We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. グロース Kanagawa//Electronic Components and Semiconductors
  4. 4 スクリーンプロセス Kanagawa//others
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. Handbook for Circuit Board Noise Countermeasures グロース
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics. マルワイ矢野製陶所
  4. Understand in 3 minutes! A substrate that dissipates heat faster [Materials available]. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  5. 4 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

Substrate Product List

1426～1440 item / All 1895 items

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[Information] Current Status of Stretchable Substrates Reaching Practical Levels

[Information] Current Status of Stretchable Substrates Reaching Practical Levels

Meeting a wide range of user needs! An introduction to the current status of the development of stretchable substrates.

This document introduces the current status of the development of stretchable substrates. It includes information on material development, improvements in construction methods, and the expansion of application uses. Our company has been able to provide variations of standard connection methods, allowing for more diverse proposals for application development on the customer side. [Contents] ■ Preface ■ Material Development ■ Improvements in Construction Methods ■ Expansion of Application Uses ■ Future Developments *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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[Information] Various Measures for Heat Dissipation in Circuit Board Design

[Information] Various Measures for Heat Dissipation in Circuit Board Design

Introducing new heat dissipation technology in circuit board design! It is already widely adopted in various mass-produced circuit boards.

The miniaturization of devices, the high-frequency characteristics of circuits, and the increase in the current being handled have led to concerns about heat generation from the devices and circuits mounted on the substrate. This document provides detailed information on substrate design techniques that can accommodate everything from small-scale prototypes to mass production. We explain various new technologies for heat dissipation measures in substrate design. We encourage you to read it. 【Contents】 ■ Trends in devices ■ High heat dissipation measures for specific devices ■ Improving heat dissipation with surface structures ■ Metal core and metal base substrates ■ Thick copper substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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High-frequency compatible substrate

High-frequency compatible substrate

Hybrid structure of PTFE material and general-purpose materials achieves both performance and cost! Introduction of composite material substrates.

When focusing on cost and availability, FR4 becomes a material with significant losses at high frequencies, while PTFE, which has issues with cost, is highlighted when considering high-frequency characteristics. Additionally, the reality is that high-frequency material substrates are often difficult to obtain, and it is not easy to find manufacturers that can accommodate small-scale prototypes. The "composite material substrate" uses PTFE material for the layers that form high-frequency circuits. General circuits and power circuits are constructed with FR-4 or high Tg materials, providing multilayer substrates that are compatible with high frequencies while keeping total costs down. 【Composite Material Substrate Features】 ■ PTFE + General-purpose materials ■ PTFE material is used for the layers that form high-frequency circuits ■ General circuits and power circuits are constructed with FR-4 or high Tg materials ■ Multilayer substrates compatible with high frequencies that keep total costs down *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Heat management of mounted components on the substrate.

Heat management of mounted components on the substrate.

The thermal conductivity of copper inlay is 390 W/mK! It can efficiently dissipate heat to the heat sink.

With the increase in signal high frequency, there is a tendency for the heat generation from components to increase, and the heat generated from individual circuit components also rises due to the increase in electrical power of the circuit. If these components are used without sufficient heat dissipation, issues such as unstable operation, reduced output, and decreased reliability may occur. By embedding a copper inlay, which is a metal with good thermal conductivity, directly beneath the mounted components, it is possible to efficiently dissipate heat to the heat sink. Our company can accommodate everything from double-sided boards to multilayer boards, and we can use materials such as FR-4, high Tg materials, and high-frequency materials. Please contact us for details regarding configuration and materials. 【Features】 ■ Directly dissipates heat from mounted components to the heat sink ■ Thermal conductivity of copper inlay: 390W/mK ■ Compatible with double-sided boards to multilayer boards ■ Materials available include FR-4, high Tg materials, and high-frequency materials *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Hamamatsu Pulse Co., Ltd. Business Introduction

Hamamatsu Pulse Co., Ltd. Business Introduction

If you are considering outsourcing manufacturing for circuit board assembly, semi-finished products, and finished product assembly and packaging, primarily related to consumer goods machinery and industrial equipment, please contact us!

