We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 558 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. グロース Kanagawa//Electronic Components and Semiconductors
  4. 4 スクリーンプロセス Kanagawa//others
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. Handbook for Circuit Board Noise Countermeasures グロース
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics. マルワイ矢野製陶所
  4. Understand in 3 minutes! A substrate that dissipates heat faster [Materials available]. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  5. 4 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

Substrate Product List

1441～1455 item / All 1889 items

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Waterproofing and long-life enhancement of the implementation substrate: "Resin potting application."

Waterproofing and long-life enhancement of the implementation substrate: "Resin potting application."

[Waterproof and Dirt Prevention] Are you having trouble with making your circuit board waterproof, vibration-resistant, or preventing dirt accumulation? Achieve a longer lifespan for your board with resin potting.

The challenge with implementation boards is the reduced lifespan due to various environmental factors. - Damage from vibration and impact - Accumulation of water droplets, dust, and dirt In response to the above, we recommend "resin potting" for enhancing the water resistance, seismic resistance, and longevity of the boards. By injecting urethane resin into cases, dust, dirt, and water can be completely shut out. Additionally, since the board is fixed by the resin, it can also be protected from vibrations. **Benefits of Resin Potting:** - No worries about dust or dirt adhering to the board - Excellent waterproof and moisture-proof properties - Strong against vibrations and impacts as the case can be filled and fixed with resin - Can extend the component replacement cycle, proving effective for products aimed at overseas markets In this way, Astom, with over 20 years of experience, offers various solutions to the challenges and concerns related to boards. Please feel free to consult us regarding any issues related to implementation boards.

  • Contract manufacturing
  • Testing Equipment and Devices
  • Circuit Board Inspection Equipment
  • Substrate

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Printed circuit board

Printed circuit board

Leave the design and production of printed circuit board patterns to us!

Kobayashi Electronic Industry Co., Ltd. primarily manufactures printed circuit boards for industrial equipment, responding to customer needs from pattern design to printed circuit board assembly. Additionally, through a thorough quality control system and production management system, we deliver "peace of mind" to our customers. 【Business Description】 ■ Design, manufacturing, and sales of printed circuit boards for industrial equipment *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Contract manufacturing
  • Substrate

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Thorough quality control and production management at Kobayashi Electronics!

Thorough quality control and production management at Kobayashi Electronics!

We have implemented our own production management system, managing everything from order receipt to delivery with barcode tracking.

Since our establishment in 1970, we have been delivering "peace of mind" to many customers. We have implemented our unique production management system, which allows us to manage the entire process from order receipt to delivery using barcode management, ensuring reliable delivery date management. Not only do we manage delivery dates, but we also carefully manage customer information to reduce the hassle for repeat customers.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Voices from the Development Manufacturer: Avery Corporation

Voices from the Development Manufacturer: Avery Corporation

Evaluation board for medium to high voltage ICs. Our flexible response to customer needs and ongoing support have been well received.

Kai Electronics Co., Ltd. has been involved in the design and manufacturing of printed circuit boards and the overall development of electronic devices, working with many development manufacturers. Within the company, there are three engineers specializing in system design, enclosure design, and printed circuit board design. We can pursue designs that consider requests from other processes and seek optimal solutions from multiple perspectives. This time, we would like to share feedback from a development representative at Averyk Co., Ltd. They have entrusted us with the design and manufacturing of evaluation boards for high-voltage ICs. [Customer Feedback] - They responded flexibly to the situation while maintaining close communication even after the specification document was submitted. - They contributed to quality improvement and accelerated development. - They are expected to provide support for the increasingly complex IC specifications. *For more details, please refer to the PDF document or feel free to contact us.*

  • Circuit board design and manufacturing
  • Substrate

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NBC's Electronics Division

NBC's Electronics Division

We strive for quality with a reliable system. We also manufacture high thermal conductivity metal substrates, which have received positive feedback from our customers.

