We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 559 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. 共栄電資 Tokyo//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office Tokyo//Ceramics
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 null/null
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Substrate Product ranking

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. Molded cast products [We propose the selection of resins tailored to the required characteristics]. 共栄電資
  2. Tokyo Machine and Tool Co., Ltd. Business Introduction 東京マシン・アンド・ツール
  3. High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Noda Screen Co., Ltd. Company Profile NODASCREEN CO.,LTD.

Substrate Product List

1711～1740 item / All 1932 items

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[Concerns about Device Assembly] It requires technology to mount the circuit board onto the aluminum casing.

[Concerns about Device Assembly] It requires technology to mount the circuit board onto the aluminum casing.

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section. By pre-installing and securing with screws, labor reduction becomes possible!

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Realization of GND connection for the aluminum part ■ Dramatic improvement in the usability of the aluminum part ■ Automatic mounting via reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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[Concerns about Device Assembly] The circuit board is thin and difficult to handle.

[Concerns about Device Assembly] The circuit board is thin and difficult to handle.

Achieve grounding of the aluminum section! This improves the usability and design flexibility of the aluminum part. By pre-installing and securing with screws, labor reduction becomes possible!

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing the thickness of aluminum or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Realization of GND for the aluminum part ■ Dramatic improvement in the utilization of the aluminum part ■ Automatic mounting with reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Busbar for Data Centers - High Current Board

Busbar for Data Centers - High Current Board

A substrate for data centers that achieves high insulation properties and miniaturization.

In data center power supply systems, stable power supply and space-saving are required. Especially as density increases, improving power supply efficiency and addressing heat generation are crucial. The reliability of busbars is directly linked to the stable operation of the system, making high insulation and secure connections essential. Our busbars (bus bars) for high current substrates address these challenges. 【Usage Scenarios】 - Power units for data centers - Power supply within server racks - Power systems requiring high-density mounting 【Benefits of Implementation】 - Improved safety due to high insulation - Enhanced system efficiency through space-saving - Reduced assembly labor and prevention of wiring errors - Miniaturization of the entire device

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Must-see for those who want to improve production efficiency! Free simple diagnosis for logistics sites.

Must-see for those who want to improve production efficiency! Free simple diagnosis for logistics sites.

Logistics professionals observe logistics sites! We propose work improvements and layout reviews from a field perspective! *A collection of improvement case studies is currently being offered!

We are working on improving production efficiency, but we are running out of options soon... Do you have any such concerns? At Ohsaki Corporation, we offer free diagnostics of logistics sites from a professional perspective! With 70 years of experience in factory logistics, we provide feasible proposals from a site perspective. We will visit your logistics site to identify issues and organize challenges. We do not propose based on theoretical ideals. By shortening the flow lines of the site layout, streamlining processes, and effectively utilizing space, we will assist in improving productivity. Ohsaki Corporation will be your partner in supporting manufacturing sites through logistics (improving logistics QCD)! [We solve the following concerns] ■ There are no logistics professionals in-house ■ Unable to determine if the current factory logistics are good or bad ■ Want to reduce costs and increase production efficiency *We are currently offering a collection of improvement case studies! For more details, please download the catalog or contact us.

  • Other services
  • others
  • Substrate

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[Case Study Materials for Repair and Maintenance of Circuit Boards] Circuit Board of Conveying Equipment

[Case Study Materials for Repair and Maintenance of Circuit Boards] Circuit Board of Conveying Equipment

We will introduce a case where the replacement of defective parts and degraded components, along with power protection measures, successfully extended the product's lifespan.

In these uncertain times, why not extend the life of your current, familiar equipment by repairing and maintaining it, thereby reducing labor and costs? At Tsuda Manufacturing Co., Ltd., we leverage the technical skills we have developed through jig manufacturing and unit assembly to engage in printed circuit board repair testing, repairs, and reverse engineering. We are currently showcasing successful cases of product life extension. [Case Study] At a certain resin processing company, multiple ICs were found to have broken bonding wires, short circuits at power terminals, and operational abnormalities. It is believed that the power supply connected to this board experienced an anomaly, causing widespread damage to components. As a result, we replaced the defective parts and degraded components and implemented protective measures for the power supply. Upon powering it on, we confirmed that it operated similarly to a normal functioning unit, leading us to conclude that the repair was successful, and we delivered it to the user. For solutions to your circuit board issues and concerns, please consider our company, which excels in technical skills, analytical capabilities, and proposal power. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Other electronic parts
  • Substrate

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Presentation of Success Case Collection: Leave the repair and maintenance extension of circuit boards to us.

