We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. 共栄電資 Tokyo//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 null/null
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Substrate Product ranking

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. Busbar for Data Centers - High Current Board 共栄電資
  2. FPC for the space industry 太洋テクノレックス 本社　和歌山
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  5. 5 CAN/CANFD communication is possible with the sequencer! CANNEX サンプロシステム

Substrate Product List

1711～1740 item / All 1948 items

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High heat-resistant, low-loss flexible substrate for IoT devices

High heat-resistant, low-loss flexible substrate for IoT devices

Flexible substrate that contributes to power saving of IoT devices with high heat resistance and low loss.

In the IoT device industry, there is a demand for miniaturization while simultaneously extending battery life. Particularly in devices that operate in high-temperature environments or use high-frequency signals, the performance of the substrate significantly impacts the overall power efficiency of the device. Conventional substrates have sometimes hindered power saving due to issues with high-frequency signal loss and heat resistance. Our high-heat-resistant, low-loss flexible substrate contributes to the power efficiency of IoT devices with its low-loss characteristics and high heat resistance. 【Usage Scenarios】 - Wearable devices - Smart sensors - Industrial IoT equipment 【Benefits of Implementation】 - Extended battery life - Miniaturization of devices - Stable transmission of high-frequency signals

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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High heat-resistant, low-loss flexible substrate for home appliances

High heat-resistant, low-loss flexible substrate for home appliances

A flexible substrate that achieves slim, high-performance home appliances with high heat resistance and low loss.

In the home appliance industry, there is a simultaneous demand for thinner and higher-performance products. To maintain high performance within limited space, it is important to miniaturize the circuit board and reduce the loss of high-frequency signals. Our high heat-resistant, low-loss flexible circuit boards contribute to the improvement of home appliance performance by achieving thinness while providing high heat resistance and low loss characteristics. 【Application Scenarios】 - Thin televisions - Smartphones - Wearable devices 【Benefits of Implementation】 - Miniaturization of products - Reduction of high-frequency signal loss - Improvement of product reliability

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

By using a special manufacturing method, it is possible to produce substrates with a copper thickness of up to 400μ.

When a standard thickness of 18μ copper foil carries a large current, it can generate high heat and, in some cases, may even break, which is very dangerous. Such substrates can be addressed by increasing the thickness of the copper foil, and K2 Corporation can manufacture substrates with thicknesses ranging from 35μ to 105μ using standard substrate manufacturing methods. Furthermore, by employing special manufacturing techniques, it is possible to produce substrates with a maximum copper foil thickness of 400μ. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board
  • Substrate

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Latest comprehensive catalog of a substrate specialty manufacturer 【*Includes 3 case studies!】

Latest comprehensive catalog of a substrate specialty manufacturer 【*Includes 3 case studies!】

What is the secret behind achieving ultra-short delivery times for special substrates? Limited free sample giveaway!

At K2, a manufacturer specializing in printed circuit boards, we have all the manufacturing equipment necessary for PCB production fully equipped in-house. By operating this equipment at 100%, we achieve shorter delivery times and lower costs for special PCBs and medium-lot products, which are difficult for prototype manufacturers to handle. We address five key issues in the PCB manufacturing industry: inability to accommodate ultra-short delivery times, excessively high initial costs for flexible PCBs, being turned down for inquiries about special PCB manufacturing, inability to meet short delivery times for medium-lot production, and concerns about PCB quality. *Exclusive to Ipros users! We are currently offering samples of rigid-flex PCBs and double-sided flexible PCBs! Please contact us during this opportunity. (Limited quantities available) [Case Studies] - Resin filling (Pad on Via holes) specification ⇒ Where outsourcing would typically require an extra 3 days, we can accommodate it in 1 day! - Double-sided flexible PCBs ⇒ Achieved shorter delivery times and reduced initial costs by using laser processing instead of molds for shape processing! - 4-layer rigid-flex PCBs (without reinforcement) ⇒ Typically 7 days, expedited response in 6 days! *For more details, please contact us or download our catalog to view.

  • Printed Circuit Board
  • Substrate

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We do not refuse! Responding to various circuit boards with short delivery times! *Exhibiting at Nepcon.

We do not refuse! Responding to various circuit boards with short delivery times! *Exhibiting at Nepcon.

