We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Mar 18, 2026~Apr 14, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Mar 18, 2026~Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. 共栄電資 Tokyo//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office Tokyo//Ceramics
  4. 4 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 null/null

Substrate Product ranking

Last Updated: Aggregation Period:Mar 18, 2026~Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. Molded cast products [We propose the selection of resins tailored to the required characteristics]. 共栄電資
  2. Tokyo Machine and Tool Co., Ltd. Business Introduction 東京マシン・アンド・ツール
  3. High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Noda Screen Co., Ltd. Company Profile NODASCREEN CO.,LTD.

Substrate Product List

1651~1680 item / All 1931 items

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[Information] President's Blog December 2020

It provides a detailed explanation of "What is a Smith chart?" using diagrams and photos!

This document summarizes the president's blog of Wave Technology Co., Ltd., a "development design promotion business" that addresses the shortage of engineers, from December 4, 2020, to December 17, 2020. Starting with the announcement of the exhibition participation on December 4, 2020, "Following up on the previous announcement of our exhibition," and introducing "What is a Smith chart?" on December 8, 2020. In addition, we have published a wealth of useful information related to products and industries. Please take a moment to read it. [Contents] ■ December 4, 2020: Following up on the previous announcement of our exhibition participation. ~ Virtual Exhibition HYOGO! ~ ■ December 8, 2020: What is a Smith chart? ~ Let's visualize the Smith chart ~ ■ December 17, 2020: It's not just for engineers. Sales training can also be rapidly learned with Tech Sherpa. *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing
  • Substrate

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[Data] Shirutoku Report No. 10 #Metal Enclosure

How is a metal casing made? A brief introduction to processing methods and design techniques.

★★Shirutoku Report: Useful Information You Can Benefit From★★ Without further ado, I will talk about the metal enclosures I am currently involved in developing. There are various processing methods for creating metal enclosures, and the design approach changes depending on the processing method. This report briefly introduces the representative processing methods and design approaches for metal enclosures. [Contents] ■ Press bending processing ■ Deep drawing processing ■ Die casting *For more details, please refer to the PDF document or feel free to contact us.

  • Mold Design
  • Processing Contract
  • Substrate

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[Information] Shirutoku Report No. 20 #Tips for Reducing PCB Costs

It is also possible to reduce high manufacturing initial costs! Here are some tips for reducing the cost of printed circuit boards.

★★Shirutoku Report: Useful Information You Should Know★★ Printed circuit boards (PCBs) are relatively expensive components among electronic devices, and depending on the quality of the design, the use of the board may change, which can impact costs. You might consider searching for inexpensive PCB manufacturers overseas and adopting them, but the factors that significantly affect the cost of printed circuit boards are "board structure/layer count" and "board size." This report focuses on "board size" and introduces tips for reducing PCB costs. [Contents] ■ Tips for Reducing Costs Based on Board Size *For more details, please refer to the PDF document or feel free to contact us.*

  • Printed Circuit Board
  • Substrate

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[Information] Shirutoku Report No. 95 # Effective Components for Noise Countermeasures

I will talk about the noise countermeasures in the evaluation of power converters!

★★Shirutoku Report: Useful Information You Can Benefit From★★ The current task is the evaluation of "power conditioners" (hereinafter referred to as power conditioners). When we talk about "evaluation of power conditioners," there are various types of evaluations, but this time I would like to discuss the noise countermeasures implemented in our recent work. Please take a moment to read it. [Contents] ■ Causes of Noise Generation ■ Noise Countermeasure Component "Core (Core Material of the Coil)" *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Substrate

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Transparent substrate "SPET"

Due to its reflow heat resistance of 180°C and high-temperature storage resistance of 120°C, it is suitable for soldering electronic components.

"SPET" is a highly heat-resistant and low-resistance transparent substrate that, despite being PET, enhances LED driving, increases the sensitivity of electrostatic switches, and improves antenna characteristics. The total light transmittance of the substrate is 90.0%, with a haze of 0.8, and it features fine wiring that is difficult to see. Additionally, the sheet resistance of the conductor is 0.95 mΩ/□, and the conductor thickness is 18 μm, making it suitable for use as a substrate. [Features] ■ High transparency substrate ■ Low resistance conductor ■ High heat-resistant substrate *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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What is SPET?

