List of Wafer products
- classification:Wafer
121~180 item / All 309 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
We will accommodate various stud bump processing according to your specifications.
- Wafer
Supports high-difficulty processing of hard materials! Dicing processing of fragile chips like Low-k wafers can be done without damage.
- Wafer
Utilized in many products around us! An introduction to the manufacturing processes and applications of semiconductors.
- Wafer
We will be exhibiting at 'SEMICON JAPAN' held at Tokyo Big Sight (East Exhibition Hall) from December 13 (Wednesday) to 15 (Friday), 2023!
- Wafer
With a commitment to high quality and short delivery times, we will expand our business to meet the diverse needs of our customers!
- Wafer
- Other semiconductors
Achieving high-aspect-ratio trench pattern wafers with deep etching technology.
- Wafer
Full cut and step cut compatible with dual spindle! Processing track record for wafer thickness of 725 to 100 μm and chip sizes of 0.5 mm or less!
- Wafer
In the state of the sheet after dicing, it cannot be picked up by the device, and we want to change to tray specifications; we can accommodate even just with die sorting according to the application!
- Wafer
It has the characteristic of small output fluctuations due to temperature, making it possible to expand into various fields! Custom manufacturing is also available.
- Wafer
Prevention of damage from shock and vibration!!
- Wafer
sakase topics No.62
Introduction to the upcoming exhibition We will be exhibiting at the "MEMS Sensing & Network Systems Exhibition" held at Makuhari Messe from October 17 to 19! At the Sakase booth, we will showcase products that can be used as "research and development/production process support tools" for sensors and next-generation MEMS (IoT, AI, automotive, medical), including: - Transport boxes and cases for sensors and MEMS - Transport jigs for inter-process handling If you are nearby, please stop by our booth. Testing with actual products is possible, so take this opportunity to try out any samples you would like to test. For more details, please refer to the attached "Sakase Topics September issue."
Due to the dry process, no water is used, making it environmentally friendly. Achieves increased productivity with zero car floss. Compared to conventional methods, it reduces the footprint.
- Wafer
- LCD display
- Fine Ceramics
Due to the dry process, no water is used, making it environmentally friendly. Achieves increased productivity with zero car flows. Compared to conventional methods, it has a smaller footprint.
- Wafer
- LCD display
- Fine Ceramics
Leave the semiconductor silicon wafers to us.
- Processing Contract
- Wafer
The system features modular design! It can accommodate long-term changes according to technology and productivity.
- Wafer
Low cost and high productivity! With modular design, the equipment can be configured to meet customer requirements.
- Other electronic parts
- Wafer
The laser head and controller are integrated. There is also a water-cooled model.
- Laser marker
- Wafer
- Secondary Cells/Batteries
A versatile marking device equipped with the latest picosecond and femtosecond lasers.
- Wafer
- diode
- Laser marker
Proposal for semiconductor manufacturing: We offer cost-effective materials as alternatives to traditional thick epitaxy and inverted epitaxy for IC and MEMS applications.
- Wafer
Adopts a mechanism that discharges exhaust upward. It picks up and transfers surrounding chips non-contact without blowing them away with the ejected gas.
- Wafer
- CVD Equipment
- Wafer processing/polishing equipment
A Bernoulli chuck for non-contact transport of ultra-thin, long workpieces measuring 1.4 mm in width and 55 mm in length.
- Wafer processing/polishing equipment
- Wafer
- Separation device
We offer custom products such as 100-200mm bonded wafers (SOI, SiSi), dielectric separation, and deep trench etching with a high aspect ratio.
- Wafer
[Demo unit available for loan] This lighting is suitable for inspecting transparent and translucent compound semiconductor wafers, defect inspection on non-transparent silicon wafer surfaces, and scra...
- LED lighting
- Work Light
- Wafer
Development of technologies for adhesion, control, and monitoring! Comprehensive support from design to manufacturing.
- Other semiconductors
- Wafer
- Other conveying machines
Providing epitaxial wafers for various optical semiconductor devices such as semiconductor lasers, VCSELs, PDs, and DBRs.
- Laser Components
- Other optical parts
- Wafer
2-inch epitaxial wafers of semiconductor lasers and RCLEDs
- Wafer
- Laser Components
Natural silica is the raw material. A new material that emits terahertz waves, applied in various fields due to its performance.
- Wafer
Ultra-high vacuum - compatible with pressurized atmospheres! A bonding system equipped with uniform heating and pressurization functions!
- Wafer
- Other machine elements
193 nm, 213 nm, 244 nm, 257 nm, 266 nm FHG generation semiconductor laser system
- Wafer
Utilizing its characteristics, it is used in various fields including optical fibers! A detailed introduction to the main types and more.
- Glass
- Wafer
Introducing products for semiconductors, such as silicon wafers and CZ/FZ ingots!
- Wafer
- Other semiconductors
Notice of Participation in 'SEMICON Japan 2022' from December 14 (Wednesday) to December 16 (Friday), 2022
Trinity Corporation will be exhibiting at SEMICON Japan 2022, held at Tokyo Big Sight. We will primarily showcase silicon wafers and ingots for semiconductors, as well as their processed products. This exhibition will focus on displaying silicon wafers and ingots for semiconductors, along with their processed products. We sincerely look forward to your visit.
We handle various types of membrane-coated wafers. We also accept inquiries regarding specially processed wafers.
