ケニックス List of Products and Services

The "PGS model" is a groundbreaking sputtering device that employs the pressure gradient phenomenon. It enables sputter deposition in a high vacuum environment. Additionally, it allows for the formation of low-damage, high-quality thin films through a high route. This product is the result of collaborative research with Kyushu University, Meijo University, and Okayama University of Science. 【Features】 ■ Utilizes the pressure gradient phenomenon ■ Enables sputter deposition in a high vacuum environment ■ Result of collaborative research with Kyushu University, Meijo University, and Okayama University of Science *For more details, please refer to the PDF document or feel free to contact us.

• Other physicochemical equipment

At Kenix Corporation, we confirmed that stable crystal growth of bismuth selenide, which is expected to be a topological semiconductor, can be achieved using a deposition source that evaporates low-temperature materials stably. We verified the crystal growth of bismuth selenide through RHEED streaks, confirmation of oscillations, and peak verification via Raman spectroscopy measurements. This crystal growth experiment and data were conducted and obtained with the cooperation of a professor from Kyushu Institute of Technology. 【Evaluation Data】 ■ Low-temperature material high-speed molecular beam deposition source ■ Growth rate (Bi2Se3) ■ RHEED streak images (Bi2Se3) ■ RHEED oscillation data (Bi2Se3) ■ Raman spectroscopy measurement data (Bi2Se3) *For more details, please refer to the PDF document or feel free to contact us.

• others

At Kenix Co., Ltd., we confirmed that stable crystal growth of bismuth selenide can be achieved using a high-speed molecular beam evaporation source. We verified the crystal growth of bismuth selenide through RHEED streaks, confirmation of oscillations, and peak verification using Raman spectroscopy. This crystal growth experiment and data were conducted and obtained with the significant cooperation of Professor at the Graduate School of Information Engineering, Kyushu Institute of Technology. 【Measurement Data】 ■ High-speed molecular beam evaporation source ■ Evaporation rate curve (Bi, Se) ■ RHEED streak images (Bi2Se3) ■ RHEED oscillation data (Bi2Se3) ■ Raman spectroscopy measurement data (Bi2Se3) *For more details, please refer to the PDF document or feel free to contact us.

• others

At Kenix Co., Ltd., we accept precision processing of hard and brittle materials such as quartz, sapphire, and alumina. We perform grinding, fine processing, and joining of hard and brittle materials, including "Pyrex-SUS joining" and "alumina fine processing." Please feel free to contact us when you need our services. 【Grinding, Fine Processing, and Joining of Hard and Brittle Materials】 ■ Pyrex-SUS Joining ■ Alumina Fine Processing ■ Quartz Fine Processing ■ Quartz-SUS Joining *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

The "Plasma Assist Source" is a plasma application product for semiconductor manufacturing processes. By adding plasma functionality, it is possible to enhance reactivity. Additionally, we design and develop products that add plasma functionality to existing process technologies, proposing innovative process technologies. 【Product Features】 ■ Plasma Cracking Cell - A cracking evaporation source for materials with high vapor pressure and poor directionality. - Activates sublimated materials and irradiates them onto the substrate through an orifice. ■ Plasma Source for ALD - Plasma source for ALD equipment, using oxygen or nitrogen. - Adjustable irradiation distance of 50 to 100 mm. - Excellent ON/OFF response speed and plasma stability. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

At Kenix Corporation, we provide various quartz products that are essential in semiconductor processes with advanced technology. Our quartz glass wafer boats are available in both vertical and horizontal types, as well as quartz hangers for small diameters and boats for solar cells, offering a wide range of options. Please feel free to contact us when you need assistance. 【Main Processed Products】 ■ Wafer Boats ■ Cleaning Tanks ■ Process Tubes *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

At Kenix Co., Ltd., we offer a variety of quartz glass with excellent transparency, chemical resistance, and heat resistance, which are necessary for semiconductor manufacturing processes and optical applications. We can provide quartz tubes in a wide range of sizes. Additionally, we can accommodate diameter modifications up to φ400 through resizing processing. Please feel free to contact us when you need assistance. 【Main Materials】 ■ Quartz Tubes ■ Quartz Plates ■ Quartz Shaped Tubes *For more details, please refer to the PDF document or feel free to contact us.

