ファインテック日本 List of Products and Services

The "pico 2" is a multipurpose die bonder with a mounting accuracy within 3μm. With quick setup and easy operation, it is suitable for rapid and flexible product development and prototyping in corporate laboratories and universities. Additionally, thanks to its modular design philosophy, new functions can be added even after the equipment has been installed, allowing for easy integration throughout the equipment's lifespan. 【Features】 ■ Compact tabletop die bonder ideal for prototyping and research and development ■ Simple operation for alignment using a unique vision alignment system ■ Supports various mounting processes such as thermocompression, soldering, ultrasonic, and adhesive ■ Integrated process control (heat, temperature, load, etc.) via IPM commands ■ Accommodates a wide range of component sizes (0.05mm to 100mm) ■ Cost-effective equipment configuration through a modular system *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

Lambda2 is a new standard model of a high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact tabletop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies such as thermal eutectic, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact tabletop size, it is very easy to introduce into operations, and considering future scalability through a modular system, it is a highly cost-effective model. Lambda2 is a new standard model from Finetech, a German manufacturer specializing in die bonders, which has poured its unique know-how into this product. Its ultra-high precision and usability, realized through its unique design philosophy, leave no room for competitors to catch up. For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

The model name sigma from the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N within a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, supporting wafer-level applications such as MEMS/MOEMS assembly, image sensor bonding, and chip packaging. The FINEPLACER sigma is designed for development applications that align with future-oriented assembly technologies, accommodating a variety of techniques and applications.

• Bonding Equipment

This is a die bonder device that supports various bonding processes in prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic parts. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers safety for operators regarding the use of process gases and UV irradiation. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip compatible • Cost-effective equipment configuration • Supports various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.

• others

The model name femto2 of the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.5μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely isolates itself from external influences, achieving a stable assembly process with top-class yield. *For more details, please download the PDF or contact us.

• Other semiconductor manufacturing equipment

The packaging of optoelectronics (photoelectronic components) units is one of the important applications in microassembly. In the recent field of photonics, multiplex transmitters and receivers with high-density packaging targeting high bandwidth, as well as assemblies that combine them, have become crucial elements. Consequently, high placement accuracy is required for the bonding of these components, and various assembly technologies are utilized. This technical paper discusses the challenges associated with these components and Fine Tech's solutions for the assembly of VCSELs and photodiodes, as well as relative high-precision bonding for single components and array components, handling of small components, safe transfer of adhesives, and advanced tool design for components with contact prohibition areas. *For more details, please refer to the PDF document or feel free to contact us.*

• Other semiconductor manufacturing equipment

Thermal compression bonding is a quick and easy method for reliably joining flip chips. Many bonding processes, such as eutectic soldering implemented with load in laser bar soldering, are fundamentally classified in this category. This technical paper focuses on specific thermal compression processes used in combination with gold stud bumps or indium bumps. Flip chip bonding using this bonding method has many advantages and excellent bonding characteristics. Nevertheless, as this document indicates, it is still a niche technology and not widely adopted. Here, we provide a general overview of the process and its parameters. We also address common challenges when adopting this technology and introduce ways to solve them using the FINEPLACER die bonding equipment. *For more details, please refer to the PDF document or feel free to contact us.*

• Other semiconductor manufacturing equipment

With the advancement of laser technology, its range of applications is also expanding. From infrared to ultraviolet, lasers are utilized in various fields such as measurement, spectroscopy, optical communication, optical data processing and storage, fiber optic communication, and medical devices. Moreover, with the increasing demand, the manufacturing of high-power laser diodes, for example, has become one of the main mass production processes. To produce high-power lasers in large quantities, die bonding equipment is required, which must maintain high precision and reproducibility while accommodating variations in the size and type of many different components, and achieving high production efficiency in the assembly of finished products. This technical paper provides an explanation of the fully automated assembly process for high-power laser diodes, including general process parameters, bonding conditions, and process steps, and introduces solutions to typical challenges faced during laser diode manufacturing, such as the bonding quality of Au80Sn20, the bonding process, and various factors arising from materials and components themselves. *For more details, please refer to the PDF document or feel free to contact us.*

