We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. グロース Kanagawa//Electronic Components and Semiconductors
  4. 4 スクリーンプロセス Kanagawa//others
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
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Substrate Product ranking

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. Handbook for Circuit Board Noise Countermeasures グロース
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics. マルワイ矢野製陶所
  4. Understand in 3 minutes! A substrate that dissipates heat faster [Materials available]. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  5. 4 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

Substrate Product List

1411～1425 item / All 1895 items

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Freesia Auto Research Co., Ltd. Business Introduction

Freesia Auto Research Co., Ltd. Business Introduction

We respond to all needs from the design, prototyping, manufacturing, to assembly of printed circuit boards.

Our company, as one of the leading circuit board manufacturers in Japan, provides comprehensive support from circuit board design to assembly. With the teamwork of planners and printed circuit board designers who have extensive experience, we design and manufacture printed circuit boards that are thoroughly focused on circuit performance. Leveraging the network of our various locations across Japan, we respond flexibly to meet our customers' needs. 【Business Activities】 ■ Circuit Board Design ■ Circuit Board Prototyping ■ Circuit Board Manufacturing ■ Circuit Board Assembly *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Limited Liability Company R.I.F. Business Introduction

Limited Liability Company R.I.F. Business Introduction

Leave electronic circuit design, electronic system design, and embedded board design to us!

RIF Co., Ltd. specializes in electronic circuit design, electronic system design, and the sale of embedded circuit board design. We offer a wide range of products, including LED digital thermometers, simple infrared remote control repeaters, and LANC mode selectors. Additionally, we can produce prototypes and evaluation boards at low prices for small-scale production and hobby projects, so please feel free to contact us with your requests. 【Features】 ■ We can make some modifications to related products or develop new ones. ■ Depending on the content, we can produce even one unit. *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Dissimilar copper thick coexistence substrate

Dissimilar copper thick coexistence substrate

A high-current substrate suitable for miniaturized power devices!

The "Hybrid Copper Thickness Coexistence Substrate" is a high-current substrate that allows for the coexistence of 300μm thick copper foil and 70μm thin copper foil within the same layer, enabling switching between them. It achieves a reduction in assembly processes and component count, making it suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 ■ Switchable between 300μm and 70μm ■ 300μm and 70μm can be interwoven ■ Combination of copper inlays is possible *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High current substrate

High current substrate

With a rich lineup of copper foil thicknesses, we can accommodate current values from a few amperes to several hundred amperes!

The "High Current Substrate" is a printed circuit board that can carry large currents ranging from several tens to several hundred amperes, featuring thick copper foil. We offer "Ultra Thick Copper High Current Substrates" that use copper thicknesses of 300μm, 400μm, and 500μm, exceeding the conventional copper thickness of 105 to 240μm, as well as "Irregular Copper Thickness Coexisting Substrates" suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 - In the case of 300μm, coexistence with 50μm thin copper foil is possible in the same layer. - For thicknesses of 500μm or more, it is possible to draw copper foil out of the substrate from the inner or outer layers. - Exposure within the substrate is also possible. - Terminal processing, bending processing, and three-dimensional shaping of the substrate are possible. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Copper inlay substrate

Copper inlay substrate

A high-current, high-heat-dissipation substrate that achieves effective heat dissipation!

The "copper inlay substrate" is used in a wide range of fields and is particularly adopted as a critical component related to human life in automotive applications, being a high-current and high-heat-dissipation substrate. It achieves an excellent cost-performance heat dissipation method. By pressing copper directly beneath heat-generating components, it effectively dissipates heat. Additionally, eliminating the need for screw fastening for each heat-generating component enhances reliability, reduces costs, and decreases assembly labor. 【Features】 ■ Compared to aluminum heat dissipation substrates, the lower coefficient of thermal expansion of copper improves the reliability of solder joints. ■ Compared to aluminum heat dissipation substrates, it allows for the use of high multilayer substrates and double-sided mounted substrates, increasing design flexibility. ■ Increased circuit efficiency due to greater freedom in component placement. ■ Miniaturization. ■ Both SMD and lead components can adopt the same heat dissipation structure. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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BN substrate (substrate for high heat-resistant printed circuit boards)

BN substrate (substrate for high heat-resistant printed circuit boards)

Substrate for high-temperature printed circuit boards with excellent insulation reliability.

