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Substrate Product List and Ranking from 558 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Dec 31, 2025~Jan 27, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Dec 31, 2025~Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  3. グロース Kanagawa//Electronic Components and Semiconductors
  4. 4 スクリーンプロセス Kanagawa//others
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors

Substrate Product ranking

Last Updated: Aggregation Period:Dec 31, 2025~Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. Handbook for Circuit Board Noise Countermeasures グロース
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics. マルワイ矢野製陶所
  4. Understand in 3 minutes! A substrate that dissipates heat faster [Materials available]. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  5. 4 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

Substrate Product List

1456~1470 item / All 1889 items

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[Equipment Introduction] Leave implementation technology and circuit board assembly to us.

We offer a lead-free compatible line, discrete component inserters, inspection equipment, and more!

We would like to introduce the equipment owned by World Electronics Co., Ltd. The SMT L6 line (lead-free compatible line) includes a cream solder printer, adhesive applicator, high-speed component mounter, odd-form component mounter, and a lead-free compatible N2 reflow oven. Additionally, the high-speed axial component inserter "AVK3" supports self-insertion for board sizes (mm) with a maximum of 508×381 and a minimum of 50×50. 【Equipment Owned (Excerpt)】 ■ Flow Soldering Line - Spray Fluxer - Automatic Soldering Equipment: 3 lines for lead-free solder, 1 line for eutectic solder *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment
  • Circuit Board Inspection Equipment
  • X-ray inspection equipment
  • Substrate

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Transaction Flow

First, please feel free to contact us via the inquiry form or by phone!

We would like to introduce the flow of transactions with World Electronics Co., Ltd. First, please contact us via the inquiry form or by phone, and we will gather necessary information such as the type of product, quantity, and delivery date. Based on the information provided, we will create and present a quotation. Once you agree to it, we will proceed with the contract. Next, we will create a prototype and respond sincerely until the desired product is completed. Once the prototype is finished, we will manufacture the product and deliver it according to the desired delivery date. 【Transaction Flow】 1. Inquiry 2. Requirements Hearing 3. Quotation 4. Contract 5. Prototype Creation 6. Manufacturing 7. Delivery *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Substrate

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Board "SY-KUS-01"

PCI Express board capable of high-capacity data transmission and reception using high-speed serial communication.

The "SY-KUS-01" is a PCI Express board equipped with a Xilinx Kintex UltraScale FPGA. It enables high-speed serial communication for large-capacity data transmission and reception. It features two channels of DDR4 as external memory. It is equipped with the FPGA XCKU035-2FFVA1156C, and options for 025, 040, and 060 are also available. Additionally, it includes two QSPI (totaling 512Mbit). 256Mbit can be used as user space. 【Features】 ■ PCI Express (supports up to Gen3 x 8) ■ Oscillator ・ Equipped with 100MHz, 200MHz, and 250MHz ■ Two channels of DDR4 (1 channel = 32Gbit 64bit_DataBus) ■ SFP+ 4ch ■ MMCX 2Lane (Tx/Rx) + RefCLK ■ 8-pin PinHeader external interface *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Substrate

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[Solution Example] i.MX8M Mini <Differences in Patterns>

Compare the differences and start testing with four types of design and pattern variations! Please take a look.

The preliminary evaluation has been completed to some extent, and we have created four types of circuit boards with different wiring patterns for LP-DDR4. We are comparing the differences between the pattern simulations during the design phase and the actual devices, providing feedback, and adjusting detailed CPU parameter settings while confirming operation and accumulating data. We are progressing with the evaluation work to propose suitable solutions. 【Design and Patterns】 ■Standard patterns based on NXP evaluation boards ■Consideration of delay constraint relaxation for high-density design support ■Verification of crosstalk effects ■Consideration of layer reduction *Details of the case studies can be viewed via the related links. For more information, please feel free to contact us.

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[Solution Case] FPGA In-house Research Meeting vol.1

Control the ping pong balls inside the tube! Introducing research on high-speed image processing and motor control.