• Other semiconductor manufacturing equipment

Fine Tech's laser-assisted die bonding technology is suitable for chip-to-substrate (C2S) and chip-to-wafer (C2W) applications that require precise control of process speed, accuracy, and localized heating. In particular, rapid temperature cycling minimizes the risk of surface oxidation and enables the shortening of process cycles in production environments where temporal optimization is required. In continuous bonding processes at the substrate or wafer level, each chip is heated only once. Additionally, unlike area heating, localized laser heating does not require extensive equipment to prevent thermal expansion. Laser-assisted die bonding with such features is an effective technology newly added to Fine Tech's assembly and packaging technology. *For more details, please refer to the PDF document or feel free to contact us.*

• Other semiconductor manufacturing equipment

In applications such as cutting, welding, and marking, fiber laser solutions are increasingly replacing traditional methods. In recent years, the manufacturing costs of semiconductor laser chips have been continuously reduced, but the current single largest cost factor is in assembly and packaging, primarily due to the manual processes involved in second-level packaging where the CoS is attached to the heat sink. To address this issue, Finetech has developed, evaluated, and provided an automated solution for packaging CoS to heat sinks using new bonding technologies. This technical paper will explain this. *For more details, please refer to the PDF document or feel free to contact us.*

• Other semiconductor manufacturing equipment

In the assembly (mounting and bonding) of optical package products, it is necessary to align optical components and electronic components with the highest precision. Furthermore, in cases such as products that incorporate thermoelectric coolers (TECs), the assembly process becomes even more complex. This technical paper describes the assembly of general printed circuit board (PCB) based optical transceiver modules (40 Gbit/s to 400 Gbit/s) for data communication applications, specifically QSFP (Quad Small Form-factor Pluggable). *For more details, please refer to the PDF document or feel free to contact us.*

• Other semiconductor manufacturing equipment

It is now unimaginable to have a world without technologies like Flex-on-Glass, which electrically connects flexible printed circuit boards to glass substrates, or Chip-on-Glass, which directly bonds chips to glass. These technologies utilize anisotropic conductive films and pastes that have different functional principles compared to conventional adhesives and solder materials, requiring appropriate processing. This technical paper introduces these technologies and discusses typical challenges and proven solutions. *For more details, please refer to the PDF document or feel free to contact us.*

• Other semiconductor manufacturing equipment

The semiconductor laser diode bar is used as an excitation light source for optical resonators in solid-state lasers and gas lasers, as well as in other fields such as medical devices and material processing. In the assembly process, alignment and bonding to the sub-carrier, as well as bonding to special heat sinks for sub-assemblies, are performed. This document describes the challenges related to the assembly of laser diode bars, common error cases, and Fine Tech's approach as a solution to ensure the success of the process. *For more details, please refer to the PDF document or feel free to contact us.*

• Other semiconductor manufacturing equipment

This document describes the characteristic evaluation of micro-assembly technologies utilized in manufacturing techniques such as anisotropic adhesive bonding, ultrasonic mounting, thermal combined ultrasonic mounting, and solder mounting. It includes an overview of flip chip bonding technology, as well as experimental results and discussions. A custom flip chip bonding technology inspired by solder bump technology was also experimentally validated. 【Contents】 ■ Introduction ■ Overview of Flip Chip Bonding Technology ■ Experimental Results and Discussion ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other mounting machines

This document introduces various bonding methods used in 3D packaging. As a result of extensive prototype research, various chips with a high number of bumps (up to 143,000), narrow pitch widths (minimum 25μm), and small bump diameters (minimum 13μm) were mounted on substrates using the high-precision die bonder "FINEPLACER sigma." It presents experimental methods related to 3D packaging technology, the process parameters used, and the results obtained. [Contents (excerpt)] ■ Metal diffusion (MD) bonding, transient liquid phase bonding (TLPB) ■ Thermal compression bonding using pre-underfill ■ Liquid-solid diffusion bonding (SLID) ■ Thermal compression bonding ■ Eutectic bonding ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other mounting machines

Since 2012, as part of NASA's MSL mission, the "Curiosity" rover, equipped with scientific instruments including high-power lasers, has been investigating the geology and climate of Mars. The importance of QCW laser diodes cannot be underestimated, from the Chemistry and Camera complex to the wavelength-tunable laser spectrometer. These semiconductor laser arrays, specifically designed for space applications, are manufactured by Quantel, a French company that is one of the leading manufacturers of high-power solid-state lasers and a long-term partner of Finetech. This case study introduces the "High-Power Semiconductor Laser Assembly for Mars Rovers" from Quantel. *For more detailed information about the case study, please refer to the PDF document. Feel free to contact us for more details.

