List of Bonding Equipment products
- classification：Bonding Equipment
1～45 item / All 167 items
We provide comprehensive support from design to manufacturing and maintenance!
- Contract manufacturing
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
A method to triple production capacity without expanding the clean room!
- Bonding Equipment
Easier wedge bonding of copper wire using heating technology.
- Bonding Equipment
Easily connect copper wire chips with innovative laser heating.
- Bonding Equipment
The optimal bonding solution for the aerospace field, which requires high reliability.
- Bonding Equipment
High-precision bonding solutions that meet miniaturization needs.
- Bonding Equipment
Providing the optimal bond for high-brightness LED manufacturing.
- Bonding Equipment
Providing optimal and high-quality bonds that correspond to high currents.
- Bonding Equipment
Achieving high-quality bonds optimized for automotive powertrains.
- Bonding Equipment
Reliable bonding solutions that support the robustness of industrial robots.
- Bonding Equipment
Bonding solutions that contribute to improving productivity and reducing costs in home appliance manufacturing.
- Bonding Equipment
Providing optimal and high-quality bonding that supports multi-pin configurations.
- Bonding Equipment
Providing the ideal bond for manufacturing high-sensitivity sensors.
- Bonding Equipment
Providing bonds that contribute to improving durability in the renewable energy sector.
- Bonding Equipment
Providing optimal and high-quality bonds that support high-speed transmission.
- Bonding Equipment
Providing optimal adhesive for large-capacity bonding for EV batteries.
- Bonding Equipment
Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.
- Bonding Equipment
Combining display devices with cover panels and films! Contributes to the enhancement of functionality and design.
- Bonding Equipment
- Processing Contract
An innovative technology that heats the bond, making it easier to wedge bond copper wire.
- Bonding Equipment
A controllable current transducer and frequency that continuously monitors wire deformation.
- Bonding Equipment
Expansion of productivity! The large work area allows for batch processing of multiple devices.
- Bonding Equipment
Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.
- Bonding Equipment
Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.
- Bonding Equipment
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
- Bonding Equipment
Manual flip chip bonder suitable for small-scale production and various experiments.
- Bonding Equipment
Air bearing cylinder with zero friction resistance.
- Pneumatic Equipment
- Bonding Equipment
- Wafer processing/polishing equipment
Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition
We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee
Non-contact, high-speed response allows for control as you wish. Custom orders are available starting from one unit!
- Pneumatic Equipment
- Bonding Equipment
- Wafer processing/polishing equipment
Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition
We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee
Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.
- Bonding Equipment
"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.
- Other processing machines
- Bonding Equipment
- Other semiconductor manufacturing equipment
The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.
- Bonding Equipment
Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]
- Bonding Equipment
Stable and high-quality wire bond process management! Achieve improved operating rates and high productivity!
- Bonding Equipment
- Other mounting machines
- Other contract services
Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
- Other processing machines
- Bonding Equipment
- Other semiconductor manufacturing equipment
Techno Alpha is the Japanese distributor of K&S wire bonders, which boasts a top-class global share in wire bonding, as well as consumables for wire bonders.
- Bonding Equipment
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
- Bonding Equipment
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.