Introducing NBC's "Electronic Business Division." This division plays a role in automotive electronics through the design, manufacturing, and sales of printed circuit boards, with a motto of "creating reliable products" required in automotive electronics. Recently, we have also started manufacturing metal substrates aimed at improving reliability against heat, which has been well received by our customers. 【Features】 - Primarily focused on automotive products, but also provides a wide range of products for communications and industrial equipment. - Capable of handling small lot products from single-layer to high multilayer. - Addresses thermal measures with metal-based substrates and high heat-resistant materials. - Committed to creating high-quality, highly reliable products to meet diverse customer needs. *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • Substrate

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Expansion board "Raspberry Pi(R)"

Expansion board "Raspberry Pi(R)"

We provide teaching materials and reference books that can be used in actual embedded business.

We offer the expansion board "Raspberry Pi(R)" as our own product. We provide teaching materials and reference books that can be used in actual embedded work. Please feel free to contact us if you have any requests. 【Lineup】 ■ Basic image processing programs: face recognition, color recognition, centroid determination, etc. ■ Japanese speech recognition ■ Japanese speech synthesis ■ Digital input/output: AD conversion input support ■ Embedded-compatible power configuration ■ Internet-based remote communication ■ 24-channel servo motor control: teaching operation possible *For more details, please download the PDF or contact us.

  • Circuit board design and manufacturing
  • Substrate

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Ultra-small, high-precision flexible substrate

Ultra-small, high-precision flexible substrate

Custom-made support for narrow pitch high-definition and ultra-high-definition substrates! Leave flexible substrates (high-definition FPC) to us!

Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We utilize advanced techniques such as micro-hole processing using chemical etching, BVH connections, and polyimide micro-hole processing technology that allows for simultaneous hole drilling to meet our customers' needs. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Micro-hole processing and BVH connections using chemical etching ■ Introduction of polyimide micro-hole processing technology that allows for simultaneous hole drilling *For more details, please download the PDF or contact us.

  • Board to FPC connector
  • Substrate

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Mountaineer "My Data MY15"

Mountaineer "My Data MY15"

A compact feeder that allows for the removal of setup time! The tip tape can be set even if it is short.

"My Data MY15" is a mounter suitable for implementing various types and small lot sizes. It allows for the mounting of components on multiple types of printed circuit boards at once and can also handle irregularly shaped boards. Additionally, the feeder allows for quick setup by simply inserting the tip of the reel component, reducing work time. By scanning the barcode on the feeder and setting it in the magazine, the component setup is completed. 【Features】 ■ Capable of mounting components on multiple types of printed circuit boards at once ■ Capable of mounting components on irregularly shaped boards (no need for dummy boards) ■ Can mount circular, trapezoidal, star-shaped, and other types of printed circuit boards ■ Short changeover time ■ Can be set even with short tape on the tip of reel components *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Substrate

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ＦＰＣ

ＦＰＣ

With our extensive experience and production technology, we provide timely FPCs that satisfy everyone at any stage of development cooperation, prototyping, and mass production.

Single-sided FPC, double-sided FPC, multi-layer FPC, low-rebound FPC, used in various applications such as space and aerospace equipment, medical devices, industrial equipment and robots, car electronics, mobile devices and computer-related equipment, cameras and movie equipment, and electronic components.

  • Board to FPC connector
  • Substrate

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Aluminum base substrate [Noise and heat countermeasures with aluminum grounding]

Aluminum base substrate [Noise and heat countermeasures with aluminum grounding]

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.

When it comes to aluminum base substrates, the mainstream options are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. To address this, our company has developed a unique method of bonding the substrate to aluminum, allowing us to create aluminum base substrates using the desired substrate and aluminum. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, post-bonding processing is possible, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material to aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting via reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Large high multi-layer / large substrate

Large high multi-layer / large substrate

Production of ultra-large size boards such as motherboards and long boards for LED lighting is possible!

At Kyoei Denshi Co., Ltd., we are capable of producing long and large substrates exceeding 1,000mm in length. We accommodate various specifications such as high frequency, thick copper, and high multilayer. We support ultra-large size "large high multilayer substrates" for motherboards used in information and communication devices and for BTB applications, as well as "long substrates" up to a maximum of 1,000mm for LED lighting and A0 print heads. 【Features】 ■ Capable of producing ultra-large sizes ■ Vacuum forming press machine / heating plate size 750×1,100 ■ Supports up to 24 layers ■ Products up to a maximum of 1,000mm for LED lighting and A0 print heads *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Hybrid substrate (honeycomb material laminated substrate)

Hybrid substrate (honeycomb material laminated substrate)

By combining different substrate materials in horizontal and vertical directions, we can reduce assembly man-hours and save space!

