コンガテックジャパン List of Products and Services

The 【conga-TC750】 is a COM Express Type 6 Compact (95 x 95 mm) module equipped with an Intel Core Ultra processor (codename: Arrow Lake). The processor, based on a performance hybrid architecture, can be selected from five types and supports up to 16 cores and 22 threads. With two SO-DIMM sockets, it can implement up to 128GB of DDR5 RAM (up to 6,400 MT/s, with in-band ECC). It features state-of-the-art Intel Arc graphics with an XMX systolic array and up to 128 EUs, achieving 99 TOPS by combining the NPU and CPU. Operating systems with licenses, such as ctrlX OS, Ubuntu, and RT-Linux, can be pre-installed, and it can also be offered as an application-ready aReady.COM product.

• Printed Circuit Board
• Embedded Board Computers

The 【conga-HPC/cBLS】 is a COM-HPC Client Size C (120x160 mm) module equipped with an Intel Core processor (Series 2) (codename: Bartlett Lake). The processor, based on a performance hybrid architecture, offers three options, featuring up to 16 efficient cores (E-core) and up to 8 performance cores (P-core), supporting a maximum of 32 threads. With four SO-DIMM sockets, it can implement up to 128GB of DDR5 RAM (up to 4,000 MT/s, with ECC as an option). It can be pre-installed with licensed operating systems such as ctrlX OS, Ubuntu, and RT-Linux, and can also be offered as an application-ready aReady.COM product. Target applications include medical imaging, testing and measurement, telecommunications and networking, retail, energy sector, banking, monitoring cameras for traffic, and automation applications such as optical inspection.

• Embedded Board Computers

The conga-HPC/mRLP is a COM-HPC Mini Size (95x70 mm) module equipped with the 13th generation Intel Core processor (previously codenamed Raptor Lake-P). The new processor with a hybrid architecture offers a choice of seven types (5 to 14 cores) and features up to 64GB of soldered DDR5 memory (6400MT/s). It also supports AI acceleration through Intel Deep Learning Boost (VNNI). **Features** - High performance in a small form factor (credit card size 95 x 70 mm) - Supports high-speed interfaces (USB4, Thunderbolt, 10Gbit Ethernet, PCIe Gen4/5) - Industrial operating temperature options from -40°C to +85°C - High durability against vibration and shock

• Embedded Board Computers

The economic value of the industrial robot market is rapidly increasing, and the introduction of new technologies such as artificial intelligence (AI) is accelerating. How efficiently and quickly intelligent robots equipped with AI can be developed will determine the success or failure of the project. We are providing reference materials and videos for free. Please take a look. === Public Resources (Partial) === 【Web Page for Robot Developers】 High-Performance Ecosystem for High-Performance Robots 【Case Study】 Autonomous Inspection Robot 【White Paper】 System Integration of Autonomous Mobile Robots (AMR) 【White Paper】 How to Design the Brain of a Robot 【Webinar】 How to Solve Computing Challenges for Future Robots (22 minutes) 【Video】 Reasons for Adopting Computer-on-Module (CoM) in Robots (2 minutes) 【Video】 Overview of Workload Integration - Don't Waste Valuable Resources - (1 minute 30 seconds) 【Podcast】 Behind the Development of Autonomous Mobile Robots (AMR) (24 minutes) For more details, please refer to the related links.

• Embedded Board Computers

Conga-connect is an industrial IoT edge connector that serves as a digitalization solution covering the entire process of smart factories, including the digitalization of production processes, direct utilization of data collected at the edge, and additional processing. This enables secure OT/IT connections and allows for the integration of OT systems across different production departments or locations. Conga-connect can be utilized as a compact, application-ready system for industrial applications, with flexible options for physical interfaces. The system configuration is straightforward and does not require programming, allowing individual solution modules to be used immediately after simple parameter settings. It is ideal for machine manufacturers, system integrators, and manufacturers seeking flexible digitalization solutions.