Our company is entrusted with the manufacturing of printed circuit board assembly, semi-finished module unit assembly, and finished product assembly and packaging, based on strong trust and a proven track record from major manufacturers, including small lot and diverse production. We have numerous orders for PCB assembly, not only for domestic production but also for the implementation of prototype boards intended for mass production overseas. If desired, we can also provide technical proposals regarding issues encountered during prototype assembly and the manufacturing process for mass production. We have established a comprehensive production system, so we strive to meet customer requests by offering high-value-added semi-finished module units that incorporate not only PCB assembly but also sheet metal parts and resin-molded components, along with proposals for Q.C.D. We actively accept orders for semi-finished module assembly and finished product assembly, even if PCB assembly is not involved, so please feel free to contact us. *Please consult us regarding prototype-only or limited-time cases. 【Business Content】 ■ Manufacturing, assembly, and packaging related to electronic musical instruments and industrial control devices ■ Development, manufacturing, and sales of LED film light-related products ■ Other related businesses *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]

Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]

Adoption of precision total extraction mold! High accuracy in outer shape and hole pitch, improved finish on the burr surface and shear surface!

We handle "base plates" and "heat sinks." Thanks to our precision progressive dies, the accuracy of the outer shape and hole pitch has significantly improved, resulting in enhanced finish quality on both the edge and shear surfaces. With the adoption of progressive dies for coil materials, continuous processing is possible for thicknesses up to 5mm, contributing to lower costs and shorter delivery times. We also utilize UV printing. Additionally, we can accommodate micron-level flatness and specified warp processing, as well as resist baked printing. 【Features】 ■ High accuracy of outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil materials up to 5mm thickness with the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Substrate

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Aluminum foil etching processing and circuit board

Aluminum foil etching processing and circuit board

It is possible to reduce costs compared to copper foil etched circuit boards.

We will form circuits using composite materials such as aluminum foil and PET film through etching processing. Our unique aluminum foil etching method enables the formation of precise circuits for applications such as aluminum heater products, antennas, or sensors using aluminum foil.

  • aluminum
  • Sensors
  • Aluminum heater
  • Substrate

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High thermal conductivity substrate "Metal substrate"

High thermal conductivity substrate "Metal substrate"

You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board
  • Substrate

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Printed circuit board "Silicone-based substrate (Silicone)"

Printed circuit board "Silicone-based substrate (Silicone)"

Utilizing the flexibility of the substrate, it can be implemented without a heat sink even on curved surfaces!

The "Silicone-based substrate" is a flexible printed circuit board that uses high thermal conductivity silicone sheets. Silicone resin is highly flexible and can be expected to prevent solder cracks during heat cycles. Additionally, by utilizing the flexibility of the substrate, it can be implemented without a heat sink on curved surfaces. 【Features】 ■ Flexible printed circuit board ■ Uses high thermal conductivity silicone sheets ■ Prevents solder cracks during heat cycles ■ Can be implemented without a heat sink on curved surfaces *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board
  • Substrate

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Introduction to Techno Staff Support Services

Introduction to Techno Staff Support Services

Support the development of young and mid-career technicians and skilled workers who will become the driving force behind Japan's manufacturing capabilities!

Techno Staff Co., Ltd. is a support company for human resource development and manufacturing that nurtures successors in mechanical, mold, and electrical technology and skills. We realize the aspirations of young people who want to acquire more advanced technology and skills, apply their improved abilities to their daily work, and contribute to Japan's manufacturing by participating in skill tests and skill Olympics. Our "professional instructors," who possess the technology and skills that supported Japan's rapid economic growth, will assist you in inheriting your "technology and abilities." [Support Services] ■ Processing, Assembly, Adjustment ■ Design, Drafting ■ Management, Operations *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Substrate

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5C-SSM evaluation kit_box

5C-SSM evaluation kit_box

Evaluation kit equipped with an odor sensor, "CEK box"

Evaluation kit consisting of three components: CMOS-type odor sensor "5C-SSM," interface board, and flow path fixture, all housed in a casing. The accompanying software includes automatic setting functions for sensor drive parameters and pixel selection, allowing for simple data acquisition. The CEK box (official name: 5C-SSM evaluation kit_box) is available for purchase starting from one set.