• Glass

Our "Quartz/Glass Flat Joining" technology directly bonds borosilicate glass such as quartz, Pyrex, and Tempax using heat and pressure. After joining, there is no peeling due to fire processing or machining, resulting in a strong bonded state. High-precision joining with minimal thermal deformation, which is difficult with fire processing, is possible. It allows for the easy manufacturing of components like hollow groove parts. 【Features】 ■ Direct bonding of borosilicate glass using heat and pressure ■ Strong bonded state without peeling from machining ■ Maximum size of processed material: 8 inches ■ Surface condition - The surface after joining becomes cloudy - Polishing is required if transparency is needed *For more details, please refer to the PDF document or feel free to contact us.

• others

Our "Glass-Metal Joining" technology enables the direct bonding of Kovar metal and Kovar glass, which have matching coefficients of thermal expansion. By using Kovar metal, various metal tubes can be converted into glass tubes. In development cases, we have implemented stepwise joint bonding using intermediate glass, not just Kovar glass. Materials can be freely selected according to applications, ranging from Pyrex glass to quartz glass and soda-lime glass, which have significantly different coefficients of thermal expansion. 【Features】 ■ Kovar metal and Kovar glass with matching coefficients of thermal expansion can be directly bonded. ■ Various metal tubes can be converted into glass tubes through Kovar metal. ■ Environmental performance of the joint - Heat resistance temperature: -196℃ to 400℃ - Leakage rate: 1×10^-7 Pa·m3/sec (He) or less *For more details, please refer to the PDF document or feel free to contact us.

• others

Our bonding technology is characterized by the ability to join metals without oxidation in a reducing atmosphere, and this technology applies know-how cultivated in electronic tube manufacturing. In development examples, we have metallized ceramics to directly braze metal parts, producing components with excellent heat resistance, vacuum tightness, and insulation properties. Additionally, bonding between sapphire and metal is also possible, and we manufacture items such as viewing ports. 【Features】 ■ Environmental performance of the joint - Heat resistance temperature: -196℃ to 900℃ (varies with solder) - Leakage rate: 1×10^-9 Pa·m3/sec (He) ■ Main solders - Alloys of gold, silver, copper, and nickel (780℃ to 1083℃) *For more details, please refer to the PDF document or feel free to contact us.

• others

This product is a clean heater with high control responsiveness and an extremely low gas emission structure. It is compatible with both direct sample irradiation heating and hot plate indirect heating. It has a small heat capacity and can be used in ultra-high vacuum, atmospheric pressure, and oxygen atmosphere. 【Features】 ■ Halogen lamp capable of uniform irradiation ■ Economical and highly energy-efficient heater with high responsiveness ■ Composed of quartz body lamp and high-temperature compatible metal reflector and base ■ Structure with extremely low gas emission ■ Capable of heating up to a maximum temperature of 900°C (temperature control measurement point, in vacuum) ■ Very high control responsiveness *For more details, please refer to the PDF document or feel free to contact us.

• Other heaters

We would like to introduce our "Tubular Electric Furnace." The "Fuel Cell Heating Test Device" consists of a furnace body, a quartz core tube with a high vacuum exhaust system, gas system, and electrical measurement system. It heats samples at a constant 1000°C and measures power generation efficiency through the H2.O2 gas reaction. Additionally, we also offer "Solid-State Ion Migration Devices" and "Vertical Electric Atmosphere Furnaces." Please feel free to contact us if you have any inquiries. 【Product Lineup】 ■ Fuel Cell Heating Test Device ■ Solid-State Ion Migration Device ■ Vertical Electric Atmosphere Furnace *For more details, please refer to the PDF materials or feel free to contact us.