Hybrid substrates integrate multiple substrate materials with different characteristics by combining them in horizontal and vertical directions (layering), allowing for the unification of what was previously divided into multiple boards, thus achieving a reduction in assembly labor and space-saving. Additionally, we offer "honeycomb substrates" that are ultra-lightweight and have excellent electrical properties through a composite technology that incorporates honeycomb materials into the substrate and layers them. Honeycomb materials are particularly effective when bonded with fluoropolymer (Teflon) substrates. Fluoropolymers are used as materials for high-frequency substrates due to their low dielectric constant, but the base material itself is soft, making it difficult to handle. When scaled up, thin substrates can bend or break, while making the substrate thicker can lead to warping due to its own weight. Honeycomb materials are lightweight and have high strength, allowing for reinforcement of the substrate when bonded, which helps to reduce warping. Furthermore, not only does it contribute to weight reduction, but the air within the honeycomb also serves as an insulating layer, making it effective when a lower dielectric constant is desired. Moreover, because the honeycomb material provides reinforcement, handling becomes easier compared to when using the substrate alone, thus improving work efficiency. *For more details, please refer to the PDF document or feel free to contact us.*

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Molded cast products [We propose the selection of resins tailored to the required characteristics].

Molded cast products [We propose the selection of resins tailored to the required characteristics].

Product creation tailored to needs: ・High voltage resistance (proven up to 30kV) ・Custom resin formulation to match desired performance.

Molded cast products can conform to any shape for mold production and ensure insulation performance. They also excel in electrical properties, mechanical strength, dimensional stability, and chemical resistance. Leveraging our unique position as both a manufacturer and a trading company, we propose the optimal resin from multiple options based on the usage environment and the most important performance criteria you prioritize. Additionally, we can collaborate with resin manufacturers to custom blend resins to achieve the desired properties. Resins come with various performance characteristics. If you want to use them outdoors or need something resistant to chemicals, please feel free to consult us. 【Cast Products】 ■ High-strength resins ■ Low thermal expansion resins ■ Thermal conductive resins 【Applications and Examples】 ■ Switching devices ■ Circuit breakers ■ Power conditioners ■ Gap spacers 【Quality Control】 ■ Dielectric strength testing ■ Corona discharge testing *For more details, please refer to the PDF document or feel free to contact us using the form below.

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  • Vacuum Equipment
  • Resin mold
  • Substrate

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Heat-dissipating molded cast products [Resin molded products that combine heat dissipation and insulation properties]

Heat-dissipating molded cast products [Resin molded products that combine heat dissipation and insulation properties]

Proposals for EV vehicles with increasing heat dissipation requirements, high-efficiency motors, power devices, etc.

We solve heat problems caused by the miniaturization of devices with the power of resin. We offer proposals for applications such as EV vehicles, high-efficiency motors, and power devices, where the demand for heat dissipation is increasing. Leveraging our unique position as both a manufacturer and a trading company, we suggest suitable resins from multiple manufacturers based on the usage environment and other factors. Additionally, we can collaborate with resin manufacturers to custom blend resins to achieve desired properties. Please feel free to consult us with any other requests. 【Features】 ■ Achieves thermal conductivity of 2.6 W/m·K ■ Breakdown voltage of 17 kV/mm *For more details, please refer to the PDF document or feel free to contact us.

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  • Other Auto Parts
  • Substrate

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Bus bar (bus bar) high current substrate

Bus bar (bus bar) high current substrate

By substrate-izing the busbar, high insulation and compactness are achieved!

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and a compact, lightweight design. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization offers the following benefits: - Mounting of power devices such as IGBTs and SiCs on the substrate. - After substrate mounting, installation into equipment is possible, leading to reduced assembly time and prevention of miswiring. - Space-saving due to simplified substrate and wiring, resulting in overall equipment miniaturization. - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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