results into big data. 【Features】 - Processing assembly accuracy, operational precision, and ultrasonic control that ensure the ultrasonic vibration energy during bonding is reliably transmitted to the workpiece. - High reliability in position accuracy (1µm) achieved through the rigidity of the distinctive one-piece frame structure. - Original program that realizes high-speed load tracking (stable load) against load fluctuations during bonding. - Easy setting operations enabled by the simple screen MMI (man-machine interface) with a color touch panel. - Unique ultrasonic control method for applications sensitive to frequency and impedance fluctuations. - Protective circuit program included to prevent failures of the ultrasonic oscillator and servo due to overloads. - Excellent bonding reproducibility that allows for easy reading of processing behavior from bonding data waveforms and performing multiple regression analysis of the data.

• Welding Machine

The "Ultrasonic Sieve Unit" transmits special ultrasonic vibrations to each individual stainless steel mesh wire, resolving issues such as clogging, adhesion, agglomeration, and bridging in sieves and hoppers. It improves the classification efficiency in powder sieving processes and contributes to time savings! It achieves dry sieving with high mesh sizes such as 20μm and can be installed on mass production machines ranging from standard JIS mesh frames to large Φ1200 models. ★ We will be exhibiting at the 2022 Powder Industry Exhibition in Tokyo. Please refer to the basic information for details. 【Features】 ■ Prevents issues with special "sweep vibrations (30kHz to 38kHz)" ■ Compatible with various applications from lab-scale to mass production machines ■ Excellent maintenance, maintaining the quality of mesh screens over long-term vibrations ■ Dustproof and waterproof (CE certified, IP65 structure) ■ Easy installation with clamp hand tools of various dedicated sizes (Φ50, 75, 100, 150, 200, 300, etc.) * For more details, please refer to the PDF materials and the product introduction video on YouTube. Feel free to contact us with any inquiries.

• Sieve/Shaker

In the field of powder handling, when issues arise due to bridging, rat-holing, or adhesion, it is necessary to install auxiliary powder discharge devices in a timely manner to prevent quality issues and production interruptions. By using Artec's innovative 'flowsonic' solution, we achieve an improvement in the overall capacity of powder equipment while creating a production environment with low noise and mechanical vibrations! By simply connecting an ultrasonic converter to the side of the hopper, ultrasonic micro-vibrations are generated throughout the inner walls of the hopper, preventing powder adhesion and ensuring flowability. It is possible to apply ultrasonic vibrations to various structural components such as piping, chutes, silos, and volumetric feeders in powder transport. 【Features】 ■ Prevents powder adhesion and ensures flowability ■ Creates a production environment with low noise and vibrations ■ Capable of applying ultrasonic vibrations *For more details, please refer to the PDF document or feel free to contact us.

• Ultrasonic Oscillator

This is the latest comprehensive catalog from UC Japan Co., Ltd., which has been developing domestic specifications in collaboration with major semiconductor manufacturing equipment manufacturers in Japan, building trust and a proven track record. As a leading global company in ultrasound with a strong reputation, we solve ultrasound-related issues! We are expanding our business in the global market and have a robust support system in various countries! *Currently, we are offering the comprehensive catalog for free!* [Contents (excerpt)] ■ Wire bonders for semiconductor manufacturing (from UC Technology) ■ Ultrasonic plastic welding machines / cutters (from Rinko Ultrasonics) ■ Ultrasonic powder sieving machines / ultrasonic hoppers (from Artec Ultrasonics) ■ Main features of ultrasonic oscillators / ultrasonic transducers 　　　　　　　　　　　　　　　　　　　　　and more *For more details, please refer to the catalog or feel free to contact us.*

• Ultrasonic Oscillator

With just a one-touch attachment to a commercially available test sieve frame, it can be used as a tabletop ultrasonic sieve shaker. We have prepared dedicated clamp band fixtures (for φ75, φ100, φ150, φ200, φ300). A new nylon mesh option will also be released. We welcome evaluations of demo units! We will provide catalog PDFs, experimental videos (YouTube), and exhibition invitation tickets. 【Features】 ■ Dramatically improves sieving capability by eliminating clogging. ■ Powder troubles! Clogging, adhesion, bridging, and agglomeration are all handled by ultrasound. ■ We have started releasing the 【Ultrasonic Scraper】 that is compatible with nylon mesh (synthetic fiber mesh). Demo units are currently being evaluated! ■ Can accommodate multi-stage setups. Up to 2 or 4 stages. ■ Can be used in conjunction with general-purpose vibrating sieves. Electromagnetic vibrators, air turbines, etc. Enhanced performance with powder dispersion effects and ultrasonic effects! *For more details, please contact us or download the catalog.