• Other embedded systems (software and hardware)

The 【conga-TCR8】 is a COM Express Compact Type 6 module equipped with the AMD Ryzen Embedded 8000 processor series. The processor can be selected from four types (6 or 8 cores), featuring up to 8 Zen 4 cores, integrated AMD Radeon RDNA 3 graphics, and an AMD XDNA NPU. It supports up to 128GB of DDR5 RAM (up to 5600 MT/s, with ECC as an option) through two SO-DIMM sockets, and it can optionally include an onboard NVMe SSD. The TDP is scalable from 15 to 54W, making it suitable for upgrading existing products. It provides up to 39 TOPS of performance for AI inference, making it ideal for edge AI applications that require high computing power, combining the latest AI and graphics in cost-sensitive mass production. Its applications include medical imaging, testing and measurement, AI-based POS, and high-end gaming.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-SMX95】 is a SMARC 2.1 module equipped with the NXP i.MX 95 processor. It features up to 6 cores of Arm Cortex-A55, an eIQ Neutron NPU, and an EdgeLock secure enclave. It supports up to 16GB of onboard LPDDR5 (with a maximum speed of 6400 MT/s and inline ECC) and provides two gigabit Ethernet ports compliant with TSN, a DisplayPort, an LVDS display interface, and two MIPI-CSI for cameras. There is also a version that supports an industrial temperature range of -40°C to +85°C. Applications include industrial production, machine vision and visual inspection, robust HMIs, 3D printers, robot controllers for AMRs and AGVs, medical imaging systems, patient monitoring systems, as well as seat monitors for buses and airplanes, vehicle management in transportation, construction, and agriculture.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-TEVAL3/COMe3.1】 is an evaluation carrier board compliant with COM Express Type 6 (Basic, Compact) Rev. 3.1, outputting all signals to standard interface connectors. Size: 294 x 244 mm. Operating temperature range: -40 to +85°C.

• Embedded Board Computers

The RTS Hypervisor is software for virtualizing computers. It allows the creation of virtual machines (VMs) on a single multi-core x86-based computer, enabling the simultaneous execution of different operating systems, such as real-time OS and general-purpose OS, on individual VMs, while providing hard real-time performance. The RTS Hypervisor allocates available resources, including CPU cores, graphics, memory, and I/O devices, to individual VMs as needed. Each VM is completely isolated from one another, ensuring that a specific VM does not affect other VMs.

