ジャステム List of Products and Services

At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, using our unique technology. We provide these to many customers. By applying our know-how from the silicon wafer manufacturing industry, we are expanding our market into areas such as SiC wafers, sapphire wafers for LED substrates, solar cells, and MEMS. We also offer demonstration measurements for thickness measurement of various materials. For more details, please contact us or download our catalog.

• Contract manufacturing
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Compatible with wafers from φ2 inches to φ6 inches. Supports various materials including Si, glass, SiC, oxides, and compound wafers. Miniaturized for use in research, development, and prototyping processes.

• Wafer processing/polishing equipment

The diameter measurement values (average diameter values, etc.) will be saved in Excel format on the attached computer.

• Semiconductor inspection/test equipment

Thickness measurement of 4”, 5”, 6”, and 8” Si wafers, determination of front and back P/N, and resistivity measurement will be conducted, and based on the results, sorting will be performed into cassettes that have been pre-set in the recipe.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Thickness measurement is performed using multi-point measurements according to the recipe. The measurement sensor uses a spectroscopic interference method sensor to perform measurements from one side.

• Semiconductor inspection/test equipment

By holding three points on the outer circumference of the silicon wafer and rotating the θ table, the thickness at any location can be measured. Our unique "non-contact earth" method allows for safe, non-contact handling.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

- The thickness of the silicon wafer will be measured non-contact. - A laser length measuring device will be used to measure the thickness. - The thickness measurement data will be saved on a PC.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

□TME-02A Type/TME-02B Type□ This is a device that extracts silicon wafers from a dedicated cassette using edge handling and measures the thickness of a set pattern. It holds three points on the outer circumference of the silicon wafer and rotates the θ table to measure the thickness at any desired location. Thanks to our unique "non-contact earth" method, it allows for safe and non-contact handling. It is equipped with a barcode reader, and the scanned barcode number can be saved in a specified cell in Excel. □TME-03 Type□ This is a device that extracts silicon wafers from a dedicated cassette and measures the thickness of a set pattern. The chucking of the silicon wafer during transport and measurement at the stage uses vacuum to hold the backside.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

- The thickness is measured non-contact using an optical probe/sensor. - A porous chuck-type wafer stage is used to uniformly hold thin wafers. - Measurement data is saved in CSV format, in addition to being displayed on the monitor of the accompanying computer. Graphical display is also possible.

• Other semiconductor manufacturing equipment
• Semiconductor inspection/test equipment

- The wafer thickness is measured non-contact using a capacitance sensor. - Wafer size changes are possible through recipe settings, eliminating the need for setup changes. - The measurement point is set to one point at the center, with cross measurements configured in the recipe. The number of points and their positions during cross measurements can also be specified. - The measured data is saved on the accompanying computer.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This machine is a device for measuring the thickness of silicon wafers with diameters of φ200mm and φ300mm. The setting and measurement of the wafers are performed by manual operation by the operator.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This machine is a device for manually measuring the thickness of wafers such as Si and SiC with diameters ranging from φ100mm to φ150mm. The thickness measurement is performed using a high-precision contact digital sensor and is conducted on one side.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This machine is a device that manually measures the thickness of various materials' wafers with a diameter of 4 inches or less. The thickness measurement is performed using a confocal chromatic aberration sensor, measuring the difference between a block gauge or reference wafer and the target wafer in a one-sided measurement.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This machine is a device for manually measuring the thickness of compound semiconductor wafers in sizes of φ2”, φ4”, or φ6”. Thickness measurements are performed using an optical sensor, with standalone wafers measured by clamping and wafers attached to a flat plate measured from one side. To conduct each type of measurement, two types of measurement stages are prepared, and the sensors are swapped out for the measurements.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Set the carrier, and it will automatically measure the pre-set measurement position by operating the [Start] switch. The measurement data will be recorded on the included computer.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

The operator can determine the measurement position and measure the thickness using a foot switch. The measurement values are displayed on the counter. It is also possible to record them on a computer as an option.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Set the carrier, move to the pre-set measurement position by operating the [Start] switch, and perform the measurement by operating the [Measure] switch. The θ-axis direction depends on the operator's setting. The measurement values will be displayed on the counter. It is also possible to record the data on a computer as an option.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

By using a twin-arm robot, efficient operation has become possible, allowing for processing in a short time. Measurement data is automatically saved in an Excel file.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

By having two discharge stages, short processing times have become possible. Measurement data is automatically saved in an Excel file.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

By making the stage three-tiered, it has become possible to process more wafers. Measurement data is automatically saved in an Excel file.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

By sorting, we prevent wafers with abnormal thickness from flowing into the next process. By measuring the thickness before and after wafer processing, we can also manage the processing conditions. Additionally, by standardizing the thickness for each cassette, the processing quality in the next step is improved.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