Various types of substrates can be manufactured, including rigid substrates, flexible substrates, build-up substrates, rigid-flex substrates, and special substrates!

K2 has all the necessary equipment for circuit board manufacturing in-house, allowing us to complete all processes without relying on outsourcing. K2 does not turn down requests for specialized circuit board manufacturing, even those that require high processing technology and precision. For complex projects that have been rejected by other companies, we leverage our established track record and know-how to find unique solutions. 【Features】 ◆ Flexible response to detailed customer requests ◆ Thorough data checks contribute to reduced lead times and costs ◆ Short lead times achievable through in-house integrated production and strict deadline management *For more details, please refer to our materials. Feel free to contact us. 【Exhibition Information】 We will be exhibiting at Nepcon Japan from January 22 (Wednesday) to January 24 (Friday), 2025! Booth: East Hall 2 E10-36. We look forward to your visit!

  • Printed Circuit Board
  • Substrate

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Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

Introducing technology for improving V-cut position accuracy! High-precision V-cut method using CCD.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm through improvements in V-cut and pattern positioning. The pattern formation is made possible by the LDI (Laser Direct Imaging) method, and the V-cut is achieved using a high-precision V-cut method with CCD. We enhance hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling equipment and X-ray measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Flat plugs (pad-on-via) allow for mounting on through-holes ○ Landless through-holes enable compatibility with narrow pitch patterns ○ Ultra-fine printing is possible (1 character: vertical 0.28 × horizontal 0.15 mm) Please contact us for more details.

  • Printed Circuit Board
  • Substrate

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Technical Introduction: "Zaguri (COB Technology)"

Technical Introduction: "Zaguri (COB Technology)"

Introducing the boring technique! It is possible to perform boring to lower the height of the LSI.

Sato-sen Co., Ltd.'s router machines are equipped with Z-axis sensors that measure the thickness of the board and perform machining from the top surface, enabling high-precision counterboring. This allows for the embedding of LSI through cavity processing for die bonding. 【COB Technology Features】 ○ Providing reliable and stable COBs → Strict quality control by experienced engineers from a company that has emerged from the plating industry ○ Proven track record from COB development to mass production ○ Even when leads cannot be drawn due to gold plating for electro-bonding in design, unique lead-free electro-bonding gold plating is possible ○ Equipped with bonding machines and pull-cut testers in-house, ensuring a quality assurance system through various chemical analyses, SEM, etc. For more details, please contact us.

  • Printed Circuit Board
  • Substrate

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Technical Introduction: "LED Brightness (High Brightness and Heat Dissipation Technology)"

Technical Introduction: "LED Brightness (High Brightness and Heat Dissipation Technology)"

Introducing LED brightness enhancement technology! It enables improved reflectivity and reduced junction temperature.

At Sato-Sen Co., Ltd., we have methods to improve the brightness of LEDs. One method involves enhancing the reflectivity, which can be achieved through the substrate, plating, and solder resist. Another method is to lower the junction temperature of the LED, which can be accomplished through pattern design, selection of heat dissipation materials, and setting conductor thickness. Additionally, it is also possible to improve brightness with our unique substrate shape. 【Features】 - Outer shape processing can be done through V-cut, routing, and press processing. - Thermal vias filled with copper paste allow for heat dissipation through through-holes. - Heat dissipation can also be achieved with heat sink pins inserted into through-holes. For more details, please contact us.

  • Printed Circuit Board
  • Substrate

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Technical Introduction: "Implementation Technology"

Technical Introduction: "Implementation Technology"

Introducing the implementation technology of printed circuit boards! Measures against poor solder wetting during assembly.

At Sato-Sen Co., Ltd., we are implementing pattern designs that are easy to assemble at the design stage as a measure to improve yield in general printed circuit board assembly. Additionally, to enhance yield in flip chip assembly, we are forming dams using film solder resist, which is effective in preventing solder shorts at C4 and ensuring package parallelism. [Factors Contributing to Poor Solder Wetting] - The increase in alloy layers with lead-free solder, and the presence of black pads due to the nickel layer in flash gold plating are considered potential causes. ⇒ In lead-free solder, managing the composition and temperature of the solder bath is crucial. ⇒ For flash gold plating, proper management of the pre-treatment and nickel bath solution is essential. For more details, please contact us.