Our company regularly holds research meetings to improve FPGA technology in-house. This time, we are using an FPGA with an ARM core to process images captured by a camera while controlling a fan motor, and to control a ping pong ball inside a tube at the same location where the image was taken. We are advancing research that enables simultaneous processing on the ARM and FPGA, allowing for faster and more appropriate feedback. By continuing such in-house research, we are tackling new technological fields. *Details of the case can be viewed through the related links. For more information, please feel free to contact us.*

  • Embedded Board Computers
  • Development support tools (ICE, emulators, debuggers, etc.)
  • Substrate

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Printed circuit board

Developing printed circuit boards that support technology! Bringing products to life that meet various needs.

Daishin Sangyo Co., Ltd. develops printed circuit boards with a skilled and experienced design team specializing in technical expertise. We are capable of manufacturing special substrates, including build-up boards, Teflon boards, and aluminum boards. We offer a wide range of services from circuit tracing to power supply, analog, digital, high frequency, impedance, and FPGA design. 【Features】 ■ Possible to ship as soon as the next day ■ Supports small lots to mass production ■ Circuit design ■ Artwork design (pattern design) ■ Metal mask production *For more details, please refer to the PDF document or feel free to contact us.

  • IPROS51674970813232955168.png
  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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[Information] Daishin Sangyo Co., Ltd. Manufacturing Supplement

Introducing numerous examples of high-difficulty substrates, such as 0.5 pitch BGA mounted 8-layer through resin-filled boards (t0.6)!

This document is a supplementary manufacturing material from Oshin Industry Co., Ltd. It includes information such as the lineup of standard substrate materials, maximum sizes of multilayer boards, and maximum board thickness. Additionally, as examples of high-difficulty substrates, we introduce technologies such as "0.4 pitch BGA mounted 8-layer through resin-filled substrate (t1.6)" and "0.4 pitch BGA mounted 16-layer L1-2/L1-3…L1-8 continuous IVH substrate (t3.2)." We encourage you to read it. 【Contents (partial)】 ■General - Standard substrate materials - Maximum sizes of multilayer boards - Maximum board thickness ■Technology (Examples of high-difficulty substrate achievements) - 0.5 pitch BGA mounted 12-layer 2-8-2 build-up substrate (t1.6) - 0.5 pitch BGA mounted 16-layer L1-8/L9-16 IVH + through resin-filled substrate (t2.0) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Other processing machines
  • Substrate

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Printed circuit board "10-layer 3-4-3 build-up board"

Introducing a printed circuit board with a core section of 4-layer TH, resin-filled and lid-plated! It features a 0.4 pitch 256-pin BGA.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima Ward of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "10-layer 3-4-3 build-up substrate" is a printed circuit board equipped with a 0.4 pitch 256 pin BGA. It features via-on-via with via fill copper plating. The resist is exposed using DI laser, with a laser hole diameter of φ0.1. 【Features】 ■ Via-on-via with via fill copper plating ■ Core section 4-layer TH is resin-filled and covered with plating ■ L5/6 layer clearance φ0.35 (TH φ0.2 drill) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Circuit board design and manufacturing
  • Substrate

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Solid State Lighting (SSL) Printed Circuit Board (PCB) Solutions Guide

ODM services from research and development to mass production of solid-state lighting (SSL). Proven delivery records to major multinational companies worldwide. [Catalog available]

We provide comprehensive services from the idea stage to the design and implementation of circuit boards, thermal management solutions for light source design and production, and final lighting fixture production. From IMS, PCB, and MCPCB to assembly and system integration, we have manufactured world-class products in fields such as automotive, medical, and industrial equipment, building a solid track record. Please feel free to entrust us with your needs. [Content] ■ Consistent support from concept design → prototyping → product development → manufacturing. ■ Solid State Lighting (SSL) solutions. ■ Solutions for IMS, PCB, MCPCB, and more. *For more details, please download our catalog or feel free to contact us.

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FSM Adapter Board

The substrate dimensions are 70×47×1.4mm! A product for the RZ/V2M Evaluation Board Kit.