Presentation of Success Case Collection: Leave the repair and maintenance extension of circuit boards to us.

We would like to introduce examples of successful product lifespan extension through repairs, duplication, circuit diagram restoration, and overhauls, made possible by our technical and analytical capabilities.

In these uncertain times, why not extend the life of your currently familiar equipment by repairing and maintaining it, thereby reducing labor and costs? At Tsuda Manufacturing Co., Ltd., we leverage the technical skills we have cultivated through printed circuit board assembly, jig manufacturing, and unit assembly to engage in reverse engineering projects such as printed circuit board repair testing, repairs, duplication, and circuit diagram restoration. Additionally, we perform over 2,000 overhauls annually, which are beneficial for preventing minor stoppages and addressing near-failure situations. We are currently showcasing successful cases of product life extension. Examples include "printed circuit boards for marine positioning equipment" and "printed circuit boards for conveyors." 【Featured Cases】 ■ A certain marine-related company: Printed circuit board for marine positioning equipment ■ A certain resin processing company: Printed circuit board for conveyors ■ A certain forestry-related company: Winch lever ■ A certain equipment maintenance company: Printed circuit board for combustion equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Board to Board Connectors
  • Substrate

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Leave the redesign and manufacturing of aging printed circuit boards to us!

Leave the redesign and manufacturing of aging printed circuit boards to us!

If you have the actual item, it's all good! We contribute to extending the life of equipment through advanced reverse engineering technology.

Tsuda Manufacturing Co., Ltd. has been providing repair and life extension services for industrial machinery and commercial equipment, primarily focusing on circuit board repairs, since its establishment in 1972, with a motto of "short delivery times" and "high quality" for over 50 years. Please leave the redesign and production of aging printed circuit boards to Tsuda Manufacturing! If you have the physical item, that's enough! No need for circuit diagrams or Gerber data. With our advanced reverse engineering technology, we can restore circuit boards and, in some cases, create equivalent function circuit boards, contributing to the longevity of your equipment. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Circuit board design achievements

Circuit board design achievements

Numerous design experiences, including automotive boards, amusement development boards, transportation equipment boards, and IC evaluation boards!

We provide high-quality pattern design tailored to our customers' needs at a low cost. We have extensive experience in designing various types of boards, including automotive boards, video equipment boards, image processing boards, amusement development boards, LCD panel boards, transportation equipment boards, audio equipment boards, measurement equipment boards, computer peripheral boards, and IC evaluation boards. Please feel free to consult us when you need our services. 【Design Achievements】 ■ Automotive boards, video equipment boards, image processing boards, amusement development boards ■ LCD panel boards, transportation equipment boards, audio equipment boards, measurement equipment boards ■ Computer peripheral boards, IC evaluation boards, high-speed communication boards, medical device boards ■ Home appliance boards, power supply boards, lighting equipment boards, high-frequency boards *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Special substrate

Special substrate

We have various design achievements such as thick copper foil substrates, high aspect ratio substrates, and copper inlay substrates!

At Arcel Design, we also accommodate special substrates. We have design achievements in through resin-filled substrates, IVH substrates, thick copper foil substrates, high-frequency substrates, high-aspect substrates, back-drill substrates, copper-inlay substrates, and build-up substrates. Please feel free to consult us when you need assistance. 【Design Achievements (Partial)】 ■ Through resin-filled substrates ■ IVH substrates ■ Thick copper foil substrates ■ High-frequency substrates ■ High-aspect substrates *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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High-frequency substrate

High-frequency substrate

High-frequency substrate

For high-frequency substrates (with proven results above 24GHz) and high-speed transmission substrates (with proven results above 40Gbps), we can accommodate proposals for layer composition and materials (MEG6) considering the components mounted on the substrate and their density.

  • others
  • Substrate

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High-density substrate

High-density substrate

High-density substrate

We will propose and accommodate ultra-high-density designs, such as setting the space between components like CR to 0.3mm, using through-hole substrates, build-up/IVH, and through resin filling specifications.