  • Printed Circuit Board
  • Substrate

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Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics.

Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics.

Pre-sintering processing is also possible! We have a proven track record in a variety of ceramic processing, including alumina, zirconia, and 99.8% high-purity fused silica molded products.

Our company offers "ceramics contract processing," where we handle molding, processing, and firing in-house. We can process various ceramics such as alumina, zirconia, and magnesia. In addition to post-firing processing, we also perform pre-firing processing, which helps prevent cracking and chipping due to thermal expansion and post-molding processing. Currently, we are offering a comprehensive catalog of ceramic products! It includes a wide range of ceramic products, starting from dense products like alumina and zirconia to 99.8% high-purity fused silica molded items. Furthermore, the catalog provides information on the types of ceramics, purity, and characteristics based on molding methods, making it useful for property comparison and selection! 【Points for Choosing Maruwai】 ◆ All contract molding, processing, and firing are handled in-house ◆ High purity with excellent heat resistance and thermal shock resistance ◆ Superior durability ◆ Capable of accommodating various shapes from large to small ◆ Wide-ranging support for pressing, CIP, casting, extrusion molding, and machining ◆ We also develop raw materials in-house, allowing us to propose suitable materials based on applications and needs *Please view the Maruwai Ceramics Comprehensive Catalog PDF available for download.

  • Ceramics
  • Substrate

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Face's Wisdom Bag: "Points to Note When Releasing Materials (3)"

Face's Wisdom Bag: "Points to Note When Releasing Materials (3)"

We will propose points of caution and countermeasures from the perspective of the manufacturing site regarding material shipment.

This item introduces precautions for parts shipping (parts packaging) and examples that may lead to manufacturing defects. *For more details, please refer to the PDF document or feel free to contact us.

  • EMS
  • Substrate

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BeagleBone Black PoE/PSE board

BeagleBone Black PoE/PSE board

You will be able to use PoE devices such as network cameras in a solar/battery environment.

Texas Instruments Linux/ARM system: By using the BeagleBone Black board in conjunction with the battery charger circuit board OELBBBPWR01, it becomes possible to utilize PoE devices such as network cameras in solar/battery environments. This device (OELBBBPoE01) provides the functionality of PSE (Power Sourcing Equipment) for PoE (Power over Ethernet).

  • Embedded Board Computers
  • Substrate

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Solar/Battery Charger Board for BeagleBone Black

Solar/Battery Charger Board for BeagleBone Black

The BeagleBone Black can be used in indoor and outdoor areas without power supply. It is convenient when used in conjunction with a mobile router.

This product is a battery charger circuit board for operating the Texas Instruments Linux/ARM system: BeagleBone Black board with battery/solar power. It is convenient to use this product (OELBBBPWR01) in conjunction with a mobile router and LAN hub. It enables a cable-free operation of the BeagleBone Black without the need for power lines or communication lines, allowing for use in areas without electricity. By combining this product with the BeagleBone Black, various IoT devices can be easily and inexpensively realized. Please mount this product (OELBBBPWR01) on the 46-pin expansion connector of the BeagleBone Black board. Additionally, you can charge a mobile phone from this product via the Micro USB connector (5V). By using this product, you can charge a mobile phone from a battery or solar panel during a disaster.

  • Embedded Board Computers
  • Other embedded systems (software and hardware)
  • Other environmental analysis equipment
  • Substrate

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High-strength alumina substrate for thin films

High-strength alumina substrate for thin films

Ideal for thin film circuit formation! JFC's unique alumina substrate with high strength, high purity, and excellent planar smoothness.

The high-strength alumina substrates for thin films manufactured by our company feature a dense and smooth surface achieved through the use of fine and uniform raw powder, making them suitable for the formation of fine thin film circuits. Due to their high purity and bending strength, they are resistant to cracking even when the substrates are made thin, and they excel in handling, contributing to the miniaturization and thinning of the substrates. They are increasingly being adopted for temperature sensors and chip resistors.

  • High frequency/microwave parts
  • Fine Ceramics
  • Substrate

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I2C_4SENSOR board (VL53L0X shield)

I2C_4SENSOR board (VL53L0X shield)

This is an introduction to the shield board that reads values from the VL53L0X laser distance sensor.