• Electric furnace

This product is a device for precision bonding of wafer-level silicon, metal, quartz, glass, etc., after surface modification treatment in a vacuum or any atmosphere. It supports various bonding for 4 to 6-inch wafer levels. We propose surface modification treatments and precision bonding models suitable for bonding materials such as anodic bonding, diffusion/eutectic bonding, direct bonding, and thermocompression bonding. 【Features】 ■ Supports various bonding for 4 to 6-inch wafer levels ■ Pre-treatment function with surface modification treatment suitable for any material ■ Bonding system equipped with uniform heating and pressurization functions ■ Heating and cooling system to reduce residual stress ■ Capable of operating in ultra-high vacuum to pressurized atmosphere ■ Control mechanism for arbitrary position pressurization and voltage application *For more details, please refer to the PDF document or feel free to contact us.

• Wafer
• Other machine elements

We would like to introduce our "Semiconductor Probe Evaluation Equipment." The "Organic Semiconductor EL Evaluation Equipment" allows for electrical measurements and optical measurements while heating a substrate that is in contact with probes in a high vacuum to atmospheric pressure environment. Additionally, we also offer "High Vacuum High Temperature Probe Equipment" aimed at power devices such as SiC, as well as "Environmental Control Evaluation Testing Equipment." 【Product Lineup】 ■ Organic Semiconductor EL Evaluation Equipment ■ High Vacuum High Temperature Probe Equipment ■ Environmental Control Evaluation Testing Equipment *For more details, please refer to the PDF document or feel free to contact us.

• probe

This product is a plasma CVD device with a cylinder cabinet designed for liquid raw material sources, including TEOS. It is equipped with a bakeable MFC compatible with liquid sources and various baking mechanisms, and features a uniquely designed plasma electrode to prevent internal abnormal discharges and ensure stable plasma generation. The device allows for substrate replacement and internal maintenance through the opening and closing of the top cover, and it is compact with excellent space efficiency. 【Features】 ■ Equipped with a cylinder cabinet ■ Includes a bakeable MFC compatible with liquid sources and various baking mechanisms ■ Designed with a unique plasma electrode ■ Allows for substrate replacement and internal maintenance through the opening and closing of the top cover ■ Compact and space-efficient *For more details, please refer to the PDF materials or feel free to contact us.

• CVD Equipment

We would like to introduce our "Ultra High Vacuum Multi-Chamber Connection System." The UHV integrated system connects multiple film deposition and analysis devices to a chamber for ultra-high vacuum transport, including ALD, ECR plasma treatment, sputtering devices, and XPS analysis devices. Additionally, there are systems that connect MEB chambers with XPS surface analysis devices, as well as systems that connect MBE chambers with oxidation treatment chambers and STM analysis chambers. 【Product Lineup】 ■ ALD, Plasma Treatment, Sputtering, Surface Analysis System ■ MBE Growth, XPS Surface Analysis System ■ MBE Growth, Oxidation Treatment, STM Analysis System *For more details, please refer to the PDF document or feel free to contact us.

• Plasma surface treatment equipment
• Sputtering Equipment
• Analytical Equipment and Devices

The product is an in-situ system that combines the growth mechanism of graphene crystal thin films using "MBE method" and "surface thermal decomposition method" with RHEED/LEED surface analysis mechanisms. Using a 6H-SiC micro-tilted ([1-100] 4° off) substrate with a (0001) surface (Si face), the formation of graphene was confirmed through diffraction patterns during the growth of graphene. Additionally, the formation of graphene was also confirmed through micro-Raman measurements. 【Components】 ■ MBE deposition mechanism equipped with a "high-temperature K cell for graphene thin film growth" ■ Surface thermal analysis mechanism using a "heating holder for thermal decomposition of SiC substrate" ■ RHRRD crystal structure analysis system ■ LEED surface observation system *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices

We would like to introduce our "Glove Box Integrated Vacuum Deposition System." This compact deposition bell jar can deposit on 50×50 substrates and is housed within a glove box. You can attach and detach the bell jar inside the glove box to exchange or replenish substrates and deposition materials. 【Features】 ■ Capable of depositing on 50×50 substrates ■ Compact deposition bell jar housed within the glove box ■ Ability to attach and detach the bell jar inside the glove box to exchange or replenish substrates and deposition materials *For more details, please refer to the PDF document or feel free to contact us.

• Evaporation Equipment

This product is designed for 50×50 substrates and is a device that connects a resistance heating evaporation system for organic transistors and EL elements, as well as an RF sputtering system for oxides, to a glove box. It transports materials between chambers using a transfer rod, allowing for continuous film deposition without releasing to the atmosphere. Please feel free to contact us when you need assistance. 【Features】 ■ Compatible with 50×50 substrates ■ Continuous film deposition possible without releasing to the atmosphere ■ Connects a resistance heating evaporation system for organic transistors and EL elements, and an RF sputtering system for oxides to a glove box *For more details, please refer to the PDF materials or feel free to contact us.

• Evaporation Equipment
• Sputtering Equipment

This product is an organic and metal deposition device compatible with 100×100 substrates. It is connected to a glove box for mask exchange, allowing for continuous film deposition without exposing the atmosphere. The deposition source is a large deposition chamber equipped with multiple resistance heating deposition sources, organic-only deposition sources, and conical deposition source K cells. 【Features】 ■ Compatible with 100×100 substrates ■ Connected to a glove box for mask exchange ■ Equipped with multiple resistance heating deposition sources, organic-only deposition sources, and conical deposition source K cells ■ Includes a holder compatible with substrate rotation and heating ■ Excellent film thickness distribution *For more details, please refer to the PDF materials or feel free to contact us.

• Evaporation Equipment

This product is a substrate incident angle variable deposition device equipped with attachment-free K cells and conical evaporation sources. It can be fixed at any position on an arc-shaped rail that accommodates any substrate incidence. The deposition position can be adjusted. [K Cell] ■ Crucible capacity: 2cc ■ Heating temperature: Max 1,200℃ ■ Heating control power supply *For more details, please refer to the PDF document or feel free to contact us.

• Evaporation Equipment

This product is a three-source switchable resistance heating vapor deposition device aimed at metal materials. The square chamber improves maintainability. It supports 4-inch substrates and is equipped with a substrate heating mechanism and a film thickness control mechanism. 【Features】 ■ Substrate dimensions: 100×100 ■ Substrate heating temperature: Normal use 600℃ ■ Substrate rotation holder ■ Quartz film thickness gauge ■ EB source expansion port included ■ Resistance heating source: 100A three-source switchable *For more details, please refer to the PDF document or feel free to contact us.

• Evaporation Equipment

This product is an electron beam evaporation device capable of lift-off film formation, targeting metallic materials. The triple EB gun features a sliding movement mechanism, making maintenance and operation easy. The maximum substrate size is φ3 inches, and the lift-off film formation mechanism employs a special heat shielding mechanism. 【Features】 ■ Substrate size: Maximum φ3 inches ■ Substrate heating temperature: Normal use 600℃ ■ Lift-off film formation mechanism: Special heat shielding mechanism adopted ■ Electron beam gun: Hars 3-way manual sliding movement type ■ EB gun maintenance mechanism: EB gun sliding movement mechanism *For more details, please refer to the PDF document or feel free to contact us.