Tightly laminated resist, copper foil, adhesive layer, and PET! Introducing our transparent substrate.

"SPET" is a single-sided substrate made by laminating copper foil onto a PET base material. The base material thickness is 100μm/188μm, and the copper foil thickness is 12μm/18μm. It is a product that is tightly laminated with resist, copper foil, adhesive layer, and PET. Additionally, we also offer "SPET-MM," which has wiring that is nearly invisible. Please feel free to contact us when you need assistance. 【Features】 ■ High transparency flexible substrate ■ Low-resistance conductor due to copper foil lamination ■ Compatible with low-temperature soldering (180°C) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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[Introduction to the Fair Process] Manufacturing/Assembly/Inspection/Packaging

The product, along with the instruction manual, is placed in a dedicated individual box and shipped directly to the customer's specified factory! Electrical testing can also be performed.

At Fair Co., Ltd., we perform harness processing, sheet metal assembly, and circuit board installation, among other tasks. We can also program and conduct electrical inspections, and in cases of high production volume, we create dedicated jigs to enhance production efficiency. Additionally, we handle projects that involve placing instruction manuals in dedicated packaging boxes along with the products and shipping them directly to the customer's specified factory. 【Other Process Examples (Excerpt)】 ■ Product Planning ■ CPU Firmware Design ■ Circuit Board Pattern Design ■ Component Procurement ■ Component Mounting *For more details, please refer to the related links or feel free to contact us.

  • Other contract services
  • Substrate

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Printed circuit board design high-frequency board

We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

  • others
  • Substrate

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Rigid flex circuit impedance

We also accept prototyping and small lot production of rigid-flex PCBs from AW design at our array.

By combining rigid substrates with bendable flexible substrates, various layouts become possible.

  • Prototype Services
  • others
  • Substrate

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Flexible printed circuit board (FPC) impedance control

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We can respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we manufacture high-performance flexible circuit boards with impedance control during the artwork design phase. We can also accommodate small lot production. Please feel free to consult with us.

  • others
  • Prototype Services
  • Substrate

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Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Solving the issues of prototype development for flexible PCBs with many limitations! We manufacture high-performance flexible PCBs!

We can respond to circuit board manufacturing and component mounting in as little as one working day each. Additionally, we manufacture high-performance flexible circuit boards with impedance control during artwork design. We also accommodate small lot production. 【We can also support the following specifications】 ■ Component mounting FPC (double-sided mounting, lead-free mounting, mounter/reflow, bare chip mounting) ■ Bonding processing with other boards using ACF (FPC + FPC, FPC + PBC, FPC + glass substrate, etc.) ■ Multi-layer FPC (supports 3 to 6 layers; double-sided mounting is also possible) ■ Fine pitch FPC (single-sided board... minimum L/S 12/30μm; double-sided board... minimum L/S 25/50μm) *For details, please request materials or view the PDF data from the download.

  • others
  • Substrate

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Tokaishin'e Electronics Industry Multi-layer Circuit Board

We have a variety of products available to meet the diverse needs of our customers.

It is a substrate with copper foil on both sides and inside of a glass epoxy insulating board.

  • Other services
  • Substrate

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Daichang Electronics Flex-Rigid Circuit Boards

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

  • Other network tools
  • Substrate

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Daichang Electronics Build-Up Multilayer Circuit Board

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

  • Other network tools
  • Substrate

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Small lot for development! For automotive and power supply use. Thick copper substrate (high current substrate).

With a maximum copper thickness of 400μm, it is suitable for heat dissipation measures and power supply for power devices! It can also be formed on substrates such as transformers and motors.

