Substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies

[Data] Shirutoku Report No. 10 #Metal Enclosure

How is a metal casing made? A brief introduction to processing methods and design techniques.

★★Shirutoku Report: Useful Information You Can Benefit From★★ Without further ado, I will talk about the metal enclosures I am currently involved in developing. There are various processing methods for creating metal enclosures, and the design approach changes depending on the processing method. This report briefly introduces the representative processing methods and design approaches for metal enclosures. [Contents] ■ Press bending processing ■ Deep drawing processing ■ Die casting *For more details, please refer to the PDF document or feel free to contact us.

Company：Wave Technology
Price：Other

Mold Design
Processing Contract
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[Information] Shirutoku Report No. 20 #Tips for Reducing PCB Costs

It is also possible to reduce high manufacturing initial costs! Here are some tips for reducing the cost of printed circuit boards.

★★Shirutoku Report: Useful Information You Should Know★★ Printed circuit boards (PCBs) are relatively expensive components among electronic devices, and depending on the quality of the design, the use of the board may change, which can impact costs. You might consider searching for inexpensive PCB manufacturers overseas and adopting them, but the factors that significantly affect the cost of printed circuit boards are "board structure/layer count" and "board size." This report focuses on "board size" and introduces tips for reducing PCB costs. [Contents] ■ Tips for Reducing Costs Based on Board Size *For more details, please refer to the PDF document or feel free to contact us.*

Company：Wave Technology
Price：Other

Printed Circuit Board
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[Information] Shirutoku Report No. 95 # Effective Components for Noise Countermeasures

I will talk about the noise countermeasures in the evaluation of power converters!

★★Shirutoku Report: Useful Information You Can Benefit From★★ The current task is the evaluation of "power conditioners" (hereinafter referred to as power conditioners). When we talk about "evaluation of power conditioners," there are various types of evaluations, but this time I would like to discuss the noise countermeasures implemented in our recent work. Please take a moment to read it. [Contents] ■ Causes of Noise Generation ■ Noise Countermeasure Component "Core (Core Material of the Coil)" *For more details, please refer to the PDF document or feel free to contact us.

Company：Wave Technology
Price：Other

Other electronic parts
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Transparent substrate "SPET"

Due to its reflow heat resistance of 180°C and high-temperature storage resistance of 120°C, it is suitable for soldering electronic components.

"SPET" is a highly heat-resistant and low-resistance transparent substrate that, despite being PET, enhances LED driving, increases the sensitivity of electrostatic switches, and improves antenna characteristics. The total light transmittance of the substrate is 90.0%, with a haze of 0.8, and it features fine wiring that is difficult to see. Additionally, the sheet resistance of the conductor is 0.95 mΩ/□, and the conductor thickness is 18 μm, making it suitable for use as a substrate. [Features] ■ High transparency substrate ■ Low resistance conductor ■ High heat-resistant substrate *For more details, please refer to the related links or feel free to contact us.

Company：シライ電子工業 SPET事業部
Price：Other

Printed Circuit Board
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What is SPET?

Tightly laminated resist, copper foil, adhesive layer, and PET! Introducing our transparent substrate.

"SPET" is a single-sided substrate made by laminating copper foil onto a PET base material. The base material thickness is 100μm/188μm, and the copper foil thickness is 12μm/18μm. It is a product that is tightly laminated with resist, copper foil, adhesive layer, and PET. Additionally, we also offer "SPET-MM," which has wiring that is nearly invisible. Please feel free to contact us when you need assistance. 【Features】 ■ High transparency flexible substrate ■ Low-resistance conductor due to copper foil lamination ■ Compatible with low-temperature soldering (180°C) *For more details, please refer to the related links or feel free to contact us.

Company：シライ電子工業 SPET事業部
Price：Other

Printed Circuit Board
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[Introduction to the Fair Process] Manufacturing/Assembly/Inspection/Packaging

The product, along with the instruction manual, is placed in a dedicated individual box and shipped directly to the customer's specified factory! Electrical testing can also be performed.