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  • Substrate

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Single-sided board

Single-sided board

Single-sided circuit board

We have many achievements with single-sided boards in mass-produced substrates for people's livelihoods.

  • others
  • Substrate

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Power supply board

Power supply board

Power supply board

We have experience in supporting various power supply boards. We can offer suggestions such as high thermal conductivity copper inlays, thermal analysis, and thick copper boards.

  • others
  • Substrate

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Flexible circuit board

Flexible circuit board

Flexible circuit board

We can accommodate everything from single-sided flexible printed circuit boards to multi-layer flexible printed circuit boards, including assembly.

  • others
  • Substrate

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BGA conversion board

BGA conversion board

BGA conversion board

In cases where you want to replace a BGA, it is possible to create a conversion board and design a BGA board that mounts a different BGA on the board.

  • others
  • Substrate

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Through-hole resin-filled substrate

Through-hole resin-filled substrate

Through-hole resin-filled substrate

This is a method of placing through vias on the pads of electronic components and filling the vias with paste to eliminate issues during the mounting of electronic components. It is effective in high-density designs and may be less expensive than IVH or build methods. It is used for narrow-pitch BGAs and similar components.

  • others
  • Substrate

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Back drill substrate

Back drill substrate

Back drill substrate

To eliminate stubs in high-speed signals, we will remove the unnecessary plating of the VIA using back drilling.

  • others
  • Substrate

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Copper-based substrate

Copper-based substrate

Copper-based substrate

You can achieve an even greater heat dissipation effect. We can provide a quote including manufacturing as well.

  • others
  • Substrate

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Narrow pitch BGA substrate (0.25mm/0.3mm/0.4mm, etc.)

Narrow pitch BGA substrate (0.25mm/0.3mm/0.4mm, etc.)

Narrow pitch BGA substrate (0.25mm/0.3mm/0.4mm, etc.)

We have a wealth of experience in designing narrow pitch BGA mounted boards. Regarding board manufacturing, we will select and propose manufacturers that are capable of production.

  • others
  • Substrate

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Prototype and assembly achievements of printed circuit boards related to measuring devices.

Prototype and assembly achievements of printed circuit boards related to measuring devices.

We would like to introduce our achievements in the production of printed circuit boards related to measuring instruments. *For waterproof and dustproof measures for mounted boards!

Our company has a track record in the production of circuit boards for various measuring instruments and other LCD assembly. Tojo Manufacturing offers one-stop total solutions from prototype printed circuit boards to final assembly. If you are facing issues with delivery times or quality, please feel free to consult with us. [Achievements] ■ Production of circuit boards for various measuring instruments ■ Other LCD assembly, etc. *For more details, please refer to the external link page or feel free to contact us.

  • Printed Circuit Board
  • Processing Contract
  • Substrate

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Prototype and assembly achievements of printed circuit boards related to industrial equipment.

Prototype and assembly achievements of printed circuit boards related to industrial equipment.

We would like to introduce our achievements in the production of printed circuit boards related to industrial equipment. *For waterproof and dustproof measures for mounted boards!

We have manufactured control boards for resin processing machines and crimping machines. At Tojo Manufacturing, we offer one-stop total solutions from prototype printed circuit boards to final assembly. If you are facing issues with delivery times or quality, please feel free to consult us. 【Features】 ■ Manufactured control boards for resin processing machines and crimping machines *For more details, please visit the external link page or feel free to contact us.

  • Printed Circuit Board
  • Processing Contract
  • Substrate

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What is black potting for waterproofing measures (equivalent to IP67) of the implementation substrate?

What is black potting for waterproofing measures (equivalent to IP67) of the implementation substrate?

Protects the circuit board from external humidity, rain, and wind! A black resin potting with a high hardness of 76 that does not stress the circuit board!

If waterproofing is necessary, if you want to protect the circuit board from vibrations, or if you are concerned about the reduced lifespan of the mounted circuit board due to dirt, resin potting is recommended. Among them, black potting has a high hardness of 76, but it is a processing method that contributes to waterproofing (equivalent to IP67), dustproofing, and explosion-proofing without putting stress on the circuit board. 【Features of Black Potting】 ■ High hardness of 76, but does not stress the circuit board ■ Excellent waterproofing (equivalent to IP67), dustproofing, explosion-proofing, and earthquake resistance ■ No limits on the work size for resin potting Regardless of the size of the circuit board, feel free to consult us, and prototype support is also possible. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Coating Agent
  • Substrate

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PuriKen Co., Ltd. Printed Circuit Board Resin Filling

PuriKen Co., Ltd. Printed Circuit Board Resin Filling

After drilling, there is a process of resin filling and lid plating following copper plating!