  • O2 sensor evaluation test device
  • Other Sensors
  • Substrate

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Introduction to Liquid Resist Screen Printing (Photo Developing Type Solder Resist)

Introduction to Liquid Resist Screen Printing (Photo Developing Type Solder Resist)

A manufacturing method that corresponds to the evolution of printed circuit boards from rough designs to those with fine structures.

Abe Print Circuit Board Co., Ltd. is focusing on liquid resin screen printing technology as its main method to adapt to the evolution of printed circuit boards, which range from coarse structures to fine structures, in response to the advancement of electronic devices. In this method, resin is applied in a thin film using screen printing, and light is partially irradiated to change its solubility, allowing for the removal of unnecessary parts through development. The process concludes with drying and printing of characters, and it has been adopted in many factories. *For more details, please feel free to contact us.*

  • Printing/Publishing
  • Substrate

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"Design, manufacturing, and sales of printed circuit boards" *Business Introduction*

"Design, manufacturing, and sales of printed circuit boards" *Business Introduction*

If you are having trouble with printed circuit boards, please contact us! We can also accommodate prototypes.

Stay Electronics Co., Ltd. is engaged in the design, manufacturing, and sales of printed circuit boards. Our company has built up expertise based on the craftsmanship spirit: STAY-ISM, fueled by the thoughts, requests, and expectations we have received from many customers over the years. Our motto is "Creating products that respond to the developer's thoughts and commitments." At Stay Electronics, we are dedicated to answering the developer's question, "What should I do in this situation?" We aim to be the company you turn to in times of trouble. 【Business Description】 ■ Design, manufacturing, and sales of printed circuit boards 【Products Offered】 ■ Flexible printed circuit boards ■ Rigid printed circuit boards 【Main Inspection Equipment】 ■ AOI/AVI ■ Image dimension measuring instruments/projectors ■ Ultra-depth multi-angle lenses ■ Microscopes ■ Two-dimensional automatic length measuring devices ■ Others: Equipment for prototype support available Please contact us if you want to reduce tool costs such as molds. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi

  • Wiring materials
  • Substrate

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Image Analysis Using a Microscope / Flexible Substrate Mock Production

Image Analysis Using a Microscope / Flexible Substrate Mock Production

It is possible to create a simple mock-up of the base for those who want to analyze the internal structure of FPC products, troubleshoot issues, or pre-verify complex product shapes.

We would like to introduce the services provided by Stay Electronics Co., Ltd. The "Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter" is a service that creates simple mock-ups of flexible circuit boards using polyimide film for those who have never handled flexible circuit boards before or wish to pre-validate complex product shapes. Additionally, the "Image Analysis using a Super Depth Multi-Angle Lens Microscope" can be utilized for internal structure analysis and defect analysis of FPC products. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi [Service Operations] ■ Image Analysis using a Super Depth Multi-Angle Lens Microscope ■ Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter *For more details, please refer to the PDF document or feel free to contact us.

  • Microscope
  • Substrate

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[Production Example] Superconducting Device (Flexible for Superconducting Circuit Evaluation)

[Production Example] Superconducting Device (Flexible for Superconducting Circuit Evaluation)

Examples of superconducting devices (for superconducting circuit evaluation) operating at ultra-low temperatures of -269℃. *Source: Yokohama National University

We would like to introduce a case study of the fabrication of a superconducting device flex that operates at an ultra-low temperature of -269°C. Using flex materials that operate in a superconducting environment, we produced flex for superconducting devices, including single flux quantum circuits (SFQ circuits) and adiabatic quantum flux parametron (AQFP), for the purpose of verifying the operation of superconducting circuits. Laser processing was applied due to the tolerances required for the device electrode parts. [Case Overview] ■ Materials Used - 2-layer materials (2 types) - 3-layer materials (2 types) *Materials were determined after verification experiments. ■ Laser processing was applied due to the tolerances required for the device electrode parts. *For more details, please refer to the PDF document or feel free to contact us.

  • Piezoelectric Devices
  • Substrate

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