- Wafer
Notice of Participation in 'SEMICON Japan 2022' from December 14 (Wednesday) to December 16 (Friday), 2022
Trinity Corporation will be exhibiting at SEMICON Japan 2022, held at Tokyo Big Sight. We will primarily showcase silicon wafers and ingots for semiconductors, as well as their processed products. This exhibition will focus on displaying silicon wafers and ingots for semiconductors, along with their processed products. We sincerely look forward to your visit.
We have a wide stock of silicon wafers ranging from 2 inches to 12 inches in various types, and we can provide small lots, short delivery times, and stable supply!
- Wafer
Notice of Participation in 'SEMICON Japan 2022' from December 14 (Wednesday) to December 16 (Friday), 2022
Trinity Corporation will be exhibiting at SEMICON Japan 2022, held at Tokyo Big Sight. We will primarily showcase silicon wafers and ingots for semiconductors, as well as their processed products. This exhibition will focus on displaying silicon wafers and ingots for semiconductors, along with their processed products. We sincerely look forward to your visit.
We have a selection of small-diameter (approximately φ300) silicon ingots available.
- Wafer
Notice of Participation in 'SEMICON Japan 2022' from December 14 (Wednesday) to December 16 (Friday), 2022
Trinity Corporation will be exhibiting at SEMICON Japan 2022, held at Tokyo Big Sight. We will primarily showcase silicon wafers and ingots for semiconductors, as well as their processed products. This exhibition will focus on displaying silicon wafers and ingots for semiconductors, along with their processed products. We sincerely look forward to your visit.
Bernoulli chuck capable of efficient non-contact transport even for heavy workloads.
- Wafer
- Press Dies
We can provide small lots, short delivery times, and stable supply! We offer a wide variety of silicon wafers for semiconductors.
- Wafer
Notice of Participation in 'SEMICON Japan 2022' from December 14 (Wednesday) to December 16 (Friday), 2022
Trinity Corporation will be exhibiting at SEMICON Japan 2022, held at Tokyo Big Sight. We will primarily showcase silicon wafers and ingots for semiconductors, as well as their processed products. This exhibition will focus on displaying silicon wafers and ingots for semiconductors, along with their processed products. We sincerely look forward to your visit.
The HGTECH marking machine, boasting overwhelming cost performance, has been released for wafers!
- Wafer
- Laser marker
- Circuit board processing machine
This is an interferometer that combines user-friendliness suitable for any user with high functionality such as back reflection cancellation, while also excelling in cost performance.
- Analytical Equipment and Devices
- Wafer
- Circuit Board Inspection Equipment
Compact packaging of semiconductor wafers. Thin wafers can also be transported safely. Complies with ANSI/ESD S541 standards.
- Wafer
We will obtain high-quality silicon from the market very efficiently and provide it to you!
- Wafer
The transportation between UV and heating treatment by the operator has been simplified into a single device, making it a safe specification that can be used with peace of mind.
- Wafer
- LED Module
- Other semiconductors
We have a variety of silicon ingots in different diameters available.
- Wafer
Notice of Participation in 'SEMICON Japan 2022' from December 14 (Wednesday) to December 16 (Friday), 2022
Trinity Corporation will be exhibiting at SEMICON Japan 2022, held at Tokyo Big Sight. We will primarily showcase silicon wafers and ingots for semiconductors, as well as their processed products. This exhibition will focus on displaying silicon wafers and ingots for semiconductors, along with their processed products. We sincerely look forward to your visit.
JEITA・SEMI standard products, high-grade TTV and particle products, support for other optional specifications, handling of domestic and international manufacturers' products, small quantity support.
- Wafer
Prototype support, small quantity support, 4 to 12 inch support, optional film thickness (10nm to 20μm), substrate arrangement possible, support for supplied substrates, short delivery time.
- Wafer
Prototype support, small quantity support, 4 to 12 inch support, optional film types, supplied substrate support.
- Wafer processing/polishing equipment
- Wafer
Prototype support, small quantity support, 4 to 8 inch support, customizable thickness and shape, PCB arrangement possible, support for supplied PCBs, short delivery time.
- Wafer
Silicon disks for silicon component manufacturing, focus rings for plasma processing equipment, and more are available!
- Wafer
- Other polymer materials
- Plasma Generator
12-inch wafer processing with ring attachment is possible! Surface modification, removal of inorganic/organic contamination! Ideal for evaluation and research before mass production! High speed, low c...
- Wafer
- Other semiconductors
- Other electronic parts
High-speed transfer of up to 25,000 UPH, high precision/damage-free storage, various optional features, supports multiple types of appearance inspection (2 sides, 6 sides).
- Capacitor
- Other electronic parts
- Wafer
Increased curing treatment efficiency with UV irradiation in a vacuum environment! Supports wafering up to a maximum of 8 inches! Demonstrations and customization available!
- Wafer
A rich lineup of 27 different types! We also accept custom orders, regular calibration, and repairs.
- Thermometer
- Wafer
- Other measurement, recording and measuring instruments
High repetition rate high output short pulse green pulse laser
- Capacitor
- Secondary Cells/Batteries
- Wafer
We offer 6-inch SiC substrate wafers, 6-inch GaN-on-Si HEMT RF epitaxial wafers, and more.
- Wafer
- Other laboratory equipment and containers
We will coat with fluororesin that has the properties of being heat-resistant, chemical-resistant, non-conductive, non-stick, and slippery.
- Wafer
- Other electronic parts
- Processing Contract
We handle lead-free solder ball bump mounting processes and solder bump mounting processes using printing methods.
- Wafer
- Circuit board design and manufacturing