The "I2C_4SENSOR board (VL53L0X shield)" is a shield board that connects to the Arduino Uno (R3) and reads values from the VL53L0X laser distance sensor. Since it communicates via I2C, it saves I/O pins, and up to four VL53L0X laser distance sensors can be connected. We have connection records for the "VL53L0X Time-of-Flight distance sensor module" and "Pololu VL53L0X Time-of-Flight distance sensor module" sold by SWITCHSCIENCE. 【Features】 ■ Saves I/O pins due to I2C communication ■ Up to four VL53L0X laser distance sensors can be connected *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Substrate

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Attention fuel cell manufacturers! A specialized manufacturer of high-performance ceramic substrates.

Attention fuel cell manufacturers! A specialized manufacturer of high-performance ceramic substrates.

We will manufacture zirconia ceramic substrates with toughness and ionic conductivity in a thin form.

Utilizing the toughness of "bendable ceramic substrates," we offer them as "next-generation ceramic substrates," enhancing their value as components. Bendable zirconia Ultra-thin zirconia ceramic substrate Zirconia possesses strong toughness (characteristics). By combining it with the manufacturing technology of ultra-thin ceramic substrates from a specialized high-performance ceramic substrate manufacturer, we can achieve bendability while maintaining its ceramic nature. The ultra-thin ceramic substrate (thickness: 50μm) also has transparency, offering possibilities such as achieving thinner substrate layers.

  • Fine Ceramics
  • Substrate

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Business Introduction: Printed Circuit Board Manufacturing

Business Introduction: Printed Circuit Board Manufacturing

In-house integrated production of printed circuit boards is possible! Introducing the features of the boards, such as the number of layers and maximum size!

We would like to introduce our "Printed Circuit Board Manufacturing." The characteristics of the boards include a thick electroplated gold finish of 0.5 to 1.0 μm, layer counts from single-sided to 30 layers, a maximum size of 670×590 mm, board thickness ranging from 0.1 to 5.0 mm, and a minimum hole diameter of Φ0.1. Additionally, we have manufacturing equipment that allows for in-house integrated production of printed wiring boards. 【Board Characteristics】 ■ Thick electroplated gold finish: 0.5 to 1.0 μm ■ Layer count: single-sided to 30 layers ■ Maximum size: 670×590 mm ■ Board thickness: 0.1 to 5.0 mm ■ Minimum hole diameter: Φ0.1 ■ UL certified substrate ■ Special boards ・IVH boards, blind hole boards ・Controlled characteristic impedance boards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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【Exhibition Participation】Unique technology that enables fine processing of printed circuit boards.

【Exhibition Participation】Unique technology that enables fine processing of printed circuit boards.

We will propose solutions tailored to your technical needs! We will respond with our unique technology for fine and thin plate processing, as well as hole processing.

【Exhibition Overview】 38th Nepcon Japan - Electronics Development and Implementation Exhibition - Exhibition Name: 24th Printed Circuit Board EXPO Dates: January 24, 2024 [Wed] to January 26, 2024 [Fri] 10:00 AM to 5:00 PM Venue: Tokyo Big Sight Booth Number: E27-37 At our booth, we will showcase cavity substrates suitable for various sensor devices, ultra-thin high-density substrates with a thickness of 0.0mm, via diameter of Φ0.04mm, and positional accuracy of ±0.025mm that enhance the performance of advanced electronic devices, as well as MSAP high-density substrates with a pattern width of 0.01mm and pattern spacing of 0.025mm achieved through selective plating methods. 【Exhibited Products】 ■ Thin high-density substrate processing technology ■ Cavity substrates ■ MSAP method We will be available for consultations at the technology, quality, and procurement booth. Please feel free to stop by. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Substrate

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Mini-ITX motherboard for industrial machinery integration 'MIX-H810WV1'

Mini-ITX motherboard for industrial machinery integration 'MIX-H810WV1'

Achieves high-speed computation and stability. An industrial Mini-ITX motherboard that can be smoothly integrated into NC devices, control panels, and automated processing equipment.