• Evaporation Equipment

This product is a 3-source RF magnetron sputtering system designed for metal and insulating materials. The substrate features a heating mechanism and a reverse sputtering mechanism. The sputter cathodes consist of three φ4-inch magnetron cathodes, and the substrate insertion is designed for manual opening and closing of the top cover. 【Features】 ■ Substrate size: Maximum 3 inches (can accommodate 3 pieces) ■ Substrate holder: Substrate heating up to 500°C, substrate rotation, and reverse sputtering mechanism included ■ Sputter cathodes: Three φ4-inch magnetron cathodes ■ Gas system: Two systems of Ar and O2 MFC ■ Substrate insertion: Manual opening and closing of the top cover *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment

This product is a film deposition device that combines RF sputtering and resistance heating evaporation. It is possible to add a load lock chamber. It features a heating and rotating substrate holder compatible with 2-inch substrates. Additionally, it has a 1-inch UHV-compatible sputter cathode with two sources and a three-source switchable resistance heating evaporation system. 【Features】 ■ 1-inch UHV-compatible sputter cathode with two sources ■ Three-source switchable resistance heating evaporation ■ Heating and rotating substrate holder compatible with 2-inch substrates ■ Load lock chamber can be added *For more details, please refer to the PDF materials or feel free to contact us.

• Sputtering Equipment

This product is a sputtering device for the development of batteries, catalyst materials, and organic devices. It connects a load lock chamber and a glove box to the sputtering chamber. It can accommodate four UHV-compatible sputter cathodes. Additionally, it supports multilayer films, compound film deposition, and reactive film deposition. 【Features】 ■ For the development of batteries, catalyst materials, and organic devices ■ Connects a load lock chamber and a glove box to the sputtering chamber ■ Can accommodate four UHV-compatible sputter cathodes ■ Research film deposition environment that eliminates oxygen and moisture ■ Supports multilayer films, compound film deposition, and reactive film deposition *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment

We would like to introduce our "Thin Film Creation Components." Our lineup includes the world’s smallest class UHV-compatible "Magnetron Sputter Cathode," as well as the "EB Gun" that can be mounted from ICF70, and the "K Cell" compatible with crucibles ranging from a minimum of 2cc to 100cc. Additionally, we offer "Multi-Resistance Heating Sources" and "Conical Vapor Deposition Sources" that are compatible with organic and metal materials. 【Product Lineup】 ■ Magnetron Sputter Cathode ■ EB Gun ■ K Cell ■ Multi-Resistance Heating Source ■ Conical Vapor Deposition Source *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment
• Other machine elements

The "PGS Model" is a revolutionary sputtering device that employs the pressure gradient phenomenon. It enables sputter deposition in a high vacuum environment. Additionally, it can form low-damage, high-quality thin films through a high route. This product is the result of collaborative research with Kyushu University, Meijo University, and Okayama University of Science. 【Features】 ■ Utilizes the pressure gradient phenomenon ■ Enables sputter deposition in a high vacuum environment ■ Result of collaborative research with Kyushu University, Meijo University, and Okayama University of Science *For more details, please refer to the PDF materials or feel free to contact us.

• Other physicochemical equipment

In the development of miniaturization and prototype equipment for the Polarization Mode Converter (PMC), there is growing interest in special polarized beams such as radial polarization and azimuthal polarization, which have distributions of polarization, phase, and intensity in the laser beam cross-section. These polarizations are gaining attention in optical measurement, particularly in the field of optical microscopy, with numerous applications proposed, including enhanced sensitivity for super-resolution and surface observation, as well as high-efficiency light trapping, leading to an increase in the number of published papers. Professor Keisuke Tomoki from Hyogo Prefectural University, who has a vision for new application devices, is developing the world's first three-dimensional stereoscopic orientation microscope that measures molecular orientation with three-dimensional resolution, and the liquid crystal optical element that made this possible is the PMC. The goal of the joint research between Hyogo Prefectural University’s optical system construction and control technology and Kenix Co., Ltd.’s device design and process development is to manufacture and sell a compact and simple PMC at a low cost. For more details, please contact us or refer to the catalog.