At Fair Co., Ltd., we perform harness processing, sheet metal assembly, and circuit board installation, among other tasks. We can also program and conduct electrical inspections, and in cases of high production volume, we create dedicated jigs to enhance production efficiency. Additionally, we handle projects that involve placing instruction manuals in dedicated packaging boxes along with the products and shipping them directly to the customer's specified factory. 【Other Process Examples (Excerpt)】 ■ Product Planning ■ CPU Firmware Design ■ Circuit Board Pattern Design ■ Component Procurement ■ Component Mounting *For more details, please refer to the related links or feel free to contact us.

Company：フェア
Price：Other

Other contract services
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Printed circuit board design high-frequency board

We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

Company：アレイ
Price：Other

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Rigid flex circuit impedance

We also accept prototyping and small lot production of rigid-flex PCBs from AW design at our array.

By combining rigid substrates with bendable flexible substrates, various layouts become possible.

Company：アレイ
Price：Other

Prototype Services
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Flexible printed circuit board (FPC) impedance control

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We can respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we manufacture high-performance flexible circuit boards with impedance control during the artwork design phase. We can also accommodate small lot production. Please feel free to consult with us.

Company：アレイ
Price：Other

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Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Solving the issues of prototype development for flexible PCBs with many limitations! We manufacture high-performance flexible PCBs!

We can respond to circuit board manufacturing and component mounting in as little as one working day each. Additionally, we manufacture high-performance flexible circuit boards with impedance control during artwork design. We also accommodate small lot production. 【We can also support the following specifications】 ■ Component mounting FPC (double-sided mounting, lead-free mounting, mounter/reflow, bare chip mounting) ■ Bonding processing with other boards using ACF (FPC + FPC, FPC + PBC, FPC + glass substrate, etc.) ■ Multi-layer FPC (supports 3 to 6 layers; double-sided mounting is also possible) ■ Fine pitch FPC (single-sided board... minimum L/S 12/30μm; double-sided board... minimum L/S 25/50μm) *For details, please request materials or view the PDF data from the download.

Company：アレイ
Price：Other

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Tokaishin'e Electronics Industry Multi-layer Circuit Board

We have a variety of products available to meet the diverse needs of our customers.

It is a substrate with copper foil on both sides and inside of a glass epoxy insulating board.

Company：東海神栄電子工業
Price：Other

Other services
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Daichang Electronics Flex-Rigid Circuit Boards

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

Company：大昌電子
Price：Other

Other network tools
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Daichang Electronics Build-Up Multilayer Circuit Board

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

Company：大昌電子
Price：Other

Other network tools
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Small lot for development! For automotive and power supply use. Thick copper substrate (high current substrate).

With a maximum copper thickness of 400μm, it is suitable for heat dissipation measures and power supply for power devices! It can also be formed on substrates such as transformers and motors.

Meito Electric's "Thick Copper Substrate (High Current Substrate)" is suitable for heat dissipation and current supply in heating devices used in automotive and power supply applications. By increasing the conductor (copper) thickness compared to the conventional 35μm, power circuits and control circuits can be formed on the same substrate. The creation of thick copper coil patterns allows for the construction of transformer circuits and motor circuits on the substrate. 【Substrate Specifications】 ■ Outer layer copper foil thickness: 70μm to 200μm ■ Inner layer copper foil thickness: 70μm to 400μm ■ High thermal conductivity resin: up to 8W/mK ■ Bonding: High thermal conductivity resin and copper, etc. ■ Number of layers: Proven from 2 layers to 10 layers (specifications to be discussed) ■ Copper plate: C1020 (oxygen-free) or C1100 (tough pitch) *For detailed information, please download the PDF or feel free to contact us.

Company：名東電産
Price：Other

Contract manufacturing
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High performance enhancement of thin film circuit boards for semiconductors.

Thin film circuit boards support the high performance of semiconductors.