• Other mounting machines

Collaboration is one of the important driving forces for continuous growth in any business. Kromek, a manufacturer of radiation detection products, has been able to meet the conditions necessary for growth through 20 years of effective collaboration with Finetech and their assembly equipment. This case study introduces "the assembly of innovative radiation detection device prototypes to mass production." *For more details about the case study, please refer to the PDF document. Feel free to contact us for more information.*

• Other mounting machines

We will introduce how the University of South-Eastern Norway is utilizing assembly equipment from Finetech to promote innovation at one of Norway's leading microtechnology hubs. The University of South-Eastern Norway (USN), which has 20,000 students across eight campuses, is one of the educational institutions in Norway. This university, which was formed by the merger of three regional colleges, currently offers a variety of bachelor's, master's, and doctoral programs in many scientific fields. In addition, USN not only plays an important role in domestic and international research and education but is also closely linked to one of the dynamic economic regions. This case study introduces the use of high-precision die bonders in the "Electronic Coast." *For more detailed information about the case study, please refer to the PDF document. Feel free to contact us for more details.

• Other mounting machines

The Microelectronics Research Institute in Stuttgart conducts business-oriented research in fields such as silicon technology, application-specific integrated circuits (ASICs), nanostructures, and image sensor technology, and provides specialized training. In new applications, it has become a critical requirement to stack membrane chips of a few centimeters in size with very high precision. After all steps of placement and stacking are completed, the post-bonding accuracy for the entire process must be less than 1μm. This case study introduces a "die bonder compatible with stacking implementation of membrane chips with a post-bonding accuracy of 1μm." *For more detailed information about the case study, please refer to the PDF materials. Feel free to contact us for more details.*

• Other mounting machines

The University of Southampton (UK), known for its prominent research activities, influences science and human life across various fields and provides a foundation for critical thinking and scientific advancement for scholars and professionals. Finetech's versatile flip chip die bonder, FINEPLACER, contributes to optoelectronics research at one of the UK's polytechnic universities. This case study introduces "top-notch equipment for top-notch research." *For more details about the case study, please refer to the PDF document. Feel free to contact us for more information.*

• Other mounting machines

The new LCD displays for transportation and industrial use from Aditec are manufactured using the FINEPLACER system. In other words, Finetech contributes to maintaining a timely flow of information. They can be easily read from a distance, list departure times and platform numbers, bring order to the noise, and provide direction and important information at a glance. This case study introduces the concept of "everything at a glance." *For detailed information about the case study, please refer to the PDF materials. Feel free to contact us for more details.*

• Other mounting machines

The CANDO project in the UK is advancing the development of brain implants to actively avoid life-threatening seizures for epilepsy patients. The implant, measuring just a few micrometers, is assembled using the FINEPLACER high-precision die bonder. This case introduces "How brain implants offer new hope for epilepsy patients." *For detailed information about the case, please refer to the PDF document. Feel free to contact us for more details.*

• Other mounting machines

In the latest applications of optical devices, high data transfer speeds, composite transmitters, receivers, and mixed elements are important components. In the implementation process of these components, precise position control through appropriate bonding techniques is required.

• Bonding Equipment

In the development of electronic devices, there is a constant demand for increased speed, higher density, and optimization of device size and functional integration. Recent technological trends have made it a critical issue to incorporate three-dimensional stacked structures into the implementation of microprocessors, memory, image sensors, and IR sensors. In response to various demands such as the reduction of pitch size, the need for miniaturization of devices, and the pursuit of thermal and electrical mechanical stability, optimization of internal wiring is required. To accommodate the increasing number of bumps, miniaturization of pitch size, and demands for reduced device height, high-precision die bonders and flip chip bonders that guarantee large bonding loads and extensive flatness are needed.

• Bonding Equipment

The package of optical components consists of the implementation of optical systems (lenses, prisms, apertures, filters, etc.) and electronic components (LD, PD, amplifiers, controllers, etc.). These are widely used in communication technologies where optical signals are converted to electrical signals, or vice versa. High-precision positioning of the optical systems and electronic components during implementation is essential for the normal operation of the package.