Meito Electric's "Thick Copper Substrate (High Current Substrate)" is suitable for heat dissipation and current supply in heating devices used in automotive and power supply applications. By increasing the conductor (copper) thickness compared to the conventional 35μm, power circuits and control circuits can be formed on the same substrate. The creation of thick copper coil patterns allows for the construction of transformer circuits and motor circuits on the substrate. 【Substrate Specifications】 ■ Outer layer copper foil thickness: 70μm to 200μm ■ Inner layer copper foil thickness: 70μm to 400μm ■ High thermal conductivity resin: up to 8W/mK ■ Bonding: High thermal conductivity resin and copper, etc. ■ Number of layers: Proven from 2 layers to 10 layers (specifications to be discussed) ■ Copper plate: C1020 (oxygen-free) or C1100 (tough pitch) *For detailed information, please download the PDF or feel free to contact us.

  • Contract manufacturing
  • Substrate

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High performance enhancement of thin film circuit boards for semiconductors.

Thin film circuit boards support the high performance of semiconductors.

In the semiconductor industry, as devices become more high-performance, substrates that allow for heat dissipation and high-density mounting are in demand. Particularly in the mounting of laser diodes and LEDs, fine circuit patterns and high thermal conductivity are crucial. Inappropriate substrates can lead to decreased device performance and shortened lifespan. Our thin-film circuit substrates apply film formation and thin-film processing technologies to achieve highly precise fine circuit patterns and excellent thermal conductivity. 【Application Scenes】 Laser Diode (LD) mounting substrates Light Emitting Diode (LED) mounting substrates Photodiode (PD) mounting substrates Optical communication (FTTx, data centers, mobile base stations) 【Benefits of Introduction】 Contributes to high performance of devices Achieves high reliability Contributes to miniaturization and high-density mounting of products

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  • Circuit board design and manufacturing
  • Substrate

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Thin film circuit board for medical devices

Thin film circuit boards that contribute to the miniaturization of medical devices.

In the medical device industry, there is a demand for miniaturization and high-precision components. In particular, miniaturizing parts is a crucial challenge in order to pack many functions into limited space. Our thin-film circuit boards contribute to solving this challenge in the design of medical devices that require small, precise, and high-accuracy components. 【Application Scenes】 - Endoscopes - Portable diagnostic devices - Biometric sensors 【Benefits of Implementation】 - Miniaturization of devices - High-density mounting - High reliability

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  • Circuit board design and manufacturing
  • Substrate

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Thin Film Circuit Board for Aerospace Applications

Thin film circuit boards that achieve weight reduction and high performance.

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. Particularly for electronic devices used in outer space or harsh environments, there is a demand for high reliability and durability while being compact and lightweight. Thin-film circuit boards have been developed to meet these requirements. 【Application Scenarios】 - Electronic devices for aircraft and spacecraft - Satellite-mounted equipment - Drones 【Benefits of Implementation】 - Improved fuel efficiency through weight reduction - Effective use of space through miniaturization - Increased longevity of devices due to high reliability

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  • Circuit board design and manufacturing
  • Substrate

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Thin film circuit board for wearables

Thin film circuit boards that achieve high-density implementation. Contributes to miniaturization and high performance.

In the wearable device industry, there is a demand for both miniaturization and high performance. In particular, high-density implementation technology is essential to pack many functions into a limited space. Thin-film circuit boards have been developed to address this challenge. Our thin-film circuit boards achieve high-density implementation through high-precision fine circuit pattern formation technology, contributing to the miniaturization and high performance of wearable devices. [Use Cases] - Smartwatches - VR/AR devices - Healthcare devices [Benefits of Implementation] - Miniaturization of devices - Enhanced performance - Improved reliability

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  • Circuit board design and manufacturing
  • Substrate

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Thin film circuit board for energy efficiency.

Contributing to energy efficiency with film formation technology and thin film processing technology!

In the energy industry, energy conservation and efficient power supply are required. In particular, high-performance electronic components are essential in fields such as solar power generation and energy storage systems. Thin-film circuit boards contribute to the miniaturization and high performance of devices in these systems, supporting improvements in energy efficiency. 【Usage Scenarios】 - Solar power generation systems - Energy storage systems - Power converters 【Benefits of Implementation】 - Enhanced device performance - Miniaturization of systems - Improved energy efficiency

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  • Circuit board design and manufacturing
  • Substrate

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Thin Film Circuit Board for Measuring Instruments

Thin film circuit board contributing to the performance improvement of high-frequency measuring instruments.