The industrial Mini-ITX motherboard 'MIX-H810WV1' is designed with a focus on the required "stable operation," "high-speed response," and "long-term supply" for control systems in working machinery. By adopting the latest Intel Core Ultra 200S series, it can comfortably handle complex interpolation calculations and high-speed communication with peripherals. It is equipped with specifications that support high-speed processing for control applications, including up to 96GB of DDR5 memory, PCIe Gen5 x4, and M.2 NVMe. Standard I/O includes USB3.2, 2.5GbE x2, serial x4, and DIO, ensuring connectivity with on-site PLCs, sensors, and display devices, and it serves as a central controller for NC devices and automation equipment. It supports DC 12-24V input and operates within a temperature range of 0-60°C, demonstrating robustness suitable for installation inside machinery.

  • Embedded Board Computers
  • Substrate

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High board thickness and narrow pitch printed circuit board manufacturing technology.

High board thickness and narrow pitch printed circuit board manufacturing technology.

High-precision FiTT method! Achieving further high multilayer and high board thickness areas for narrow pitch BGA compatible boards.

We would like to introduce our "High Board Thickness and Narrow Pitch Printed Circuit Board Manufacturing Technology." Based on the FiTT method, we promote high-precision technology to achieve narrow pitch printed circuit boards in the realm of high multilayer and high board thickness. Main applications include semiconductor tester boards, load boards, socket boards, and probe cards. 【Features】 ■ High-precision FiTT method enables narrow pitch BGA compatible boards in high multilayer and high board thickness areas. ■ Supports 0.50mm pitch BGA with a board thickness of 7.65mm and φ0.20 drill through processing. ■ Supports 0.25mm pitch BGA with ultra-small diameter φ0.10 drill processing. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High-frequency compatible printed circuit board

High-frequency compatible printed circuit board

A printed circuit board that balances performance and cost! Correlated high-precision transmission line modeling.

We support the development of high-frequency substrates from materials, processes, and design. High-precision transmission line modeling correlated with in-house manufactured substrates. We can provide materials, treatments, and processes tailored to your applications. We offer printed circuit boards that balance performance and cost in a one-stop solution, so please feel free to contact us with your requests. 【Features】 ■ Manufacturing process compatible with high frequency - We propose suitable materials from the perspective of performance and cost - Improvement of characteristics through high-precision back drilling - 20% reduction in loss at 14GHz with changes to solder resist only ■ Support for chemically bonded surface treatments *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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LED signal lamp circuit board unit MR2505-160ABG 250φ blue-green

LED signal lamp circuit board unit MR2505-160ABG 250φ blue-green

Wide-angle ultra-high brightness signal light circuit board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit, 'MR2505-160ABG', which we handle. It has been a best-selling product for over 10 years as a specialized manufacturer of LED signal light circuit board units. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Supply Voltage: AC100V ■ Dimensions: 280mm square ■ Inner Diameter: 250φ ■ Number of LEDs: 160 ■ Emission Color: Cyan *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights
  • Substrate

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LED signal light circuit board unit 'MR2505-160AR' 250φ red

LED signal light circuit board unit 'MR2505-160AR' 250φ red

Wide-angle ultra-high brightness signal light circuit board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit 'MR2505-160AR' that we handle. It is a best-selling product from a manufacturer specializing in LED signal light circuit board units for over 10 years. Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Supply Voltage: AC100V ■ Dimensions: 280mm square ■ Inner Diameter: 250φ ■ Number of LEDs: 160 ■ Emission Color: Red *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights
  • Substrate

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LED signal light circuit board unit 'MR180-120AGR' two-color display

LED signal light circuit board unit 'MR180-120AGR' two-color display

Wide-angle ultra-high brightness signal light board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit 'MR180-120AGR' that we handle. It is a best-selling product from our company, which specializes in LED signal light circuit board units for over 10 years. Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Supply Voltage: AC100V ■ Board Dimensions: 180mm square ■ Used LEDs: 5φ LEDs in red and cyan 60 pieces each in alternating arrangement, independent dual circuit *For more details, please refer to the PDF materials or feel free to contact us.