In the semiconductor industry, as devices become more high-performance, substrates that allow for heat dissipation and high-density mounting are in demand. Particularly in the mounting of laser diodes and LEDs, fine circuit patterns and high thermal conductivity are crucial. Inappropriate substrates can lead to decreased device performance and shortened lifespan. Our thin-film circuit substrates apply film formation and thin-film processing technologies to achieve highly precise fine circuit patterns and excellent thermal conductivity. 【Application Scenes】 Laser Diode (LD) mounting substrates Light Emitting Diode (LED) mounting substrates Photodiode (PD) mounting substrates Optical communication (FTTx, data centers, mobile base stations) 【Benefits of Introduction】 Contributes to high performance of devices Achieves high reliability Contributes to miniaturization and high-density mounting of products

Company：Citizen Finedevice Co.,Ltd
Price：Other

Circuit board design and manufacturing
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Thin film circuit board for medical devices

Thin film circuit boards that contribute to the miniaturization of medical devices.

In the medical device industry, there is a demand for miniaturization and high-precision components. In particular, miniaturizing parts is a crucial challenge in order to pack many functions into limited space. Our thin-film circuit boards contribute to solving this challenge in the design of medical devices that require small, precise, and high-accuracy components. 【Application Scenes】 - Endoscopes - Portable diagnostic devices - Biometric sensors 【Benefits of Implementation】 - Miniaturization of devices - High-density mounting - High reliability

Company：Citizen Finedevice Co.,Ltd
Price：Other

Circuit board design and manufacturing
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Thin Film Circuit Board for Aerospace Applications

Thin film circuit boards that achieve weight reduction and high performance.

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. Particularly for electronic devices used in outer space or harsh environments, there is a demand for high reliability and durability while being compact and lightweight. Thin-film circuit boards have been developed to meet these requirements. 【Application Scenarios】 - Electronic devices for aircraft and spacecraft - Satellite-mounted equipment - Drones 【Benefits of Implementation】 - Improved fuel efficiency through weight reduction - Effective use of space through miniaturization - Increased longevity of devices due to high reliability

Company：Citizen Finedevice Co.,Ltd
Price：Other

Circuit board design and manufacturing
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Thin film circuit board for wearables

Thin film circuit boards that achieve high-density implementation. Contributes to miniaturization and high performance.

In the wearable device industry, there is a demand for both miniaturization and high performance. In particular, high-density implementation technology is essential to pack many functions into a limited space. Thin-film circuit boards have been developed to address this challenge. Our thin-film circuit boards achieve high-density implementation through high-precision fine circuit pattern formation technology, contributing to the miniaturization and high performance of wearable devices. [Use Cases] - Smartwatches - VR/AR devices - Healthcare devices [Benefits of Implementation] - Miniaturization of devices - Enhanced performance - Improved reliability

Company：Citizen Finedevice Co.,Ltd
Price：Other

Circuit board design and manufacturing
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Thin film circuit board for energy efficiency.

Contributing to energy efficiency with film formation technology and thin film processing technology!

In the energy industry, energy conservation and efficient power supply are required. In particular, high-performance electronic components are essential in fields such as solar power generation and energy storage systems. Thin-film circuit boards contribute to the miniaturization and high performance of devices in these systems, supporting improvements in energy efficiency. 【Usage Scenarios】 - Solar power generation systems - Energy storage systems - Power converters 【Benefits of Implementation】 - Enhanced device performance - Miniaturization of systems - Improved energy efficiency

Company：Citizen Finedevice Co.,Ltd
Price：Other

Circuit board design and manufacturing
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Thin Film Circuit Board for Measuring Instruments

Thin film circuit board contributing to the performance improvement of high-frequency measuring instruments.