• Bonding Equipment

In the implementation of optical devices such as VCSELs and PDs, the alignment target is an aperture with a diameter of only 7 micrometers. Achieving high-precision alignment of this within a millimeter-scale field of view is extremely challenging.

• Bonding Equipment

Fine Tech specializes in the manufacturing of high-precision die bonding equipment and is constantly pursuing cutting-edge technology. With its innovative know-how, it supports the mounting of fine components. The "FINEPLACER series" allows for flexible addition of bonding processes to manual, semi-automatic, and fully automatic machines, thanks to its modular structure, which is the basic concept of the equipment. The multi-purpose die bonding equipment offers configurations ranging from small-scale production at the prototype research and development level to fully automatic models that cater to production phases with high yield. 【Features】 ■ Mounting accuracy of 0.5μm ■ Based on the technology of the "FINEPLACER series" ■ Easy process transfer ■ Verification of rare processes ■ High-precision mounting facilitates rapid process establishment *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment
• others

Due to COVID-19, we have become accustomed to seeing ourselves on screen. Of course, there is no problem with holding online meetings. However, to be honest, I don't really like seeing myself, and I think many people can relate to this feeling. Nevertheless, our sales team, application engineers, and product managers have become less shy about the camera. In this blog, we introduce "Can you see me? Let's start the demonstration!" *For more details, you can view the content in the PDF document. Please feel free to contact us for more information.

• Other services

The word that may be suitable to describe the year 2020 is "Perseverance." Of course, this word applies not only to the dedicated employees of Fintech but to the entire world. Extraordinary sacrifices have been made for a greater cause, and it is not over yet. There have certainly been mistakes and lessons to learn. However, many people must have done what they believed to be right. Our Fintech offices around the world have endured shutdowns in regions including China, Malaysia, Japan, Europe, and the United States. Yet, while sincerely acknowledging this situation, our business continues to improve. In this blog, we discuss "Perseverance during COVID-19." *For more details, you can view the PDF materials. Please feel free to contact us for more information.*

• Other services

In the world of contract manufacturing, we must consider the projects that may come in at any time. Therefore, to determine what kind of equipment to purchase, it is necessary to take into account many variables (factors). To ensure that contract manufacturers can produce high-quality products while competing, a suitable set of production equipment is required. In the world of contract manufacturing, it is not uncommon to handle dozens of products, ranging from small-scale items with fewer than 100 units to mass production. In the case of OEM, there may be a need to assemble thousands of products. This blog introduces the topic of "Speed vs Throughput." *For more detailed information, you can view the PDF materials. Please feel free to contact us for more details.*

• Other mounting machines

Fine Tech participated in the IMAPS Advanced Packaging for Medical Microelectronics Workshop held in San Diego, and it did not disappoint. It was an honor to see Fine Tech mentioned in several technical presentations regarding various interesting biomedical applications. In a presentation from Lawrence Livermore National Labs, they discussed the development of a bionic retina, which is provided as a biocompatible electronic package that includes electronic devices to stimulate the retina using semiconductor technology. This blog introduces "Technology in Biomedical Applications." *For more details, you can view the PDF materials. Please feel free to contact us for more information.*

• Other mounting machines

I was invited to a session on rework and presented on the rework methods for highly miniaturized SMT components such as micro LEDs. Finetech has long been a company that provides complete solutions for microchip rework, but it seems that the definitions of "micro" and "small" have been changing year by year. In this blog, I will introduce some "small things" related to SMTAi 2018. *For more details, you can view the PDF materials. Please feel free to contact us for more information.

• Other mounting machines

Light Emitting Diodes (LEDs) are semiconductor light sources with two leads that emit energy in the form of photons of various colors. Common colors include red, green, and blue (RGB), and there are now also white and other colors available. The color of an LED is determined by the differences in materials. For example, red, orange, and yellow LEDs are made from aluminum gallium indium phosphide, while green, blue, and white LEDs are made from indium gallium nitride. This blog introduces "LED bonding." *For more detailed information, please refer to the PDF materials. Feel free to contact us for further inquiries.*

• Other mounting machines

On May 17, 2018, approximately 50 European professionals from industry and academia participated in Fine Tech's Micro Assembly Day 2018. This one-day conference, held annually in Berlin, was organized to facilitate active knowledge sharing and experience exchange regarding new trends in high-precision packaging and micro assembly. In this blog, we introduce "Micro Assembly Day 2018 a Success." *For more detailed information, please refer to the PDF document. Feel free to contact us for more details.*