  • Signal lights and rotating lights
  • Substrate

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LED signal light circuit board unit 'MR1105-24CR' 110φ red

LED signal light circuit board unit 'MR1105-24CR' 110φ red

Wide-angle ultra-high brightness signal lamp circuit board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit, 'MR1105-24CR', which we handle. It is a best-selling product that has been in the market for over 10 years as a specialized manufacturer of LED signal light circuit board units. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Supply Voltage: DC24V ■ Dimensions: 135mm square ■ Inner Diameter: 110φ ■ Number of LEDs: 80 ■ Emission Color: Red *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights
  • Substrate

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LED signal light circuit board unit 'MR1505-100AY' 150φ yellow

LED signal light circuit board unit 'MR1505-100AY' 150φ yellow

Signal lamp circuit board unit equipped with a wide-angle, ultra-high brightness 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit, 'MR1505-100AY'. This is a best-selling product from our company, which has been a specialized manufacturer of LED signal light circuit board units for over 10 years. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Supply voltage: AC100V; a DC24V version is also available. ■ Dimensions: 180mm square ■ Inner diameter: 150φ ■ Number of LEDs: 100 ■ Emission color: Yellow *For more details, please download the PDF or feel free to contact us.

  • Signal lights and rotating lights
  • Substrate

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LED signal lamp circuit board unit 'MR1505-100AR' 150φ red

LED signal lamp circuit board unit 'MR1505-100AR' 150φ red

Signal lamp circuit board unit equipped with wide-angle, ultra-high brightness 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit, 'MR1505-100AR', which we handle. It is a best-selling product from a specialized manufacturer of LED signal light circuit boards for over 10 years. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Supply Voltage: AC100V (DC24V version is also available separately) ■ Dimensions: 180mm square ■ Inner Diameter: 150φ ■ Number of LEDs: 100 ■ Emission Color: Red *For more details, please download the PDF or feel free to contact us.

  • Signal lights and rotating lights
  • Substrate

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PLC to microcontroller board!

PLC to microcontroller board!

When replacing a PLC with a microcontroller board, definitely come to us!

Overseas, we specialize in injection molding machine controllers, while domestically, we focus on OEM business. As a past example, we worked on replacing a major manufacturer's PLC with a microcontroller board. During that process, we started with ladder diagram analysis and successfully completed the product. Our customer was delighted and exclaimed, "Can you really do that?!" 【Our Strengths】 Having our own products for overseas markets allows us to achieve cost-effective products by using common components. We can handle everything from design to prototyping and mass production consistently. Of course, we are also flexible in accommodating just design or just prototyping.

  • Other process controls
  • controller
  • Circuit board design and manufacturing
  • Substrate

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Solving problems related to embedded systems software and hardware development.

Solving problems related to embedded systems software and hardware development.

We will develop embedded system software and hardware exclusively for your company! If you have any concerns regarding development, please feel free to consult with us!

Star Electronics develops custom software and hardware for embedded systems. We design and manufacture a complete set of various microcontrollers, analog and digital interfaces, sensor I/F, FPGA circuit design, HMI design, cases, and enclosures. Additionally, we can accommodate mass production, which eliminates the hassle of coordinating and placing orders with multiple vendors. Our development achievements with our own product, the "Controller for Injection Molding Machines," have provided reassurance and satisfaction, allowing us to design and develop control devices for various industries. 【Past Achievements】 - Electro-pneumatic regulator control controller - Control board for automatic door opening and closing in special buildings - Control controller for amusement game machines - Control board for HI cooking appliances - LED control board - Remote control for home appliances We have development achievements in various industries beyond those listed above. For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • EMS
  • controller
  • Substrate

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Power Supply Board Design Handbook for Medical Devices

Power Supply Board Design Handbook for Medical Devices

Know-how for power supply board design that supports the miniaturization of medical devices.

In the medical device industry, there is a simultaneous demand for miniaturization and high functionality. In particular, the design of power supply boards is crucial for packing many functions into a limited space. If the design of the power supply board is inadequate, issues such as noise and heat generation may arise, potentially compromising the reliability of the device. This document explains the key points of power supply board design to achieve miniaturization in medical devices. 【Usage Scenarios】 - Small and portable medical devices - Precision measurement instruments - Implantable medical devices 【Benefits of Implementation】 - Achieving both miniaturization and high performance of devices - Improved reliability through noise countermeasures - Shortened design periods and cost reduction

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • Substrate

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