• Embedded OS

The 【conga-SA8】 is an industrial-grade SMARC module equipped with Intel Atom processors (x7000RE series), Intel Core i3, and the latest Intel Core 3 processors. It supports up to 8 cores and implements up to 16 GB of soldered LPDDR5, compatible with virtualization through the RTS hypervisor. The newly integrated AI features accelerate deep learning inference processing using optimized Intel AVX2 and Intel VNNI instruction sets. It supports Wi-Fi 6E, providing nearly three times the data rate and more stable connectivity in congested environments and overloaded situations compared to Wi-Fi 5 products. Additionally, it supports TSN over Wi-Fi, offering a cost-effective alternative to private 5G networking and new Ethernet cables. Designed for industrial applications, it also offers an industrial temperature range option of -40°C to +85°C.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-HPC/3.5-Mini】 is a 3.5-inch application carrier board designed to implement and use the COM-HPC Mini module. It is an application-ready product that can be immediately integrated into industrial products, such as robust high-performance IIoT applications with space constraints, supporting an industrial temperature range of -40°C to +85°C. When used in combination with the aReady.COM version of the conga-aCOM/mRLP COM-HPC Mini module, the hypervisor and operating system are pre-installed. This solution is also ideal for system integrators, as it minimizes the complexity of integration below the application layer and the diverse IIoT functionalities of embedded and edge computing systems.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-HPC/uATX-Server】 is a carrier board for standard Micro-ATX form factor COM-HPC Server modules (Size D). It is designed to be directly integrated into applications, enabling early market entry while minimizing NRE costs by combining industrial-grade COM-HPC with customized cooling solutions and comprehensive BSPs for all major RTOS, as well as real-time hypervisors from Real-Time Systems, allowing for rapid response to changing market demands. Additionally, by swapping out the COM-HPC module, applications can be further enhanced for high performance or cost reduction, making it easy to scale and create a full range of product portfolios based on a single type of carrier board.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-aCOM/cRLP】 is one of the aReady.COM product line, based on the conga-HPC/cRLP-i5-1340PE module equipped with a 13th generation Intel Core processor. It is an application-ready COM-HPC Client Size A module with a pre-installed hypervisor and operating system. It comes pre-configured with two virtual machines, running real-time Linux OS on two cores and Ubuntu Pro on ten cores, and includes an active cooling solution with heat pipes, allowing for immediate application development. It simplifies the implementation and use of the latest technologies in artificial intelligence (AI), IoT connectivity, and security.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-aCOM/mRLP】 is one of the aReady.COM product line, based on the conga-HPC/mRLP-i5-1345URE module equipped with a 13th generation Intel Core processor. It is an application-ready COM-HPC Mini Size module with a hypervisor and operating system pre-installed. It comes pre-configured with two virtual machines, running real-time Linux OS on one core and Ubuntu Pro on nine cores, and includes an active cooling solution with heat pipes, allowing for immediate application development. It simplifies the implementation and use of the latest technologies such as artificial intelligence (AI), IoT connectivity, and security.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-TC700】 is a COM Express Compact Type 6 (95 x 95 mm) module equipped with an Intel Core Ultra (Meteor Lake) processor. The processor, which adopts a performance hybrid architecture, can be selected from four types (12 to 16 cores) and supports up to 22 threads with a maximum of 6 P-cores, 8 E-cores, and 2 low-power E-cores. It can implement up to 96 GB of DDR5 memory (up to 5,600 MT/s) through two SO-DIMM sockets and supports in-band ECC. It features Intel Arc graphics with up to 8 Xe cores and includes the Intel AI Boost NPU accelerator, efficiently executing machine learning algorithms and AI inference.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-TC675r】 is a rugged COM Express Compact Type 6 (95 x 95 mm) module equipped with a 13th generation Intel Core (Raptor Lake-P, BGA type) processor, featuring excellent shock and vibration resistance. The processor, which utilizes a hybrid architecture, offers a choice of six types (8 to 14 cores) and supports up to 20 threads with a maximum of 6 P-cores and 8 E-cores. It comes with up to 32GB of soldered LPDDR5X (up to 6,400 MT/s) SDRAM. It supports an industrial operating temperature range of -40°C to +85°C.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

This document provides a detailed explanation of the importance of thorough preparation in the design of COM-HPC carrier boards. It introduces topics such as "latest interfaces," "main challenges," and "compliance proof." We encourage you to read it. 【Contents (partial)】 ■ Latest interfaces ■ Statistically distributed sporadic errors ■ Compliance proof ■ Increased heat dissipation ■ Proven compliance ■ About congatec *For more details, please refer to the PDF document or feel free to contact us.

• Other embedded systems (software and hardware)

This document provides a detailed explanation of what developers and users should know about COM-HPC. It introduces topics such as "more processing units with a single standard," "more I/O," and "more and faster interfaces." Please take a moment to read it. 【Contents (partial)】 ■ COM-HPC: What developers and users should know ■ More processing units with a single standard ■ More space for enhanced performance ■ Optimized server-grade board management ■ COM-HPC Client - larger, faster, and more ■ About congatec *For more details, please refer to the PDF document or feel free to contact us.

• Embedded OS

The conga-HPC/cRLS is a COM-HPC Client Size C (120x160 mm) module equipped with the LGA type of the 13th/14th generation Intel Core processors (previously codenamed Raptor Lake-S). The new processors with a hybrid architecture can be selected from eight types (4 to 24 cores) and can implement up to 128GB of DDR5 memory (5600MT/s) through four SODIMM sockets. It supports up to PCIe Gen 5, Thunderbolt, and also supports AI acceleration through Intel Deep Learning Boost (VNNI). 【Features】 - Equipped with high-end processors of LGA socket type - Implements up to 16 E-cores and 8 P-cores - Dedicated customized cooling solution - Supports RTS's real-time hypervisor - Suitable for embedded and edge computing solutions that require integration of workloads, as well as edge applications using artificial intelligence (AI) and machine learning (ML) in fields such as healthcare.