In the high-frequency measurement instrument industry, accurate signal transmission and noise suppression are essential. Particularly in measurements within the high-frequency range, the dielectric properties of substrate materials and the precision of circuit patterns significantly influence the reliability of measurement results. Inadequate substrate or pattern design can lead to signal attenuation and reflection, hindering accurate measurements. Our thin-film circuit substrates contribute to the performance enhancement of high-frequency measurement instruments by using materials with high-precision fine circuit patterns and excellent thermal conductivity. 【Application Scenarios】 - High-frequency signal measurement - Testing of wireless communication devices - Development of radar systems - Evaluation of various sensors 【Benefits of Implementation】 - Improvement of high-frequency characteristics - Reduction of signal transmission loss - Enhanced noise resistance - Increased measurement accuracy

Company：Citizen Finedevice Co.,Ltd
Price：Other

Circuit board design and manufacturing
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ATE substrate

Leave the semiconductor inspection device substrate (ATE substrate) to Cygnus.

We manufacture ATE boards at a top-tier overseas manufacturer. We have numerous achievements in probe cards, performance boards, burn-in boards, and more. AW design support (domestic) is also available.

Company：シグナス
Price：Other

Printed Circuit Board
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Introduction of high-performance components for communications

We provide optimal solutions to solve our customers' challenges by leveraging our years of accumulated experience. If you have any difficulties, such as selecting products, please feel free to contact us.

【Products Handled】 ■ Various Boards ■ Environmentally Resistant SSDs ■ Mechanical Components ■ Microwave ■ Network

Company：アスコット
Price：Other

High frequency/microwave parts
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Liquid Flow Sensor Evaluation Kit 'EK-SLF3S-0600F'

Response speed < 20ms! Maximum flow rate is 2000ul/min for aqueous and hydrocarbon systems.

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLF3S-0600F'. The maximum flow rate is 2000ul/min (for aqueous and hydrocarbon fluids), with a response time of <20ms. The interface (connector) is I2C (6-pin Molex). Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLF3S-0600F ×1 ■ SLF3x mounting clamp ×1 ■ SCC1-USB sensor cable ×1 ■ Adapter cable for connecting from 6-pin connector to SCC1-USB sensor cable ×1 ■ 6-pin ribbon cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Flow Sensor
Evaluation Board
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[Development Case] Control Board for LED Near Ultraviolet Irradiation Device - [EOL Support]

Replacement design of embedded systems - Transition to a high-functionality microcontroller 1Chip that achieves stable supply and cost reduction.

By adopting overseas microcontrollers and FPGAs, we have implemented alternative board designs that achieve stable supply and high performance for customers facing increased component procurement risks due to changes in the global situation. While maintaining the conventional configuration, we have replaced it with a high-functionality microcontroller from a domestic manufacturer, eliminating the need for complex circuit designs and FPGA circuits. This allows us to break free from dependence on overseas components and significantly reduce component supply risks. Furthermore, by simplifying design changes and management burdens, we have achieved improved productivity and reduced total costs. We have realized stable supply to end users while enhancing product safety and market competitiveness through a consistent development process. Design engineers, procurement, and production management can solve on-site challenges and improve operational efficiency through our replacement design examples. Please feel free to contact us!

Company：倭技術研究所
Price：Other

Embedded system design service
Microcomputer
Embedded Board Computers
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[Example] RS232C to RS422 conversion board for currency exchange machines [EOL support]

Replacement Design for Embedded Systems - How to Expand Device Lineup by Maintaining Size and Signal Conversion -

With the expansion of the lineup of currency exchange machines, it became necessary to convert the existing RS232C signals to RS422 signals. However, due to constraints in the device housing, changing the board size was not possible. Therefore, we faced the challenge of improving signal conversion performance while maintaining the existing design by adding an RS422 conversion circuit to the current RS232C board. Our company first conducted detailed hearings with customers to optimize the circuit of the existing board, and then, after confirming the operation with a prototype RS422 conversion board, established a design that could be integrated without changing the board size. Furthermore, in addition to evaluating the board alone, we conducted verification of its incorporation into the device and confirmed that there were no issues with all specified operations. This enabled us to achieve the continued use of the existing design and high-reliability signal conversion, responding to the expansion of the currency exchange machine lineup. We would like design engineers, procurement, and production management to consider this case as an optimal solution that enhances product performance, production stability, and cost efficiency while overcoming the constraints of the device housing.