We would like to introduce the "FSM Adapter Board for RZ/V2M Evaluation Board Kit" that we handle. This product is compatible with the "RZ/V2M ISP Support Package" provided by Renesas Electronics. It allows you to connect FRAMOS sensor modules to the V2M_EVK. Please feel free to contact us if you have any inquiries. 【Features】 ■ Image sensor conversion board for RZ/V2M Evaluation Board Kit ■ Capable of connecting FRAMOS sensor modules to V2M_EVK ■ Compatible with the "RZ/V2M ISP Support Package" provided by Renesas Electronics *For more details, please refer to the PDF document or feel free to contact us.

  • Evaluation Board
  • Substrate

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Numerous adoption achievements for aerospace applications - power control boards & battery modules.

Many achievements in mounting on satellites! The satellite is alive because the power supply is operational. The heart of electronic devices, power control board and battery module [Catalog available].

Numerous achievements in mounting on space probes and satellites! The satellites are alive because the power supply is operational. Here is an introduction to our power control boards and lithium-ion batteries, which have been widely adopted. 【Adoption Achievements】 ◆ The University of Tokyo TRICOM-1R (SS-520:5) ◆ NESTA Hodoyoshi No. 3 and No. 4 (Dnepr), among many others 【Product Introduction】 ◆ Multi-functional lithium-ion battery models ◆ Hodoyoshi-mounted EPS modules, among many others *For more details, please download the catalog or feel free to contact us.

  • Secondary Cells/Batteries
  • Fuel Cells
  • Lithium-ion battery
  • Substrate

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Coated prisms for electrical components, perforated substrates, medical polishing substrates, etc.

Actively responding to customer requirements such as flatness and surface roughness in grinding.

Our company specializes in the polishing and molding of optical glass for electronic devices. We are capable of purchasing and manufacturing various materials such as single crystal LiNbO3, LiTaO3, La3Ga5SiO14, and SrTiO3. We actively respond to customer requirements regarding flatness and surface roughness in polishing. 【Features】 ■ Advanced technology and extensive know-how accumulated in the field of parallel plane polishing of optical glass for electronic devices ■ Proven track record in special glass processing for environmental numerical measuring instruments, with high evaluations from major glass manufacturers ■ High quality and short delivery times. We carefully respond to customer needs to ensure greater satisfaction. 【Photo Content】 1) BK-7 glass substrate 2) Drilled substrate 3) Polished substrate for medical use 4) Drilled substrate 5) Polished substrate with coating for electrical components prism *For more details, please feel free to contact us.

  • Glass
  • Processing Contract
  • Substrate

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Long-sized printed circuit board ☆ up to 1500mm ☆

Leave everything related to printed circuit boards to us! We can handle everything from single-sided to build-up, aluminum core, and rigid-flex, even in small quantities.

Our company provides electronic devices, including printed circuit boards, based on our unique value chain and network with "high quality," "low price," and "short delivery time." ---------------------------- ◆ Quality <Q> We ensure reliable quality by having a QA organization centered around Japanese personnel that works closely with the factory. We can accommodate from AW design, enabling designs that consider manufacturing. ◆ Price <C> Depending on the type and quantity of the circuit boards, we can procure them at prices 30% to over 50% lower than domestic products. ◆ Delivery <D> We have a dedicated organization for delivery management, minimizing delivery issues through detailed management. ---------------------------- Our feature is that we can provide "Chinese-produced products at low prices with Japanese quality." We can flexibly utilize short delivery domestic manufacturing and low-cost overseas manufacturing, accommodating a wide range from single-sided boards to build-up mass production. We have our own factory in China, and we are also equipped to produce special-shaped boards, such as long boards over 1 meter and thin boards of 0.2 mm. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Plywood composite substrate

Achieving the quality desired by customers by combining various raw materials.

We achieve and provide the quality that our customers seek by combining various raw materials, such as plywood + plywood and plywood + MDF, to meet strength and surface characteristics based on their applications. By thoroughly managing press time, press pressure, and adhesive, we guarantee reliable traceability and adhesive performance. Furthermore, with high-precision thickness adjustment and surface finishing, we deliver more user-friendly products. 【Features】 ■ We combine various raw materials to meet the quality that our customers seek. ■ We guarantee reliable traceability and adhesive performance. ■ We deliver more user-friendly products. *For more details, please contact us.

  • wood
  • Wood products
  • Contract manufacturing
  • Substrate

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