• Other electronic parts

The 【conga-STDA4】 is a SMARC 2.1 (82 x 50 mm) module equipped with the TI Jacinto7 processor TDA4VM or DRA829J. It adopts a heterogeneous architecture, incorporating dual Arm Cortex-A72, DSP, accelerators for deep learning and multimedia, and an Arm Cortex-R5F MCU to alleviate the load of real-time communications. It features up to 8GB of soldered LPDDR4X memory (up to 3,733MT/s) and supports inline ECC.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-HPC/mRLP】 is a COM-HPC Mini Size (95 x 70 mm) module equipped with the 13th generation Intel Core (Raptor Lake-P) processor. The new processor with a hybrid architecture can be selected from seven types (5 to 14 cores) and features up to 64GB of soldered DDR5 memory (6400MT/s). An industrial temperature range option of -40℃ to +85℃ is also available. 【Features】 ■ High performance in a small form factor (credit card size 95 x 70 mm) ■ Supports high-speed interfaces (USB4, Thunderbolt, 10Gbit Ethernet, PCIe Gen4/5) ■ Industrial-grade operating temperature option of -40℃ to +85℃ ■ High durability against vibration and shock

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-HPC/cRLS】 is a COM-HPC Client Size C (160 x 120 mm) module equipped with the 13th/14th generation Intel Core (Raptor Lake-S) processor. The new processor with a hybrid architecture can be selected from eight types (4 to 24 cores) and can implement up to 128GB of DDR5 memory (5600MT/s) through four SO-DIMM sockets.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-HPC/cRLP】 is a COM-HPC Client Size A (95 x 120 mm) module equipped with the 13th generation Intel Core (Raptor Lake-P) processor. The new processor with a hybrid architecture is available in seven variants (10 to 14 cores), and it can implement up to 64GB of DDR5 memory (4800MT/s) through two SO-DIMM sockets. An industrial temperature range option of -40°C to +85°C is also available.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-TC675】 is a COM Express Compact Type 6 (95 x 95 mm) module equipped with a 13th generation Intel Core (Raptor Lake-P, BGA type) processor. The processor, which adopts a hybrid architecture, can be selected from 18 types (5 to 14 cores) and supports up to 20 threads with a maximum of 6 P-cores and 8 E-cores. With two SO-DIMM sockets, it can implement up to 64GB of DDR5 memory (up to 4,800MT/s). An industrial temperature range option of -40°C to +85°C is also available.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-HPC/sILH】 is a COM-HPC Server Size D (160 x 160 mm) module equipped with Intel Xeon D-2700/2800 series (Ice Lake D) processors. The processor can be selected from six types (4 to 22 cores), and it can implement up to 512GB of high-speed DDR4 memory (up to 2933MT/s, with ECC) through four DIMM sockets. An optional Size E (200 x 160 mm) is also available, which allows for the addition of four more DIMM sockets to implement up to 1TB of memory. An extended temperature range option of -40℃ to +80℃ is also available.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-HPC/sILL】 is a COM-HPC Server Size D (160 x 160 mm) module equipped with Intel Xeon D-1700/1800 series (Ice Lake D) processors. The processor can be selected from six types (4 to 10 cores), and it can implement up to 256GB of high-speed DDR4 memory (up to 2933MT/s, with ECC) through four DIMM sockets. An industrial temperature range option of -40°C to +85°C is also available.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-B7Xl】 is a COM Express Basic Type 7 (125 x 95 mm) module equipped with Intel Xeon D-1700/1800 series (Ice Lake D) processors. The processor can be selected from six types (4 to 10 cores), and it can implement up to 128GB of DDR4 memory (up to 2,666 MT/s) through four SO-DIMM sockets. An industrial temperature range option of -40°C to +85°C is also available.