• others

The ultra-high vacuum 1-inch (compact) sputter cathode is among the smallest in the world and can be custom-made from single prototypes to suit various applications. The background of product development includes the miniaturization of research equipment, the efficient use of rare metal materials, continuity towards high quality, high reproducibility, and technologies applicable for mass production, as well as connections to analysis and evaluation systems. It features direct gas introduction and a water-cooled structure compatible with a φ1-inch target, and comes with a dedicated RF power supply with a built-in matching box, making it easy to install in your existing vacuum chamber, even for UHV applications. For more details, please contact us or refer to the catalog.

• others

The design and development concept of the epitaxial graphene crystal growth device using the sic surface thermal decomposition method focuses on miniaturization and simplification of the graphene growth apparatus. It aims for high crystal quality and reproducibility of growth, as well as the addition and connectivity of surface analysis equipment, making it economically feasible for investment. The formation of graphene was confirmed from the diffraction pattern. A graphene/buffer layer has been formed. The streaks are believed to be due to the one-dimensional structure of graphene on the facets. Graphene is uniformly formed on terraces (0001) approximately 250 nm wide, and the periodic structure is a result of step punching unique to the off-substrate. The formation of graphene was also confirmed through micro-Raman measurements. The Raman spectra of the terraces (red) and facets (blue) shown in the optical microscope image of the sample surface are presented. It is a typical graphene spectrum, confirming that it is a single layer graphene based on the half-width of the 2D peak. Additionally, the D band is significantly larger on the facets, which is believed to reflect the one-dimensional structure of graphene. This was clearly observed in the mapping as well. For more details, please contact us or refer to the catalog.

• others

This is an introduction to Kenix Corporation's "Thin Film Creation Components," which manufactures and sells custom-made products. ■□■ Product Lineup ■□■ ■ Custom-made sputter cathodes from single-item prototypes to suit your needs! - Direct gas introduction to the head, water-cooled structure - Compatible with φ1-inch targets - Comes with a dedicated RF power supply with a matching box - Compatible with UHV - Easily mountable on your existing vacuum chamber ■ EB guns that can be mounted from ICF70 - Available in 3kW single and triple configurations - Small electronic gun with a 2cc crucible (minimum) - Designed and manufactured with water-cooled connection ports, etc. - Water-cooled UHV-compatible structure - Abundant materials for the hearth ■ K cells compatible with crucibles from a minimum of 2cc to 100cc - Compatible with mounting from ICF70 - Shutter mechanism option - Comes with a control power supply ■ For more details, please contact us.

• Contract manufacturing

Device for continuously forming films from roll-shaped film ■□■Features■□■ ■Compatible with sputtering, EB, and resistance heating deposition ■Tension pickup feedback control ■Cold trap for film release gas exhaust ■Differential exhaust system (optional installation) ■Substrate cleaning mechanism ■Resistance value transmittance monitoring mechanism ■Deposition roller cooling refrigerant system ■Supports continuous film formation on both sides (see image on the right) ■Roll width, roll diameter, and winding speed are negotiable ■Winding control with independent control of UW, W, and CR ■For custom-made semiconductor manufacturing equipment, scientific instruments, and accessories, please leave it to us. For details, please contact us.

• Other semiconductor manufacturing equipment

A device for precision bonding of wafer-level silicon, metals, quartz, glass, etc., after surface modification treatment in a vacuum to any atmosphere. ■□■Features■□■ ■Compatible with various 4 to 6-inch wafer-level bonding ■Pre-treatment function through surface modification suitable for any material ■Bonding system equipped with uniform heating and pressurization functions ■Heating and cooling system to reduce residual stress ■Compatible with ultra-high vacuum to pressurized atmosphere ■Arbitrary position pressurization and voltage application control mechanism For custom-made semiconductor manufacturing equipment, scientific instruments, and accessories, please leave it to us. For more details, please contact us.