In the high-frequency measurement instrument industry, accurate signal transmission and noise suppression are essential. Particularly in measurements within the high-frequency range, the dielectric properties of substrate materials and the precision of circuit patterns significantly influence the reliability of measurement results. Inadequate substrate or pattern design can lead to signal attenuation and reflection, hindering accurate measurements. Our thin-film circuit substrates contribute to the performance enhancement of high-frequency measurement instruments by using materials with high-precision fine circuit patterns and excellent thermal conductivity. 【Application Scenarios】 - High-frequency signal measurement - Testing of wireless communication devices - Development of radar systems - Evaluation of various sensors 【Benefits of Implementation】 - Improvement of high-frequency characteristics - Reduction of signal transmission loss - Enhanced noise resistance - Increased measurement accuracy

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  • Circuit board design and manufacturing
  • Substrate

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ATE substrate

Leave the semiconductor inspection device substrate (ATE substrate) to Cygnus.

We manufacture ATE boards at a top-tier overseas manufacturer. We have numerous achievements in probe cards, performance boards, burn-in boards, and more. AW design support (domestic) is also available.

  • Printed Circuit Board
  • Substrate

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Introduction of high-performance components for communications

We provide optimal solutions to solve our customers' challenges by leveraging our years of accumulated experience. If you have any difficulties, such as selecting products, please feel free to contact us.

【Products Handled】 ■ Various Boards ■ Environmentally Resistant SSDs ■ Mechanical Components ■ Microwave ■ Network

  • High frequency/microwave parts
  • Substrate

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Liquid Flow Sensor Evaluation Kit 'EK-SLF3S-0600F'

Response speed < 20ms! Maximum flow rate is 2000ul/min for aqueous and hydrocarbon systems.

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLF3S-0600F'. The maximum flow rate is 2000ul/min (for aqueous and hydrocarbon fluids), with a response time of <20ms. The interface (connector) is I2C (6-pin Molex). Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLF3S-0600F ×1 ■ SLF3x mounting clamp ×1 ■ SCC1-USB sensor cable ×1 ■ Adapter cable for connecting from 6-pin connector to SCC1-USB sensor cable ×1 ■ 6-pin ribbon cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.

  • Flow Sensor
  • Evaluation Board
  • Substrate

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[Development Case] Control Board for LED Near Ultraviolet Irradiation Device - [EOL Support]

Replacement design of embedded systems - Transition to a high-functionality microcontroller 1Chip that achieves stable supply and cost reduction.

By adopting overseas microcontrollers and FPGAs, we have implemented alternative board designs that achieve stable supply and high performance for customers facing increased component procurement risks due to changes in the global situation. While maintaining the conventional configuration, we have replaced it with a high-functionality microcontroller from a domestic manufacturer, eliminating the need for complex circuit designs and FPGA circuits. This allows us to break free from dependence on overseas components and significantly reduce component supply risks. Furthermore, by simplifying design changes and management burdens, we have achieved improved productivity and reduced total costs. We have realized stable supply to end users while enhancing product safety and market competitiveness through a consistent development process. Design engineers, procurement, and production management can solve on-site challenges and improve operational efficiency through our replacement design examples. Please feel free to contact us!

  • Embedded system design service
  • Microcomputer
  • Embedded Board Computers
  • Substrate

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[Example] RS232C to RS422 conversion board for currency exchange machines [EOL support]

Replacement Design for Embedded Systems - How to Expand Device Lineup by Maintaining Size and Signal Conversion -

With the expansion of the lineup of currency exchange machines, it became necessary to convert the existing RS232C signals to RS422 signals. However, due to constraints in the device housing, changing the board size was not possible. Therefore, we faced the challenge of improving signal conversion performance while maintaining the existing design by adding an RS422 conversion circuit to the current RS232C board. Our company first conducted detailed hearings with customers to optimize the circuit of the existing board, and then, after confirming the operation with a prototype RS422 conversion board, established a design that could be integrated without changing the board size. Furthermore, in addition to evaluating the board alone, we conducted verification of its incorporation into the device and confirmed that there were no issues with all specified operations. This enabled us to achieve the continued use of the existing design and high-reliability signal conversion, responding to the expansion of the currency exchange machine lineup. We would like design engineers, procurement, and production management to consider this case as an optimal solution that enhances product performance, production stability, and cost efficiency while overcoming the constraints of the device housing.