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-QMX8-Plus】 is a Qseven computer-on-module equipped with the NXP i.MX 8M Plus processor. The i.MX 8M Plus processor features a quad-core ARM Cortex-A53 and includes a neural processing unit (NPU) capable of up to 2.3 TOPS for deep learning inference and artificial intelligence. This module supports a 64-bit architecture and up to 6 GB of onboard LPDDR4 memory while consuming only 3 watts of ultra-low power. Combined with TSN-enabled Ethernet, it enables more powerful and intelligent embedded systems at the edge, as well as IIoT-connected systems. This module is the perfect solution for upgrading existing i.MX 6-based systems, with optimal industrial applications including industrial control devices, smart robots, factory automation, medical healthcare, retail, and extending to transportation, smart agriculture, smart cities, and smart buildings. It supports operating systems such as Linux, Yocto 2.0, and Android.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-HPC/cTLH】 is a COM-HPC Client Size B (120x120 mm) module equipped with the 11th generation Intel Core processor (Tiger Lake-H). It can implement up to 128GB of DDR4 memory (3200MT/s) through four SO-DIMM sockets. It supports PCIe Gen 4 and USB 4.0, and there is also an option for an extended operating temperature range.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-TS570】 is a COM Express Basic Type 6 module equipped with an 11th generation Intel Core (Tiger Lake-H) processor.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-TC570r】 is a rugged version of the COM Express compact Type 6 module equipped with the 11th generation Intel Core (Tiger Lake UP3), with memory directly soldered to the board for vibration and shock resistance.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-SMX8-Plus】 is a computer-on-module that complies with the SMARC 2.1 standard and is equipped with the NXP i.MX 8M Plus processor. The i.MX 8M Plus processor features four Arm Cortex-A53 cores, an Arm Cortex-M7 controller, and an NPU that accelerates deep learning algorithms. The module supports up to 6GB of LPDDR4 memory (with inline ECC) and can drive up to three independent displays. It includes peripheral interfaces such as PCIe Gen 3 x1, USB 3.0 x2, USB 2.0 x3, UART x4, CAN FD x2, GPIO x14, and one GbE port supporting TSN for real-time networking, along with a conventional GbE port. There is also a version with an extended temperature range (-40℃ to +85℃), making it ideal for applications such as industrial edge analytics, embedded vision, and artificial intelligence (AI). It supports operating systems like Linux, Yocto 2.0, and Android.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-HPC/cTLU】 is a COM-HPC Client Size A module equipped with an 11th generation Intel Core (Tiger Lake UP3) processor. It supports PCIe Gen 4 as well as USB 4.0. It offers a maximum transfer speed of 40 Gbit/s, supports PCIe 4.0 tunneling, and DP-Alt mode, accommodating video signals with a resolution of up to 8K at 60Hz and 10-bit HDR. Audio is provided via I2S and SoundWire. It is compatible with major operating systems such as Linux, Windows, and Chrome. It is ideal for a wide range of high-end solutions, including embedded systems, edge computing, fog computing, network hubs, core network nodes and appliances, as well as highly durable central cloud data centers for critical applications in government agencies.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-TC570】 is a COM Express compact Type 6 module equipped with the 11th generation Intel Core (Tiger Lake UP3).

