We can accommodate a wide range of processing variations! We can also handle processing on supplied materials or only specific processes.
This is a manufacturing example of thin film circuit substrates that combines vacuum film formation through sputtering and deposition with photolithography.
We can accommodate a wide range of processing variations, including hole drilling and contour cutting using lasers and dicing, as well as thin film resistor formation, providing high-quality thin film circuit substrates with a high degree of design flexibility.
We can also process supplied materials or handle only specific processes.
【Case Overview】
■Materials: Alumina, Aluminum Nitride, Quartz Glass, etc.
■Thickness: 0.1 to 1.0 mm
■Conductor Films: Ti/Pd/Au, Ti/Pd/Cu/Ni/Au, Ti/Pt/Au, etc.
*For more details, please refer to the PDF document or feel free to contact us.