We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 558 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Dec 31, 2025~Jan 27, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Dec 31, 2025~Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  3. グロース Kanagawa//Electronic Components and Semiconductors
  4. 4 スクリーンプロセス Kanagawa//others
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors

Substrate Product ranking

Last Updated: Aggregation Period:Dec 31, 2025~Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. Handbook for Circuit Board Noise Countermeasures グロース
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics. マルワイ矢野製陶所
  4. Understand in 3 minutes! A substrate that dissipates heat faster [Materials available]. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  5. 4 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

Substrate Product List

1471~1485 item / All 1889 items

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Analog amplifier circuit board "CMC-PIB-A"

High precision and high temperature characteristics! Zero-span adjustment volume orientation can be specified at the time of shipment.

The "CMC-PIB-A" is an analog amplifier board specifically designed for strain gauge sensors. It outputs voltage according to the input signal, eliminating unnecessary functions such as monitoring, and is specialized for data measurement in research and embedded devices. Please feel free to consult us when you need assistance. 【Features】 ■ Compact design allows for flexible installation ■ Zero and span adjustment volume orientation can be specified at the time of shipment ■ High precision and high temperature characteristics ■ Equipped with a pseudo input switch for convenient calibration *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Single-sided circuit board

Priority selection of various electronic products is relatively easy to produce at low cost. They are used in small household electrical appliances, such as computers, radios, and printers.

Low cost! Easy to design and produce! Furthermore, short delivery time!

  • Circuit board design and manufacturing
  • Substrate

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Four-layer flexible circuit board

We can meet the diverse design needs of our customers.

The advantages of copper foil circuits are their ability to withstand high temperatures and their rigidity. They are suitable for various types of handheld mobile devices, printers, and table equipment.

  • Circuit board design and manufacturing
  • EMS
  • Substrate

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Six-layer multi-layer circuit board

For computers, cameras, automobiles, etc.

Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.

  • Other electronic parts
  • Processing Contract
  • Circuit board design and manufacturing
  • Substrate

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Six-layer multi-layer substrate

The functions of electronic devices are becoming increasingly complex and their sizes are getting smaller. If you need multilayer substrates, please consult us here.

Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.

  • Circuit board design and manufacturing
  • EMS
  • Processing Contract
  • Substrate

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Six-layer high-density multilayer circuit board

Generally, high multilayer lamination technology is adopted in manufacturing.

Number of Layers: Six Layers Material: FR-4 (High TG 170) Board Thickness: 1.6 +/- 0.1mm Surface Treatment: Electroless Nickel/Electroless Gold Copper Foil Thickness: H/1/1/1/1H OZ Remark: Blind Holes: L1/L2 & Blind Holes

  • Circuit board design and manufacturing
  • Substrate

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4-layer rigid flex circuit board

4-layer rigid flex circuit board

Number of Layers: Four Layers Materials: FR4 + Polyimide + Copper Foil + Carbarelay Board Thickness: FR4: 0.8 +/- 0.1mm PI: 0.175mm Surface Treatment: Electroless Gold Plating Au 2µ", Ni 80µ" Copper Foil Thickness: 1/H~H/1 OZ Blind Holes: L1~L2 / L3~L4 Remark: Smartwatch

  • Circuit board design and manufacturing
  • Substrate

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12-layer high-density multilayer circuit board

Generally, high multilayer stacking technology is adopted in manufacturing.

Number of layers: 12 layers Material: FR4 TG175 Board thickness: 2.0 +/- 10% mm Surface treatment: Electroless nickel/electroless gold plating Copper foil thickness: H/1/1/1/1H OZ Remark: Blind holes: L1/L2 & blind holes

  • Circuit board design and manufacturing
  • Substrate

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Printed resistive substrate

The production system aims to introduce equipment and improve efficiency to accommodate short delivery times, a wide variety of products, and small lot production!

Our company provides printed resistive substrates in various fields such as automotive, motors, and cameras. Among them, the "heat-resistant substrate with a fine pitch pattern width of 30μ to 90μ" has been adopted as an important substrate related to automotive safety and has received positive evaluations. We are also focusing on the development of human resources backed by experience rather than relying solely on machines. We are preparing to meet the diverse needs of everyone. 【Examples of manufactured products】 ■ Slide volume using printed resistors ■ Transfer substrate using printed resistors ■ Actuator substrate using printed resistors ■ Heat-resistant substrate with a fine pitch pattern width of 30μ to 90μ ■ Carbon paste manufactured and sold in-house *Please feel free to contact us for more details.