• Other mounting machines
• Other embedded systems (software and hardware)

Fine Tech has been a company specializing in SMT rework and repair equipment since its founding over 25 years ago. Interestingly, the machine we first manufactured and continue to sell today has a placement accuracy of ±10μm. That said, now that 25 years have passed, the question posed in the title of this blog is indeed very valid. There are many rework systems on the market, including those with optical systems, those without, devices that use infrared as a heat source, and convection devices, among various types. In this blog, we discuss the topic, "Is rework a mature technology?" *For more details, you can view the content in the PDF document. Please feel free to contact us for more information.

• Other mounting machines

I feel like everyone in the technology industry is talking about LiDAR, but is it just me? What exactly is LiDAR, and why is everyone discussing it? The "what" part is simple. LiDAR stands for Light Detection and Ranging, and it is essentially similar to radar, but instead of detecting "something," the signals detected by LiDAR devices are full-area scans, meaning you can think of them as images of the objects. In this blog, we introduce "LiDAR in various locations." *For more details, you can view the information in the PDF document. Please feel free to contact us for more information.*

• Analytical Equipment and Devices

In laser bar bonding, achieving a void-free gold-tin eutectic joint is a very simple process. With conventional bonders, both the substrate and the die are heated in some way, allowing for a void-free joint to be realized without damaging the completed assembly. Void-free bonding means that no thermal shock is applied to the substrate or die during the joining process. This blog introduces "laser assist and laser bonding." *For more details, you can view the PDF materials. Please feel free to contact us for more information.*

• Other mounting machines

It is always interesting to learn about the chemicals used by customers in bonding technology. There are many factors to consider. Due to the diversity and characteristics of materials, such as low viscosity, high viscosity, and thixotropic media, it is necessary to take multiple parameters into account when selecting materials suitable for the application. Even more importantly, it is essential to invest in equipment that can build a profile that allows for a phased bonding process and ensures a seamless roadmap to the production process. Here, Finetech can make an impact on your research and development. In this blog, we introduce "bonding materials and bonding methods." *For more details, you can view the PDF materials. Please feel free to contact us for more information.*

• Other mounting machines

The "FINEPLACER femto2" is a fully automatic high-precision die bonding machine that achieves a mounting accuracy of 0.3μm @ 3 sigma. It supports various mounting methods such as thermal eutectic, ultrasonic, and more, ensuring a consistently stable assembly process even when transitioning from product development to full-scale manufacturing. 【Features】 ■ High-precision alignment with UHD vision alignment system ■ Integrated process management for quick adaptation to multiple mounting processes ■ Compatible with various mounting processes (thermal compression, soldering, adhesives, ultrasonic, etc.) ■ Modular system design allows for diverse configurations ■ Process environment managed with cleanroom quality ■ Equipped with three-color LED lighting for excellent visibility and image recognition ■ Intuitive operation via touch screen panel *You can view product materials and technical documents related to bonding by downloading the PDF. Please feel free to contact us with any inquiries.

• Other semiconductor manufacturing equipment

This is a die bonder device that supports various bonding processes for prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic components. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers the safety of process gas usage and UV irradiation for operating personnel. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip support • Cost-effective equipment configuration • Compatible with various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.

• others

Lambda2 is a new standard model of high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact desktop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies, including thermal compression, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact desktop size, it offers a very user-friendly scale for equipment installation, and with future expandability through a modular system, it represents a highly cost-effective model. Lambda2 is a new standard model from Fine Tech, a German manufacturer specializing in die bonders, which has poured its unique know-how into it. The ultra-high precision and usability achieved through its unique design philosophy are unmatched by other manufacturers. For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

The model name femto2 from the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.3μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely shields against external influences, achieving a top-class yield and a stable assembly process. *For more details, please download the PDF or contact us.*

• Other semiconductor manufacturing equipment

The model name sigma of the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N in a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, accommodating MEMS/MOEMS assembly, bonding of image sensors, and chip packaging at the wafer level. FINEPLACER sigma is a model designed for development applications that support assembly technologies aimed at the future, catering to a variety of technologies and applications.

• Bonding Equipment