• Ultrasonic Oscillator

Equipped with a servo press that efficiently transmits ultrasonic energy to the workpiece and an oscillator from RINCO with excellent ultrasonic control functions. It suppresses deformation and slipping of the base material during joining, preventing cracks and disconnection troubles. Additionally, if you want to realize your company's ideals rather than standard products, consultations are welcome. We will support you while sharing know-how for each customer's application, so modifications and program adjustments are also accepted. 【Features】 ■ Settings can be adjusted according to material characteristics ■ Customization and program modifications are possible ■ Support available for overseas deliveries *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines

An ultrasonic unit that adds special ultrasonic sweep vibrations to each stainless steel mesh wire, effectively improving issues (such as clogging, adhesion, agglomeration, segregation, bridging, etc.) in various environments handling powders! It contributes to resolving troubles like clogging, adhesion, and agglomeration in the powder sieving process, as well as improving yield and reducing time during classification. It achieves dry sieving with high mesh openings such as 20µm and can be installed on large mass production machines like Φ1200. 【Features】 ■ Innovative ultrasonic oscillation 'sweep vibration (30kHz to 38kHz)' ■ Compatible with various applications from lab scale to mass production machines ■ Doubles processing capacity by eliminating clogging (over 10 times capacity increase possible) ■ Significantly improves classification efficiency with fine meshes such as SUS mesh openings of 20μm ■ Excellent maintainability, preventing damage, opening, and collapse of screens due to long-term vibrations ■ Dustproof and waterproof (CE certified, IP65 structure) *For more details, please refer to the PDF document or feel free to contact us.

• Sieve/Shaker

Transducer for Ball Bonders ■〈ST Type Transducer〉 The ST type ultrasonic transducer is a standard ultrasonic transducer for ball bonders that Uthe Technology has been supplying stably for many years. ■〈ST-LE Type Transducer〉 The ST-LE type transducer is an ultrasonic transducer that enables fine-pitch wire bonding, which has become particularly important in recent years. ■〈B Type Transducer〉 The latest ultrasonic transducer for ball bonders, confidently delivered by Uthe Technology. 〈ST Type Transducer〉 ■〈PT Type Transducer〉 The PT type ultrasonic transducer is a standard ultrasonic transducer for wedge bonders that Uthe Technology has been supplying stably for many years. ■〈PT-LE Type Transducer〉 The PT-LE type ultrasonic transducer is an ultrasonic transducer that enables fine-pitch wire bonding, which has become particularly important in recent years. ■〈W Type Transducer〉 The latest ultrasonic transducer for wedge bonders, confidently delivered by Uthe Technology.

• Sieve/Shaker

Ultrasonic Powder Sifter: Clogging Prevention, Standard JIS Sifting, Mesh Cleaning ◆Features - The ultrasonic transducer converter is positioned outside the contact powder area - Approximately 1.5 times the processing capacity with the same mesh area as conventional machines - Easy to attach and detach - No tapping balls required - Available in sizes φ500, φ700, and φ1000 For more details, please download the catalog.

• Sieve/Shaker

Introducing the ultrasonic plastic welder, horn, cutter, sealer, and hand unit. Equipped with a high-performance oscillator that allows for a variety of parameter settings in different plastic welding modes, it features graphic displays of welding time, melt amount, and energy, as well as data statistical functions through dedicated PC software, enabling comprehensive database management. With a highly rigid welding stand and a pneumatic high-leg actuator, it boasts a welding finish accuracy within ±10μm at a pressure increment of 1N. For more details, please download the catalog.

• Welding Machine

In recent years, the demands for ultrasonic bonding with various materials and fine pitch bonding have become complex and diversified. We provide reliable solutions for all of these needs. 【Features】 We offer a variety of types. ○ ST Type Transducer Standard ultrasonic transducer for pole bonders ○ ST-LE Type Transducer Ultrasonic transducer enabling fine pitch wire bonding ○ B Type Transducer Latest ultrasonic transducer for pole bonders ○ PT Type Transducer Standard ultrasonic transducer for wedge bonders ○ PT-LE Type Transducer Ultrasonic transducer enabling fine pitch wire bonding ○ W Type Transducer Latest ultrasonic transducer for wedge bonders ● For more details, please contact us or download the catalog.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

It is developed targeting chip sizes from 0.15mm to 5mm. 【Features】 - The tip of the ultrasonic transducer is designed to allow for the attachment of a collet. - Capable of accommodating various chip sizes without replacing the transducer. - Frequency: 60kHz - Option: Cartridge heater For more details, please contact us or download the catalog.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