Our company performs "resin filling" using process equipment. Conductive metal and non-conductive non-metal pastes are applied to the surface of the substrate, and after being embedded in the holes, they are printed using a screen plate. By overheating and curing the resin, and then performing lid plating after polishing, a flat surface is achieved. 【Process】 1. Drilling 2. Copper plating 3. Resin filling 4. Lid plating *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Puriken Co., Ltd. Printed Circuit Board Cost

Puriken Co., Ltd. Printed Circuit Board Cost

Appropriate layer structure and material selection! If it leads to mass production, consider the specifications of the mass production factory.

We would like to introduce "cost," which is a key point in our design. The number of boards is determined while satisfying physical conditions, considering efficient area and shape. We select appropriate layer composition and materials to avoid being over-spec. We aim to make the line and space as large as possible, while keeping the board thickness/hole diameter (aspect ratio) as small as possible. 【Features】 ■ Considers efficient area and shape while satisfying physical conditions ■ Takes into account usage and specifications ■ If it leads to mass production, considers the specifications of the mass production factory *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Puriken Co., Ltd. Printed Circuit Board EMC

Puriken Co., Ltd. Printed Circuit Board EMC

Ensure that the plain has a secured return path, a large opening, and check for any gaps!

We would like to introduce "EMC," which is a key aspect of our design. Check the component placement to ensure that the crystal is not located at the edge of the board, that the filter circuit is near the external IF, and that the damping resistor is placed close to the output pin. Also, verify the position of the termination resistor and the placement of the bypass capacitor. For wiring, confirm that high-speed signal lines are not routed to the edge of the board, and route high-speed signals and bus lines as much as possible in the inner layers. 【Features】 ■ Plain ■ Component placement ■ Wiring *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Puriken Co., Ltd. Printed Circuit Board Design Department Structure

Puriken Co., Ltd. Printed Circuit Board Design Department Structure

As a substrate manufacturer, we can design with manufacturing standards in mind!

We would like to introduce our design department structure. We can handle customer projects in various fields such as high-speed digital, analog, power supply, and antennas (design provided by the customer). By using characteristic impedance calculation tools and feedback from the manufacturing department, we can achieve highly accurate impedance matching design. 【Features】 ■ Capable of handling customer projects in various fields such as high-speed digital, analog, power supply, and antennas (design provided by the customer) ■ As a circuit board manufacturer, we can design with manufacturing standards in mind ■ Capable of impedance matching design ■ For large-scale circuit boards or projects requiring simulation, we collaborate with partner companies *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Delivery in as short as 1 day. A production system that meets development needs.

Delivery in as short as 1 day. A production system that meets development needs.

Quickly respond to the needs of customers in the development department who demand an early release with a short turnaround time!

We would like to introduce the production system of Puriken Co., Ltd. The number of orders received in a month ranges from 1,500 to 2,000 items. The average time from order to delivery is 2 to 3 days. In the fastest cases, delivery can be made on the same day the order is received. What makes this possible is our one-stop system, which allows for consistent in-house production from design to manufacturing. Since all processes can be completed in-house, we can deliver products without any time lag. 【Features】 ■ Accommodates a variety of products ■ Delivery in as little as 1 day ■ Orders accepted from a single circuit board *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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New value in services such as tracking systems and factory tours.

New value in services such as tracking systems and factory tours.

We are utilizing it for technical training, new employee training, and social studies education in local schools!

At Puriken Co., Ltd., we are committed not only to product development and manufacturing but also to service development and provision. We have implemented our unique traceability system, "Shinchoku-kun," which allows us to track in real-time the stage of the ordered product within 10 to 20 different processes. Additionally, to provide information about our advanced equipment and manufacturing processes, we conduct factory tours both online and offline. 【Features】 ■ Supports a variety of products ■ Delivery in as little as 1 day ■ Orders accepted from just one circuit board *For more details, please refer to the related links or feel free to contact us.

  • Production Scheduler
  • Substrate

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