Company：倭技術研究所
Price：Other

Embedded system design service
EMS
Communications
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[Development Case] - Audio Encoder Control Board - [EOL Support]

Replacement design of embedded systems - Avoiding production interruption risks while maintaining quality and mass production capability.

By adopting overseas-made microcontrollers and FPGAs, we have implemented alternative board designs that ensure stable supply and high performance for customers facing increased component procurement risks due to changes in the global situation. While maintaining the conventional configuration, we have also redesigned the peripheral circuits to allow the implementation of pin-compatible microcontrollers from other manufacturers. This enables a second source in case the currently used microcontroller becomes difficult to obtain, ensuring stable supply to end users and improving product safety and market competitiveness through a consistent development process. Design engineers, procurement, and production management can solve on-site challenges and enhance operational efficiency through our replacement design examples. Please feel free to contact us!

Company：倭技術研究所
Price：Other

Embedded system design service
Microcomputer
Embedded Board Computers
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High Heat Resistance and Low Loss Flexible Substrate for 5G Communication

Flexible substrates with high heat resistance and low loss that support high-speed 5G communication.

In the 5G communication industry, substrates with excellent high-frequency characteristics are required to ensure stable high-speed data transmission. It is particularly important to minimize signal loss and maintain performance even in high-temperature environments. Conventional substrates may lead to issues with high-frequency signal loss and heat resistance, potentially resulting in decreased communication speeds and equipment failures. Our high-heat-resistant, low-loss flexible substrates achieve both low-loss characteristics and high heat resistance, contributing to the acceleration of 5G communication. 【Usage Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Reduction of high-frequency signal loss - Stable operation in high-temperature environments - Improvement in communication speed

Company：山下マテリアル
Price：Other

Printed Circuit Board
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High Heat Resistance and Low Loss All-LCP Flexible Substrate for 5G Communication

Flexible substrates with high heat resistance and low loss that support high-speed communication.

In the 5G communication industry, components with excellent high-frequency characteristics are required to achieve high-speed data transmission. It is particularly important to minimize signal transmission loss and ensure stable communication quality. Conventional substrates may face challenges with losses in the high-frequency range. Our high-heat-resistant, low-loss all-LCP flexible substrates utilize low dielectric constant materials to reduce losses of high-frequency signals, contributing to the acceleration of 5G communication. 【Application Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Stabilization of high-speed data communication - Reduction of signal loss - Improvement of communication quality

Company：山下マテリアル
Price：Other

Printed Circuit Board
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Aerospace-grade high heat-resistant, low-loss flexible substrate

Flexible substrates for aerospace applications that achieve both lightweight and high performance.

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. At the same time, high safety and reliability are required, making electronic components that can perform stably even in harsh environments crucial. Our high heat-resistant, low-loss flexible circuit boards are lightweight yet equipped with high heat resistance, low loss characteristics, and chemical resistance, meeting the stringent demands of aerospace applications. 【Application Scenarios】 * Aircraft * Space probes * Satellites * Electronic devices requiring weight reduction 【Benefits of Implementation】 * Improved fuel efficiency through weight reduction * Stable operation in harsh environments * High reliability * Increased design flexibility

Company：山下マテリアル
Price：Other

Printed Circuit Board
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High heat-resistant, low-loss flexible substrate for wearables

A flexible substrate that achieves both miniaturization and high performance without the use of adhesives.

As wearable devices continue to shrink in size, the enhancement of circuit board performance is essential. In particular, high-density implementation in limited space and high reliability are required. It is also important to accommodate high-temperature environments and high-frequency signals. Our high heat-resistant, low-loss all-LCP flexible circuit boards meet these challenges. 【Usage Scenarios】 - Smartwatches - VR/AR devices - Healthcare devices - Wearable sensors 【Benefits of Implementation】 - Compatibility of miniaturization and high performance - High reliability - Improvement of high-frequency characteristics

Company：山下マテリアル
Price：Other

Printed Circuit Board
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Substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies | IPROS GMS

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