  • Circuit board design and manufacturing
  • Substrate

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Resin potting refers to waterproofing and dustproofing measures for mounted circuit boards!

Waterproofing, long-life enhancement, and earthquake resistance of the implementation board are recommended with resin potting!

Resin potting involves injecting urethane resin into cases, effectively shutting out dust, dirt, and water. Additionally, since the circuit board is fixed in place, it can be protected from vibrations. It is recommended for waterproofing, extending the lifespan, and enhancing earthquake resistance of mounted circuit boards. We will carry out the work according to your requirements, so please feel free to contact us. 【Benefits of Resin Potting】 ■ No worry about dust or dirt adhering to the circuit board ■ Excellent waterproofing and moisture resistance ■ Strong against vibrations and shocks as the case can be filled and fixed with resin ■ Can extend the component replacement cycle, making it effective for products intended for overseas markets ■ Prototyping is possible *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract
  • Coating Agent
  • Substrate

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[Example] Black Potting - For waterproofing and dustproofing of mounted circuit boards!

Although the hardness is high at 76, it does not put stress on the substrate! Introduction of resin potting examples.

If waterproofing is necessary, if you want to protect the circuit board from vibrations, or if you are concerned about the reduced lifespan of the mounted circuit board due to dirt, resin potting is the solution. Black potting has a high hardness of 76, but it has the advantage of not putting stress on the circuit board. There are no limits to the work size for resin potting. Please feel free to consult us regardless of the size of the circuit board. 【Advantages of Black Potting】 ■ High hardness of 76, but does not stress the circuit board ■ Excellent waterproofing (equivalent to IP67), dustproofing, explosion-proofing, and earthquake resistance ■ Prototyping is possible *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract
  • Coating Agent
  • Substrate

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[Example] Transparent Potting

Affordable implementation is possible! Introduction of resin potting examples. *For waterproofing and dustproofing of mounted circuit boards!

If waterproofing is necessary, if you want to protect the circuit board from vibrations, or if you are concerned about the reduced lifespan of the mounted circuit board due to dirt, resin potting is the solution. Transparent potting has the advantage of being clear, allowing for inspection of the surface of the circuit board. There are no limits to the work size for resin potting. Please feel free to consult us regardless of the size of the circuit board. 【Advantages of Transparent Potting】 ■ Being transparent allows for inspection of the surface of the circuit board ■ Excellent waterproofing (equivalent to IP64), dustproofing, and vibration resistance ■ Can be implemented at a low cost ■ Prototyping is possible *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Coating Agent
  • Substrate

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Achievements in prototype and assembly of printed circuit boards related to medical devices.

We would like to introduce our achievements in the production of printed circuit boards related to medical devices. *For waterproof and dustproof measures for mounted boards!

In the production of printed circuit boards related to medical devices, we perform board coating from the perspective of protecting the printed circuit boards. Tojo Manufacturing Co., Ltd. offers one-stop total support from prototype printed circuit boards to final assembly. If you are facing issues with delivery times or quality, please feel free to consult with us. 【Features】 ■ We perform board coating from the perspective of protecting printed circuit boards. *For more details, please refer to the external link page or feel free to contact us.

  • Printed Circuit Board
  • Processing Contract
  • Substrate

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Coating for Waterproof and Explosion-Proof Measures in Circuit Board Implementation Explained in One Book! Free materials available.

A detailed explanation of coatings for waterproofing and explosion-proofing measures for substrate mounting! We will propose coatings that match your effectiveness objectives.

This document is a collection of basic knowledge explaining potting (for waterproofing, seismic resistance, dustproofing, explosion-proofing of circuit boards) and coating (for moisture-proofing and insulation measures of circuit boards). It introduces the effects and purposes, work methods, and frequently asked questions. Additionally, a comparison table by effect is also included. If you are struggling with installation in special locations, please feel free to contact us. 【Contents (excerpt)】 ■ What is potting? - Overview / Effects and purposes / Work methods ■ Frequently asked questions - Isn't potting expensive? ■ Main criteria for judgment ■ Comparison table by effect *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Coating Agent
  • Substrate

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