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-TCV2】 is a COM Express Compact Type 6 (95 x 95 mm) module equipped with an AMD Ryzen Embedded V2000 processor. The V2000 processor, with up to 8 cores and 16 threads, is based on the innovative 7nm process technology and the "Zen 2" x86 core architecture, featuring high-performance graphics and exceptional power efficiency. It supports up to four independent displays with 4k60 UHD resolution through three DisplayPort 1.4/HDMI 2.1 and one LVDS/eDP. By implementing the RTS hypervisor, it enables workload balancing and integration through virtual machines. Additionally, it supports operating systems such as Windows and Linux. The integrated AMD Secure Processor accelerates RSA, SHA, and AES encryption and decryption on hardware, and it also supports TPM, making it ideal for applications where security is a priority.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-PA7】 is a Pico-ITX SBC (100 x 72 mm) equipped with Intel Atom x6000E, Celeron, and Pentium J series processors (Elkhart Lake) based on low-power 10nm technology. Even in applications where reliability is required, it enhances reliability with standard memory without the need for ECC memory through in-band error correction codes, while also supporting an extended temperature range of -40°C to +85°C, making it suitable for products in harsh industrial environments. For real-time applications, it supports TSN and Intel TCC, and a comprehensive board support package is provided for major operating systems such as hypervisors, Linux, and Windows.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-MA7】 is a COM Express Mini Type 10 (55 x 84 mm) module equipped with Intel Atom x6000E, Celeron, and Pentium J series processors (Elkhart Lake) based on low-power 10nm technology. Even in applications where reliability is required, it enhances reliability with standard memory without the need for ECC memory through in-band error correction codes, while also supporting an extended temperature range of -40°C to +85°C, making it suitable for industrial market products in harsh environments. For real-time applications, it supports TSN and Intel TCC, and a comprehensive board support package is provided for major operating systems such as hypervisors, Linux, and Windows.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-SA7】 is a SMARC 2.1 (82 x 50 mm) module equipped with Intel Atom x6000E, Celeron, and Pentium J series processors (Elkhart Lake) based on low-power 10nm technology. Even in applications where reliability is required, it enhances reliability with standard memory without the need for ECC memory through in-band error correction codes, while also supporting an extended temperature range of -40°C to +85°C, making it suitable for products in harsh industrial environments. For real-time applications, it supports TSN and Intel TCC, and a comprehensive board support package is provided for major operating systems such as hypervisors, Linux, and Windows.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-QA7】 is a Qseven (70 x 70 mm) module equipped with Intel Atom x6000E, Celeron, and Pentium J series processors (Elkhart Lake) based on low-power 10nm technology. Even in applications where reliability is required, it enhances reliability with standard memory without the need for ECC memory through in-band error correction codes, while also supporting an extended temperature range of -40°C to +85°C, making it suitable for industrial market products in harsh environments. For real-time applications, it supports TSN and Intel TCC, and a comprehensive board support package is provided for major operating systems such as hypervisors, Linux, and Windows.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-TCA7】 is a COM Express Compact Type 6 (95 x 95 mm) module equipped with Intel Atom x6000E, Celeron, and Pentium J series processors (Elkhart Lake) based on low-power 10nm technology. Even in applications where reliability is required, it enhances reliability with standard memory without the need for ECC memory through in-band error correction codes, while also supporting an extended temperature range of -40°C to +85°C, making it suitable for industrial market products in harsh environments. For real-time applications, it supports TSN and Intel TCC, and a comprehensive board support package is provided for major operating systems such as hypervisors, Linux, and Windows.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-SMX8-Mini】 is a SMARC 2.1 module equipped with the NXP i.MX 8M Mini series processor. It offers scalable Arm performance with up to four Cortex-A53 cores (1.8GHz) and one Cortex-M4F, excellent power efficiency and performance through 14LPC FinFET process technology, 3D graphics, and full HD resolution, as well as a MIPI CSI-2 camera interface. It is also available for long-term supply for industrial applications.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-TC370】 is a COM Express Compact Type 6 module equipped with an 8th generation Intel Core (Whiskey Lake) processor.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-JC370】 is a 3.5-inch form factor single-board computer equipped with an 8th generation Intel Core (Whiskey Lake) processor.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-B7E3】 is a COM Express Basic Type 7 module equipped with an AMD EPYC Embedded 3000 series processor.

• Embedded Board Computers
• Microcomputer
• Other electronic parts

The 【conga-SMX8-X】 is a SMARC 2.1 module equipped with the ultra-low power NXP i.MX 8X series processor. It features built-in Arm Cortex-A35 and Cortex-M4F, with an ultra-low power consumption of 2 to 5 watts. It offers industrial-grade reliability, enhanced virtualization, 3D graphics for up to two independent HD displays, and a MIPI CSI-2 camera interface.

• Other electronic parts
• Microcomputer
• Embedded Board Computers