  • Embedded system design service
  • EMS
  • Communications
  • Substrate

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Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

By using a special manufacturing method, it is possible to produce substrates with a copper thickness of up to 400μ.

When a standard thickness of 18μ copper foil carries a large current, it can generate high heat and, in some cases, may even break, which is very dangerous. Such substrates can be addressed by increasing the thickness of the copper foil, and K2 Corporation can manufacture substrates with thicknesses ranging from 35μ to 105μ using standard substrate manufacturing methods. Furthermore, by employing special manufacturing techniques, it is possible to produce substrates with a maximum copper foil thickness of 400μ. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board
  • Substrate

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Latest comprehensive catalog of a substrate specialty manufacturer 【*Includes 3 case studies!】

What is the secret behind achieving ultra-short delivery times for special substrates? Limited free sample giveaway!

At K2, a manufacturer specializing in printed circuit boards, we have all the manufacturing equipment necessary for PCB production fully equipped in-house. By operating this equipment at 100%, we achieve shorter delivery times and lower costs for special PCBs and medium-lot products, which are difficult for prototype manufacturers to handle. We address five key issues in the PCB manufacturing industry: inability to accommodate ultra-short delivery times, excessively high initial costs for flexible PCBs, being turned down for inquiries about special PCB manufacturing, inability to meet short delivery times for medium-lot production, and concerns about PCB quality. *Exclusive to Ipros users! We are currently offering samples of rigid-flex PCBs and double-sided flexible PCBs! Please contact us during this opportunity. (Limited quantities available) [Case Studies] - Resin filling (Pad on Via holes) specification ⇒ Where outsourcing would typically require an extra 3 days, we can accommodate it in 1 day! - Double-sided flexible PCBs ⇒ Achieved shorter delivery times and reduced initial costs by using laser processing instead of molds for shape processing! - 4-layer rigid-flex PCBs (without reinforcement) ⇒ Typically 7 days, expedited response in 6 days! *For more details, please contact us or download our catalog to view.

  • Printed Circuit Board
  • Substrate

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We do not refuse! Responding to various circuit boards with short delivery times! *Exhibiting at Nepcon.

Various types of substrates can be manufactured, including rigid substrates, flexible substrates, build-up substrates, rigid-flex substrates, and special substrates!

K2 has all the necessary equipment for circuit board manufacturing in-house, allowing us to complete all processes without relying on outsourcing. K2 does not turn down requests for specialized circuit board manufacturing, even those that require high processing technology and precision. For complex projects that have been rejected by other companies, we leverage our established track record and know-how to find unique solutions. 【Features】 ◆ Flexible response to detailed customer requests ◆ Thorough data checks contribute to reduced lead times and costs ◆ Short lead times achievable through in-house integrated production and strict deadline management *For more details, please refer to our materials. Feel free to contact us. 【Exhibition Information】 We will be exhibiting at Nepcon Japan from January 22 (Wednesday) to January 24 (Friday), 2025! Booth: East Hall 2 E10-36. We look forward to your visit!

  • Printed Circuit Board
  • Substrate

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Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

Introducing technology for improving V-cut position accuracy! High-precision V-cut method using CCD.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm through improvements in V-cut and pattern positioning. The pattern formation is made possible by the LDI (Laser Direct Imaging) method, and the V-cut is achieved using a high-precision V-cut method with CCD. We enhance hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling equipment and X-ray measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Flat plugs (pad-on-via) allow for mounting on through-holes ○ Landless through-holes enable compatibility with narrow pitch patterns ○ Ultra-fine printing is possible (1 character: vertical 0.28 × horizontal 0.15 mm) Please contact us for more details.

  • Printed Circuit Board
  • Substrate

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