It is developed targeting chip sizes from □3mm to □10mm. 【Features】 ○ The tip of the ultrasonic transducer is designed to allow for the attachment of a collet. ○ Capable of accommodating various chip sizes without replacing the transducer. ○ Frequency: 60kHz ○ Option: Cartridge heater ● For more details, please contact us or download the catalog.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

This is a notification from UC Japan Co., Ltd. regarding the "Custom Specification Special Order Transducer Dual Frequency Ultrasonic Transducer." 【Features】 - A unique ultrasonic transducer that allows the use of two resonant frequencies, 65kHz and 135kHz, with a single unit, pioneering in the industry. - It enables instantaneous switching between bonding in the 60kHz range, which typically requires the replacement of the ultrasonic transducer, and bonding in the 130kHz range (high frequency) without needing to replace the transducer. - It can accommodate a variety of applications, such as bonding at 130kHz for the 1ST and bonding at 60kHz for the 2ND. For more details, please contact us or download the catalog.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

This is a notice from UC Japan Co., Ltd. regarding the "Custom Specification Special Order Transducer Wideband Frequency Compatible Ultrasonic Oscillator." 【Features】 ○ Capable of switching rapidly between 65/135kHz (1st/2nd bond) ○ Select appropriate parameters from 16 different profiles ○ Equipped with a fully automatic tracking function controlled by CPU ● For more details, please contact us or download the catalog.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

It is designed to monitor the impedance value fluctuations during bonding and automatically achieve stable ultrasonic output. 【Features】 ○ Always capable of selecting optimal conditions for bonding applications ○ Functions such as "RAMP," "DELAY," and "BOOST" can be utilized ○ Stable bonding is possible even for materials prone to cracking and chipping ○ Ultrasonic output: up to 2.5W ○ Control method: voltage control, power control (power equalization) ○ Frequency: standard products 58–64kHz, high-frequency products 80–130kHz ○ Weekly control: automatic impedance tracking type ○ Interface: 8-bit parallel, Trigger I/F, RS-232C ○ External display: impedance value, oscillation frequency, oscillation output level phase difference ○ Input power supply: 100–240V AC 50/60Hz (multi-voltage compatible) ● For more details, please contact us or download the catalog.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

This is a notice from UC Japan Co., Ltd. regarding the "Intelligent Ultrasonic Oscillator High Frequency Type 10H-P2-100." 【Features】 ○ Ultrasonic Output: Maximum 2.5W ○ Control Method: Voltage Control, Power Control (Power Equalization) ○ Frequency: Standard Product 58–64kHz, High Frequency Product 80–130kHz ○ Weekly Control: Impedance Automatic Tracking Type ○ Interface: 8-bit Parallel, Trigger I/F, RS-232C ○ External Display: Impedance Value, Oscillation Frequency, Oscillation Output Level Phase Difference ○ Input Power Supply: 100–240V AC 50/60Hz (Multi-Voltage Compatible) ● For more details, please contact us.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

This is a notice from UC Japan Co., Ltd. regarding the "Intelligent Ultrasonic Oscillator High Frequency Type 10H-P2-138." 【Features】 ○ Ultrasonic Output: Maximum 2.5W ○ Control Method: Voltage Control, Power Control (Power Equalization) ○ Frequency: Standard Product 58–64kHz, High Frequency Product 80–130kHz ○ Weekly Control: Impedance Automatic Tracking Type ○ Interface: 8-bit Parallel, Trigger I/F, RS-232C ○ External Display: Impedance Value, Oscillation Frequency, Oscillation Output Level Phase Difference ○ Input Power Supply: 100–240V AC 50/60Hz (Multi-Voltage Compatible) ● For more details, please contact us.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

This is a notice from UC Japan Co., Ltd. regarding the "Intelligent Ultrasonic Oscillator High Power Type 10H-P2-HP." 【Features】 ○ Ultrasonic Output: Maximum 10W (standard model), 8W (high frequency model) ○ Control Method: Voltage control, power control (power equalization) ○ Frequency: Standard model 58–64kHz, high frequency model 80–130kHz ○ Weekly Control: Automatic impedance tracking type ○ Interface: 8-bit parallel, Trigger I/F, RS-232C ○ External Display: Impedance value, oscillation frequency, oscillation output level phase difference ○ Input Power Supply: 100–240V AC 50/60Hz (multi-voltage compatible) ● For more details, please contact us.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

This is a notice from UC Japan Co., Ltd. regarding the "Intelligent Ultrasonic Oscillator High Power Type 40H-P2." 【Features】 ○ Ultrasonic Output: Maximum 40W ○ Control Method: Voltage Control, Power Control (Power Equalization) ○ Frequency: Standard Product 40–48kHz ○ Weekly Control: Impedance Automatic Tracking Type ○ Interface: 8-bit Parallel, Trigger I/F, RS-232C ○ External Display: Impedance Value, Oscillation Frequency, Oscillation Output Level Phase Difference ○ Input Power Supply: 100–240V AC 50/60Hz (Multi-Voltage Compatible) ● For more details, please contact us.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