At Print Tech Co., Ltd., we handle substrates for printed circuit boards that excel in heat resistance. We offer "BN300," which is used as a substrate for semiconductor substrates due to its high heat resistance characteristics, and "BN-LX," a high-reliability substrate for printed circuit boards that achieves environmental compatibility, high heat resistance (TG = 300°C), and low warpage (CTE = 6ppm). Please feel free to consult us if you have any requests. 【Product Lineup】 ■ BN300 ■ BN-LX *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts
  • Other machine elements
  • Substrate

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High multi-layer, large printed circuit boards (PCBs) and backplanes manufactured overseas.

High multi-layer, large printed circuit boards (PCBs) and backplanes manufactured overseas.

Our company's circuit board manufacturing specializes in high-layer and large circuit boards up to 60 layers. We will develop solutions for your interconnection issues.

For over 30 years, our technological advancements in PCBs and backplanes have enabled several key innovations in high-speed networking and computing products. 【Services Offered】 ■ PCB layout, CAD, design for manufacturability and cost ■ Quick-turn PCB prototyping for PCBs, backplanes, and flex circuits ■ Mass production and global manufacturing in North America and Asia ■ Advanced technologies: laminated boards, HDI, any layer through structure, multiple sequential laminations ■ Manufacturing services utilizing SVP (Simultaneous Via Partitioning™) and intellectual property licensing opportunities ■ Manufacturing of high-layer-count and large PCBs *For more details, please refer to the PDF document or feel free to contact Sanmina.

  • Contract manufacturing
  • Substrate

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Overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, etc.

Overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, etc.

We have strengths in advanced technology for high multilayer and ultra-fine pitch developed for aerospace applications, and we respond to the needs for procuring advanced substrates overseas.

We would like to introduce our overseas manufacturing of advanced PCBs (printed circuit boards) for aerospace, medical devices, communication equipment, and more. Our company is a PCB manufacturing company with a long track record of providing PCB solutions for major markets in high-speed telecom, networking, computing, ATE, mission-critical defense and aerospace (MIL-PRF-31032, AS9100), automotive, and medical sectors. 【Features】 ■ Global footprint (two locations in the U.S., four factories in Singapore and China) ■ Design for PCB layout, CAD, productivity improvement, and cost reduction ■ Complete NPI support ■ Material technology ■ Technical leadership (multilayer boards, HDI, etc.) 【We will be exhibiting at NEPCON Japan 2025!】 Date: January 22 (Wed) - 24 (Fri), 2025, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight (Booth # E28-17) *Please register your visit via the link below and stop by our booth! (No waiting time)

  • 航空宇宙向け等高度なPCB（基板）の海外製造2.PNG
  • 航空宇宙向け等高度なPCB（基板）の海外製造3.PNG
  • 航空宇宙向け等高度なPCB（基板）の海外製造4.PNG
  • 航空宇宙向け等高度なPCB（基板）の海外製造5.PNG
  • 航空宇宙向け等高度なPCB（基板）の海外製造6.PNG
  • Circuit board design and manufacturing
  • Substrate

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High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate

High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate

The cup angle and bottom size can be freely selected! After implementation, the height of the board can be kept low.

This product is a "high-precision device substrate" that allows for a low profile of the board after mounting by installing an IC in the seat groove. It is designed for LED light reflectors, and the cup angle and bottom surface size can be freely selected. In addition, we also offer "high heat dissipation device substrates" and "ultra-thin glass cloth multilayer substrates." 【Features】 <High-Precision Device Substrate> ■ Enables a low profile of the board after mounting ■ Cup angle and bottom surface size can be freely selected <High Heat Dissipation Device Substrate> ■ Combines various heat dissipation technologies to meet advanced requirements ■ Copper pillars do not damage through-hole plating as they are not press-fitted *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Heat-dissipating substrate "Thick Copper Special Substrate"

Heat-dissipating substrate "Thick Copper Special Substrate"

A thick copper three-layer substrate with a total thickness of 0.35mm! Suitable for applications such as mobile phone camera flash substrates.