• Wafer processing/polishing equipment

This is an introduction to Kenix's "Vacuum Sealing and Bonding Equipment," which manufactures and sells custom-made products. ■□■Features■□■ ■Compatible with anodic bonding, direct bonding, and thermal compression bonding ■Compatible with wafer-level to chip-level bonding ■Heating area and temperature: φ6cm, Max 1,000℃ ■Pressure: Max 1,000kg/cm2 ■Atmospheric pressure: Vacuum to pressurized atmosphere ■Various MEMS sensors, microchips, and next-generation devices ■Surface modification unit can be optionally installed For custom-made semiconductor manufacturing equipment, scientific instruments, and accessories, please leave it to us. For more details, please contact us.

• Other semiconductor manufacturing equipment

This is an introduction to Kenix Corporation's "Spectroscopy and Measurement," which manufactures and sells custom-made products. ■□■ Product Lineup ■□■ ■ Micro Laser Raman Spectroscopy: Stable measurement of heat-sensitive samples with high sensitivity - Suitable for microcrystals, solar cell thin films, thermoplastic polymers, proteins, etc. - Employs an optical system that effectively handles excitation light and Raman light - Uses a high NA objective lens (100x) for a large Raman collection amount - Matches the Raman collection point with the TV monitor focus - Allows for arbitrary adjustment of the laser vapor pot, enabling high S/N ratio measurements in a short time ■ Vacuum Prober: Multi-functional measurement in arbitrary environments using an externally operated probe - Probe measurements in vacuum, pressurized, and arbitrary gas atmospheres - Supports high temperatures (1,000°C) to low temperatures (-190°C) - Compatible with vacuum integrated transport with film deposition equipment - Probe with BNC (XYZ stroke: over 5 mm each) - Compact tabletop design For custom-made products related to semiconductor manufacturing equipment, scientific instruments, and accessories, please leave it to us. For more details, please contact us.

• Other measurement, recording and measuring instruments

This is an introduction to Kenix Corporation's "Surface Improvement Components," which manufactures and sells custom-made products. ■□■ Product Lineup ■□■ ■ Excimer light source using 172nm vacuum ultraviolet light - Low temperature, damage-free processing - High energy efficiency with a single wavelength - Increases work function of organic EL ■ Handy atmospheric pressure plasma - Compact design - Easy to handle - Operates with a standard AC100V outlet - Easy maintenance ■ Low-speed high-intensity ion beam gun ■ Simple tabletop plasma treatment device - Handy type, 100V operation For custom-made products related to semiconductor manufacturing equipment, scientific instruments, and accessories, please leave it to us. For more details, please contact us.

• Other semiconductor manufacturing equipment
• Contract manufacturing

This is an introduction to Kenix Co., Ltd.'s "Quartz Precision Machining Products," which manufactures and sells custom-made items. ■□■ Product Lineup ■□■ ■ Ultra-Precision Quartz Machining: Precision micro-machining products for highly brittle materials such as quartz. Minimum hole diameter: φ0.1, groove processing, deep hole processing, glass, single crystals (silicon, sapphire, etc.), ceramics. ■ Optical Components: Custom manufacturing from single prototypes to suit various applications. Various lenses, fly-eye lenses, various prisms, various mirrors, filters, and polarizing elements. ■ Ultra-Precision Polished and Bonded Components: (Micro flow cells, optical cells, etc.) Flow path cross-section can be produced from 20μm square. Custom manufacturing based on application. Direct bonding of quartz through ultra-precision polishing, also applicable for precision sample holders and quartz jigs. ■ Quartz Clean Heaters: Clean heaters with non-exposed heating elements, capable of high heating under reactive gases and ambient conditions. ■ Quartz Tubes and Quartz Plates: Wafer holders, sample holders, gas purge tubes, quartz furnace core tubes, custom-shaped gas burner processing. ■ For more details, please contact us.

• Contract manufacturing
• Processing Contract