This is a production-capacity type ultrasonic plastic welding machine developed based on extensive achievements, excelling in performance in production environments. 【Features】 ○ Equipped with a high-performance oscillator that allows for a variety of parameter settings in various welding modes ○ Capable of database management for welding time, melt amount, energy, and other data ○ Achieves high reproducibility in welding finish accuracy with a highly rigid welding stand ○ Easy to integrate into automated systems ● For more details, please contact us.

• Ultrasonic Oscillator

This is a high-performance ultrasonic oscillator AGM designed for integration into automated production lines. 【Features】 ○ Easy parameter manipulation and complete database management via dedicated PC software ○ Ability to manage all tasks through parameter signals from external controllers ○ Welding modes include three types of oscillation control: time, energy, and continuous ○ Achieves reproducible plastic welding through limit functions for frequency, time, and energy ● For more details, please contact us.

• Ultrasonic Oscillator

Rinko Corporation designs and manufactures horn resonance using advanced finite element analysis (FEM). 【Features】 ○ The horn is used as a welding tool in combination with ultrasonic plastic welding machines. ○ By using dedicated horns compatible with ultrasonic oscillators operating at frequencies of 20kHz, 35kHz, and 70kHz, stable tip amplitudes essential for ultrasonic plastic welding are generated. ○ Due to differences in resin properties, work sizes, and frequencies, the required tip amplitude varies individually, allowing for stable amplitudes without load even during amplification and attenuation. ● For more details, please contact us.

• Ultrasonic Oscillator
• Other processing machines

We will perform welding of thin film composite sheets and films using ultrasonic technology. 【Features】 ○ Ultrasonic 70kHz enables welding of ultra-thin sheets and films ○ Diversification of lower jig shapes allows for various sealing and welding surfaces ○ Simplifying the horn shape improves wear resistance ○ Low electricity consumption reduces running costs ○ Compact converter designed for space-saving ○ Easy integration into automatic machines when combined with AGM oscillators ● For more details, please contact us.

• Ultrasonic Oscillator

This is a notice from UC Japan Co., Ltd. regarding the "Ultrasonic Welding Ultrasonic Cutter." 【Features】 ○ Over 100 types of ultrasonic cutter horns have been standardized, allowing for ultrasonic cutting, cutting, and trimming according to materials and requirements. ○ Specially shaped ultrasonic punching cutters can also be accommodated through horn design. ○ By combining converters, boosters, horns, and oscillators designed for automation, it is possible to construct ultrasonic cutters for various working environments. ○ We have extensive experience in cutting and trimming non-woven fabrics, making it effective for cutting and trimming automotive interior parts. ● For more details, please contact us or download the catalog.

• Ultrasonic Oscillator

This is a notice from UC Japan Co., Ltd. regarding "Ultrasonic Plastic Welding Medical Applications." 【Features】 ○ Assembly and processing of medical components using the highest quality ultrasonic plastic welding machines for over 30 years ○ Development of ultrasonic welding and punching technology based on extensive know-how and rich experience ○ In situations requiring precise welding, RINCO ultrasonic welding machines are offered as a reliable solution ● For more details, please contact us.

• Ultrasonic Oscillator

The handheld ultrasonic unit allows for construction using manual labor or robotic hands. 【Features】 ○ The high rigidity internal structure enables stable application of pressure to welding areas such as spot welding, rivet welding, and cutting. ○ Frequency: 20kHz ○ Oscillator: Combination with SL type ○ Weight: 1.8kg, built-in converter ● For more details, please contact us.

• Ultrasonic Oscillator

The handheld ultrasonic unit enables construction using manual or robotic hands. 【Features】 ○ Stable application of pressure to welding areas such as spot welding, rivet welding, and cutting due to a highly rigid internal structure. ○ Frequency: 35kHz ○ Oscillator: Combination with RL/SL type ○ Weight: 1.2kg, built-in converter ● For more details, please contact us.

• Ultrasonic Oscillator
• Other processing machines

The handheld ultrasonic unit enables construction using manual or robotic hands. 【Features】 ○ Stable application of pressure to welding areas such as spot welding, rivet welding, and cutting due to a highly rigid internal structure. ○ Frequency: 35kHz ○ Oscillator: Combination with RL/SL type ○ Weight: 0.7kg, built-in converter ● For more details, please contact us.

• Ultrasonic Oscillator
• Other processing machines