- The diameter of the wafer is measured non-contact. - By rotating the stage, it also accommodates the diameter of the orifice surface and the depth of the notch. - The camera mounting section has a mechanism that allows for manual adjustment in the vertical direction.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

- The diameter of the wafer is measured non-contact. - By rotating the stage, the A diameter (3 points) and B diameter can be measured. - The LOT NO. and other information can be read using a barcode reader. - The measurement values are saved in Excel format on the accompanying computer.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device that measures the thickness and resistance of silicon wafers and classifies them into specified resistivity categories or categories based on resistivity and thickness.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

- The handling of silicon wafers using an outer peripheral hanging method allows for the transfer of ultra-thin wafers. - The robot's hand is made of ceramic, and Teflon is used for the clamps in the inversion section. - There are three carrier ports, with two used for loading and unloading, and the remaining one used as a buffer.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

The wafers are handled using a vacuum suction method. By using this device, we can improve the quality of the wafer handling work that was traditionally done by operators manually.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Two φ150mm cassettes can be set up, and based on signals from the device, wafers are supplied to the device one by one.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

The wafer is placed onto the wafer shuttle by the operator using a suction pad after being processed by the equipment, and then it is slid into the Teflon cassette for storage by utilizing the tilt of the stage and the discharge of pure water.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device for loading and unloading φ150 mm and φ125 mm silicon wafers into a lap processing machine. The wafers taken out are subjected to thickness measurement one at a time for each batch, and an OK/NG judgment on the finished thickness is made.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

- After cleaning, dry the water droplets on both sides of the air knife wafer. - The wafer is handled with edge clamps and does not come into contact with either side.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

- The wafer is dried using air blow. - It is driven by compressed air, so no electricity is used.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device that transfers chips placed on a tray to a designated separate tray based on the tray information (information for each chip) stored in a pre-saved CSV file. It can accommodate up to 8 classifications. It contributes to the rationalization of chip transfer operations.

• Other electronic parts
• Transport and handling robots
• Sorting machine

This device can perform three types of operations: extracting from a 6.8-inch wafer cassette (Load Mode), storing into a cassette (Unload Mode), and alternating between Load Mode and Unload Mode (In-and-Out Mode).

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This machine is a device that performs cassette-to-cassette transfer of φ200mm wafers through manual operation.

• Other semiconductor manufacturing equipment

- Manual/automatic switching and arbitrary temperature adjustment are possible. - The heating temperature can rise up to a maximum of 500℃.

• Other semiconductor manufacturing equipment

This device is a manual apparatus equipped with a safety cover and remote operation mechanism, designed to safely perform work processing tasks carried out by the operator. The operator sets the workpiece into the device and performs the processing while adjusting the angle of the grinding wheel and the X-axis position.

• Other semiconductor manufacturing equipment
• Other processing machines

It is a device that detects scratches on the front and back surfaces of silicon wafers through image processing and determines pass or fail.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Five wafers are transported from the FOSB to the inspection stage, and the wafers after inspection are returned to the same slot of the same FOSB. The wafers are handled using an edge clamp method.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device for reading the two-dimensional code on a φ300 mm silicon wafer. It is a portable desktop model.

• Other semiconductor manufacturing equipment
• Other semiconductor manufacturing equipment

- Detects foreign particles of φ0.2μm or larger using a scattered light detection method. - Uses vacuum suction on the backside, ensuring no contact with the wafer surface.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

- Macro inspection uses an outer peripheral chuck and allows for inspection of both sides of the wafer by adjusting the wafer tilt and horizontal rotation with a joystick. - In micro inspection, it is possible to specify inspection points via a recipe. - The extraction of wafers from the cassette, transportation to each inspection unit, and storage back into the cassette are all performed by an automatic wafer transfer robot. - The wafer transfer robot employs a Bernoulli-type hand, enabling it to handle thin and warped wafers. - Equipped with an FFU (PTFE specification) and an all-stainless steel frame, it can support a high-cleanliness environment. - Communication with the factory HOST is also possible.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

- Visual inspection can be easily performed using JOG stick operation. - Alignment is performed based on the notch position, and clamping measurement is conducted using a capacitive sensor.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

The operator sets the workpiece. It is held in place by a resin pin. Manual tilting and turning operations can be performed, making it easy to inspect both sides of the workpiece.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

The cassette containing the wafers will be automatically transported to the inspection stage. Based on the pass/fail judgment results from the operator, the cassette for inserting the wafers will be selected and transported.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Using an image processing system, we will perform length measurement and foreign object inspection of the workpiece. The workpieces will be sorted based on the pass/fail judgment results from the image processing system.

• Inspection robot
• Food environmental hygiene/contamination prevention equipment
• Other food machinery