We handle "heat dissipation structure substrates" with built-in copper. We use a thick copper three-layer substrate (inner layer copper thickness 0.2mm, total board thickness 0.35mm) and ultra-thin PP (0.03mm). These are used for applications such as mobile phone camera flash substrates. 【Required Performance】 ■ Circuit and SR alignment tolerance of 0.04mm ■ Surface treatment for gold wire bonding (electroless NiPdAu plating) ■ Deviation tolerance between the outer shape centerline and the component pad centerline of ±0.075mm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other electronic parts
  • Substrate

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High Heat Dissipation Substrate "High Precision Heat Dissipation Via"

High Heat Dissipation Substrate "High Precision Heat Dissipation Via"

We meet advanced requirements through the combination of high-precision machining and high heat dissipation structures!

Our company handles the heat dissipation substrate "High Precision Heat Dissipation Via." The applicable substrate methods include general through-hole TH, BVH, IVH, and build-up methods. The finishing plating options include electroless NiAu, bonding NiAu, and other impedance control solutions. By combining high-precision machining with a high heat dissipation structure, we meet advanced requirements. 【Features】 ■ Applicable substrate methods: Compatible with general through-hole TH, BVH, IVH, and build-up methods ■ Finishing plating: Electroless NiAu, bonding NiAu 　　　　　　　　Other impedance control compatible ■ Resin dam structure compatible with both high and low standards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Heat dissipation substrate "Heat dissipation Via"

Heat dissipation substrate "Heat dissipation Via"

Multilayering of thick copper substrates is also possible! We can handle filling of blind vias and vacuum filling in-house.

Our company handles the heat dissipation substrate "Heat Dissipation Via." With the increasing heat generation due to the high performance and miniaturization of electronic components, there is a growing need for heat dissipation pathways that allow the heat generated by components to escape from the space to the pattern, in order to maintain the performance of electronic devices and extend their lifespan. We propose solutions to these issues as heat dissipation measures. It is also possible to create multilayer thick copper substrates, allowing for the development of new applications that have not been seen before. 【Features】 ■ Thick copper substrate with copper foil thickness of 210μm ■ Copper paste VIA hole filling (thermal conductivity 0.58–7.8W/mk) - Small diameter VIA φ 0.15 is supported, - Bottom-filled VIA hole filling can also be handled in-house with vacuum filling. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Special processing for substrates used in high-precision devices.

Special processing for substrates used in high-precision devices.

Special processing such as ZAGRI processing, laser processing, and high-precision processing for pattern alignment is possible!

Our company handles special processing of "high-precision substrates for high-precision devices." The accuracy of the counterbore processing is ±20μm, the high-precision outer diameter processing by laser is ±10μm, and the high-precision processing for pattern alignment is ±50μm. By installing ICs in the counterbore section, it is possible to keep the height of the substrate low after mounting. 【High-Precision Processing】 ■ Counterbore processing accuracy: ±20μm ■ High-precision outer diameter processing by laser: ±10μm ■ High-precision processing for pattern alignment: ±50μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts
  • converter
  • Substrate

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Metal base substrate

Metal base substrate

A special substrate that is joined to a metal base by thermal pressing beneath the substrate. The through-hole section can be joined to the metal base by copper plating.

A solder plating or tin plating is applied in advance under the substrate, and by thermally bonding it to the metal plate, a complete surface joint is provided. It is also possible to use high-frequency compatible substrates made of low dielectric materials or substrates made of fluororesin. Such combinations can provide a very effective heat dissipation structure for high-frequency applications. Additionally, it is also effective for EMI countermeasures in RF applications.

  • High frequency/microwave parts
  • Substrate

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Stretchable circuit board

Stretchable circuit board

Follows uneven surfaces and curves! A circuit board that serves as electrodes for various sensors and maintains conductivity even when stretched.

The "stretchable circuit board" conforms to uneven surfaces and curves, maintaining conductivity even during stretching. It allows for circuit formation on any material depending on the application, while ensuring elasticity. As a stretchable pressure sensor, it can be utilized in various applications such as monitoring beds and shoe insoles, and it does not break even under load. Additionally, the stretchable biosensor detects weak biological signals using Ag/AgCl electrodes. 【Features】 ■ Conforms to uneven surfaces and curves ■ Maintains conductivity during stretching ■ Supports various batch sizes ■ Can serve as electrodes for various sensors ■ Does not break under load *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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